CN108112158A - A kind of flexible PCB yoke plate structure - Google Patents
A kind of flexible PCB yoke plate structure Download PDFInfo
- Publication number
- CN108112158A CN108112158A CN201711365612.0A CN201711365612A CN108112158A CN 108112158 A CN108112158 A CN 108112158A CN 201711365612 A CN201711365612 A CN 201711365612A CN 108112158 A CN108112158 A CN 108112158A
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- China
- Prior art keywords
- layers
- copper
- cover film
- flexible pcb
- yoke plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of flexible PCB yoke plate structures, including setting gradually from top to bottom and Justified upper cover film, upper layers of copper, PI bases, lower layers of copper and lower cover layer, PI bases are provided with tie point cutting line, upper layers of copper includes being located at the upper left layers of copper that two lateral extent of tie point cutting line is less than or equal to 0.1mm, first upper right layers of copper and the second upper right layers of copper, lower layers of copper includes corresponding up and down with upper layers of copper structure, it is arranged on the uplifting window area of the upper surface of PI bases and/or the dropping window area of lower surface, uplifting window area include between upper left layers of copper and the first upper right layers of copper and region of its upper part and upper cover film it is upper in upper left layers of copper right end starting subregion should, further include the EIM layers that upper surface or lower surface is completely covered.Windowing up and down is set by tie point cutting line is avoided by using levels layers of copper and levels cover film, all covers EIM layers in the one side for needing to increase electromagnetism interference, meets client's needs.
Description
Technical field
The present invention relates to flexible circuit board structure technical field, more particularly to a kind of flexible PCB yoke plate structure.
Background technology
Flexible PCB is that have height reliability as one kind made of base material using polyimides or polyester film, excellent
Flexible printed circuit.Abbreviation soft board or FPC have the characteristics that Distribution density is high, light-weight, thickness is thin, are mainly used in
Many products such as mobile phone, laptop, PDA, digital camera, LCM.
TP and display module industry at present, each produce competes between family more and more fierce, and the price of product will become each production man
Most important chip is compared with, therefore reduces cost and the competitiveness of monovalent direct relation enterprise.And current flexible circuit board industry
It is interior, all it is that element under SMT (efficiency of element is low under simple grain) is done using yoke plate flexible circuit board for higher efficiency and yield,
Under be divided into simple grain after complete element, such as using tearing technique into simple grain, then 0.2-0.5 can be gone to by having torn rear tie points and protruding FPC sides
Scope, it is impossible to meet customer requirement；And if using punching or laser cutting tie point into simple grain technique, efficiency it is low and
It is of high cost.
The content of the invention
The object of the present invention is to provide a kind of flexible PCB yoke plate structures so that tie point protrudes flexible circuit edges of boards
It controls in minimum, to the control of flexible PCB Outside Dimensions in the margin of tolerance.
In order to solve the above technical problems, an embodiment of the present invention provides a kind of flexible PCB yoke plate structure, including from upper
It is set gradually under and Justified upper cover film, upper layers of copper, PI bases, lower layers of copper and lower cover layer, the PI bases
Tie point cutting line is provided with, the upper layers of copper is including the upper left layers of copper on the left of the tie point cutting line and positioned at described
The first upper right layers of copper, the second upper right layers of copper on the right side of tie point cutting line, the lower layers of copper include set corresponding with the upper layers of copper
Lower-left layers of copper, the first bottom right layers of copper and the second bottom right layers of copper put, the left end of the first upper right layers of copper, the upper left layers of copper
The spacing of right end and the tie point cutting line, which is respectively less than, equal to 0.1mm, further includes the upper surface for being arranged on the PI bases
Uplifting window area and the dropping window area for being arranged on lower surface, the upper cover film include being arranged in the upper layers of copper from left to right connecting
Continuous upper left cover film, in upper cover film, upper right cover film, the left end of the upper right cover film and the first upper right layers of copper
Left alignment, the right end of the upper left cover film are located at the upper left layers of copper upper surface, and the uplifting window area includes the upper left
Region between layers of copper and the first upper right layers of copper and it is described in region where upper cover film, the Xia Chuan areas with it is described
Uplifting window mouth corresponds to, and further includes upper EMI layers that upper surface is completely covered or lower EMI layers that lower surface is completely covered.
Wherein, further include and be arranged between the upper cover film and the upper layers of copper to connect the upper cover film and institute
It states the upper glue layer of layers of copper and/or is arranged between the lower cover film and the lower layers of copper to connect the lower cover film
With the lower glue layer of the lower layers of copper.
Wherein, the described upper EMI layers width beyond the lower cover film is super for lower EMI layers of 0.1mm~0.2mm or described
The width for going out the lower cover film is 0.1mm~0.2mm.
Wherein, the uplifting window mouth is located at one end of the upper cover film, the width of the upper cover film for 0.7mm~
0.8mm。
Wherein, the spacing between the first upper right layers of copper and the second upper right layers of copper is 0.05mm~0.1mm.
Wherein, the spacing between the upper left cover film and the upper right cover film is 0.7mm~0.75mm.
Wherein, the straight slot for being arranged on the upper left layers of copper and the lower-left layers of copper above or below, the straight slot are further included
The right it is conllinear with the tie point cutting line.
Wherein, the straight slot is arc-shaped slot pass or right angled triangle straight slot.
Wherein, the left end spacing of the straight slot and the second upper right layers of copper is 0.25mm~0.3mm.
Wherein, the length of the second upper right layers of copper is 0.1mm~0.15mm.
The flexible PCB yoke plate structure that the embodiment of the present invention is provided, compared with prior art, has the following advantages：
Flexible PCB yoke plate structure provided in an embodiment of the present invention, by using levels layers of copper and levels cover film
By avoiding tie point cutting line, uplifting window mouth and dropping window mouth are set in tie point cutting line, it is ensured that tear fracture tie point is into simple grain
After FPC, prominent flexible circuit board side control reaches to FPC peripheral controls in the range of standard of tolerance to minimum, and ensures not
The optimum efficiency for being not easy breakpoint and board falling is produced before tearing tie point；And pass through above EMI layers or EMI layers lower of setting, in the external world
EMI layers of setting is completely covered in the strong one side of electromagnetic interference, improves the antijamming capability to outside electromagnetic interference, enables
It is worked normally under more severe electromagnetic environment, improves the functional reliability for being attached thereto device, and effectively reduce cost.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is a kind of structural representation of specific embodiment of flexible PCB yoke plate structure provided in an embodiment of the present invention
Figure；
Fig. 2 is that the structure of another specific embodiment of flexible PCB yoke plate structure provided in an embodiment of the present invention is shown
It is intended to.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment belongs to the scope of protection of the invention.
~Fig. 2 is please referred to Fig.1, Fig. 1 is a kind of specific reality of flexible PCB yoke plate structure provided in an embodiment of the present invention
Apply the structure diagram of mode；Fig. 2 is another specific implementation of flexible PCB yoke plate structure provided in an embodiment of the present invention
The structure diagram of mode.
In a kind of specific embodiment, the flexible PCB yoke plate structure, including setting gradually from top to bottom and two
50 layers of upper cover film 10, upper layers of copper 20, PI bases 30, lower layers of copper 40 and the lower cover film of alignment are held, the PI bases 30 are set
There is tie point cutting line, the upper layers of copper 20 is including the upper left layers of copper 21 on the left of the tie point cutting line and positioned at described
The first upper right layers of copper 22, the second upper right layers of copper 23 on the right side of tie point cutting line, the lower layers of copper 40 include and the upper layers of copper
The 20 lower-left layers of copper 41 being correspondingly arranged, the first bottom right layers of copper 42 and the second bottom right layers of copper 43, a left side for the first upper right layers of copper 22
End, the right end of the upper left layers of copper 21 are respectively less than with the spacing of the tie point cutting line is equal to 0.1mm, further includes and is arranged on institute
It states the uplifting window area of the upper surface of PI bases 30 and is arranged on the dropping window area of lower surface, the upper cover film 10 includes being arranged on
In the upper layers of copper 20 from left to right continuous upper left cover film, in upper cover film, upper right cover film, the upper right cover film
Left end and the left alignment of the first upper right layers of copper 22, the right end of the upper left cover film are located at 21 upper table of upper left layers of copper
Face, the uplifting window area include the region and the middle overlying between the upper left layers of copper 21 and the first upper right layers of copper 22
Region where epiphragma, the Xia Chuan areas are corresponding with the uplifting window mouth, further include upper EMI layers or complete that upper surface is completely covered
Lower EMI layers of all standing lower surface.
Upper surface is completely covered or lower surface is completely covered here, is arranged on and completes corresponding layers of copper structure design, covers
Outer surface after epiphragma design, windowing setting, sets EMI layers so that flexible PCB yoke plate structure can on the surface
There is anti-jamming effectiveness to the electromagnetic interference of assigned direction.
As above the upper cover film upper surface, 21 upper surface of upper left layers of copper, the PI bases 30 are arranged on for EMI layers
Upper surface, the upper surface of the upper right cover film, lower EMI layers are arranged on 50 lower surface of lower cover film, the lower-left layers of copper
41 lower surface, the lower surface of the PI bases 30, the bottom right cover film.
The flexible PCB yoke plate structure, cuts by using levels layers of copper and levels cover film by tie point is avoided
Broken string sets uplifting window mouth and dropping window mouth in tie point cutting line, it is ensured that for tear fracture tie point into after simple grain FPC, protrusion is soft
Circuit edges of boards are controlled to minimum, are reached to FPC peripheral controls in the range of standard of tolerance, and are ensured do not tearing tie point previous existence
Production is not easy the optimum efficiency of breakpoint and board falling；；And EMI is set by being completely covered in the strong one side of outside electromagnetic interference
Layer, improves the antijamming capability to outside electromagnetic interference, enables to work normally under more severe electromagnetic environment, carry
Height is attached thereto the functional reliability of device, and effectively reduces cost.
Flexible PCB yoke plate structure in the present invention, which is all in, needs the one side for carrying out electromagnetism interference to set EMI layers i.e.
Can, it is generally used for being fitted and connected with other devices, EMI layers are arranged on outside.
The second upper right layers of copper 23 and the second bottom right layers of copper 43 in the present invention are used as edge ground wire, therefore and phase
Adjacent the first upper right layers of copper 22 and the first bottom right layers of copper 42 is separated and used.
It is pointed out that the present invention is for upper cover film 10, upper layers of copper 20, PI bases 30, lower layers of copper 40 and lower covering
The thickness that 50 layers of film is not specifically limited.
Uplifting window area in the present invention be by away from PI bases 30 in the part of 21 and first upper right layers of copper 22 of upper left layers of copper
And 10 part of upper cover film in upper left layers of copper 21 removes what is formed, typically just passes through one closed recess shape of setting
Windowing sets a groove in the specific position of upper left layers of copper 21 and upper cover film 10, form windowing, generally square
Shape windowing.
In order to improve connection effect and quality between upper cover film 10 and upper layers of copper 20, the flexible PCB yoke plate knot
Structure, which further includes, to be arranged between the upper cover film 10 and the upper layers of copper 20 to connect the upper cover film 10 and described
The upper glue layer 60 of layers of copper 20 and/or be arranged between the lower cover film 50 and the lower layers of copper 40 for connect it is described under cover
The lower glue layer 70 of epiphragma 50 and the lower layers of copper 40.
The present invention is not limited for the type and thickness of upper glue layer 60 and lower glue layer 70, both general to use same class
The glue of type, same thickness.
By the way that the one side for strengthening electromagnetism interference is being needed to set 80 or lower EMI layers of EMI layers, anti-interference energy is improved
Power, and due to without setting EMI layers simultaneously in both sides, while device reliability is improved, reducing cost, being also suitable simultaneously
In some special situations.It should be noted that in the present invention in 80 or lower EMI layers of upper EMI layers be completely covered it is entire
Harden structure.
And for upper EMI layers 80 and lower EMI layers of size, the present invention is not specifically limited, and general described upper EMI layers 80 surpasses
The width for going out the lower cover film 50 is that the lower EMI layers width beyond the lower cover film 50 of 0.1mm~0.2mm or described is
0.1mm~0.2mm.
In one embodiment, the upper EMI layers 80 are 0.2mm beyond the width of the lower cover film 50, described EMI layers lower
Width beyond the lower cover film 50 is 0.2mm.
Positioning and the setting of windowing, the uplifting window mouth are located at the upper cover film 10 for convenience in the present invention
One end, the width of the upper cover film 10 is 0.7mm~0.8mm.
In the present invention, be not specifically limited for the length of each several part in upper layers of copper 20, can according to actual needs into
Row setting.
The length of the general first upper right layers of copper 22 is 0.1mm~0.15mm.
Spacing between the first upper right layers of copper 22 and the second upper right layers of copper 23 is generally 0.05mm~0.1mm,
Spacing between the upper left cover film 10 and the upper right cover film 10 is 0.7mm~0.75mm.
For example, in one embodiment of the invention, the length of the first upper right layers of copper 22 is 0.1mm, the first upper right layers of copper
Gap between 22 and the second upper right layers of copper 23 is 0.05mm, the upper left cover film 10 and the upper right cover film 10 it
Between spacing be 0.75mm.
The present invention is not specifically limited for the width of upper cover film 10 and lower cover film 50, and generally 0.7mm~
0.8mm, windowing are arranged on one end of cover film, and this setup is set convenient for the positioning and windowing of windowing.
It is divided into simple grain after complete element under the purpose of setting tie point cutting line is conveniently in the present invention, such as uses tearing technique
Into simple grain, in order to further facilitate separative efficiency, in one embodiment of invention, the flexible PCB yoke plate structure is also wrapped
Include the straight slot 90 for being arranged on the upper left layers of copper and the lower-left layers of copper above or below, the right and the company of the straight slot 90
Contact cutting line is conllinear.
Straight slot 90 in the present invention is exactly by the presumptive area in upper left layers of copper Yu the lower-left layers of copper above or below
Cut or emptied what is formed, the present invention is not limited for the generation type of groove.
By setting straight slot 90 in the present invention, reduce the region that has copper to cover on flexible PCB tears difficulty, this is logical
The setting of slot 90 is in the outside in lying copper region domain, generally can also be carried out in the adjacent flexible circuit plate part with the lying copper region domain
Division operation is gone in cutting.Since tie point cutting line is located at the right side of straight slot 90, in order to further facilitate flexible circuit board structure
Segmentation, the straight slot 90 is the straight slot 90 that from left to right depth gradually increases, easy to process.
The present invention is not limited for the structure of straight slot 90, and the straight slot 90 can be arc-shaped slot pass 90 or right angle trigonometry
Shape straight slot 90 or other shapes of straight slot 90.
And for the spacing between the first upper right layers of copper and the second upper right layers of copper, the present invention does not limit, the straight slot 90
0.25mm~0.3mm is generally with the left end spacing of the second upper right layers of copper, it, can also be certainly if user has special needs
Row is designed and customizes.
In one embodiment of the invention, the left end spacing of the 90 and second upper right layers of copper 20 of straight slot is 0.25mm,
Right end spacing with the second upper right layers of copper 20 is 0.4mm.
The present invention is not limited for the length of the second upper right layers of copper 23, due to the second upper right layers of copper 23 and the second bottom right copper
Layer 42 is used as edge ground wire, and the length of the second upper right layers of copper 23 is generally 0.1mm~0.15mm, and user may be used also
With the second upper right layers of copper 23 of designed, designed appropriate length as needed.
In conclusion flexible PCB yoke plate structure provided in an embodiment of the present invention, by using levels layers of copper and upper
Lower floor's cover film sets uplifting window mouth and dropping window mouth by tie point cutting line is avoided, in tie point cutting line, it is ensured that tear fracture connects
Into after simple grain FPC, prominent flexible circuit board side control reaches to FPC peripheral controls to minimum in the range of standard of tolerance contact
And ensure to produce the optimum efficiency for being not easy breakpoint and board falling before tie point is not torn；And by strong in outside electromagnetic interference
One side be completely covered setting EMI layers, improve the antijamming capability to outside electromagnetic interference, enable more severe
It is worked normally under electromagnetic environment, improves the functional reliability for being attached thereto device, and effectively reduce cost.
Flexible PCB yoke plate structure provided by the present invention is described in detail above.It is used herein specifically
A example is set forth the principle of the present invention and embodiment, and the explanation of above example is only intended to help to understand the present invention
Method and its core concept.It should be pointed out that for those skilled in the art, original of the invention is not being departed from
On the premise of reason, can also to the present invention some improvement and modification can also be carried out, these improvement and modification also fall into right of the present invention will
In the protection domain asked.
Claims (10)
1. a kind of flexible PCB yoke plate structure, which is characterized in that including setting gradually from top to bottom and Justified overlying
Epiphragma, upper layers of copper, PI bases, lower layers of copper and lower cover layer, the PI bases are provided with tie point cutting line, the upper layers of copper
The first upper right copper including the upper left layers of copper being located on the left of the tie point cutting line and on the right side of the tie point cutting line
Layer, the second upper right layers of copper, the lower layers of copper include the lower-left layers of copper being correspondingly arranged with the upper layers of copper, the first bottom right layers of copper and the
Two bottom right layers of copper, the spacing of the left end of the first upper right layers of copper, the right end of the upper left layers of copper and the tie point cutting line
Respectively less than it is equal to 0.1mm, further includes the uplifting window area for the upper surface for being arranged on the PI bases and be arranged under lower surface and open
Window area, the upper cover film include being arranged in the upper layers of copper from left to right continuous upper left cover film, in upper cover film, the right side
Upper cover film, the left end of the upper right cover film and the left alignment of the first upper right layers of copper, the right side of the upper left cover film
End is located at the upper left layers of copper upper surface, and the uplifting window area is included between the upper left layers of copper and the first upper right layers of copper
Region and it is described in region where upper cover film, the Xia Chuan areas are corresponding with the uplifting window mouth, further include and are completely covered
Upper EMI layers of upper surface or it is completely covered lower EMI layers of lower surface.
2. flexible PCB yoke plate structure as described in claim 1, which is characterized in that further include be arranged on the upper cover film and
It is used to connect the upper glue layer of the upper cover film and the upper layers of copper between the upper layers of copper and/or is arranged on the lower covering
It is used to connect the lower cover film and the lower glue layer of the lower layers of copper between film and the lower layers of copper.
3. flexible PCB yoke plate structure as claimed in claim 2, which is characterized in that described upper EMI layers exceeds the lower covering
The width of film is that the lower EMI layers width beyond the lower cover film of 0.1mm~0.2mm or described is 0.1mm~0.2mm.
4. flexible PCB yoke plate structure as claimed in claim 3, which is characterized in that the uplifting window mouth is located at the upper covering
One end of film, the width of the upper cover film is 0.7mm~0.8mm.
5. flexible PCB yoke plate structure as claimed in claim 4, which is characterized in that the first upper right layers of copper and described second
Spacing between upper right layers of copper is 0.05mm~0.1mm.
6. flexible PCB yoke plate structure as claimed in claim 5, which is characterized in that the upper left cover film is covered with the upper right
Spacing between epiphragma is 0.7mm~0.75mm.
7. flexible PCB yoke plate structure as claimed in claim 6, which is characterized in that further include be arranged on the upper left layers of copper with
The straight slot of the lower-left layers of copper above or below, the right of the straight slot are conllinear with the tie point cutting line.
8. flexible PCB yoke plate structure as claimed in claim 7, which is characterized in that the straight slot is arc-shaped slot pass or right angle
Triangle straight slot.
9. flexible PCB yoke plate structure as claimed in claim 8, which is characterized in that the straight slot and the second upper right layers of copper
Left end spacing be 0.25mm~0.3mm.
10. flexible PCB yoke plate structure as described in claim 1, which is characterized in that the length of the second upper right layers of copper is
0.1mm~0.15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711365612.0A CN108112158A (en) | 2017-12-18 | 2017-12-18 | A kind of flexible PCB yoke plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711365612.0A CN108112158A (en) | 2017-12-18 | 2017-12-18 | A kind of flexible PCB yoke plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108112158A true CN108112158A (en) | 2018-06-01 |
Family
ID=62209872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711365612.0A Pending CN108112158A (en) | 2017-12-18 | 2017-12-18 | A kind of flexible PCB yoke plate structure |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003304038A (en) * | 2002-04-11 | 2003-10-24 | Fuji Photo Film Co Ltd | Wiring board |
| CN1486128A (en) * | 2002-07-29 | 2004-03-31 | �ձ�������ҵ��ʽ���� | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| CN103517552A (en) * | 2013-09-22 | 2014-01-15 | 深圳市精益盛电子有限公司 | Piece-connecting-type printed circuit board and cutting transplanting technology method |
| US20140063756A1 (en) * | 2012-09-04 | 2014-03-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Printed circuit board (pcb), laminating method of the pcb and chip on flexible printed circuit board, and lcd device |
| CN105960112A (en) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | Manufacturing method of flexible printed circuit board splice board |
-
2017
- 2017-12-18 CN CN201711365612.0A patent/CN108112158A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003304038A (en) * | 2002-04-11 | 2003-10-24 | Fuji Photo Film Co Ltd | Wiring board |
| CN1486128A (en) * | 2002-07-29 | 2004-03-31 | �ձ�������ҵ��ʽ���� | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| US20140063756A1 (en) * | 2012-09-04 | 2014-03-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Printed circuit board (pcb), laminating method of the pcb and chip on flexible printed circuit board, and lcd device |
| CN103517552A (en) * | 2013-09-22 | 2014-01-15 | 深圳市精益盛电子有限公司 | Piece-connecting-type printed circuit board and cutting transplanting technology method |
| CN105960112A (en) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | Manufacturing method of flexible printed circuit board splice board |
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Application publication date: 20180601 |