CN108123065B - OLED display panel and packaging method thereof - Google Patents
OLED display panel and packaging method thereof Download PDFInfo
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- CN108123065B CN108123065B CN201711345922.6A CN201711345922A CN108123065B CN 108123065 B CN108123065 B CN 108123065B CN 201711345922 A CN201711345922 A CN 201711345922A CN 108123065 B CN108123065 B CN 108123065B
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 title claims description 36
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 38
- 238000005538 encapsulation Methods 0.000 claims abstract description 20
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 239000000565 sealant Substances 0.000 claims description 36
- 238000005520 cutting process Methods 0.000 claims description 15
- 238000005286 illumination Methods 0.000 claims description 15
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 150000002790 naphthalenes Chemical class 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 10
- 239000001301 oxygen Substances 0.000 abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 abstract description 10
- 238000012858 packaging process Methods 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 26
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an OLED display panel, which comprises a substrate, an encapsulation cover plate and an OLED device unit, wherein the substrate and the encapsulation cover plate are oppositely arranged, the OLED device unit is arranged between the substrate and the encapsulation cover plate, the encapsulation cover plate and the peripheral edge of the substrate are sealed through frame glue, a closed cavity is formed among the frame glue, the encapsulation cover plate, the substrate and the OLED device unit, a hydrophobic layer is arranged on the surface of the whole inner wall of the closed cavity, and the hydrophobic layer comprises a hydrophobic material. According to the OLED display panel, the hydrophobic layer is arranged on the surface of the whole inner wall of the closed cavity formed in the frame glue packaging process, so that moisture and oxygen can be effectively prevented from permeating into the OLED display panel, the OLED device unit is protected, and the service life of the OLED display panel is prolonged. The invention also provides an encapsulation method of the OLED display panel.
Description
Technical Field
The invention relates to the technical field of display panels, in particular to an OLED display panel and an encapsulating method thereof.
Background
An OLED (Organic Light-Emitting Diode) display panel is one of the most promising display technologies in the present due to its characteristics of self-luminescence, wide viewing angle, long service life, energy saving, environmental protection, and the like, and gradually enters consumer electronics markets such as mobile devices and televisions.
The OLED device belongs to a sandwich structure, an organic light emitting layer is clamped between electrodes, and the organic light emitting layer is sensitive to moisture and oxygen in the air, is easy to react with the moisture or the oxygen, and influences the light emitting performance and the service life. Therefore, the OLED device requires a strict encapsulation process.
However, in the prior art, the capability of blocking moisture and oxygen of the OLED display panel packaged by the sealant is limited, and the service life of the OLED display panel is short; in addition, the curing and packaging of the frame glue often uses a light heating step, which easily causes over-high heat and affects the functions of the OLED device; the illumination heating method using the air cooling method will result in too long curing process time, which is not suitable for mass production.
Disclosure of Invention
In view of this, the present invention provides an OLED display panel and a packaging method thereof, which can effectively block moisture and oxygen and prolong the light emitting service life of the OLED display panel.
In a first aspect, the invention provides a flexible OLED display panel, which includes a substrate and an encapsulation cover plate that are arranged oppositely, and an OLED device unit that is arranged between the substrate and the encapsulation cover plate, the encapsulation cover plate and the peripheral edge of the substrate are sealed by frame glue, a closed cavity is formed between the frame glue and the encapsulation cover plate, the substrate and the OLED device unit, a hydrophobic layer is arranged on the whole inner wall surface of the closed cavity, and the hydrophobic layer includes a hydrophobic material.
Wherein the hydrophobic layer is composed of a hydrophobic material, and the melting point temperature range is 50-100 ℃.
Wherein the hydrophobic material comprises one or more of naphthalene and naphthalene derivatives.
Wherein the thickness of the hydrophobic layer is 30-100 nm.
The frame glue comprises one or more of UV glue and glass glue.
According to the OLED display panel provided by the first aspect of the invention, the hydrophobic layer is arranged on the whole inner wall surface of the closed cavity formed in the frame glue packaging process, so that moisture and oxygen can be effectively prevented from permeating into the OLED display panel, an OLED device unit is protected, and the service life of the OLED display panel is prolonged.
In a second aspect, the present invention further provides an encapsulating method for an OLED display panel, including the following steps:
(1) coating a circle of hydrophobic material outside the peripheral edge of the corresponding position of each OLED device unit on the uncut packaging cover plate;
(2) coating a circle of frame glue on the outer edge of the hydrophobic material on the uncut packaging cover plate;
(3) pressing the uncut packaging cover plate and the uncut substrate with the OLED device units on the surface, which are subjected to the step (2), together in a pure nitrogen environment, performing illumination heating along the laying path of the frame glue to enable the frame glue to be sintered and packaged, and simultaneously sublimating the hydrophobic material after absorbing heat and depositing the hydrophobic material on the whole inner wall surface of a closed cavity formed among the frame glue, the uncut packaging cover plate, the uncut substrate and the OLED device units to form a hydrophobic layer so as to obtain an OLED display panel packaging structure;
(4) and (4) sending the OLED display panel packaging structure obtained in the step (3) into a cutting device for cutting to obtain the OLED display panel.
Wherein, the hydrophobic material in the step (1) comprises one or more of naphthalene and naphthalene derivatives.
Wherein, the coating thickness of the hydrophobic material in the step (1) is 5-100 μm, and the width is 1-5 mm.
Wherein, the coating thickness of the frame glue in the step (2) is 5-100 μm, and the width is 1-5 mm.
The packaging method of the OLED display panel provided by the second aspect of the invention has simple process, and can obtain a compact and uniform hydrophobic layer on the whole inner wall surface of the closed cavity formed in the frame glue packaging process, thereby effectively preventing water vapor and oxygen from entering the device and prolonging the service life of the OLED display panel; meanwhile, the hydrophobic layer is made of hydrophobic materials, so that heat near the frame glue in the illumination heating process is absorbed, the OLED device unit can be effectively protected from being damaged by temperature generated in the illumination heating process, and the production quality of the product is improved.
The third aspect of the present invention also provides a display device comprising the OLED display panel according to the first aspect of the present invention.
Advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
Fig. 1 is a schematic structural diagram of an OLED display panel according to an embodiment of the present invention;
FIG. 2 is a schematic plan view of an uncut substrate with OLED device cells mounted on its surface according to an embodiment of the present invention;
fig. 3 is a schematic plan view of an uncut package cover plate after the surface is coated with sealant according to the present invention;
fig. 4 is a schematic structural diagram of an OLED display panel package structure provided in the present invention.
Detailed Description
While the following is a description of the preferred embodiments of the present invention, it should be noted that those skilled in the art can make various modifications and improvements without departing from the principle of the embodiments of the present invention, and such modifications and improvements are considered to be within the scope of the embodiments of the present invention.
The embodiment of the invention provides an OLED display panel 100, as shown in fig. 1, which includes a substrate 101, a packaging cover plate 103 and an OLED device unit 102, wherein the substrate 101 and the packaging cover plate 103 are arranged oppositely, the OLED device unit 102 is arranged between the substrate 101 and the packaging cover plate 103, the packaging cover plate 103 and the peripheral edge of the substrate 101 are sealed by a sealant 104, a closed cavity 105 is formed between the sealant 104 and the packaging cover plate 103, the substrate 101 and the OLED device unit 102, and a hydrophobic layer 106 is arranged on the whole inner wall surface of the closed cavity.
In this embodiment, the OLED device unit 102 is stacked on the surface of the substrate 101 and disposed between the substrate 101 and the encapsulating cover plate 103. The OLED device unit 102 is an organic light emitting diode, and may include an anode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a cathode, which are stacked, or other organic light emitting diode structures in the prior art, which is not limited in this embodiment.
In this embodiment, the sealant 104 connects the substrate 101 and the encapsulation cover plate 103 to form a closed structure, that is, a closed cavity 105 is formed between the sealant 104 and the encapsulation cover plate 103, the substrate 101, and the OLED device unit 102. The closed cavity 105 has good sealing performance, can prevent outside moisture and air from entering the interior of the closed cavity, and protects the OLED device unit 102 in the closed cavity from being corroded by moisture and oxygen; meanwhile, the closed cavity 105 can prevent physical damage to the OLED device unit 102 caused by external pressing to some extent. Wherein, the height of the frame glue is 5-100 μm, and the width is 1-5 mm. The sealant 104 may be a UV sealant, a glass sealant, or both a UV sealant and a glass sealant. The height of the sealant 104 is greater than the structural thickness of the OLED device unit 102, and the height of the sealant 104 can be adjusted according to the thickness of the OLED device unit 102, for example, when the structural thickness of the OLED device unit 102 is 50 μm, the height of the sealant 104 can be 55 μm or 60 μm.
In this embodiment, the hydrophobic layer 106 is added on the entire inner wall surface of the closed cavity 105, the entire inner wall of the closed cavity 105 includes a side surface of the OLED device unit 102 away from the substrate 101 and a peripheral side surface thereof, includes a side surface of the encapsulation cover plate 103 close to the OLED device unit 102, includes a side surface of the sealant 104 facing the closed cavity 105, and includes a surface of the substrate 101 facing the closed cavity 105 and not covered by the OLED device unit 102. The hydrophobic layer is composed of a hydrophobic material and comprises one or more of naphthalene and naphthalene derivatives, and the melting point temperature range is 50-100 ℃. The thickness of the hydrophobic layer is 30-100nm, or 30-80nm, or 50-100nm, or 35nm, or 50nm, or 80nm, or 100 nm.
The embodiment of the invention also provides an encapsulation method of the OLED display panel, which can be used for encapsulating the OLED device unit. For example, the encapsulation method of the OLED display panel may be used to encapsulate the OLED device units on the uncut substrate loaded with the OLED device units as shown in fig. 2. As shown in fig. 2, there is shown an uncut substrate 200 having OLED device cells loaded on a surface thereof, the uncut substrate 200 having OLED device cells loaded on a surface thereof includes an uncut substrate 201 and OLED device cells 202 arranged in a 2 × 2 matrix. The OLED device unit 202 is stacked on the same side surface of the uncut substrate 201, and the OLED device unit 202 is a conventional organic light emitting diode. On the same side surface of the uncut substrate 201, several OLED device units 202 arranged in an M × N (where M, N is a natural number) matrix can be simultaneously formed, and only the OLED device units 202 arranged in a 2 × 2 matrix are used in the present embodiment. In addition, the shape of the OLED device unit 202 may be various, including circular, rectangular, trapezoidal and other shapes, and the rectangular shaped OLED device unit is taken as a representative in the present embodiment.
As shown in fig. 3, the method for encapsulating an OLED display panel in this embodiment includes:
(1) coating a circle of hydrophobic material 303 outside the peripheral edge of each OLED device unit corresponding to the position 304 on the uncut encapsulation cover plate 301;
(2) coating a circle of sealant 302 on the outer edge of the hydrophobic material 303 on the uncut package cover plate 301 to obtain an uncut package cover plate 300 with the sealant coated on the surface.
(3) In a pure nitrogen environment, pressing an uncut packaging cover plate 300 with the surface coated with frame glue and an uncut substrate 200 with the surface loaded with OLED device units, performing illumination heating along the laying path of the frame glue 302 to fuse and package the frame glue 302, sublimating a hydrophobic material 303 after absorbing heat, and forming a hydrophobic layer on the whole inner wall surface of a closed cavity formed among the frame glue 302, the uncut packaging cover plate 301, the uncut substrate 201 and the OLED device units 202 to obtain an OLED display panel packaging structure;
(4) and (4) sending the OLED display panel packaging structure obtained in the step (3) into a cutting device for cutting to obtain the OLED display panel.
Wherein, the OLED device unit corresponding position 304 (see fig. 3) in the step (1) is pre-customized and is mapped on the area of the uncut cover plate for the OLED device unit. The OLED device cell corresponding locations 304 in this embodiment are the same as the location distribution of the OLED device cells 202 shown in fig. 2. The hydrophobic material 303 is a hydrophobic material with a low melting point. The hydrophobic material 303 comprises one or more of naphthalene and naphthalene derivatives, and the melting point temperature range is 50-100 ℃. The hydrophobic material 303 sublimes when it reaches a temperature near its melting point. In addition to one or more of naphthalene and naphthalene derivatives, the hydrophobic material 303 in this embodiment further includes other sublimable compounds or mixtures having a melting point of 50-100 ℃ and a hydrophobic oxygen barrier function. In this embodiment, the coating thickness of the hydrophobic material 303 is 5-100 μm, or 5-50 μm, or 5-80 μm, or 10-100 μm, or 8 μm, or 10 μm, or 20 μm. The coating width of the hydrophobic material is 1-5mm, or 1mm, or 3mm, or 5 mm. The distance between the hydrophobic material 303 and the corresponding position 304 of the OLED device unit is 1-10mm, or 2mm, or 3mm, or 5mm, or 8mm, or 10 mm.
The sealant 302 in the step (2) includes one or more of UV sealant and glass sealant, and the coating thickness of the sealant is 5-100 μm, or 5-50 μm, or 5-80 μm, or 10-100 μm, or 8 μm, or 10 μm, or 20 μm. The coating width of the frame glue is 1-5mm, or 1mm, or 3mm, or 5 mm. The distance between the frame glue 302 and the hydrophobic material 303 is 0.1-2mm, or 0.1mm, or 0.5mm, or 1mm, or 1.5mm, or 2 mm. The frame glue can be of a single-layer structure or a multi-layer structure, and the multi-layer structure comprises a multi-layer structure made of the same material or an alternate structure made of different materials; if the sealant 302 includes glass glue and UV glue at the same time, the sealant 302 has a two-layer structure, which includes coating a circle of glass glue (or UV glue) on the outer edge of the hydrophobic material 303 and coating a circle of UV glue (or glass glue) on the outer edge of the glass glue (or UV glue).
In the step (3), the uncut encapsulating cover plate 300 with the surface coated with the sealant and the uncut substrate 200 (see fig. 2) with the surface loaded with the OLED device unit are pressed together, and the OLED device unit 201 is located between the uncut encapsulating cover plate 300 with the surface coated with the sealant and the uncut substrate 200 with the surface loaded with the OLED device unit and is correspondingly matched with the OLED device unit corresponding position 304 in the uncut encapsulating cover plate 300 with the surface coated with the sealant.
In the step (3), the illumination heating may be UV lamp illumination heating or laser illumination heating. When the sealant 302 is UV sealant, the illumination heating may be UV lamp illumination heating; when the sealant 302 is a glass sealant, the illumination heating may be performed by laser irradiation. The spectral range of the laser may be 780-900 nm. When the frame glue is heated by illumination, the frame glue 302 starts to melt, and the uncut packaging cover plate 300 with the frame glue coated on the surface and the uncut substrate 200 with the OLED device units loaded on the surface are connected and sealed to obtain a closed cavity formed among the frame glue 302, the uncut packaging cover plate 301, the uncut substrate 201 and the OLED device units 202; meanwhile, after absorbing the transferred heat, the hydrophobic material 303 disposed near the sealant 302 begins to sublimate, and condenses on the entire inner wall of the closed cavity to form a hydrophobic layer. The hydrophobic material 303 can absorb heat near the frame adhesive 302 in the illumination heating process, effectively protect the unit structure of the OLED device from temperature damage when being heated by illumination, and can be condensed on the whole inner wall of the whole closed cavity to form a hydrophobic layer, so that moisture and oxygen can be effectively prevented from entering the unit structure of the OLED device, and the service life of the OLED display panel is prolonged.
Wherein, the step (3) can be performed under other oxygen-free and water-free environmental conditions besides pure nitrogen environmental conditions, including inert gas environment, etc.
In the step (4), as shown in fig. 4, the OLED display panel package structure is cut by a cutting device along a cutting position shown by a cutting dotted line 305, where the cutting position shown by the cutting dotted line 305 is on a side edge of the sealant 302 away from the OLED device unit 202. Here, in the present embodiment, the distance between the cutting position indicated by the cutting dashed line 305 and the sealant is not particularly limited. The OLED display panel obtained after cutting is the OLED display panel shown in fig. 1. In addition, when only 1 × 1 OLED device unit is formed on the same side surface of the uncut substrate, the step (4) may be omitted, or the substrate may be cut along the outer edge of the sealant in a cutting device, and the OLED display panel as shown in fig. 1 is obtained.
It should be noted that, according to the disclosure and the explanation of the above description, the person skilled in the art to which the present invention pertains may make variations and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some equivalent modifications and variations of the present invention should be covered by the protection scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (7)
1. The packaging method of the OLED display panel is characterized by comprising the following steps:
(1) coating a circle of hydrophobic material outside the peripheral edge of the corresponding position of each OLED device unit on the uncut packaging cover plate;
(2) coating a circle of frame glue on the outer edge of the hydrophobic material on the uncut packaging cover plate;
(3) pressing the uncut packaging cover plate and the uncut substrate with the OLED device units on the surface, which are subjected to the step (2), together in a pure nitrogen environment, performing illumination heating along the laying path of the frame glue to enable the frame glue to be sintered and packaged, and simultaneously sublimating the hydrophobic material after absorbing heat and depositing the hydrophobic material on the whole inner wall surface of a closed cavity formed among the frame glue, the uncut packaging cover plate, the uncut substrate and the OLED device units to form a hydrophobic layer so as to obtain an OLED display panel packaging structure;
(4) and (4) sending the OLED display panel packaging structure obtained in the step (3) into a cutting device for cutting to obtain the OLED display panel.
2. The encapsulation method of claim 1, wherein the hydrophobic material of step (1) comprises one or more of naphthalene and naphthalene derivatives.
3. The encapsulation method according to claim 1, wherein the hydrophobic material is coated in the step (1) to have a thickness of 5 to 100 μm and a width of 1 to 5 mm.
4. The packaging method according to claim 1, wherein the sealant in the step (2) is coated to a thickness of 5-100 μm and a width of 1-5 mm.
5. An OLED display panel, wherein the OLED display panel is manufactured by the encapsulation method according to any one of claims 1 to 4;
the packaging structure comprises a substrate, a packaging cover plate and an OLED device unit, wherein the substrate and the packaging cover plate are arranged oppositely, the OLED device unit is arranged between the substrate and the packaging cover plate, the packaging cover plate and the peripheral edge of the substrate are sealed through frame glue, a closed cavity is formed among the frame glue, the packaging cover plate, the substrate and the OLED device unit, a hydrophobic layer is arranged on the whole inner wall surface of the closed cavity, and the hydrophobic layer comprises a hydrophobic material; the hydrophobic material comprises one or more of naphthalene and naphthalene derivatives; the thickness of the hydrophobic layer is 30-100 nm.
6. The OLED display panel of claim 5, wherein said hydrophobic material has a melting point of 50-100 ℃.
7. The OLED display panel of claim 5, wherein the sealant comprises one or more of UV glue and glass glue.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711345922.6A CN108123065B (en) | 2017-12-15 | 2017-12-15 | OLED display panel and packaging method thereof |
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| CN201711345922.6A CN108123065B (en) | 2017-12-15 | 2017-12-15 | OLED display panel and packaging method thereof |
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| CN108123065B true CN108123065B (en) | 2020-06-05 |
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| CN109585681B (en) * | 2018-12-05 | 2021-01-22 | 京东方科技集团股份有限公司 | Display panel, packaging method thereof and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1617636A (en) * | 2003-11-12 | 2005-05-18 | 铼宝科技股份有限公司 | Organic luminous panel with hydrophobic layer |
| CN105609660A (en) * | 2016-03-22 | 2016-05-25 | 京东方科技集团股份有限公司 | OLED display panel, encapsulating method of OLED display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP1494296A1 (en) * | 2003-07-04 | 2005-01-05 | CFG S.A.Microelectronic | Electroluminescent device |
| CN100587998C (en) * | 2003-11-12 | 2010-02-03 | 铼宝科技股份有限公司 | Organic luminous panel with hydrophobic layer |
| CN110085767A (en) * | 2013-12-18 | 2019-08-02 | 上海天马有机发光显示技术有限公司 | A kind of organic light-emitting display device of hydrophobic organic film encapsulation |
| CN104157798A (en) * | 2014-08-21 | 2014-11-19 | 深圳市华星光电技术有限公司 | Packaging method and structure of OLED |
| CN104201295B (en) * | 2014-09-16 | 2017-05-03 | 深圳市华星光电技术有限公司 | OLED (organic LED) packaging method and OLED structure |
| CN104282728B (en) * | 2014-10-10 | 2017-03-15 | 深圳市华星光电技术有限公司 | A kind of white light OLED display and its method for packing |
| CN105185922B (en) * | 2015-06-12 | 2018-09-21 | 合肥京东方光电科技有限公司 | A kind of encapsulating structure and packaging method, OLED device |
| CN104966726A (en) * | 2015-07-03 | 2015-10-07 | 深圳市华星光电技术有限公司 | OLED display panel and packaging method thereof |
| CN105140420A (en) * | 2015-07-07 | 2015-12-09 | 深圳市华星光电技术有限公司 | OLED (organic light-emitting diode) display panel and packaging method thereof |
| CN105609538B (en) * | 2016-03-29 | 2020-03-27 | Tcl集团股份有限公司 | Top-emission type display panel and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1617636A (en) * | 2003-11-12 | 2005-05-18 | 铼宝科技股份有限公司 | Organic luminous panel with hydrophobic layer |
| CN105609660A (en) * | 2016-03-22 | 2016-05-25 | 京东方科技集团股份有限公司 | OLED display panel, encapsulating method of OLED display panel and display device |
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