CN108123065A - A kind of OLED display panel and its method for packing - Google Patents
A kind of OLED display panel and its method for packing Download PDFInfo
- Publication number
- CN108123065A CN108123065A CN201711345922.6A CN201711345922A CN108123065A CN 108123065 A CN108123065 A CN 108123065A CN 201711345922 A CN201711345922 A CN 201711345922A CN 108123065 A CN108123065 A CN 108123065A
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- China
- Prior art keywords
- display panel
- oled display
- cover plate
- frame glue
- encapsulation cover
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of OLED display panels, including the substrate and encapsulation cover plate being oppositely arranged, and it is arranged at the OLED device unit between the substrate and the encapsulation cover plate, the encapsulation cover plate is sealed with the substrate edge by frame glue, a closed cavity is formed between the frame glue and the encapsulation cover plate, the substrate and the OLED device unit, the entire inner wall surface of the closed cavity is equipped with hydrophobic layer, and the hydrophobic layer includes hydrophobic material.The OLED display panel; hydrophobic layer is set by the entire inner wall surface of the closed cavity formed in frame glue encapsulation process; aqueous vapor can effectively be obstructed and oxygen penetrates into OLED display panel, so as to protect OLED device unit, improve the service life of OLED display panel.The present invention also provides a kind of method for packing of OLED display panel.
Description
Technical field
The present invention relates to technical field of display panel more particularly to a kind of OLED display panel and its method for packing.
Background technology
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display panel is spontaneous by its
The features such as light, visual angle is wide, long lifespan, energy conservation and environmental protection becomes one of display technology most with prospects at present, and gradually comes into
The consumer electronics markets such as mobile equipment, television set.
OLED device belongs to " sandwich " structure, and organic luminous layer is clipped in the middle by electrode, to the aqueous vapor in air and
Oxygen is very sensitive, easily reacts with aqueous vapor or oxygen, influences luminescent properties and service life.Therefore, OLED device need into
The stringent encapsulation process of row.
However in the prior art, the ability that the OLED display panel encapsulated by frame glue obstructs aqueous vapor and oxygen is limited,
The service life of OLED display panel is short；In addition, the cure package of frame glue is easy to cause heat usually using illumination heating stepses
It is excessively high, influence the function of OLED device；And use the illumination mode of heating of air cooling way, then it can cause curing process time mistake
It is long, it is unfavorable for volume production.
The content of the invention
In view of this, the present invention provides a kind of OLED display panel and its method for packing, can effectively obstruct aqueous vapor and
Oxygen improves the luminous service life of OLED display panel.
In a first aspect, the present invention provides a kind of flexible OLED display panel, including the substrate and cap being oppositely arranged
Plate and the OLED device unit being arranged between the substrate and the encapsulation cover plate, the encapsulation cover plate and the substrate
Edge is sealed by frame glue, the frame glue and the encapsulation cover plate, the substrate and the OLED device unit
Between form a closed cavity, the entire inner wall surface of the closed cavity is equipped with hydrophobic layer, and the hydrophobic layer includes hydrophobic
Material.
Wherein, the hydrophobic layer is made of hydrophobic material, and melting range is 50-100 DEG C.
Wherein, the hydrophobic material includes the one or more in naphthalene and naphthalene derivatives.
Wherein, the thickness of the hydrophobic layer is 30-100nm.
Wherein, the frame glue includes the one or more of UV glue and glass cement.
The OLED display panel that first aspect present invention provides passes through the closed cavity that is formed in frame glue encapsulation process
Entire inner wall surface sets hydrophobic layer, can effectively obstruct aqueous vapor and oxygen penetrates into OLED display panel, so as to protect
OLED device unit improves the service life of OLED display panel.
Second aspect, the present invention also provides a kind of method for packing of OLED display panel, comprise the following steps：
(1) it is coated with one outside the edge of each OLED device unit corresponding position on uncut encapsulation cover plate
Enclose hydrophobic material；
(2) the hydrophobic material outer ledge on the uncut encapsulation cover plate is coated with a ring box glue；
(3) under pure nitrogen gas environment, the uncut encapsulation cover plate for completing step (2) and surface are loaded with OLED
The uncut substrate of device cell mutually presses, and carries out illumination heating along the layout path of the frame glue so that frame glue clinkering is simultaneously
Encapsulation, at the same the hydrophobic material absorb heat after distil, and be deposited on by the frame glue, the uncut encapsulation cover plate,
The entire inner wall surface of the closed cavity formed between the uncut substrate and the OLED device unit is formed
Hydrophobic layer obtains OLED display panel encapsulating structure；
(4) cutting in the feeding cutting equipment of OLED display panel encapsulating structure described in step (3) is obtained OLED to show
Panel.
Wherein, hydrophobic material includes the one or more in naphthalene and naphthalene derivatives in the step (1).
Wherein, the coating thickness of hydrophobic material described in the step (1) is 5-100 μm, width 1-5mm.
Wherein, the coating thickness of frame glue described in the step (2) is 5-100 μm, width 1-5mm.
The method for packing for the OLED display panel that second aspect of the present invention provides, it is simple for process, it can be in frame glue encapsulation process
The entire inner wall surface of the closed cavity of middle formation obtains the hydrophobic layer of one layer of dense uniform, so as to effectively obstruct aqueous vapor and oxygen
Into in device, the service life of OLED display panel is improved；The hydrophobic layer is that hydrophobic material is absorbed and added in illumination simultaneously
Heat in thermal process near frame glue generates the damage of temperature, carries when can effectively protect OLED device unit is not heated by illumination
The quality of production of high product.
Third aspect present invention additionally provides a kind of display device, including the OLED display surfaces described in first aspect present invention
Plate.
Advantages of the present invention will be illustrated partly in the following description, and a part is apparent according to specification
Or can be known by the implementation of the embodiment of the present invention.
Description of the drawings
Fig. 1 is a kind of structure diagram of OLED display panel provided in an embodiment of the present invention；
Fig. 2 is the plane signal for the uncut substrate that surface provided in an embodiment of the present invention is loaded with OLED device unit
Figure；
Fig. 3 be surface provided by the invention be coated with frame glue after uncut encapsulation cover plate floor map；
Fig. 4 is the structure diagram of OLED display panel encapsulating structure provided by the invention.
Specific embodiment
As described below is the preferred embodiment of the embodiment of the present invention, it is noted that for the common skill of the art
For art personnel, on the premise of principle of the embodiment of the present invention is not departed from, several improvements and modifications can also be made, these improvement
The protection domain of the embodiment of the present invention is also considered as with retouching.
An embodiment of the present invention provides a kind of OLED display panel 100, as shown in Figure 1, including the substrate 101 being oppositely arranged
With encapsulation cover plate 103 and the OLED device unit 102 being arranged between the substrate 101 and the encapsulation cover plate 103, institute
It states encapsulation cover plate 103 to seal by frame glue 104 with 101 surrounding edge of substrate, the frame glue 104 and the encapsulation cover plate
103rd, a closed cavity 105, the closed cavity are formed between the substrate 101 and the OLED device unit 102 4
Entire inner wall surface is equipped with hydrophobic layer 106.
In the present embodiment, the OLED device unit 102 is stacked on 101 surface of substrate, and is arranged at described
Between substrate 101 and the encapsulation cover plate 103.The OLED device unit 102 is Organic Light Emitting Diode, it may include stacking is set
Anode, electric hole implanted layer, electric hole transport layer, organic luminous layer, electron transfer layer, electron injecting layer and the cathode put are existing
There are other organic LED structures in technology, the present embodiment does not do further restriction.
In the present embodiment, substrate 101 is connected by the frame glue 104 with encapsulation cover plate 103, and forms the structure of closing, i.e.,
A closed cavity 105 is formed between the frame glue 104 and encapsulation cover plate 103, substrate 101 and OLED device unit 102 4.
The closed cavity 105 has good sealing performance, can obstruct extraneous aqueous vapor and air enters inside it, protect in it
The OLED device unit 102 in portion is not by the erosion of aqueous vapor and oxygen；Closed cavity 105 a degree of can prevent outside simultaneously
It squeezes to physical damnification caused by the OLED device unit 102.Wherein, the height of the frame glue is 5-100 μm, width 1-
5mm.The frame glue 104 can be UV glue or be glass cement or include UV glue and glass cement simultaneously.Wherein, the frame glue 104
Height be more than the structural thickness of the OLED device unit 102, and the height of the frame glue 104 can be according to the OLED
The thickness of device cell 102 is adjusted correspondingly, such as when the structural thickness of OLED device unit 102 is at 50 μm, it is described
The height of frame glue 104 can be 55 μm or be 60 μm.
In the present embodiment, the entire inner wall surface of the closed cavity 105 all has additional hydrophobic layer 106, and the closing is empty
The entire inner wall of chamber 105 includes OLED device unit 102 side surface and its surrounding side away from substrate 101, including encapsulation
Cover board 103, including frame glue 104 towards a side surface of closed cavity 105, is wrapped close to a side surface of OLED device unit 102
The surface that substrate 101 is included towards closed cavity 105 and is not covered by OLED device unit 102.The hydrophobic layer is by hydrophobic material
Composition, including the one or more in naphthalene and naphthalene derivatives, melting range is 50-100 DEG C.The thickness of the hydrophobic layer is
30-100nm is 30-80nm or is 50-100nm or is 35nm or is 50nm or is 80nm or is 100nm.
The embodiment of the present invention additionally provides a kind of method for packing of the OLED display panel of above-described embodiment, available for encapsulating
OLED device unit.Such as the method for packing of the OLED display panel can be used for encapsulation it is as shown in Figure 2 be loaded with OLED devices
OLED device unit on the uncut substrate of part unit.As shown in Fig. 2, illustrating a kind of surface is loaded with OLED device list
The uncut substrate 200 of member, the uncut substrate 200 that the surface is loaded with OLED device unit include uncut base
Plate 201 and the OLED device unit 202 in 2 × 2 matrix arrangements.The OLED device unit 202 is stacked not to be cut described
On the 201 same side surface of substrate cut, the OLED device unit 202 is existing conventional Organic Light Emitting Diode, of the invention
The above has been mentioned, and details are not described herein again.It is that can be formed simultaneously several in the same side surface of uncut substrate 201
In the OLED device unit 202 of M × N (wherein M, N are natural number) matrix arrangement, 2 × 2 matrix arrangements are used only in the present embodiment
OLED device unit 202.In addition, the shape of the OLED device unit 202 can be varied, including circle, rectangle, trapezoidal
And other shapes, using the OLED device unit of rectangular shape as representing in the present embodiment.
As shown in figure 3, the method for packing of OLED display panel described in the present embodiment includes：
(1) outside the edge at each OLED device unit correspondence position 304 on uncut encapsulation cover plate 301
One circle hydrophobic material 303 of coating；
(2) 303 outer ledge of the hydrophobic material on the uncut encapsulation cover plate 301 is coated with a ring box glue
302, obtain the uncut encapsulation cover plate 300 after surface coating frame glue.
(3) under pure nitrogen gas environment, the uncut encapsulation cover plate 300 and surface that surface are coated with after frame glue are loaded with
200 phase of the uncut substrate pressing of OLED device unit carries out illumination heating along the layout path of the frame glue 302 so that
302 clinkering of frame glue simultaneously encapsulates, at the same hydrophobic material 303 absorb heat after distil, and by the frame glue 302, described do not cut
Encapsulation cover plate 301, the closing that is formed between the uncut substrate 201 and the OLED device unit 202 4 it is empty
The entire inner wall surface of chamber forms hydrophobic layer, obtains OLED display panel encapsulating structure；
(4) cutting in the feeding cutting equipment of OLED display panel encapsulating structure described in step (3) is obtained OLED to show
Panel.
Wherein, OLED device unit correspondence position 304 (see Fig. 3) customizes in advance described in the step (1), is
OLED device unit is mapped in the region do not cut on cover board.The correspondence position of OLED device unit described in the present embodiment
304 be that the position distribution of the OLED device unit 202 with being shown described in Fig. 2 is identical.The hydrophobic material 303 is a kind of
The hydrophobic material of low melting point.The hydrophobic material 303 includes the one or more in naphthalene and naphthalene derivatives, and melting range is
50-100℃.The hydrophobic material 303 can generate distillation when reaching temperature near its fusing point.It is hydrophobic described in present embodiment
For material 303 in addition to including the one or more in naphthalene and naphthalene derivatives, further including other has the function of the molten of hydrophobic resistance oxygen
Sublimable compound or mixture of the point at 50-100 DEG C.The coating thickness of hydrophobic material 303 described in the present embodiment is 5-
100 μm or it is 5-50 μm or is 5-80 μm or is 10-100 μm or is 8 μm or is 10 μm or is 20 μm.The hydrophobic material
The coating width of material is 1-5mm or is 1mm or is 3mm or is 5mm.The hydrophobic material 303 and the OLED device unit
The distance of correspondence position 304 is 1-10mm or is 2mm or is 3mm or is 5mm or is 8mm or is 10mm.
Wherein, frame glue 302 described in the step (2) includes the one or more of UV glue and glass cement, the frame glue
Coating thickness is 5-100 μm or is 5-50 μm or is 5-80 μm or is 10-100 μm or is 8 μm or is 10 μm or is 20 μ
m.The coating width of the frame glue is 1-5mm or is 1mm or is 3mm or is 5mm.The frame glue 302 and the hydrophobic material
303 distance is 0.1-2mm or is 0.1mm or is 0.5mm or is 1mm or is 1.5mm or is 2mm.The frame glue can be with
It is single layer structure or multilayered structure, the multilayered structure is included between the multilayered structure or different materials of same material
Every alternating structure；If the frame glue 302 includes glass cement and UV glue simultaneously, the frame glue 302 has double-layer structure, is included in institute
It states 303 outer ledge of hydrophobic material coating, one circle glass cement (or UV glue) and is applied in the outer ledge of the glass cement (or UV glue)
Cloth one encloses UV glue (or glass cement).
Wherein, in the step (3), the surface is coated with to the uncut encapsulation cover plate 300 after frame glue and is filled with surface
The uncut substrate 200 (see Fig. 2) of OLED device unit is carried mutually to followed by pressing, the OLED device unit
The 201 uncut encapsulation cover plate 300 after surface coating frame glue is loaded with not cutting for OLED device unit with surface
Substrate 200 between, and with the surface be coated with frame glue after uncut encapsulation cover plate 300 in the OLED device unit
The corresponding matching in position of correspondence position 304.
Wherein, in the step (3), the illumination heating may be employed UV lamp illumination heating or be added using laser irradiation
Heat.When the frame glue 302 is UV glue, UV lamp illumination heating may be employed in the illumination heating；When the frame glue 302 is glass
Laser irradiation heating may be employed in the illumination heating during glue.The spectral region of the laser can be 780-900nm.Work as progress
Illumination heat when, the frame glue 302 starts to melt, and by the surface be coated with frame glue after uncut encapsulation cover plate 300 with
The uncut substrate 200 that surface is loaded with OLED device unit is attached sealing, obtain by the frame glue 302, it is described not
The envelope formed between the encapsulation cover plate 301 of cutting, the uncut substrate 201 and the OLED device unit 202 4
Close cavity；Meanwhile after being arranged on the heat that the absorption of the hydrophobic material 303 near the frame glue 302 passes over, start to rise
China, and the closed cavity entire condensed on inner walls and form hydrophobic layer.The hydrophobic material 303 can both absorb
Heat in illumination heating process near frame glue 302 effectively protects OLED device cellular construction to generate temperature when not heated by illumination
Degree damage, and in the entirely entire condensed on inner walls of the closed cavity and hydrophobic layer can be formed, effectively obstruct aqueous vapor and oxygen
Gas enters in OLED device cellular construction, improves the service life of OLED display panel.
Wherein, the step (3), in addition to it can be carried out under pure nitrogen gas environmental condition, can also other anaerobics without
The environmental condition of water carries out, and it is inferior to be included in inert gas environment.
Wherein, in the step (4), the OLED display panel encapsulating structure is as shown in figure 4, with cutting equipment along cutting
It cuts the cutting position shown in dotted line 305 to be cut, the cutting position shown in the cutting dotted line 305 is in the frame glue 302
One side edge away from OLED device unit 202.Herein, the present embodiment to it is described cutting dotted line 305 shown in cutting position away from
Size is not specially limited with a distance from the frame glue.The OLED display panel obtained after after cutting is as shown in Figure 1
OLED display panel.In addition, when only forming 1 × 1 OLED device unit in the same side surface of uncut substrate, institute
It states step (4) and is dispensed or is placed in cutting equipment and cut along the outer ledge of frame glue, and obtain such as Fig. 1
Shown OLED display panel.
It should be noted that the announcement and elaboration of book, those skilled in the art in the invention may be used also according to the above description
To change and change to the above embodiment.Therefore, the invention is not limited in specific implementations disclosed and described above
Mode, some equivalent modifications and change to the present invention should also be as within the scope of the claims of the present invention.In addition,
Although having used some specific terms in this specification, these terms merely for convenience of description, not to structure of the present invention
Into any restrictions.
Claims (10)
1. a kind of OLED display panel, which is characterized in that including the substrate being oppositely arranged and encapsulation cover plate and be arranged at described
OLED device unit between substrate and the encapsulation cover plate, the encapsulation cover plate and the substrate edge are close by frame glue
Envelope, a closed cavity is formed between the frame glue and the encapsulation cover plate, the substrate and the OLED device unit,
The entire inner wall surface of the closed cavity is equipped with hydrophobic layer, and the hydrophobic layer includes hydrophobic material.
2. OLED display panel as described in claim 1, which is characterized in that the fusing point of the hydrophobic material is 50-100 DEG C.
3. OLED display panel as claimed in claim 1 or 2, which is characterized in that the hydrophobic material includes naphthalene and naphthalene derives
One or more in object.
4. OLED display panel as described in claim 1, which is characterized in that the thickness of the hydrophobic layer is 30-100nm.
5. OLED display panel as described in claim 1, which is characterized in that the frame glue includes one kind of UV glue and glass cement
It is or a variety of.
6. a kind of method for packing of OLED display panel, which is characterized in that comprise the following steps：
(1) one circle of coating is dredged outside the edge of each OLED device unit corresponding position on uncut encapsulation cover plate
Water material；
(2) the hydrophobic material outer ledge on the uncut encapsulation cover plate is coated with a ring box glue；
(3) under pure nitrogen gas environment, the uncut encapsulation cover plate for completing step (2) and surface are loaded with OLED device
The uncut substrate of unit mutually presses, and illumination heating is carried out along the layout path of the frame glue so that and frame glue clinkering simultaneously encapsulates,
The hydrophobic material distils after absorbing heat simultaneously, and be deposited on by the frame glue, the uncut encapsulation cover plate, it is described not
The entire inner wall surface of the closed cavity formed between the substrate of cutting and the OLED device unit forms hydrophobic layer,
Obtain OLED display panel encapsulating structure；
(4) OLED display panel encapsulating structure described in step (3) is sent into cutting in cutting equipment and obtains OLED display panel.
7. method for packing as claimed in claim 6, which is characterized in that hydrophobic material includes naphthalene in the step (1) and naphthalene spreads out
One or more in biology.
8. method for packing as claimed in claim 6, which is characterized in that the coating of hydrophobic material described in the step (1) is thick
It spends for 5-100 μm, width 1-5mm.
9. method for packing as claimed in claim 6, which is characterized in that the coating thickness of frame glue is described in the step (2)
5-100 μm, width 1-5mm.
10. a kind of display device, which is characterized in that including the OLED display panel described in claim 1-5 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711345922.6A CN108123065B (en) | 2017-12-15 | 2017-12-15 | OLED display panel and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711345922.6A CN108123065B (en) | 2017-12-15 | 2017-12-15 | OLED display panel and packaging method thereof |
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| CN108123065A true CN108123065A (en) | 2018-06-05 |
| CN108123065B CN108123065B (en) | 2020-06-05 |
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Also Published As
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| CN108123065B (en) | 2020-06-05 |
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