CN108122812A - A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination - Google Patents
A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination Download PDFInfo
- Publication number
- CN108122812A CN108122812A CN201711346902.0A CN201711346902A CN108122812A CN 108122812 A CN108122812 A CN 108122812A CN 201711346902 A CN201711346902 A CN 201711346902A CN 108122812 A CN108122812 A CN 108122812A
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- Prior art keywords
- solid phase
- ultrasonic wave
- foil
- metallic foil
- phase lamination
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- 239000007790 solid phase Substances 0.000 title claims abstract description 42
- 238000003475 lamination Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 18
- 239000011888 foil Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000003801 milling Methods 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000002604 ultrasonography Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 239000007787 solid Substances 0.000 abstract description 5
- 238000007596 consolidation process Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000002775 capsule Substances 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
- 239000005030 aluminium foil Substances 0.000 description 15
- 239000011889 copper foil Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention belongs to Electronic Packaging fields, disclose a kind of electronic packaging device and method based on ultrasonic wave solid phase lamination.Device includes substrate, metallic foil, ultrasonic pressure head and the milling device of processing substrate or metallic foil.Method is that metallic foil is acted on substrate by the solid diffusivity of ultrasonic pressure head and successively accumulated, and realizes that the solid phase of three-dimensional block entity stacks.It physically processes to form specific space by numerical control milling equipment in the bulk, electronic component and connecting wire is put into the space.It is sealed against finally by the successively consolidation of metallic foil, realizes electronic component(Such as sensor)Low temperature lamination metal encapsulation.The electronic component metal capsules that the technical program obtains have many advantages, such as that service life is long, electromagnetic wave shielding is good, strong antijamming capability, working sensitivity are high, part bond strength is high, and production easy to automate.
Description
Technical field
The present invention relates to technical field of electronic encapsulation, more particularly to a kind of Electronic Packaging dress based on ultrasonic wave solid phase lamination
It puts and method.
Background technology
With the development of information age, it is most active that electronic industry has become the world today, while is also most important industry
One of.Developing Asian country based on China then substitutes North America for the first time, becomes global maximum electronic consumer markets.It is same with this
When, the powerful development of electronic industry has also driven Electronic Packaging industry closely related therewith.Microelectronics Packaging on the one hand towards
High integration, high-frequency, high-power, inexpensive direction are developed, and on the other hand, new process and new material continue to bring out,
Microelectronics Packaging is made to advance towards more energy efficient, more environmentally friendly and more longlasting road.
Metal electron encapsulation field has a the shortcomings that needing to overcome, main at present to be packaged by the way of molten soldering,
Relatively high temperature can be generated, there can be certain damage to the electronic component of encapsulation, and metal is also easy to produce phase at high temperature
Become and intermetallic compound, part strength be not high.Therefore it provides a kind of low temperature, low cost, efficient, advantages of good shielding performance, sealing
The good electronic packaging device of property and method are necessary.
The content of the invention
To solve the above problems, the present invention provides a kind of low temperature, low cost, efficient, advantages of good shielding performance, good airproof performances
Electronic package method, by ultrasonic wave solid phase lamination and numerical control machine increase and decrease material technology, by electronic component encapsulation
In metallic matrix, the service life of electronic component can be effectively improved, reduces the number for checking and replacing.
The present invention is achieved through the following technical solutions.
A kind of electronic packaging device based on ultrasonic wave solid phase lamination includes substrate, metallic foil, ultrasonic pressure head, energy converter
With the milling device of processing substrate or metallic foil, connecting wire and sealing substance.Using sealing substance electronic component company
It connects coating around conducting wire to be sealed, guarantee obtains the being fully sealed property of packaging body.Ultrasonic pressure head is connected with energy converter, energy converter
It being connected with ultrasonic-frequency power supply, ultrasonic-frequency power supply provides power to energy converter, and energy converter converts electrical energy into the mechanical energy of vibration mode,
Vibration is transferred on ultrasonic pressure head, realizes the consolidation of double layer of metal paillon, in cycles, completes the solid phase heap of multiple layer metal paillon
It is folded.
Metallic foil is multilayer.
Fiber-reinforced layer is added between metallic foil or between substrate and metallic foil.The metal foil of ultrasonic wave solid phase lamination
The fibre reinforced materials such as carbon fiber, carborundum can be added between material to enhance its intensity and performance.
Every layer includes two panels or multi-piece metal foil band, multiple layer metal foil intersecting on the section of thickness direction.Gold
Category foil is completed three-dimensional block entity by ultrasonic solid phase lamination and is prepared, and metallic foil is not interlocked with multilayer vertical setting of types or multilayer is erected
The accumulation mode of row staggeredly is accumulated.
The material of metallic foil is aluminium or copper or magnesium or titanium or nickel.Metallic foil is solid phase lamination material, is foil-like gold
Belong to band.Can be the solid phase lamination between same metal foil or the solid phase lamination between dissimilar metal foil.
The thickness of metallic foil is 0.1 ~ 0.4mm.
Ultrasonic pressure head is connected with energy converter, and energy converter is connected with ultrasonic-frequency power supply, and energy converter can be two, ultrasonic pressure head two
Symmetrical two energy converters are held, ultrasonic consolidation device is push-pull type, realizes push-pull type movement during the work time.Ultrasonic pressure head
Push-pull type ultrasonic wave solid phase laminating apparatus is formed with dual transducers, increases substantially the efficiency of plant capacity and solid phase lamination.Base
Body material is copper or iron, and milling device is numerical control.
A kind of electronic package method based on ultrasonic wave solid phase lamination is to process receiving electricity on substrate with milling device
The space of subcomponent, metallic foil are sealed space openings by ultrasonic pressure head.Pass through ultrasonic wave solid phase lamination and numerical control milling
Increase and decrease material technology is completed in equipment cooperation, by electronic package in metallic matrix, is specially:Metallic foil passes through ultrasound
The solid diffusivity of pressure head, which is acted on substrate, successively to be accumulated, and realizes that the solid phase of three-dimensional block entity stacks, in the bulk physically
It processes to form specific space by numerical control milling equipment, electronic component and connecting wire is put into the space, finally by
The successively consolidation of metallic foil is sealed against, and realizes electronic component(Such as sensor)Low temperature lamination metal encapsulation.
Before being processed using milling device, metallic foil is superimposed on substrate.Metallic foil can be first superimposed on substrate,
The space of electronic component can be accommodated by being milled out again on metallic foil or metallic foil and substrate, place electronic component and
Connecting wire, and sealed with sealing material, metallic foil is superimposed upon milling opening finally by ultrasonic pressure head, completes to accommodate
The sealing in space.
Metal foil is carried out solid phase stacking, therefore by the method for Electronic Packaging provided by the present invention by ultrasonic energy
Seldom heat is generated in process, internal electronic component will not be damaged;Part strength is high, good airproof performance,
Capability of electromagnetic shielding is good, can obtain excellent Metal Substrate electronic packing body;It can be quickly by electronic package in metal
Number that is interior, extending the service life of electronic component and replace;Part strength is high, and the intensity of welding point is close to base material, easily
In realizing automated production, there is wide application space.
Description of the drawings
Fig. 1:The operation chart of the present invention.
Fig. 2:The accumulation mode schematic diagram that metal foil multilayer vertical setting of types disclosed in this invention interlocks.
Fig. 3:The accumulation mode schematic diagram of metal foil multilayer vertical setting of types disclosed in this invention not staggeredly.
Fig. 4:The electronic package method schematic diagram of same metal foil ultrasound solid phase lamination disclosed in this invention.
Fig. 5:The electronic package method signal of the ultrasonic solid phase lamination of metal foil and metallic matrix disclosed in this invention
Figure.
Fig. 6:The electronic package method schematic diagram of dissimilar metal foil ultrasound solid phase lamination disclosed in this invention.
Wherein, 1. substrates, 2. metallic foils, 3. ultrasonic pressure heads, 4. numerical control milling equipment, 5. electronic components, 6. sealers
Matter, 7. connecting wires, 8. Copper substrates, 9. aluminium foils, 10. copper foils;11. first transducer;12. second transducer.
Specific embodiment
1-6 and embodiment below in conjunction with the accompanying drawings, are described further the technical program.
The device of the Electronic Packaging based on ultrasonic wave solid phase lamination as shown in Figure 1, including substrate 1, ultrasonic pressure head 3, the
One energy converter 11, second transducer 12 and numerical control milling device 4,1 substrate of substrate are only used as supporting item, are not the one of final part
Part.Ultrasonic pressure head 3 can do scroll actions by complicated ultrasonic wave metal solid phase stack system control in plane, and numerical control milling is set
Standby 4 increase and decrease material technology with 3 teamwork of ultrasonic pressure head, completion.
Embodiment 1
As shown in figure 4, the Metal Packaging of electronic component is carried out using the aluminium foil that thickness is 0.2mm, by ultrasonic energy by aluminium foil
Solid phase lamination, until electronic package is specifically comprised the following steps in metallic matrix:
(1)Fix one layer of aluminium foil strip on substrate 1, the ultrasonic pressure head 3 for carrying ultrasonic energy rolls on aluminium foil, by aluminium foil and base
1 complete solid phase binding of plate so carries out the preparation of three-dimensional block entity according to the accumulation mode of Fig. 2 or Fig. 3 again and again.
(2)Numerical control milling equipment 4 is processed the 3D solid of stacking, processes placement electronic component 5 and connection is led
The space of line 7.
(3)Electronic component 5 and connecting wire 7 are put into the metal cavitg processed, and coated around connecting wire
Seal substance 6.Continue the ultrasonic solid phase lamination of aluminium foil on it, until cavity is fully sealed, obtain including electronics member
The densified metal component of part.
Embodiment 2
As shown in figure 5, it is packaged using the copper foil and 8 method and apparatus using the present invention of Copper substrate that thickness is 0.2mm.It can
Existing Copper substrate 8 using numerical control milling equipment 4 is machined on a small quantity, obtains that electronic component 5 can be placed and connection is led
Electronic component 5 and connecting wire 7 are placed in the space by the space of line 7, and the coating sealing substance 6 around connecting wire.
Then the ultrasonic solid phase lamination of copper foil is carried out on it, which is fully sealed, obtains including the metal parts of electronic component,
The batch production of the part can be carried out in this way.
Embodiment 3
As shown in fig. 6, the use of thickness is the dissimilar metal encapsulation that the aluminium foil of 0.2mm and copper foil carry out electronic component, by super
Acoustic energy is by different metal materials solid phase lamination, until electronic package is specifically comprised the following steps in metallic matrix:
(1)Fix one layer of aluminium foil strip on substrate 1, the ultrasonic pressure head 3 for carrying ultrasonic energy rolls on aluminium foil, by aluminium foil and base
1 complete solid phase binding of plate.One block of copper foil is fixed above aluminium foil, same mode carries out solid diffusivity, copper foil and aluminium foil are consolidated
It is combined, so carries out aluminium foil and copper foil alternating solid phase lamination in cycles, obtain the block entity of three-dimensional of aluminum bronze dissimilar material.
(2)Numerical control milling equipment 4 is processed the 3D solid of stacking, processes placement electronic component 5 and connection is led
The space of line 7.
(3)Electronic component 5 and connecting wire 7 are put into the metal cavitg processed, and coated around connecting wire
Seal substance 6.Continue aluminium foil and copper foil alternately ultrasonic solid phase lamination on it, until cavity is fully sealed, obtain
Include the fine and close dissimilar metal part of electronic component.
Embodiment only illustrates technical scheme rather than carries out any restrictions to it;Although with reference to the foregoing embodiments
The present invention is described in detail, it for those of ordinary skill in the art, still can be to previous embodiment institute
The technical solution of record modifies or carries out equivalent substitution to which part technical characteristic;And these modifications or substitutions, and
The essence of appropriate technical solution is not made to depart from the spirit and scope of claimed technical solution of the invention.
Claims (10)
1. a kind of electronic packaging device based on ultrasonic wave solid phase lamination, it is characterised in that:Including substrate, metallic foil, ultrasound
Pressure head, energy converter and the milling device of processing substrate or metallic foil.
2. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 1, it is characterised in that:Also wrap
Include connecting wire and sealing substance.
3. according to a kind of any electronic packaging device based on ultrasonic wave solid phase lamination of claim 1 or 2, feature exists
In:Metallic foil is multilayer.
4. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 3, it is characterised in that:Metal
Fiber-reinforced layer is added between foil or between substrate and metallic foil.
5. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 3, it is characterised in that:Every layer
Including two panels or multi-piece metal foil band, multiple layer metal foil intersecting on the section of thickness direction.
6. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 3, it is characterised in that:Metal
The material of foil is aluminium or copper or magnesium or titanium or nickel.
7. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 3, it is characterised in that:Metal
The thickness of foil is 0.1 ~ 0.4mm.
8. according to a kind of any electronic packaging device based on ultrasonic wave solid phase lamination of claim 1 or 2, feature exists
In:There are two energy converters.
9. a kind of electronic package method based on ultrasonic wave solid phase lamination, it is characterised in that:It is processed with milling device on substrate
Go out to accommodate the space of electronic component, metallic foil is sealed space openings by ultrasonic pressure head.
10. a kind of electronic package method based on ultrasonic wave solid phase lamination according to claim 9, it is characterised in that:Make
Before being processed with milling device, metallic foil is superimposed on substrate.
Priority Applications (1)
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CN201711346902.0A CN108122812A (en) | 2017-12-15 | 2017-12-15 | A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination |
Applications Claiming Priority (1)
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CN201711346902.0A CN108122812A (en) | 2017-12-15 | 2017-12-15 | A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination |
Publications (1)
Publication Number | Publication Date |
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CN108122812A true CN108122812A (en) | 2018-06-05 |
Family
ID=62230092
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CN201711346902.0A Pending CN108122812A (en) | 2017-12-15 | 2017-12-15 | A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110587166A (en) * | 2019-09-29 | 2019-12-20 | 浙江海洋大学 | Ultrasonic consolidation-stirring friction composite additive manufacturing device and using method |
CN116252036A (en) * | 2022-12-23 | 2023-06-13 | 哈尔滨工程大学 | Method for integrally forming intelligent metal by metal and polymer flexible sensor |
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US20070040702A1 (en) * | 2005-05-02 | 2007-02-22 | Mosher Todd J | Method for creating highly integrated satellite systems |
US20080055186A1 (en) * | 2006-06-02 | 2008-03-06 | Fortson Frederick O | Enclosures with integrated antennas that make use of the skin effect |
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CN116252036A (en) * | 2022-12-23 | 2023-06-13 | 哈尔滨工程大学 | Method for integrally forming intelligent metal by metal and polymer flexible sensor |
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