CN108110020A - Method for manufacturing image sensor - Google Patents
Method for manufacturing image sensor Download PDFInfo
- Publication number
- CN108110020A CN108110020A CN201710886534.2A CN201710886534A CN108110020A CN 108110020 A CN108110020 A CN 108110020A CN 201710886534 A CN201710886534 A CN 201710886534A CN 108110020 A CN108110020 A CN 108110020A
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- Prior art keywords
- image sensor
- substrate
- glue
- cambered surface
- line
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 238000007373 indentation Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 abstract description 5
- 239000012790 adhesive layer Substances 0.000 abstract 5
- 239000010410 layer Substances 0.000 abstract 1
- 238000005086 pumping Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention discloses a method for manufacturing an image sensor. A substrate is provided, wherein the substrate has a cambered surface. A cover, a glue layer and an image sensor are provided. The adhesive layer is bonded between the cover and the image sensor. The combined cover body, the adhesive layer and the image sensing element are oppositely positioned on the substrate, and the cover body, the adhesive layer and the image sensing element are pressed on the substrate, so that the image sensing element is bent along with the cambered surface by pushing of the adhesive layer, and the adhesive layer covers the image sensing element.
Description
The present invention is Chinese invention patent application (application number：201611159737.3 the applying date：On December 15th, 2016,
Denomination of invention：Image Sensor) divisional application.
Technical field
Bending image sensing member is included the present invention relates to a kind of manufacturing method of Image Sensor, and more particularly to one kind
The manufacturing method of the Image Sensor of part.
Background technology
In recent years due to multimedia technology flourish, digitized video use is more frequent, consumer for image at
The demand of reason device also increasingly increases.Many digital imagery products, such as network camera (web camera), digital camera
(digital camera), intelligent mobile phone (smart phone) etc., be all by Image Sensor (image sensor) come
Extract image.
For complementary metal oxide semiconductor Image Sensor (CMOS image sensing element),
Bending can be designed to change its optical property, for reducing the quantity of required correspondence lens to reach image sensing
The miniaturization of module.Typically, it is first not yet curved Image Sensor is placed in the cambered surface of substrate, the cambered surface of substrate
Place has perforation to being located at Image Sensor, then it is described perforate driven in a manner of being evacuated Image Sensor to
It is lower bending and be attached at the cambered surface of substrate, so as to obtain curved Image Sensor.However, such mode must be first in substrate
Formed for pumping perforation and cause manufacture craft it is more time-consuming, and substrate because form perforation due to make its structure more endless
It is whole and Image Sensor can not be fixedly supported, Image Sensor may be caused to generate unexpected deformation at perforation.
In addition, in general image sensing module, Image Sensor is not coated by colloid, therefore is easily had in the fabrication process different
Object (dust in such as environment) is attached on Image Sensor and reduces the quality of image sensing module.
The content of the invention
The present invention provides a kind of manufacturing method of Image Sensor, can save manufacture cost, can make its Image Sensor
It is firmly supported, and foreign matter can be avoided to be attached in the fabrication process on Image Sensor.
The manufacturing method of the Image Sensor of the present invention comprises the following steps.A substrate is provided, substrate has a cambered surface.It carries
For a cover, a glue-line and an Image Sensor.Glue-line is engaged between cover and Image Sensor.It will be combined
Cover, glue-line and Image Sensor to being located at substrate, and press cover, glue-line and Image Sensor to substrate, make shadow
As sensing element is bent by the pushing of glue-line with cambered surface, and glue-line is made to coat Image Sensor.
Based on above-mentioned, in the Image Sensor of the present invention, except configuring Image Sensor in the cambered surface of substrate, more match somebody with somebody
The glue-line of Image Sensor is put to coat.Therefore, it is pressure bonded to by Image Sensor and glue-line in the cambered surface of substrate
During, Image Sensor can be made to be bent with cambered surface the pushing of Image Sensor by glue-line.Due to this hair
It is bright as above non-to bend Image Sensor with air suction mode, therefore be not required to such as traditional manufacturing technique at the cambered surface of substrate
The perforation for pumping is formed, and manufacture craft can be simplified to save manufacture cost.Further, since the substrate of the present invention is as above
It is not required to form perforation, therefore the structure of substrate is more complete and can be fixedly supported Image Sensor.Furthermore by glue-line to shadow
As the cladding of sensing element, foreign matter can be avoided to be attached in the fabrication process on Image Sensor.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is attached appended by cooperation
Figure is described in detail below.
Description of the drawings
Figure 1A is the sectional view of the Image Sensor of one embodiment of the invention；
Figure 1B is the partial component top view of the Image Sensor of Figure 1A；
Fig. 2 is the sectional view of the Image Sensor of another embodiment of the present invention；
Fig. 3 A are the sectional views of the Image Sensor of another embodiment of the present invention；
Fig. 3 B to Fig. 3 E are the manufacturing method flow charts of the Image Sensor of one embodiment of the invention；
Fig. 3 F are the variation diagrams of the environmental pressure of the manufacturing process of the Image Sensor of Fig. 3 A, pressure force and temperature；
Fig. 4 is the sectional view of the Image Sensor of another embodiment of the present invention；
Fig. 5 is the schematic diagram of the cover of another embodiment of the present invention, glue-line and Image Sensor.
Symbol description
100、200、300、400：Image Sensor
110、210、310、410：Substrate
110a、210a、310a、410a：Cambered surface
110b、210b、310b、410b：Dumping slot
120、220、320、420、520：Image Sensor
130、230、330、330’、430、530’：Glue-line
140、340、440、540：Cover
150、250、350：Conductive structure
152、252、352：Conducting wire
154、254、354、454：Conductive through hole
154a、254a、354a、156、256、356、456：Connection pad
160、260、360、460、560：Conducting element
A1、A2、A3：Line segment
D：Direction
E1、E2、E3、E4：End
H：Distance
h：Difference in height
R1、R2、R3、R4：Flange
S1：Upside
S2：Downside
T：Thickness
T1~t7：Time
Specific embodiment
Figure 1A is the sectional view of the Image Sensor of one embodiment of the invention.Please refer to Fig.1 A, the image sense of the present embodiment
Surveying device 100 includes a substrate 110, an Image Sensor 120, a glue-line 130 and a cover 140.Substrate 110 has a cambered surface
110a, Image Sensor 120 are configured on the cambered surface 110a of substrate 110 so that Image Sensor 120 is with substrate 110
Cambered surface 110a and bend.Glue-line 130 is configured on the cambered surface 110a of substrate 110 to coat Image Sensor 120.Cover
140 are configured on substrate 110 to cover Image Sensor 120 and glue-line 130.In the present embodiment, Image Sensor 120
E.g. complementary metal oxide semiconductor Image Sensor (CMOS image sensing element), however this hair
It is bright to be not limited.
Specifically, there is the substrate 110 of the present embodiment opposite a upside S1 and a downside S2, cambered surface 110a to be located at base
The upside S1 of plate 110, and cambered surface 110a forms a groove for cancave cambered surface on substrate 110 as shown in Figure 1A, image sensing member
Part 120 is configured in the groove, and glue-line 130 is filled in the groove, and the curvature of Image Sensor 120 is identical to arc
The curvature of face 110a.In other embodiments, cambered surface 110a be alternatively convex globoidal and Image Sensor 120 be configured at it is described convex
In cambered surface, the present invention is any limitation as not to this.
As described above, it is provided with to coat except configuring Image Sensor 120 on the cambered surface 110a of substrate 110
The glue-line 130 of Image Sensor 120.Therefore, Image Sensor 120 and glue-line 130 are being pressure bonded to the cambered surface of substrate 110
During 110a is upper, can Image Sensor 120 be made with arc to the pushing of Image Sensor 120 by glue-line 130
Face 110a is bent.Image Sensor 120 is bent with air suction mode since the present embodiment is as above non-, therefore is not required to as existing
The perforation for supplying pumping is formed as manufacture craft at the cambered surface 110a of substrate 110, and manufacture craft can be simplified and be manufactured into saving
This.It perforates further, since the substrate 110 of the present embodiment does not have as above at its cambered surface 110a, therefore the structure of substrate 110
More completely it can be fixedly supported Image Sensor 120.Furthermore by glue-line 130 to the bag of Image Sensor 120
It covers, foreign matter can be avoided to be attached in the fabrication process on Image Sensor 120.
Please refer to Fig.1 A, the maximum range H between the top surface of the Image Sensor 120 of the present embodiment and cover 140, example
The such as less than thickness T of cover 140.For example, distance H is, for example, 12.5~100 microns, and thickness T is, for example, 200~1000
Micron.The top surface of Image Sensor 120 is greater than 12.5 microns in the difference in height h of the vertical direction of Figure 1A, however this hair
It is bright to be not limited thereto.
Figure 1B is the partial component top view of the Image Sensor of Figure 1A.To make attached drawing more clear, the glue-line in Figure 1A
130th, cover 140 and conducting element 160 are not illustrated in Figure 1B.A and Figure 1B is please referred to Fig.1, the substrate 110 of the present embodiment has extremely
A few dumping slot 110b (being schematically shown as multiple), the periphery of dumping slot 110b from Image Sensor 120 extend to cambered surface 110a's
Edge, so that the extra colloid generated in 130 forming process of glue-line can be discharged by dumping slot 110b.Specifically, this reality
The multiple flange R1 having on the cambered surface 110a of example around Image Sensor 120 are applied, these flanges R1 compartment of terrain arranges and structure
Into these dumping slots 110b.In addition, the end E1 of these flanges R1 forms a location indentations around Image Sensor 120,
Image Sensor 120 is made to be positioned at the location indentations that the end E1 of these flanges R1 is formed.
In the present embodiment, the outer margin contour of cambered surface 110a is as shown in Figure 1B rectangle, and the end E1 of these flanges R1
The location indentations formed are as shown in Figure 1B rectangle, however the present invention is not limited.In other embodiments, cambered surface
The outer margin contour of 110a can be circular or other suitable shapes, and the location indentations that the end E1 of these flanges R1 is formed
Can be circular or other suitable shapes.In addition, in the present embodiment, cambered surface 110a for example only has radian in the directiond, however
The present invention is not limited, and in other embodiments, cambered surface 110a can also have radian in other directions and form bowl-shape recessed
Slot.
As illustrated in figures 1A and ib, Image Sensor 100 includes a conductive structure 150, and conductive structure 150 is configured at substrate
110 and Image Sensor 120 is electrically connected to, and is extended to from the lower section of Image Sensor 120 outside cambered surface 110a, make image
Sensing element 120 can transfer signal by conductive structure 150.Specifically, it is conductive to include at least one for Image Sensor 100
Element 160 (is schematically shown as two), and conductive structure 150 includes an at least conducting wire 152 (being schematically shown as two), at least one conduction
Through hole 154 (being schematically shown as two, be, for example, silicon perforation (TSV)) and an at least connection pad 156 (being schematically shown as two).Conducting element 160
It e.g. conductive bump and is configured between Image Sensor 120 and cambered surface 110a, two conducting elements 160 are being electrically connected shadow
Two connection pads 156 as sensing element 120 and to be electrically connected conductive structure 150.Two connection pads 156 are configured on cambered surface 110a
And two conducting wires 152 are connected respectively, two conducting wires 152 extend to arc along the upside S1 of substrate 110 out of cambered surface 110a
Face 110a is outer and is respectively connected to two conductive through holes 154, and each conductive through hole 154 is located at connecing for the upside S1 of substrate 110 by it
154a is padded to connect corresponding conducting wire 152, and the downside S2 of substrate 110 is through to outside cambered surface 110a.In the present embodiment
In, each conducting wire 152 of conductive structure 150 is, for example, to be extended to along dumping slot 110b outside cambered surface 110a, however of the invention
It is not limited.
Fig. 2 is the sectional view of the Image Sensor of another embodiment of the present invention.In the embodiment shown in Figure 2, substrate
210th, cambered surface 210a, dumping slot 210b, Image Sensor 220, glue-line 230, conductive structure 250, conducting wire 252, conduction
Through hole 254, connection pad 254a, connection pad 256, conducting element 260, flange R2, the configuration of end E2 and the mode of action are similar to Figure 1A
Substrate 110, cambered surface 110a, dumping slot 110b, Image Sensor 120, glue-line 130, conductive structure 150, conducting wire
152nd, conductive through hole 154, connection pad 154a, connection pad 156, conducting element 160, flange R1, the configuration of end E1 and the mode of action, in
This is repeated no more.The difference of Image Sensor 200 and Image Sensor 100 is in, Image Sensor 200 not as shown in Figure 1A
It configures to cover the cover 140 of Image Sensor 120 and glue-line 130.
Fig. 3 A are the sectional views of the Image Sensor of another embodiment of the present invention.In the embodiment as shown in fig. 3 a, substrate
310th, cambered surface 310a, dumping slot 310b, Image Sensor 320, glue-line 330, cover 340, conductive structure 350, conducting wire
352nd, conductive through hole 354, connection pad 354a, connection pad 356, conducting element 360, flange R3, the configuration of end E3 and mode of action class
It is similar to substrate 110, cambered surface 110a, dumping slot 110b, Image Sensor 120, glue-line 130, cover 140, the conductive knot of Figure 1A
Structure 150, conducting wire 152, conductive through hole 154, connection pad 154a, connection pad 156, conducting element 160, flange R1, end E1 match somebody with somebody
It puts and the mode of action, is repeated no more in this.Image Sensor 300 and the difference of Image Sensor 100 are in conducting element
360 be not that the conducting element 160 of Figure 1A such as is conductive bump, and conducting element 360 is anisotropy conductiving glue (anisotropic
Conductive film, ACF), with the characteristic by its anisotropic conductive two connection pads 356 is made not to be electrically connected to each other, and image
Sensor 300 is electrically connected to two connection pads 356 by the anisotropy conductiving glue.
It by taking Image Sensor 300 shown in Fig. 3 A as an example, will illustrate the system of the Image Sensor of one embodiment of the invention below
Make method.Fig. 3 B to Fig. 3 E are the manufacturing method flow charts of the Image Sensor of one embodiment of the invention.First, as shown in Figure 3B
A substrate 310 is provided, substrate 310 has a cambered surface 310a.Then, provide as shown in Figure 3 C a cover 340, a glue-line 330 ' and
One Image Sensor 320, glue-line 330 ' are, for example, non-conductive film (non-conductive film, NCF), however of the invention
It is not limited.Then, glue-line 330 ' is engaged between cover 340 and Image Sensor 320 as shown in Figure 3D.
Finally, as shown in FIGURE 3 E by the cover 340 being combined, glue-line 330 ' and Image Sensor 320 to being located at base
Plate 310, and cover 340, glue-line 330 ' and Image Sensor 320 are pressed to substrate 310 and as state shown in Fig. 3 A, make shadow
Picture sensing element 320 is bent by the pushing of glue-line 330 ' with the cambered surface 310a of substrate 310, and glue-line 330 is made to coat shadow
As sensing element 320.In the process, bend Image Sensor 320 and the curvature of Image Sensor 320 is made to be identical to arc
The curvature of face 310a, the location indentations that positioning Image Sensor 320 is formed in the end E3 of flange R3, makes Image Sensor
320 bottom surface is fully supported by cambered surface 310a, makes connecing for Image Sensor 320 and conductive structure by conducting element 360
Pad 356 is electrically connected to each other, and fills glue-line 330 in the groove of substrate 310, and is passed through cover 340 and covered Image Sensor
320 and glue-line 330.In addition, after pressing cover 340, glue-line 330 and Image Sensor 320 to substrate 310, it is more removable
Except cover 340, the present invention is any limitation as not to this.Wherein, the glue-line not yet pressed of Fig. 3 C to Fig. 3 E is with 330 ' table of label
Show, and Fig. 3 A are represented by the glue-line for pressing and being filled in the groove of substrate 310 with label 330.In the present embodiment, shadow
As sensing element 320 material can include silicon, the thickness of Image Sensor 320 is, for example, less than 200 microns, and image sensing member
Engagement (bonding) temperature of part 320 is, for example, 100~200 DEG C, however the present invention is not limited thereto.
Fig. 3 F are the variation diagrams of the environmental pressure of the manufacturing process of the Image Sensor of Fig. 3 A, pressure force and temperature.Scheming
In 3F, the longitudinal axis of line segment A1, A2, A3 represent environmental pressure, pressure force and temperature respectively, and transverse axis is the time.Please refer to Fig.3 F,
More specifically, it is first in time t1 before cover 340, glue-line 330 and Image Sensor 320 are pressure bonded to substrate 310
Operating environment is made to become vacuum state.Then, cover 340, glue-line 330 ' and Image Sensor 320 start to contact in time t2
Substrate 310, and gradually increase pressure force.Time t3 start promoted temperature with heat glue-line 330 ' make its melt and be filled in base
In the groove of plate 310, and the glue-line 330 ' of fusing is made partly to be moved away from cambered surface 310a along dumping slot 310b.Time t4 start into
One step promoted temperature with heat conducting element 360 (anisotropy conductiving glue) make its melt and be electrically connected to Image Sensor
320 and conductive structure 350.In time t5 start that operating environment is allowed to return back to non-vacuum by vacuum state.It is opened in time t6
Begin reduce temperature with cool down the glue-line 330 of fusing make its solidify and coat Image Sensor 320.Stop applying pressure in time t7
The making of Image Sensor 300 is completed with joint efforts.
Fig. 4 is the sectional view of the Image Sensor of another embodiment of the present invention.In the embodiment shown in fig. 4, substrate
410th, cambered surface 410a, dumping slot 410b, Image Sensor 420, glue-line 430, cover 440, connection pad 456, conducting element 460,
The configuration of flange R4, end E4 are similar to substrate 110, cambered surface 110a, dumping slot 110b, the image sensing of Figure 1A with the mode of action
Element 120, glue-line 130, cover 140, connection pad 156, conducting element 160, flange R1, the configuration of end E1 and the mode of action, in
This is repeated no more.The difference of Image Sensor 400 and Image Sensor 100 is in two conductive through holes 454 of conductive structure are straight
Two connection pads 460 are connected in succession, and the downside of substrate 410 is through to out of cambered surface 410a, however the present invention is not limited.
Fig. 5 illustrates the cover, glue-line and Image Sensor of another embodiment of the present invention.Cover 540 shown in Fig. 5, glue
Layer 530, the cover 340 of the configuration of Image Sensor 520 and conducting element 560 Fig. 3 D similar with the mode of action, glue-line 330,
The configuration of Image Sensor 320 and conducting element 360 and the mode of action, repeat no more in this.Embodiment illustrated in fig. 5 and Fig. 3 D
The difference of illustrated embodiment is in the glue-line 530 ' for being not yet pressure bonded to substrate has corresponding to the convex of Image Sensor 520
Portion 532, Image Sensor 520 more reliably is pressure bonded to substrate by protrusion 532.
In conclusion in the Image Sensor of the present invention, except configuring Image Sensor in the cambered surface of substrate, also match somebody with somebody
The glue-line of Image Sensor is put to coat.Therefore, it is pressure bonded to by Image Sensor and glue-line in the cambered surface of substrate
During, Image Sensor can be made to be bent with cambered surface the pushing of Image Sensor by glue-line.Due to this hair
It is bright as above non-to bend Image Sensor with air suction mode, therefore be not required to such as traditional manufacturing technique at the cambered surface of substrate
The perforation for pumping is formed, and manufacture craft can be simplified to save manufacture cost.Further, since the substrate of the present invention is as above
It is not required to form perforation, therefore the structure of substrate is more complete and can be fixedly supported Image Sensor.Furthermore by glue-line to shadow
As the cladding of sensing element, foreign matter can be avoided to be attached in the fabrication process on Image Sensor.
Although disclosing the present invention with reference to above example, the present invention, any affiliated technology are not limited to
Have usually intellectual in field, without departing from the spirit and scope of the present invention, can make a little change and retouch, therefore this hair
Bright protection domain should be subject to what the claim enclosed was defined.
Claims (6)
1. a kind of manufacturing method of Image Sensor, including：
A substrate is provided, wherein the substrate has a cambered surface；
One cover, a glue-line and an Image Sensor are provided；
The glue-line is engaged between the cover and the Image Sensor；And
By the cover being combined, the glue-line and the Image Sensor to being located at the substrate, and press the cover, the glue-line
And the Image Sensor is to the substrate, makes the Image Sensor by the pushing of the glue-line and as the cambered surface is bent, and
The glue-line is made to coat the Image Sensor.
2. the manufacturing method of Image Sensor as described in claim 1, including：
It bends the Image Sensor and the curvature of the Image Sensor is made to be identical to the curvature of the cambered surface.
3. the manufacturing method of Image Sensor as described in claim 1, including：
After the cover, the glue-line and the Image Sensor to the substrate is pressed, the cover is removed.
4. the manufacturing method of Image Sensor as described in claim 1, the wherein cambered surface structure on the substrate for cancave cambered surface
Into a groove, which includes：
The glue-line is filled in the groove.
5. the manufacturing method of Image Sensor as described in claim 1, the wherein substrate have multiple dumping slots, those dumpings
Slot extends to the edge of the cambered surface from the periphery of the Image Sensor, has multiple flanges, those flange intervals in the cambered surface
Ground arranges and forms those dumping slots, and the end of those flanges forms a location indentations, which includes：
The Image Sensor is positioned in the location indentations.
It, should 6. the manufacturing method of Image Sensor as described in claim 1, the wherein Image Sensor include a conductive structure
Conductive structure is configured at the substrate, and is extended to below the Image Sensor outside the cambered surface, which includes：
The Image Sensor and the conductive structure are electrically connected to each other by an at least conducting element.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105138514 | 2016-11-23 | ||
| TW105138514A TWI613915B (en) | 2016-11-23 | 2016-11-23 | Image sensor |
| CN201611159737.3A CN108091660B (en) | 2016-11-23 | 2016-12-15 | Image sensor |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611159737.3A Division CN108091660B (en) | 2016-11-23 | 2016-12-15 | Image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108110020A true CN108110020A (en) | 2018-06-01 |
| CN108110020B CN108110020B (en) | 2020-09-01 |
Family
ID=62016113
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611159737.3A Active CN108091660B (en) | 2016-11-23 | 2016-12-15 | Image sensor |
| CN201710886534.2A Active CN108110020B (en) | 2016-11-23 | 2016-12-15 | Method for manufacturing image sensor |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201611159737.3A Active CN108091660B (en) | 2016-11-23 | 2016-12-15 | Image sensor |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN108091660B (en) |
| TW (1) | TWI613915B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109728165A (en) * | 2019-01-04 | 2019-05-07 | 京东方科技集团股份有限公司 | A kind of display backboard and preparation method thereof, display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI660493B (en) | 2018-12-06 | 2019-05-21 | 財團法人工業技術研究院 | Image sensor and manufacturing method thereof |
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- 2016-12-15 CN CN201611159737.3A patent/CN108091660B/en active Active
- 2016-12-15 CN CN201710886534.2A patent/CN108110020B/en active Active
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109728165A (en) * | 2019-01-04 | 2019-05-07 | 京东方科技集团股份有限公司 | A kind of display backboard and preparation method thereof, display device |
| CN109728165B (en) * | 2019-01-04 | 2021-09-21 | 京东方科技集团股份有限公司 | Display back plate, manufacturing method thereof and display device |
| US11258016B2 (en) | 2019-01-04 | 2022-02-22 | Ordos Yuansheng Optoelectronics Co., Ltd. | Display backplane, method for preparing the same, and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108110020B (en) | 2020-09-01 |
| CN108091660A (en) | 2018-05-29 |
| TW201820852A (en) | 2018-06-01 |
| TWI613915B (en) | 2018-02-01 |
| CN108091660B (en) | 2020-07-31 |
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