CN106298685A - A kind of electronic chip packaging structure using ultrasonic bonding - Google Patents
A kind of electronic chip packaging structure using ultrasonic bonding Download PDFInfo
- Publication number
- CN106298685A CN106298685A CN201610864100.8A CN201610864100A CN106298685A CN 106298685 A CN106298685 A CN 106298685A CN 201610864100 A CN201610864100 A CN 201610864100A CN 106298685 A CN106298685 A CN 106298685A
- Authority
- CN
- China
- Prior art keywords
- box body
- cover plate
- electronic chip
- ultrasonic bonding
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
Abstract
The invention discloses a kind of electronic chip packaging structure using ultrasonic bonding, this encapsulating structure includes cover plate and the box body being made up of polyetheretherketonematerials materials；Circumferentially being machined with one cross section on cover plate outer circumference surface is the conical ring of triangle, and the drift angle of conical ring is arc transition；The triangular-section Welding Structure of one annular is had on the bottom surface of cover plate；The inner chamber of box body is made up of two continuous print cylindrical cavities, and the cavity diameter of box opening end, more than the cavity diameter of blind end, the step surface between two cylindrical cavities is circumferentially machined with the triangular-section Welding Structure of one annular；Cover plate is fixed in the major diameter cavity of box body open end by the form of ultrasonic bonding, and electronic chip is encapsulated in the minor diameter cavity of box body.The present invention uses rational Welding Structure to realize relieved package, it is possible to solve the problem of long-life packages under high pressure, high temperature, impact and the complex working condition such as oscillating load, acid-base environment.
Description
Technical field
The present invention relates to a kind of encapsulating structure, be specifically related to a kind of encapsulating structure for depositing electronic chip, belong to super
Sonic welding techniques field.
Background technology
Proposing focus development Marine oil and gas resource in national energy strategy, deep-sea oil gas development of resources equipment troop of China meets
Having carried out the good opportunity that develops on an unprecedented scale, equipped the important member of troop as deep-sea oil gas development of resources, oil pipe and auxiliary equipment thereof undertake
The mission critical of On The Oil And Gas Transportation.And a series of electronic devices and components with electronic chip as representative, carry underground equipment with deep
The management of life cycle management of sea exploring equipment and safeguard mission, electronic chip have recorded pipeline all size parameter and
Maintenance information, electronic chip must be reliably mounted on the pipeline of correspondence by corresponding encapsulating structure.No matter make in down-hole
Industry is still at deep ocean work, and encapsulating structure inevitably, is faced with the most harsh requirement and the most severe operating mode, makees
Industry environment has high pressure, high temperature, sour weak property, the feature of vibration.
Normally, most of encapsulating structure uses screw thread pair to coordinate mostly, and some airtight watertight equipment then uses rubber
Glue sealing ring is as sealing, pressure-bearing means.Screw thread pair needs turning profuse tooth number in processing technique, and sealing position needs pole
Its long tooth number, to reaching intended sealing effectiveness, this design has the disadvantage that: occupy the confined space, has slackened resistance to
The intensity of laminated structure, simultaneously in the liquid have severe corrosive, threaded engagement is the most easily corroded inefficacys, it is impossible to realization
Adverse circumstances lower seal and pressure-bearing.Meanwhile, usual scheme need to configure age inhibiting high-quality import sealing ring to realizing
Sealing, the rubber seal cycle is long, price, and service life is extremely limited.
Summary of the invention
In view of this, the invention provides a kind of electronic chip packaging structure using ultrasonic bonding, this encapsulating structure
Rational Welding Structure is used to realize relieved package, it is possible to solve high pressure (70MPa), high temperature (200 DEG C), impact and vibrate load
For the problem carrying out high reliability, long-life packages in extremely limited space under the complex working condition such as lotus, acid-base environment.
A kind of electronic chip packaging structure using ultrasonic bonding, this encapsulating structure includes being made up of polyetheretherketonematerials materials
Cover plate and box body, ancillary equipment is electronic chip；
Described cover plate is circular configuration, and it is the conical ring of triangle that its outer circumference surface is circumferentially machined with one cross section,
This conical ring is positioned at the center of cover sheet thickness, and the drift angle of conical ring is arc transition；Have on the bottom surface of described cover plate together
The Welding Structure of annular, this welded cross section is triangle；
The inner chamber of described box body is made up of two continuous print cylindrical cavities, and the cavity diameter of box opening end is more than closing
The cavity diameter of end, forms the step surface of level between two cylindrical cavities, step surface is circumferentially machined with one annular
Welding Structure, welded cross section is triangle；The end face of box body blind end is coned face；
Described cover plate is fixed in the major diameter cavity of box body open end by the form of ultrasonic bonding, cover plate and box body
On Welding Structure melt after be fastened to each other, electronic chip is encapsulated in the minor diameter cavity of box body.
Further, the base material of described polyether-ether-ketone uses Wei Gesi 450, and adjuvant uses glass and carbon fine, both ratios
Sum is less than 45%；Temperature during injection is maintained at 390 degree, and pressure is maintained at 30MPa.
Further, the thickness of described cover plate is 1.8mm, and the height of Welding Structure section triangle is 0.6mm, bottom side length
Degree is 0.7mm.
Further, the height of described box body Welding Structure section triangle is 0.6mm, a length of 0.7mm in base, cover plate
Centre-to-centre spacing welded with box body is respectively 8mm and 7mm, and the external diameter of cover plate is 17.4mm, and the external diameter of box body is 20mm, box body
The internal diameter of first cavity is 18mm.
Further, the tapering bottom box body is 2 °.
Beneficial effect:
1, the thickness of cover plate of the present invention is while ensureing to be enough to bear external pressure, and internal disc will not have in largely
Fall into, and then cause that there is liquid acid, corrosive press-in cavity after pressure break occurs, cause packed chip pressure break, corrosion；
Also it is avoided that the degree of depth of caving in is the biggest, stress can be produced in the local that concavity is maximum and concentrate, act directly on electronics unit
The upper surface of device, causes unnecessary damage.
2, on the outer circumference surface of cover plate of the present invention, processing has the circular cone ring of minute angle, and circular cone ring drift angle uses circular arc mistake
Cross, form taper seat dividing potential drop and damping effect.As one protect structure, coning angle make coverplate stress be decomposed into downforce and
Circumferential pressure, downforce is to press the pressure of package main body straight down, and circumferential pressure is the pressure that circumferentially normal is outside, angle
Spending the biggest, circumferential pressure is the biggest, and it produces lateral bending square=circumferential pressure * body height, and this moment work is destructive useless
Merit, thus design the angle that this angle Selection is relatively small；Meanwhile, need to meet vibration damping in coning angle design certain limit
Effect, prevents mechanical type shock loading.
3, the base material that polyether-ether-ketone of the present invention uses can resist higher pressure, but poor fluidity；Glass in adjuvant
Fibre has the effect of strengthening rigidity, and carbon fibre has the characteristic of self-lubricating, has higher intensity, has higher flowing simultaneously
Property, both are by making material have good welding performance after suitable ratio mixed injection molding molding.
4, on box body of the present invention, on the one hand the energy of welding can be carried out by the Welding Structure that cross section is triangle of design
Focus on, produce more powerful energy and high temperature, moment fusion welding, on the other hand, it is possible to resist the vibration from cover plate, no
Only reduce harmful vibration, be translated into the useful vibration being welded with facilitation, additionally increase the intensity of local,
It is unlikely to melting the most completely when to occur the bad phenomenon such as conquassation.
5, there is bottom box body of the present invention the conical bottom of certain taper, there is the energy of carrying higher pressure higher temperature operating mode
Power, the same cover plate of its taper design；Box body wall thickness is designed as the ability with pressure and the hydraulic pressure resisting periphery normal direction.
Accompanying drawing explanation
Fig. 1 is present invention overall structure schematic diagram before welding；
Fig. 2 is the overall structure schematic diagram after the welding of the present invention；
Fig. 3 is the three dimensional structure schematic diagram of box body of the present invention.
Wherein, 1-cover plate, 2-box body.
Detailed description of the invention
Develop simultaneously embodiment below in conjunction with the accompanying drawings, describes the present invention.
As shown in Figure 1, the invention provides a kind of electronic chip packaging structure using ultrasonic bonding, this encapsulation is tied
Structure includes cover plate 1 and the box body 2 being made up of polyetheretherketonematerials materials, and ancillary equipment is electronic chip；Cover plate 1 and the material of box body 2
Using polyether-ether-ketone, the base material of polyether-ether-ketone uses Wei Gesi 450, and adjuvant uses the glass of 20% and the carbon fibre of 15%, both
Ratio sum is less than 45%；Temperature during injection is maintained at 390 degree, and pressure is maintained at 30MPa.
Described cover plate 1 is circular configuration, and it is the conical ring of triangle that its outer circumference surface is circumferentially machined with one cross section,
This conical ring is positioned at the center of cover plate 1 thickness, and the drift angle of conical ring is arc transition；Have on the bottom surface of described cover plate together
The Welding Structure of annular, this welded cross section is triangle；The thickness of cover plate 1 is 1.8mm, Welding Structure section triangle
Height be 0.6mm, a length of 0.7mm in base.
The inner chamber of box body 2 is made up of two continuous print cylindrical cavities, and the cavity diameter of box body 2 opening is more than blind end
Cavity diameter, form the step surface of level between two cylindrical cavities, step surface be circumferentially machined with one annular
Welding Structure, welded cross section is triangle；The end face of box body 2 blind end is coned face；Box body Welding Structure cross section
The height of triangle is 0.6mm, a length of 0.7mm in base, and cover plate and the welded centre-to-centre spacing of box body are respectively 8mm and 7mm,
The external diameter of cover plate is 17.4mm, and the external diameter of box body is 20mm, and the internal diameter of first cavity of box body is 18mm, the tapering bottom box body
It it is 2 °
As shown in Figures 2 and 3, cover plate 1 is fixed on the major diameter cavity of box body 2 open end by the form of ultrasonic bonding
In, the Welding Structure on cover plate 1 and box body 2 is fastened to each other after melting, and electronic chip is encapsulated in the minor diameter of box body 2
In cavity.
In sum, these are only presently preferred embodiments of the present invention, be not intended to limit protection scope of the present invention.
All within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made, should be included in the present invention's
Within protection domain.
Claims (5)
1. the electronic chip packaging structure using ultrasonic bonding, it is characterised in that this encapsulating structure includes by polyethers ether
Cover plate that ketone material is made and box body, ancillary equipment is electronic chip；
Described cover plate is circular configuration, and it is the conical ring of triangle that its outer circumference surface is circumferentially machined with one cross section, this cone
Shape ring is positioned at the center of cover sheet thickness, and the drift angle of conical ring is arc transition；One annular is had on the bottom surface of described cover plate
Welding Structure, this welded cross section is triangle；
The inner chamber of described box body is made up of two continuous print cylindrical cavities, and the cavity diameter of box opening end is more than blind end
Cavity diameter, forms the step surface of level, step surface is circumferentially machined with the weldering of one annular between two cylindrical cavities
Access node structure, welded cross section is triangle；The end face of box body blind end is coned face；
Described cover plate passes through the welding in the major diameter cavity of box body open end, on cover plate and box body of the form of ultrasonic bonding
Structure is fastened to each other after melting, and electronic chip is encapsulated in the minor diameter cavity of box body.
2. the electronic chip packaging structure using ultrasonic bonding as claimed in claim 1, it is characterised in that described polyethers ether
The base material of ketone uses Wei Gesi 450, and adjuvant uses glass and carbon fine, and both ratio sums are less than 45%；During injection
Temperature is maintained at 390 degree, and pressure is maintained at 30MPa.
3. the electronic chip packaging structure using ultrasonic bonding as claimed in claim 1 or 2, it is characterised in that described lid
The thickness of plate is 1.8mm, and the height of Welding Structure section triangle is 0.6mm, a length of 0.7mm in base.
4. the electronic chip packaging structure using ultrasonic bonding as claimed in claim 3, it is characterised in that described box body welds
The height of access node structure section triangle is 0.6mm, a length of 0.7mm in base, and cover plate and the welded centre-to-centre spacing of box body are respectively
For 8mm and 7mm, the external diameter of cover plate is 17.4mm, and the external diameter of box body is 20mm, and the internal diameter of first cavity of box body is 18mm.
5. the electronic chip packaging structure using ultrasonic bonding as claimed in claim 1, it is characterised in that bottom box body
Tapering is 2 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864100.8A CN106298685B (en) | 2016-09-29 | 2016-09-29 | A kind of electronic chip packaging structure using ultrasonic bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864100.8A CN106298685B (en) | 2016-09-29 | 2016-09-29 | A kind of electronic chip packaging structure using ultrasonic bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106298685A true CN106298685A (en) | 2017-01-04 |
| CN106298685B CN106298685B (en) | 2019-01-04 |
Family
ID=57715714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610864100.8A Expired - Fee Related CN106298685B (en) | 2016-09-29 | 2016-09-29 | A kind of electronic chip packaging structure using ultrasonic bonding |
Country Status (1)
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| CN (1) | CN106298685B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108122812A (en) * | 2017-12-15 | 2018-06-05 | 威海万丰镁业科技发展有限公司 | A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination |
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Patent Citations (16)
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| JPS5358767A (en) * | 1976-11-08 | 1978-05-26 | Toshiba Corp | Production of semiconductor device |
| JPS59129445A (en) * | 1983-01-14 | 1984-07-25 | Sony Corp | Manufacture of semiconductor device |
| JPH05264750A (en) * | 1991-12-28 | 1993-10-12 | Eta Sa Fab Ebauches | Watch, watch glass, case and method for fixing glass to watch case |
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| US7690548B2 (en) * | 2005-01-03 | 2010-04-06 | 3M Innovative Properties Company | Apparatus of adjusting the position of an ultrasonic welding horn |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| Publication number | Publication date |
|---|---|
| CN106298685B (en) | 2019-01-04 |
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Granted publication date: 20190104 Termination date: 20190929 |