CN108123011A - Laser making herbs into wool equipment and its method - Google Patents
Laser making herbs into wool equipment and its method Download PDFInfo
- Publication number
- CN108123011A CN108123011A CN201810025680.0A CN201810025680A CN108123011A CN 108123011 A CN108123011 A CN 108123011A CN 201810025680 A CN201810025680 A CN 201810025680A CN 108123011 A CN108123011 A CN 108123011A
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- Prior art keywords
- laser
- silicon chip
- wool
- making herbs
- processing
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- 235000008216 herbs Nutrition 0.000 title claims abstract description 48
- 210000002268 wool Anatomy 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 115
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 115
- 239000010703 silicon Substances 0.000 claims abstract description 115
- 230000007246 mechanism Effects 0.000 claims abstract description 67
- 238000007599 discharging Methods 0.000 claims abstract description 20
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000000694 effects Effects 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 238000007514 turning Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000284 extract Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention relates to laser making herbs into wool equipment and methods, include pedestal, silicon chip conveying mechanism, silicon chip charging-discharging machine structure, laser mirror seat supports mechanism and laser parallel system of processing, silicon chip conveying mechanism is placed on pedestal, silicon chip charging-discharging machine structure and laser mirror seat supports mechanism are spaced apart around silicon chip conveying mechanism on pedestal, and laser parallel system of processing is installed in laser mirror seat supports mechanism.Using silicon chip charging-discharging machine structure to silicon chip automatic loading/unloading, drive silicon chip is intermittent to rotate by silicon chip conveying mechanism, realize automation processing;Laser parallel system of processing performs etching silicon chip, and light trapping structure is formed in silicon chip surface;By the way that silicon chip is divided into multiple regions, processing on a large scale is realized;Parallel fabrication is carried out to division region using multigroup scanning galvanometer, improves making herbs into wool efficiency.
Description
Technical field
The present invention relates to a kind of laser making herbs into wool equipment and its methods, belong to Laser Processing equipment technical field.
Background technology
At present, photovoltaic generation is increasingly popularized in recent years, and the market demand of crystal silicon solar batteries is continuously increased.In crystalline substance
In the manufacturing process of silion cell, in order to reduce the reflectivity of silicon chip surface, making herbs into wool processing links are added.In existing making herbs into wool side
In method, chemical attack making herbs into wool is used as mass producing because at low cost.But chemical attack making herbs into wool subtracts silicon chip surface
Minus effect is not fairly obvious.Laser making herbs into wool technology has many advantages, such as that noncontact procession, matte pattern are easily controllable, can be with
It is effectively reduced silicon chip surface reflectivity.The application of chemical attack making herbs into wool is very universal, and substantial amounts of silicon chip is inserted into
In film magazine, while immerse in corrosive liquid and corroded.Laser ablation needs to process silicon chip one by one, therefore chemical attack system
Suede equipment is not particularly suited for laser making herbs into wool.And since laser ablation silicon chip needs monolithic to process, result in making herbs into wool efficiency very
Lowly, laser making herbs into wool technological industrialization application is affected.
The content of the invention
The purpose of the present invention is overcoming the shortcomings of the prior art, a kind of laser making herbs into wool equipment and its method are provided.
The purpose of the present invention is achieved through the following technical solutions:
Laser making herbs into wool is equipped, and feature is:Include pedestal, silicon chip conveying mechanism, silicon chip charging-discharging machine structure, laser mirror seat supports
Mechanism and laser parallel system of processing, silicon chip conveying mechanism are placed on pedestal, silicon chip charging-discharging machine structure and laser mirror seat supports
Mechanism is spaced apart around silicon chip conveying mechanism on pedestal, and laser parallel system of processing is installed in laser mirror seat supports mechanism.
Further, above-mentioned laser making herbs into wool equipment, wherein, the silicon chip conveying mechanism includes turntable and silicon chip fixes dress
It puts, power unit is drivingly connected with turntable, and driving disc does intermittent circular motion on pedestal, positioning is provided on turntable
Hole, fixing device for silicon piece are installed on by location hole on turntable, and fixing device for silicon piece is equipped with card slot.
Further, above-mentioned laser making herbs into wool equipment, wherein, the silicon chip charging-discharging machine structure includes mechanism supports frame, gas
Dynamic telescopic rod, sliding block, sucker, leading screw and guide rail, mechanism supports frame upper mounting rail, sliding block are placed on guide rail, leading screw and cunning
Block is sequentially connected, it is driven to move along a straight line along guide rail, and Pneumatic extension bar is installed on sliding block, and the end installation of Pneumatic extension bar is inhaled
Disk.
Further, above-mentioned laser making herbs into wool equipment, wherein, the laser mirror seat supports mechanism includes support plate and microscope base
Fixed plate, microscope base fixed plate are installed on slip connection mode in support plate, can be moved on it, and microscope base fixed plate is equipped with mirror
Bore and for laser beam by laser light incident hole.
Further, above-mentioned laser making herbs into wool equipment, wherein, the laser parallel system of processing includes laser, expands
Mirror, spectroscope module, reflective mirror module and scanning galvanometer, laser lens combination light path output arrangement beam expanding lens, beam expanding lens it is defeated
Spectroscope module is arranged in light extraction road, and reflective mirror module, the reflection of reflective mirror module are arranged on the output light path of spectroscope module
Scanning galvanometer is arranged in light path.
Further, above-mentioned laser making herbs into wool equipment, wherein, the spectroscope module includes multigroup spectroscope, quantity
It is equal with the number in silicon chip division region.
Silicon chip is delivered on silicon chip conveying mechanism, silicon chip by the method for laser making herbs into wool of the present invention by silicon chip charging-discharging machine structure
Conveying mechanism provides power by power unit, and at the uniform velocity equal angular intermittent movement is done on pedestal;
The laser of laser parallel system of processing provides the required laser beam of making herbs into wool, and the laser launched is by beam expanding lens pair
It is collimated and is expanded, and improves the collimation of laser, reduces the angle of divergence of light beam, the diameter of expanded beam, then by being divided
Beam of laser is divided into multiple branches by mirror module, and each branch incides into scanning galvanometer by the reflection of reflective mirror module, shakes in scanning
Under the driving effect of the probe of mirror, laser beam shifts action, and laser beam forms sunken in Surface machining of silicon wafer, silicon chip surface
Photo structure achievees the purpose that reduce reflection.
Further, the method for above-mentioned laser making herbs into wool, wherein, the scanning galvanometer and laser mirror seat supports mechanism
Microscope base fixed plate connects, and laser beam injects scanning galvanometer by the laser light incident hole in microscope base fixed plate.
Further, the method for above-mentioned laser making herbs into wool, wherein, the quantity of the laser mirror seat supports mechanism according to plus
The area of work silicon chip is set, quantity N, and the angle between adjacent mechanism is 360/N+2 degree, and silicon chip conveying mechanism turns over every time
Angle is 360/N+2 degree.
The present invention has significant advantages and beneficial effects compared with prior art, embodies in the following areas:
1. the present invention utilizes silicon chip charging-discharging machine structure to silicon chip automatic loading/unloading, by between silicon chip conveying mechanism drive silicon chip
Having a rest property rotates, and realizes automation processing;
2. laser parallel system of processing performs etching silicon chip, light trapping structure is formed in silicon chip surface;By the way that silicon chip is drawn
It is divided into multiple regions, realizes processing on a large scale;
3. carrying out parallel fabrication to division region using multigroup scanning galvanometer, making herbs into wool efficiency is improved;It solves because laser
Etching is necessary for monolithic and etches the problem of making herbs into wool efficiency brought is low, so as to significantly improve the production efficiency of laser making herbs into wool, promotes
The industrialized development of laser making herbs into wool.
Description of the drawings
Fig. 1:The structure diagram that the present invention equips;
Fig. 2:The structure diagram of silicon chip conveying mechanism;
Fig. 3:The structure diagram of silicon chip charging-discharging machine structure;
Fig. 4:The structure diagram of laser mirror seat supports mechanism;
Fig. 5:The light path principle schematic diagram of laser parallel system of processing.
Specific embodiment
In order to which the technical features, objects and effects to the present invention are more clearly understood, specific implementation is now described in detail
Scheme.
As shown in Figure 1, laser making herbs into wool equip, comprising pedestal 100, silicon chip conveying mechanism 200, silicon chip charging-discharging machine structure 300,
Laser mirror seat supports mechanism 400 and laser parallel system of processing 500, silicon chip conveying mechanism 200 are placed on pedestal 100, silicon chip
Charging and discharging mechanism 300 and laser mirror seat supports mechanism 400 are circumferentially spaced in pedestal 100 around silicon chip conveying mechanism 200
On, laser parallel system of processing 500 is installed, laser parallel system of processing 500 carries out silicon chip in laser mirror seat supports mechanism 400
Etching forms light trapping structure in silicon chip surface.
As shown in Fig. 2, silicon chip conveying mechanism 200 includes turntable 201 and fixing device for silicon piece 203, power unit and turntable
201 are drivingly connected, and driving disc 201 does intermittent circular motion on pedestal 100, location hole 202 is provided on turntable 201,
Fixing device for silicon piece 203 is installed on by location hole 202 on turntable 201, and fixing device for silicon piece 203 is equipped with card slot, can be incited somebody to action
Silicon chip is conveniently located at card slot without deviating.Power is provided by servomotor or stepper motor, turntable 201 is in pedestal
Intermittent circular motion is done on 100.
As shown in figure 3, silicon chip charging-discharging machine structure 300 includes mechanism supports frame 301, Pneumatic extension bar 303, sliding block 304, suction
Disk 305, leading screw 306 and guide rail 307,301 upper mounting rail 307 of mechanism supports frame, sliding block 304 are placed on guide rail 307, leading screw
306 are sequentially connected with sliding block 304, it is driven to move along a straight line along guide rail 307, Pneumatic extension bar 303 are installed on sliding block 304, pneumatically
The end installation sucker 305 of telescopic rod 303.The bottom of mechanism supports frame 301 is equipped with floor 302.
Silicon chip is drawn by sucker 305, then Pneumatic extension bar 303, which is shunk, extracts silicon chip, then drives and slide by leading screw 306
Block 304 is moved along guide rail 307, is treating to transmit between making herbs into wool area and fixing device for silicon piece 203 so as to fulfill by silicon chip.
As shown in figure 4, laser mirror seat supports mechanism 400 includes support plate 401 and microscope base fixed plate 402, microscope base fixed plate
402 are installed on slip connection mode in support plate 401, can be moved on it, and microscope base fixed plate 402 is equipped with microscope base hole 403
And for laser beam by laser light incident hole 404.Microscope base hole 403 is used for fixed counter-mirror microscope base, it is therefore an objective to by laser
The laser beam emitted is reflected into scanning galvanometer after beam expanding lens and spectroscope.Laser light incident hole 404 is convenient for reflection
Laser beam passes through.Scanning galvanometer for processing silicon chip obtains required laser beam by laser light incident hole 404.Microscope base is fixed
Position of the plate 402 in support plate 401 can be determined by the parameter of scanning galvanometer.
The quantity of laser mirror seat supports mechanism 400 is set according to the area of processing silicon chip, quantity N, between adjacent mechanism
Angle be 360/N+2 degree, the angle that silicon chip conveying mechanism 200 turns over every time is 360/N+2 degree.
Using common p-type polysilicon silicon chip as processing object, specification is the ㎜ of 156 ㎜ × 156, in order to realize on a large scale
High efficiency is processed, and silicon chip is divided into 3 regions, each region corresponds to a laser mirror seat supports mechanism 400, then needs are set
Put 3 laser mirror seat supports mechanisms, the angle between adjacent mechanism is 72 degree, and correspondingly, silicon chip conveying mechanism 200 turns over every time
Angle also be 72 degree.
As shown in figure 5, laser parallel system of processing 500 includes laser 501, beam expanding lens 502, spectroscope module 503, anti-
Light microscopic module 504 and scanning galvanometer, the lens combination light path output arrangement beam expanding lens 502 of laser 501, the output light of beam expanding lens 502
Spectroscope module 503 is arranged in road, and reflective mirror module 504, reflective mirror module are arranged on the output light path of spectroscope module 503
The first scanning galvanometer 505, the second scanning galvanometer 506 and the 3rd scanning galvanometer 506 are arranged on 504 reflected light path.Scanning galvanometer
It is connected with the microscope base fixed plate 402 of laser mirror seat supports mechanism 400, laser beam passes through the laser light incident in microscope base fixed plate 402
Scanning galvanometer is injected in hole 404.
Spectroscope module 503 includes multigroup spectroscope, and quantity is equal with the number in silicon chip division region.
Reflective mirror module 504 includes multiple reflective mirrors, thus it is possible to vary the direction of propagation of light beam, by different space bits
Reflective mirror is installed, laser beam is introduced into the position of needs.
It is assumed that the number in division region is N, then the laser beam that laser is sent divides by spectroscope module 503 to be corresponding
Light beam is introduced into corresponding scanning galvanometer by N beams by reflective mirror module 504.
During concrete application, silicon chip is delivered on silicon chip conveying mechanism 200 by silicon chip charging-discharging machine structure 300, silicon chip conveying
Mechanism 200 provides power by power unit, and at the uniform velocity equal angular intermittent movement is done on pedestal 100;
The laser 501 of laser parallel system of processing 500 provides the required laser beam of making herbs into wool, and the laser launched is by expanding
Beam mirror 502 is collimated and expanded to it, improves the collimation of laser, reduces the angle of divergence of light beam, the diameter of expanded beam,
Beam of laser is divided into multiple branches by spectroscope module 503 again, scanning is incided by the reflection of reflective mirror module 504 in each branch
Galvanometer, under the driving effect of the probe of scanning galvanometer, laser beam shifts action, realizes laser beam in silicon chip surface
Processing forms light trapping structure in silicon chip surface, achievees the purpose that reduce reflection.
In order to realize large-scale processing, using multigroup scanning galvanometer to carrying out subregion processing to silicon chip.According to silicon chip
Area, is reasonably divided into three regions, and every group of scanning galvanometer processes corresponding region.Big model is realized using multigroup scanning galvanometer
It encloses, parallel fabrication.Improve laser making herbs into wool efficiency.Because the number for dividing region is three, then the laser beam sent by laser
Divide by spectroscope module 503 for corresponding three beams, light beam is introduced into corresponding scanning galvanometer by reflective mirror module 504.
The parameters such as the power using the output beam of computer controlled laser, computer can easily import the figure of processing, turn
It turns to digital signal and is transferred to scanning galvanometer, carry out region processing.
Silicon chip is divided into three regions, corresponding region is processed respectively using three groups of scanning galvanometers.Utilize silicon chip
Silicon chip is placed into the card slot of silicon chip conveying mechanism 200 by charging and discharging mechanism 300, and silicon chip conveying mechanism 200 by turning for the first time
It is dynamic to reach the first machining position, carry out first area processing.Then silicon chip conveying mechanism 200 turns to second station, the 3rd successively
Station treats silicon chip completion of processing, extracts from the card slot of fixing device for silicon piece 203 silicon chip through silicon chip charging-discharging machine structure 300
Region is completed in making herbs into wool.
In conclusion the present invention utilizes silicon chip charging-discharging machine structure to pass through silicon chip conveying mechanism band to silicon chip automatic loading/unloading
Dynamic silicon chip is intermittent to be rotated, and realizes automation processing.Laser parallel system of processing performs etching silicon chip, is formed in silicon chip surface
Light trapping structure.By the way that silicon chip is divided into multiple regions, processing on a large scale is realized;Using multigroup scanning galvanometer to dividing region
Parallel fabrication is carried out, improves making herbs into wool efficiency.Solve that the making herbs into wool efficiency brought is low because laser ablation is necessary for monolithic etching
Problem so as to significantly improve the production efficiency of laser making herbs into wool, promotes the industrialized development of laser making herbs into wool.
It should be noted that:The foregoing is merely the preferred embodiment of the present invention, are not limited to power of the invention
Sharp scope;Description above simultaneously, should can understand and implement for the special personage of correlative technology field, thus it is other without departing from
The equivalent change or modification completed under disclosed spirit, should be included in claim.
Claims (9)
1. laser making herbs into wool is equipped, it is characterised in that:Include pedestal (100), silicon chip conveying mechanism (200), silicon chip charging-discharging machine structure
(300), laser mirror seat supports mechanism (400) and laser parallel system of processing (500), silicon chip conveying mechanism (200) are placed in bottom
On seat (100), silicon chip charging-discharging machine structure (300) and laser mirror seat supports mechanism (400) are spaced around silicon chip conveying mechanism (200)
It is distributed on pedestal (100), laser parallel system of processing (500) is installed in laser mirror seat supports mechanism (400).
2. laser making herbs into wool equipment according to claim 1, it is characterised in that:The silicon chip conveying mechanism (200) includes turning
Disk (201) and fixing device for silicon piece (203), power unit are drivingly connected with turntable (201), and driving disc (201) is in pedestal
(100) intermittent circular motion is done on, location hole (202) is provided on turntable (201), it is fixed that fixing device for silicon piece (203) passes through
Position hole (202) is installed on turntable (201), and fixing device for silicon piece (203) is equipped with card slot.
3. laser making herbs into wool equipment according to claim 1, it is characterised in that:The silicon chip charging-discharging machine structure (300) includes
Mechanism supports frame (301), Pneumatic extension bar (303), sliding block (304), sucker (305), leading screw (306) and guide rail (307), machine
Structure supporting rack (301) upper mounting rail (307), sliding block (304) are placed on guide rail (307), and leading screw (306) is passed with sliding block (304)
Dynamic connection, drives it to move along a straight line along guide rail (307), and Pneumatic extension bar (303), Pneumatic extension bar are installed on sliding block (304)
(303) end installation sucker (305).
4. laser making herbs into wool equipment according to claim 1, it is characterised in that:Laser mirror seat supports mechanism (400) bag
Containing support plate (401) and microscope base fixed plate (402), microscope base fixed plate (402) is installed on support plate (401) with slip connection mode
On, can move on it, microscope base fixed plate (402) be equipped with microscope base hole (403) and for laser beam by laser light incident
Hole (404).
5. laser making herbs into wool equipment according to claim 1, it is characterised in that:Laser parallel system of processing (500) bag
Containing laser (501), beam expanding lens (502), spectroscope module (503), reflective mirror module (504) and scanning galvanometer, laser
(501) lens combination light path output arranges beam expanding lens (502), and spectroscope module (503) is arranged on the output light path of beam expanding lens (502),
Reflective mirror module (504) is arranged on the output light path of spectroscope module (503), cloth on the reflected light path of reflective mirror module (504)
Put scanning galvanometer.
6. laser making herbs into wool equipment according to claim 5, it is characterised in that:The spectroscope module (503) includes multigroup
Spectroscope, quantity are equal with the number in silicon chip division region.
7. the method that equipment described in claim 1 realizes laser making herbs into wool, it is characterised in that:By silicon chip charging-discharging machine structure (300)
Silicon chip is delivered on silicon chip conveying mechanism (200), silicon chip conveying mechanism (200) provides power by power unit, in pedestal
(100) at the uniform velocity equal angular intermittent movement is done on;
The laser of laser parallel system of processing (500) provides the required laser beam of making herbs into wool, and the laser launched is by beam expanding lens
It is collimated and is expanded, improves the collimation of laser, reduces the angle of divergence of light beam, the diameter of expanded beam, then by point
Beam of laser is divided into multiple branches by light microscopic module, and each branch incides into scanning galvanometer by the reflection of reflective mirror module, scanning
Under the driving effect of the probe of galvanometer, laser beam shifts action, and laser beam is formed in Surface machining of silicon wafer, silicon chip surface
Light trapping structure achievees the purpose that reduce reflection.
8. the method for laser making herbs into wool according to claim 7, it is characterised in that:The scanning galvanometer and laser mirror seat supports
Microscope base fixed plate (402) connection of mechanism (400), laser beam are penetrated by the laser light incident hole (404) in microscope base fixed plate (402)
Enter scanning galvanometer.
9. the method for laser making herbs into wool according to claim 7, it is characterised in that:The laser mirror seat supports mechanism (400)
Quantity set according to the area of processing silicon chip, quantity N, the angle between adjacent mechanism is 360/N+2 degree, silicon chip conveyer
The angle that structure (200) turns over every time is 360/N+2 degree.
Priority Applications (1)
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CN201810025680.0A CN108123011A (en) | 2018-01-11 | 2018-01-11 | Laser making herbs into wool equipment and its method |
Applications Claiming Priority (1)
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CN201810025680.0A CN108123011A (en) | 2018-01-11 | 2018-01-11 | Laser making herbs into wool equipment and its method |
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Publication Number | Publication Date |
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CN108123011A true CN108123011A (en) | 2018-06-05 |
Family
ID=62234033
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CN201810025680.0A Pending CN108123011A (en) | 2018-01-11 | 2018-01-11 | Laser making herbs into wool equipment and its method |
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Cited By (2)
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CN109994572A (en) * | 2019-04-24 | 2019-07-09 | 晶澳(扬州)太阳能科技有限公司 | A kind of making herbs into wool auxiliary device and crystal silicon chip processing method |
CN114257746A (en) * | 2021-12-23 | 2022-03-29 | 深圳市先地图像科技有限公司 | Method for exposing image by laser direct imaging equipment and related equipment |
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CN114257746A (en) * | 2021-12-23 | 2022-03-29 | 深圳市先地图像科技有限公司 | Method for exposing image by laser direct imaging equipment and related equipment |
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