CN108135074A - A kind of flexible PCB yoke plate structure - Google Patents
A kind of flexible PCB yoke plate structure Download PDFInfo
- Publication number
- CN108135074A CN108135074A CN201711393313.8A CN201711393313A CN108135074A CN 108135074 A CN108135074 A CN 108135074A CN 201711393313 A CN201711393313 A CN 201711393313A CN 108135074 A CN108135074 A CN 108135074A
- Authority
- CN
- China
- Prior art keywords
- copper
- layers
- cover film
- tie point
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of flexible PCB yoke plate structures, including setting gradually from top to bottom and Justified upper cover film, upper layers of copper, PI bases, lower layers of copper and lower cover layer, PI bases are provided with tie point cutting line, upper layers of copper includes being located at upper left layers of copper of the distance less than or equal to 0.1mm and the spacing on the right side of tie point cutting line on the left of tie point cutting line and is respectively less than equal to 0.1mm the first upper right layers of copper, second upper right layers of copper, lower layers of copper includes corresponding up and down with upper layers of copper structure, it is arranged on the uplifting window area of the upper surface of PI bases or the dropping window area of lower surface, uplifting window area include between upper left layers of copper and the first upper right layers of copper and region of upper part and upper cover film it is upper in upper left layers of copper right end starting subregion should.Using levels layers of copper and only one side setting windowing, cover film avoid tie point, it is ensured that for tear fracture tie point into after simple grain FPC, tie point protrudes the control of flexible circuit board side to minimum, reaches client to the control of FPC Outside Dimensions in the range of standard of tolerance.
Description
Technical field
The present invention relates to flexible circuit board structure technical field, more particularly to a kind of flexible PCB yoke plate structure.
Background technology
Flexible PCB is that have height reliability as one kind made of base material using polyimides or polyester film, excellent
Flexible printed circuit.Abbreviation soft board or FPC have the characteristics that Distribution density is high, light-weight, thickness is thin, are mainly used in
Many products such as mobile phone, laptop, PDA, digital camera, LCM.
TP and display module industry at present, each produce competes between family more and more fierce, and the price of product will become each production man
Most important chip is compared with, therefore reduces cost and the competitiveness of monovalent direct relation enterprise.And current flexible circuit board industry
It is interior, all it is that element under SMT (efficiency of element is low under simple grain) is done using yoke plate flexible circuit board for higher efficiency and yield,
Under be divided into simple grain after complete element, such as using tearing technique into simple grain, then 0.2-0.5 can be gone to by having torn rear tie points and protruding FPC sides
Range, it is impossible to meet customer requirement；And if using punching or laser cutting tie point into simple grain technique, efficiency it is low and
It is of high cost.
Invention content
The object of the present invention is to provide a kind of flexible PCB yoke plate structures so that tie point protrudes flexible circuit edges of boards
It controls in minimum, to the control of flexible PCB Outside Dimensions in the margin of tolerance.
In order to solve the above technical problems, an embodiment of the present invention provides a kind of flexible PCB yoke plate structure, including from upper
It is set gradually under and Justified upper cover film, upper layers of copper, PI bases, lower layers of copper and lower cover layer, the PI bases
Tie point cutting line is provided with, the upper layers of copper is including the upper left layers of copper on the left of the tie point cutting line and positioned at described
The first upper right layers of copper, the second upper right layers of copper on the right side of tie point cutting line, the lower layers of copper include set corresponding with the upper layers of copper
Lower-left layers of copper, the first bottom right layers of copper and the second bottom right layers of copper put, the left end of the first upper right layers of copper, the upper left layers of copper
The spacing of right end and the tie point cutting line, which is respectively less than, equal to 0.1mm, further includes the upper surface for being arranged on the PI bases
Uplifting window area or the dropping window area for being arranged on lower surface, the upper cover film include being arranged in the upper layers of copper from left to right connecting
Continuous upper left cover film, in upper cover film, upper right cover film, the left end of the upper right cover film and the first upper right layers of copper
Left alignment, the right end of the upper left cover film are located at the upper left layers of copper upper surface, and the uplifting window area includes the upper left
Region between layers of copper and the first upper right layers of copper and it is described in region where upper cover film, the Xia Chuan areas with it is described
Uplifting window mouth corresponds to.
Wherein, it further includes and is arranged between the upper cover film and the upper layers of copper to connect the upper cover film and institute
It states the upper glue layer of layers of copper and/or is arranged between the lower cover film and the lower layers of copper to connect the lower cover film
With the lower glue layer of the lower layers of copper.
Wherein, the length of the first upper right layers of copper is 0.1mm~0.15mm.
Wherein, the spacing between the first upper right layers of copper and the second upper right layers of copper is 0.05mm~0.1mm.
Wherein, the spacing between the upper left cover film and the upper right cover film is 0.7mm~0.75mm.
Wherein, the straight slot for being arranged on the upper left layers of copper and the lower-left layers of copper above or below, the straight slot are further included
The right it is conllinear with the tie point cutting line.
Wherein, the straight slot is the straight slot that from left to right depth gradually increases.
Wherein, the straight slot is arc-shaped slot pass or right angled triangle straight slot.
Wherein, the left end spacing of the straight slot and the second upper right layers of copper is 0.25mm~0.3mm.
Wherein, the length of the second upper right layers of copper is 0.1mm~0.15mm.
The flexible PCB yoke plate structure that the embodiment of the present invention is provided, compared with prior art, has the following advantages：
Flexible PCB yoke plate structure provided in an embodiment of the present invention is opened by using levels layers of copper with only one side setting
Window, i.e., only set uplifting window mouth or dropping window mouth, and corresponding cover film avoids tie point cutting line, it is ensured that tear fracture tie point Cheng Dan
After grain FPC, tie point protrudes the control of flexible circuit board side to minimum, and the control of FPC Outside Dimensions is being marked with ensuring to reach client
In the quasi- margin of tolerance；Ensure to be not easy breakpoint and board falling in producing before tie point is not torn simultaneously.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is a kind of facing structure of specific embodiment of flexible PCB yoke plate structure provided in an embodiment of the present invention
Schematic diagram；
Fig. 2 is that the structure of another specific embodiment of flexible PCB yoke plate structure provided in an embodiment of the present invention is shown
It is intended to.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
~Fig. 2 is please referred to Fig.1, Fig. 1 is a kind of specific reality of flexible PCB yoke plate structure provided in an embodiment of the present invention
Apply the positive structure diagram of mode；
Fig. 2 is that the structure of another specific embodiment of flexible PCB yoke plate structure provided in an embodiment of the present invention is shown
It is intended to.
In a kind of specific embodiment, the flexible PCB yoke plate structure, including setting gradually from top to bottom and two
50 layers of upper cover film 10, upper layers of copper 20, PI bases 30, lower layers of copper 40 and the lower cover film of alignment are held, the PI bases 30 are set
There is tie point cutting line, the upper layers of copper 20 is including the upper left layers of copper 21 on the left of the tie point cutting line and positioned at described
The first upper right layers of copper 22, the second upper right layers of copper 23 on the right side of tie point cutting line, the lower layers of copper 40 include and the upper layers of copper
The 20 lower-left layers of copper 41 being correspondingly arranged, the first bottom right layers of copper 42 and the second bottom right layers of copper 42, a left side for the first upper right layers of copper 22
End, the right end of the upper left layers of copper 21 are respectively less than with the spacing of the tie point cutting line is equal to 0.1mm, further includes and is arranged on institute
It states the uplifting window area of the upper surface of PI bases 30 or is arranged on the dropping window area of lower surface, the upper cover film 10 includes being arranged on
In the upper layers of copper 20 from left to right continuous upper left cover film, in upper cover film, upper right cover film, the upper right cover film
Left end and the left alignment of the first upper right layers of copper 22, the right end of the upper left cover film are located at 21 upper table of upper left layers of copper
Face, the uplifting window area include the region and the middle overlying between the upper left layers of copper 21 and the first upper right layers of copper 22
Region where epiphragma, the Xia Chuan areas are corresponding with the uplifting window mouth.
The flexible PCB yoke plate structure, using levels layers of copper and only one side setting windowing, i.e., only open in setting
Window or dropping window mouth, corresponding cover film avoid tie point cutting line, it is ensured that tear fracture tie point into after simple grain FPC, dash forward by tie point
Go out the control of flexible circuit board side to minimum, FPC Outside Dimensions are controlled in the range of standard of tolerance with ensuring to reach client；Simultaneously
Ensure to be not easy breakpoint and board falling in producing before tie point is not torn.
It should be pointed out that the windowing area in the present invention refers to that the specific position of assist side yoke plate is slotted, formed
Windowing does not need to the window to be formed as straight slot shape, generally closed slots, the general uplifting window area is on described
The front end in the windowing area of cover film 10 opening in the upper left layers of copper 21 and the first upper right layers of copper 22 in the uplifting window area
At outside 0.2mm~0.25mm of the front end in window area, inside 0.25mm~0.3mm of the front end of layers of copper 20 on described first
Place.
The second upper right layers of copper 23 and the second bottom right layers of copper 42 in the present invention are used as edge ground wire, therefore with
One upper right layers of copper 22 and the first bottom right layers of copper 42 are separated and are used.
It should be pointed out that the present invention is for upper cover film 10, upper layers of copper 20, PI bases 30, lower layers of copper 40 and lower covering
The thickness that 50 layers of film is not specifically limited.
In order to improve connection effect and quality between upper cover film 10 and upper layers of copper 20, the flexible PCB yoke plate knot
Structure, which further includes, to be arranged between the upper cover film 10 and the upper layers of copper 20 to connect the upper cover film 10 and described
The upper glue layer 60 of layers of copper 20 and/or be arranged between the lower cover film 50 and the lower layers of copper 40 for connect it is described under cover
The lower glue layer 70 of epiphragma 50 and the lower layers of copper 40.
In the present invention, the length of each section in upper layers of copper 20 is not specifically limited, can according to actual needs into
Row setting.
The length of the general first upper right layers of copper 22 is 0.1mm~0.15mm, the first upper right layers of copper 22 with it is described
Spacing between second upper right layers of copper 23 is 0.05mm~0.1mm, between the upper left cover film and the upper right cover film
Spacing is 0.7mm~0.75mm.
It is divided into simple grain after complete element under the purpose of setting tie point cutting line is conveniently in the present invention, such as uses tearing technique
Into simple grain, in order to further facilitate separative efficiency, in one embodiment of invention, the flexible PCB yoke plate structure is also wrapped
Include the straight slot 80 for being arranged on the upper left layers of copper and the lower-left layers of copper above or below, the right and the company of the straight slot 80
Contact cutting line is conllinear.
Straight slot 80 in the present invention is exactly by the presumptive area in upper left layers of copper Yu the lower-left layers of copper above or below
Cut or emptied what is formed, the present invention does not limit the generation type of groove.
By setting straight slot 80 in the present invention, reduce the region that has copper to cover on flexible PCB tears difficulty, this is logical
The setting of slot 80 is in the outside in lying copper region domain, generally can also be carried out in the adjacent flexible circuit plate part with the lying copper region domain
Division operation is gone in cutting.Since tie point cutting line is located at the right side of straight slot 80, in order to further facilitate flexible circuit board structure
Segmentation, the straight slot 80 is the straight slot 80 that from left to right depth gradually increases, easy to process.
The present invention does not limit the structure of straight slot 80, and the straight slot 80 can be arc-shaped slot pass 80 or right angle trigonometry
Shape straight slot 80 or other shapes of straight slot 80.
And for the spacing between the first upper right layers of copper and the second upper right layers of copper, the present invention does not limit, the straight slot with
The left end spacing of the second upper right layers of copper is generally 0.25mm~0.3mm, can also be voluntarily if user has special needs
It is designed and customizes.
The present invention does not limit the length of the second upper right layers of copper 23, due to the second upper right layers of copper 23 and the second bottom right copper
Layer 42 is used as edge ground wire, and the length of the second upper right layers of copper 23 is generally 0.1mm~0.15mm, and user may be used also
With the second upper right layers of copper 23 of designed, designed appropriate length as needed.
In conclusion flexible PCB yoke plate structure provided in an embodiment of the present invention, by using levels layers of copper and only
Windowing is set on one side, i.e., uplifting window mouth or dropping window mouth are only set, corresponding cover film avoids tie point cutting line, it is ensured that tear fracture
Tie point is into after simple grain FPC, and tie point protrudes the control of flexible circuit board side to minimum, to ensure to reach client to FPC peripheries ruler
Very little control is in the range of standard of tolerance；Ensure to be not easy breakpoint and board falling in producing before tie point is not torn simultaneously.
Flexible PCB yoke plate structure provided by the present invention is described in detail above.It is used herein specifically
A example is expounded the principle of the present invention and embodiment, and the explanation of above example is only intended to help to understand the present invention
Method and its core concept.It should be pointed out that for those skilled in the art, original of the invention is not being departed from
Under the premise of reason, can also to the present invention some improvement and modification can also be carried out, these improvement and modification also fall into right of the present invention will
In the protection domain asked.
Claims (10)
1. a kind of flexible PCB yoke plate structure, which is characterized in that including setting gradually from top to bottom and Justified overlying
Epiphragma, upper layers of copper, PI bases, lower layers of copper and lower cover layer, the PI bases are provided with tie point cutting line, the upper layers of copper
The first upper right copper including the upper left layers of copper being located on the left of the tie point cutting line and on the right side of the tie point cutting line
Layer, the second upper right layers of copper, the lower layers of copper include the lower-left layers of copper being correspondingly arranged with the upper layers of copper, the first bottom right layers of copper and the
Two bottom right layers of copper, the spacing of the left end of the first upper right layers of copper, the right end of the upper left layers of copper and the tie point cutting line
Respectively less than it is equal to 0.1mm, further includes the uplifting window area for the upper surface for being arranged on the PI bases or be arranged under lower surface and open
Window area, the upper cover film include being arranged in the upper layers of copper from left to right continuous upper left cover film, in upper cover film, the right side
Upper cover film, the left end of the upper right cover film and the left alignment of the first upper right layers of copper, the right side of the upper left cover film
End is located at the upper left layers of copper upper surface, and the uplifting window area is included between the upper left layers of copper and the first upper right layers of copper
Region and it is described in region where upper cover film, the Xia Chuan areas are corresponding with the uplifting window mouth.
2. flexible PCB yoke plate structure as described in claim 1, which is characterized in that further include be arranged on the upper cover film and
It is used to connect the upper glue layer of the upper cover film and the upper layers of copper between the upper layers of copper and/or is arranged on the lower covering
It is used to connect the lower cover film and the lower glue layer of the lower layers of copper between film and the lower layers of copper.
3. flexible PCB yoke plate structure as described in claim 1, which is characterized in that the length of the first upper right layers of copper is
0.1mm~0.15mm.
4. flexible PCB yoke plate structure as described in claim 1, which is characterized in that the first upper right layers of copper and described second
Spacing between upper right layers of copper is 0.05mm~0.1mm.
5. flexible PCB yoke plate structure as described in claim 1, which is characterized in that the upper left cover film is covered with the upper right
Spacing between epiphragma is 0.7mm~0.75mm.
6. flexible PCB yoke plate structure as described in claim 1, which is characterized in that further include be arranged on the upper left layers of copper with
The straight slot of the lower-left layers of copper above or below, the right of the straight slot are conllinear with the tie point cutting line.
7. flexible PCB yoke plate structure as claimed in claim 6, which is characterized in that the straight slot is gradual for from left to right depth
Increased straight slot.
8. flexible PCB yoke plate structure as claimed in claim 7, which is characterized in that the straight slot is arc-shaped slot pass or right angle
Triangle straight slot.
9. flexible PCB yoke plate structure as claimed in claim 8, which is characterized in that the straight slot and the second upper right layers of copper
Left end spacing be 0.25mm~0.3mm.
10. flexible PCB yoke plate structure as described in claim 1, which is characterized in that the length of the second upper right layers of copper is
0.1mm~0.15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711393313.8A CN108135074A (en) | 2017-12-18 | 2017-12-18 | A kind of flexible PCB yoke plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711393313.8A CN108135074A (en) | 2017-12-18 | 2017-12-18 | A kind of flexible PCB yoke plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108135074A true CN108135074A (en) | 2018-06-08 |
Family
ID=62392050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711393313.8A Pending CN108135074A (en) | 2017-12-18 | 2017-12-18 | A kind of flexible PCB yoke plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108135074A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11177235A (en) * | 1997-12-08 | 1999-07-02 | Cmk Corp | Manufacture of printed wiring board |
| CN1486128A (en) * | 2002-07-29 | 2004-03-31 | �ձ�������ҵ��ʽ���� | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| KR20150001423A (en) * | 2013-06-27 | 2015-01-06 | 주식회사 파워로직스 | Print circuit board and manufacturing unit of the same and manufacturing method of the same and electronic apparatus |
| CN105960112A (en) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | Manufacturing method of flexible printed circuit board splice board |
| CN107027242A (en) * | 2017-05-26 | 2017-08-08 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board contour processing method |
-
2017
- 2017-12-18 CN CN201711393313.8A patent/CN108135074A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11177235A (en) * | 1997-12-08 | 1999-07-02 | Cmk Corp | Manufacture of printed wiring board |
| CN1486128A (en) * | 2002-07-29 | 2004-03-31 | �ձ�������ҵ��ʽ���� | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| KR20150001423A (en) * | 2013-06-27 | 2015-01-06 | 주식회사 파워로직스 | Print circuit board and manufacturing unit of the same and manufacturing method of the same and electronic apparatus |
| CN105960112A (en) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | Manufacturing method of flexible printed circuit board splice board |
| CN107027242A (en) * | 2017-05-26 | 2017-08-08 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board contour processing method |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180608 |
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| RJ01 | Rejection of invention patent application after publication |