CN108122812A - A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination - Google Patents

A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination Download PDF

Info

Publication number
CN108122812A
CN108122812A CN201711346902.0A CN201711346902A CN108122812A CN 108122812 A CN108122812 A CN 108122812A CN 201711346902 A CN201711346902 A CN 201711346902A CN 108122812 A CN108122812 A CN 108122812A
Authority
CN
China
Prior art keywords
solid phase
ultrasonic wave
foil
metallic foil
phase lamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711346902.0A
Other languages
Chinese (zh)
Inventor
朱训明
张洪涛
金伟
王园园
王云峰
王波
高丙路
刘旦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wanfeng Magnesium Industry Sci & Tech Development Co Ltd Weihai
Original Assignee
Wanfeng Magnesium Industry Sci & Tech Development Co Ltd Weihai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wanfeng Magnesium Industry Sci & Tech Development Co Ltd Weihai filed Critical Wanfeng Magnesium Industry Sci & Tech Development Co Ltd Weihai
Priority to CN201711346902.0A priority Critical patent/CN108122812A/en
Publication of CN108122812A publication Critical patent/CN108122812A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

The invention belongs to Electronic Packaging fields, disclose a kind of electronic packaging device and method based on ultrasonic wave solid phase lamination.Device includes substrate, metallic foil, ultrasonic pressure head and the milling device of processing substrate or metallic foil.Method is that metallic foil is acted on substrate by the solid diffusivity of ultrasonic pressure head and successively accumulated, and realizes that the solid phase of three-dimensional block entity stacks.It physically processes to form specific space by numerical control milling equipment in the bulk, electronic component and connecting wire is put into the space.It is sealed against finally by the successively consolidation of metallic foil, realizes electronic component(Such as sensor)Low temperature lamination metal encapsulation.The electronic component metal capsules that the technical program obtains have many advantages, such as that service life is long, electromagnetic wave shielding is good, strong antijamming capability, working sensitivity are high, part bond strength is high, and production easy to automate.

Description

A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination
Technical field
The present invention relates to technical field of electronic encapsulation, more particularly to a kind of Electronic Packaging dress based on ultrasonic wave solid phase lamination It puts and method.
Background technology
With the development of information age, it is most active that electronic industry has become the world today, while is also most important industry One of.Developing Asian country based on China then substitutes North America for the first time, becomes global maximum electronic consumer markets.It is same with this When, the powerful development of electronic industry has also driven Electronic Packaging industry closely related therewith.Microelectronics Packaging on the one hand towards High integration, high-frequency, high-power, inexpensive direction are developed, and on the other hand, new process and new material continue to bring out, Microelectronics Packaging is made to advance towards more energy efficient, more environmentally friendly and more longlasting road.
Metal electron encapsulation field has a the shortcomings that needing to overcome, main at present to be packaged by the way of molten soldering, Relatively high temperature can be generated, there can be certain damage to the electronic component of encapsulation, and metal is also easy to produce phase at high temperature Become and intermetallic compound, part strength be not high.Therefore it provides a kind of low temperature, low cost, efficient, advantages of good shielding performance, sealing The good electronic packaging device of property and method are necessary.
The content of the invention
To solve the above problems, the present invention provides a kind of low temperature, low cost, efficient, advantages of good shielding performance, good airproof performances Electronic package method, by ultrasonic wave solid phase lamination and numerical control machine increase and decrease material technology, by electronic component encapsulation In metallic matrix, the service life of electronic component can be effectively improved, reduces the number for checking and replacing.
The present invention is achieved through the following technical solutions.
A kind of electronic packaging device based on ultrasonic wave solid phase lamination includes substrate, metallic foil, ultrasonic pressure head, energy converter With the milling device of processing substrate or metallic foil, connecting wire and sealing substance.Using sealing substance electronic component company It connects coating around conducting wire to be sealed, guarantee obtains the being fully sealed property of packaging body.Ultrasonic pressure head is connected with energy converter, energy converter It being connected with ultrasonic-frequency power supply, ultrasonic-frequency power supply provides power to energy converter, and energy converter converts electrical energy into the mechanical energy of vibration mode, Vibration is transferred on ultrasonic pressure head, realizes the consolidation of double layer of metal paillon, in cycles, completes the solid phase heap of multiple layer metal paillon It is folded.
Metallic foil is multilayer.
Fiber-reinforced layer is added between metallic foil or between substrate and metallic foil.The metal foil of ultrasonic wave solid phase lamination The fibre reinforced materials such as carbon fiber, carborundum can be added between material to enhance its intensity and performance.
Every layer includes two panels or multi-piece metal foil band, multiple layer metal foil intersecting on the section of thickness direction.Gold Category foil is completed three-dimensional block entity by ultrasonic solid phase lamination and is prepared, and metallic foil is not interlocked with multilayer vertical setting of types or multilayer is erected The accumulation mode of row staggeredly is accumulated.
The material of metallic foil is aluminium or copper or magnesium or titanium or nickel.Metallic foil is solid phase lamination material, is foil-like gold Belong to band.Can be the solid phase lamination between same metal foil or the solid phase lamination between dissimilar metal foil.
The thickness of metallic foil is 0.1 ~ 0.4mm.
Ultrasonic pressure head is connected with energy converter, and energy converter is connected with ultrasonic-frequency power supply, and energy converter can be two, ultrasonic pressure head two Symmetrical two energy converters are held, ultrasonic consolidation device is push-pull type, realizes push-pull type movement during the work time.Ultrasonic pressure head Push-pull type ultrasonic wave solid phase laminating apparatus is formed with dual transducers, increases substantially the efficiency of plant capacity and solid phase lamination.Base Body material is copper or iron, and milling device is numerical control.
A kind of electronic package method based on ultrasonic wave solid phase lamination is to process receiving electricity on substrate with milling device The space of subcomponent, metallic foil are sealed space openings by ultrasonic pressure head.Pass through ultrasonic wave solid phase lamination and numerical control milling Increase and decrease material technology is completed in equipment cooperation, by electronic package in metallic matrix, is specially:Metallic foil passes through ultrasound The solid diffusivity of pressure head, which is acted on substrate, successively to be accumulated, and realizes that the solid phase of three-dimensional block entity stacks, in the bulk physically It processes to form specific space by numerical control milling equipment, electronic component and connecting wire is put into the space, finally by The successively consolidation of metallic foil is sealed against, and realizes electronic component(Such as sensor)Low temperature lamination metal encapsulation.
Before being processed using milling device, metallic foil is superimposed on substrate.Metallic foil can be first superimposed on substrate, The space of electronic component can be accommodated by being milled out again on metallic foil or metallic foil and substrate, place electronic component and Connecting wire, and sealed with sealing material, metallic foil is superimposed upon milling opening finally by ultrasonic pressure head, completes to accommodate The sealing in space.
Metal foil is carried out solid phase stacking, therefore by the method for Electronic Packaging provided by the present invention by ultrasonic energy Seldom heat is generated in process, internal electronic component will not be damaged;Part strength is high, good airproof performance, Capability of electromagnetic shielding is good, can obtain excellent Metal Substrate electronic packing body;It can be quickly by electronic package in metal Number that is interior, extending the service life of electronic component and replace;Part strength is high, and the intensity of welding point is close to base material, easily In realizing automated production, there is wide application space.
Description of the drawings
Fig. 1:The operation chart of the present invention.
Fig. 2:The accumulation mode schematic diagram that metal foil multilayer vertical setting of types disclosed in this invention interlocks.
Fig. 3:The accumulation mode schematic diagram of metal foil multilayer vertical setting of types disclosed in this invention not staggeredly.
Fig. 4:The electronic package method schematic diagram of same metal foil ultrasound solid phase lamination disclosed in this invention.
Fig. 5:The electronic package method signal of the ultrasonic solid phase lamination of metal foil and metallic matrix disclosed in this invention Figure.
Fig. 6:The electronic package method schematic diagram of dissimilar metal foil ultrasound solid phase lamination disclosed in this invention.
Wherein, 1. substrates, 2. metallic foils, 3. ultrasonic pressure heads, 4. numerical control milling equipment, 5. electronic components, 6. sealers Matter, 7. connecting wires, 8. Copper substrates, 9. aluminium foils, 10. copper foils;11. first transducer;12. second transducer.
Specific embodiment
1-6 and embodiment below in conjunction with the accompanying drawings, are described further the technical program.
The device of the Electronic Packaging based on ultrasonic wave solid phase lamination as shown in Figure 1, including substrate 1, ultrasonic pressure head 3, the One energy converter 11, second transducer 12 and numerical control milling device 4,1 substrate of substrate are only used as supporting item, are not the one of final part Part.Ultrasonic pressure head 3 can do scroll actions by complicated ultrasonic wave metal solid phase stack system control in plane, and numerical control milling is set Standby 4 increase and decrease material technology with 3 teamwork of ultrasonic pressure head, completion.
Embodiment 1
As shown in figure 4, the Metal Packaging of electronic component is carried out using the aluminium foil that thickness is 0.2mm, by ultrasonic energy by aluminium foil Solid phase lamination, until electronic package is specifically comprised the following steps in metallic matrix:
(1)Fix one layer of aluminium foil strip on substrate 1, the ultrasonic pressure head 3 for carrying ultrasonic energy rolls on aluminium foil, by aluminium foil and base 1 complete solid phase binding of plate so carries out the preparation of three-dimensional block entity according to the accumulation mode of Fig. 2 or Fig. 3 again and again.
(2)Numerical control milling equipment 4 is processed the 3D solid of stacking, processes placement electronic component 5 and connection is led The space of line 7.
(3)Electronic component 5 and connecting wire 7 are put into the metal cavitg processed, and coated around connecting wire Seal substance 6.Continue the ultrasonic solid phase lamination of aluminium foil on it, until cavity is fully sealed, obtain including electronics member The densified metal component of part.
Embodiment 2
As shown in figure 5, it is packaged using the copper foil and 8 method and apparatus using the present invention of Copper substrate that thickness is 0.2mm.It can Existing Copper substrate 8 using numerical control milling equipment 4 is machined on a small quantity, obtains that electronic component 5 can be placed and connection is led Electronic component 5 and connecting wire 7 are placed in the space by the space of line 7, and the coating sealing substance 6 around connecting wire. Then the ultrasonic solid phase lamination of copper foil is carried out on it, which is fully sealed, obtains including the metal parts of electronic component, The batch production of the part can be carried out in this way.
Embodiment 3
As shown in fig. 6, the use of thickness is the dissimilar metal encapsulation that the aluminium foil of 0.2mm and copper foil carry out electronic component, by super Acoustic energy is by different metal materials solid phase lamination, until electronic package is specifically comprised the following steps in metallic matrix:
(1)Fix one layer of aluminium foil strip on substrate 1, the ultrasonic pressure head 3 for carrying ultrasonic energy rolls on aluminium foil, by aluminium foil and base 1 complete solid phase binding of plate.One block of copper foil is fixed above aluminium foil, same mode carries out solid diffusivity, copper foil and aluminium foil are consolidated It is combined, so carries out aluminium foil and copper foil alternating solid phase lamination in cycles, obtain the block entity of three-dimensional of aluminum bronze dissimilar material.
(2)Numerical control milling equipment 4 is processed the 3D solid of stacking, processes placement electronic component 5 and connection is led The space of line 7.
(3)Electronic component 5 and connecting wire 7 are put into the metal cavitg processed, and coated around connecting wire Seal substance 6.Continue aluminium foil and copper foil alternately ultrasonic solid phase lamination on it, until cavity is fully sealed, obtain Include the fine and close dissimilar metal part of electronic component.
Embodiment only illustrates technical scheme rather than carries out any restrictions to it;Although with reference to the foregoing embodiments The present invention is described in detail, it for those of ordinary skill in the art, still can be to previous embodiment institute The technical solution of record modifies or carries out equivalent substitution to which part technical characteristic;And these modifications or substitutions, and The essence of appropriate technical solution is not made to depart from the spirit and scope of claimed technical solution of the invention.

Claims (10)

1. a kind of electronic packaging device based on ultrasonic wave solid phase lamination, it is characterised in that:Including substrate, metallic foil, ultrasound Pressure head, energy converter and the milling device of processing substrate or metallic foil.
2. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 1, it is characterised in that:Also wrap Include connecting wire and sealing substance.
3. according to a kind of any electronic packaging device based on ultrasonic wave solid phase lamination of claim 1 or 2, feature exists In:Metallic foil is multilayer.
4. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 3, it is characterised in that:Metal Fiber-reinforced layer is added between foil or between substrate and metallic foil.
5. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 3, it is characterised in that:Every layer Including two panels or multi-piece metal foil band, multiple layer metal foil intersecting on the section of thickness direction.
6. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 3, it is characterised in that:Metal The material of foil is aluminium or copper or magnesium or titanium or nickel.
7. a kind of electronic packaging device based on ultrasonic wave solid phase lamination according to claim 3, it is characterised in that:Metal The thickness of foil is 0.1 ~ 0.4mm.
8. according to a kind of any electronic packaging device based on ultrasonic wave solid phase lamination of claim 1 or 2, feature exists In:There are two energy converters.
9. a kind of electronic package method based on ultrasonic wave solid phase lamination, it is characterised in that:It is processed with milling device on substrate Go out to accommodate the space of electronic component, metallic foil is sealed space openings by ultrasonic pressure head.
10. a kind of electronic package method based on ultrasonic wave solid phase lamination according to claim 9, it is characterised in that:Make Before being processed with milling device, metallic foil is superimposed on substrate.
CN201711346902.0A 2017-12-15 2017-12-15 A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination Pending CN108122812A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711346902.0A CN108122812A (en) 2017-12-15 2017-12-15 A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711346902.0A CN108122812A (en) 2017-12-15 2017-12-15 A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination

Publications (1)

Publication Number Publication Date
CN108122812A true CN108122812A (en) 2018-06-05

Family

ID=62230092

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711346902.0A Pending CN108122812A (en) 2017-12-15 2017-12-15 A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination

Country Status (1)

Country Link
CN (1) CN108122812A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110587166A (en) * 2019-09-29 2019-12-20 浙江海洋大学 Ultrasonic consolidation-stirring friction composite additive manufacturing device and using method
CN116252036A (en) * 2022-12-23 2023-06-13 哈尔滨工程大学 Method for integrally forming intelligent metal by metal and polymer flexible sensor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070040702A1 (en) * 2005-05-02 2007-02-22 Mosher Todd J Method for creating highly integrated satellite systems
US20080055186A1 (en) * 2006-06-02 2008-03-06 Fortson Frederick O Enclosures with integrated antennas that make use of the skin effect
CN102501006A (en) * 2011-10-26 2012-06-20 西安交通大学 Method for manufacturing shape memory alloy-aluminum metal matrix composite material through ultrasonic welding
CN103551721A (en) * 2013-10-31 2014-02-05 哈尔滨工业大学(威海) Method for preparing joint made of dissimilar material by firstly ultrasonically prefabricating and secondly welding transition belt
CN106298685A (en) * 2016-09-29 2017-01-04 中国船舶重工集团公司第七〇九研究所 A kind of electronic chip packaging structure using ultrasonic bonding
CN106862748A (en) * 2017-01-24 2017-06-20 中北大学 Amorphous/metal micro-laminated composite material ultrasonic wave accumulation manufacture method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070040702A1 (en) * 2005-05-02 2007-02-22 Mosher Todd J Method for creating highly integrated satellite systems
US20080055186A1 (en) * 2006-06-02 2008-03-06 Fortson Frederick O Enclosures with integrated antennas that make use of the skin effect
CN102501006A (en) * 2011-10-26 2012-06-20 西安交通大学 Method for manufacturing shape memory alloy-aluminum metal matrix composite material through ultrasonic welding
CN103551721A (en) * 2013-10-31 2014-02-05 哈尔滨工业大学(威海) Method for preparing joint made of dissimilar material by firstly ultrasonically prefabricating and secondly welding transition belt
CN106298685A (en) * 2016-09-29 2017-01-04 中国船舶重工集团公司第七〇九研究所 A kind of electronic chip packaging structure using ultrasonic bonding
CN106862748A (en) * 2017-01-24 2017-06-20 中北大学 Amorphous/metal micro-laminated composite material ultrasonic wave accumulation manufacture method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110587166A (en) * 2019-09-29 2019-12-20 浙江海洋大学 Ultrasonic consolidation-stirring friction composite additive manufacturing device and using method
CN110587166B (en) * 2019-09-29 2021-03-16 浙江海洋大学 Ultrasonic consolidation-stirring friction composite additive manufacturing device and using method
CN116252036A (en) * 2022-12-23 2023-06-13 哈尔滨工程大学 Method for integrally forming intelligent metal by metal and polymer flexible sensor

Similar Documents

Publication Publication Date Title
CN101777506B (en) Complex frequency sandwich structure ultrasonic transducer
CN103081104B (en) Power semiconductor modular and manufacture method thereof
CN101515628A (en) Thermoelectric device and method for manufacturing same
CN108122812A (en) A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination
CN103639606A (en) Thin metal sheet structure resistance/ultrasonic composite spot-welding method
CN102263078A (en) WLCSP (Wafer Level Chip Scale Package) packaging component
CN110763059A (en) Ultrathin uniform temperature plate and manufacturing method thereof
CN102244022A (en) Manufacturing method of single intermetallic compound micro-interconnecting structure of flip chip
CN205428913U (en) Power semiconductor module
CN103551721A (en) Method for preparing joint made of dissimilar material by firstly ultrasonically prefabricating and secondly welding transition belt
CN102969254A (en) Dual-interface card packaging method
CN109411464A (en) A kind of 1200V/50A IGBT power module based on Fast Sintering nano mattisolda without pressure interconnection technique
CN207743201U (en) A kind of electronic packaging device based on ultrasonic wave solid phase lamination
CN103801783B (en) High-volume fractional silicon-carbide particle reinforced aluminium-base composite material solid-liquid two-phase region method for welding
CN200997399Y (en) Electronic power-supply module
CN101728289B (en) Room temperature ultrasonic soldering method for area array encapsulated electronic components
CN104227219A (en) Diffusion welding method
CN104191099A (en) WC particle reinforced composite brazing filler metal used for brazing hard alloy and preparation method thereof
CN102842558A (en) Wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on solder paste layers and packaging method thereof
CN105513977A (en) Intelligent power module and packaging method thereof
CN103779247B (en) A kind of method that power semiconductor modular terminal soldering is received substrate
JPH11190787A (en) Heat resistant direct joint structure of high melting point material and high thermal conductivity material or jointing method therefor
CN108673976A (en) A kind of preparation method of the copper-molybdenum carbon/carbon-copper composite material based on ultrasonic wave solid phase lamination
CN104145112B (en) The actuator module of the extremely low Leakage Current constant with the multi-layer actuator arranged in the housing and on actuator surface
CN108183098A (en) The 3D staggered floor stack package structures of mass storage circuit

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination