JP2004297683A - Solid-state imaging unit - Google Patents

Solid-state imaging unit Download PDF

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Publication number
JP2004297683A
JP2004297683A JP2003090277A JP2003090277A JP2004297683A JP 2004297683 A JP2004297683 A JP 2004297683A JP 2003090277 A JP2003090277 A JP 2003090277A JP 2003090277 A JP2003090277 A JP 2003090277A JP 2004297683 A JP2004297683 A JP 2004297683A
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Prior art keywords
solid
state imaging
imaging device
holding member
lens
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Munehisa Takeda
宗久 武田
Yoshinori Yokoyama
吉典 横山
Toshiyuki Toyoshima
利之 豊島
Takashi Shirase
隆史 白瀬
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2003090277A priority Critical patent/JP2004297683A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sufficiently miniaturized solid-state imaging unit in which a solid-state imaging device is packaged while being bent. <P>SOLUTION: In a camera module 1, a solid-state imaging device 2 is fixed onto a recessed surface of a holding member 3 made of a transparent material by an adhesive layer 4 made of UV adhesives. The solid-state imaging device 2 is thinned into a thickness of about 50 μm so as to be easily bent. The recessed surface of the holding member 3 is a recessed spherical surface of which the radius of curvature is about 20 mm, and the solid-state imaging device 2 is adhered/fixed onto the holding member 3 while being bent along the spherical surface. The solid-state imaging device 2 is connected through an upper electrode pad 5 to a through-electrode 7 that passes through the holding member 3 from its upper surface to its lower surface, by a gold wire 6. A lower terminal portion of the through-electrode 7 is connected to a lower electrode 8. An electric signal of the solid-state imaging device 2 is transmitted to the outside via the through-electrode 7 or the like. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、固体撮像素子が湾曲した状態で実装された固体撮像装置に関するものである。
【０００２】
【従来の技術】
一般に、カメラ付き携帯情報端末や医療用の内視鏡には、レンズと、ＣＣＤ（Ｃｈａｒｇｅ Ｃｏｕｐｌｅｄ Ｄｅｖｉｃｅ）や人工網膜チップなどの固体撮像素子とを実装した固体撮像装置が搭載される。この種の固体撮像装置では、解像度の向上が必須であるので、レンズの収差による影響を回避するためにレンズの枚数を増やしたり、レンズずらしとよばれる不完全な収差補正を施す必要がある。このため、固体撮像装置を十分に小型化することができず、また収差も十分には解消することができないといった問題がある。
【０００３】
そこで、固体撮像素子（チップ）を変形ないし湾曲が可能な厚さまで薄膜化し、該固体撮像素子を、保持部材の湾曲面上に接着剤等で固定して湾曲した形状（凹形状）で実装することにより、少ない枚数のレンズで収差を低減して解像度の向上と小型化とを図るようにした固体撮像装置が提案されている（例えば、特許文献１〜４参照）。
【０００４】
【特許文献１】
特開平０１−２０２９８９号公報（第２頁、第１図）
【特許文献２】
特開平１０−１０８０７８号公報（段落［００１７］、図１）
【特許文献３】
特開２００１−１５６２７８号公報（段落［００１２］、図２）
【特許文献４】
特開２００１−２８４５６４号公報（段落［００３３］、図７）
【０００５】
【発明が解決しようとする課題】
しかしながら、このように固体撮像素子を湾曲した形状で実装した従来の固体撮像装置では、以下のような問題がある。
すなわち、湾曲した形状で実装された固体撮像素子から電気信号を取り出すために、固体撮像素子の表面と外部基板とを接続する配線系統が設けられるが、この配線系統を配置するためのスペースを必要とするので、該固体撮像装置（カメラモジュール）を十分に小型化することができないといった問題がある。
【０００６】
また、一般に、固体撮像素子の周辺には、画素切換用のレジスタ等の周辺回路が形成されているので、固体撮像素子の画素エリア（受光エリア）の中心は、固体撮像素子の中心から偏心した位置にある（図５参照）。このため、固体撮像素子を固体撮像装置（カメラモジュール）に実装する（組み込む）際に、レンズの光軸（光学軸）と画素エリアの中心とを一致させるための位置合わせが必要となり、固体撮像素子の実装プロセスが複雑化するといった問題がある。なお、固体撮像素子を湾曲した形状で保持部材に固定する場合、保持部材の中心と固体撮像素子の中心とを一致させれば該固定が製造プロセス上容易となるが、この場合、レンズの光軸と画素エリアの中心とが一致するように、保持部材を偏心させて配置しなければならないといった問題が生じる。
【０００７】
前記のとおり、固体撮像素子を湾曲させるには、固体撮像素子を薄くする必要があるが、固体撮像素子を構成しているシリコン基板を薄くすると、光が固体撮像素子を透過するようになる。このため、レンズから固体撮像素子に入射した光の一部が、該固体撮像素子を透過した後、保持部材等で反射して固体撮像素子に裏面側から再度入射し、迷光として画像を劣化させるといった問題がある。
【０００８】
本発明は、上記従来の問題を解決するためになされたものであって、十分に小型化され、また固体撮像素子ないしは保持部材の組み込みプロセスを簡素化することができる固体撮像装置を提供することを解決すべき課題とする。さらには、固体撮像素子を透過した光に起因する迷光の発生を防止することができる固体撮像装置を提供することも解決すべき課題とする。
【０００９】
【課題を解決するための手段】
上記課題を解決するためになされた本発明にかかる固体撮像装置は、レンズマウントに取り付けられたレンズと、保持部材のレンズ側の表面に湾曲して固定された固体撮像素子とを実装している固体撮像装置において、保持部材をレンズ側の表面から貫通して配置された貫通電極と、固体撮像素子と貫通電極とを電気的に接続する配線とが設けられていることを特徴とするものである。
【００１０】
【発明の実施の形態】
以下、添付の図面を参照しつつ、本発明のいくつかの実施の形態を具体的に説明する。なお、各実施の形態にかかるカメラモージュールに共通な構成要素には、それぞれ同一の参照番号を付している。
【００１１】
実施の形態１．
まず、図１を参照しつつ、本発明の実施の形態１にかかるカメラモジュールを説明する。
図１は、実施の形態１にかかる、レンズと固体撮像素子とを実装したカメラモジュール（固体撮像装置）の立面断面を示している。なお、以下では、便宜上、レンズと固体撮像素子とが並ぶ方向にみて、レンズが配置された方を「上」といい、固体撮像素子が配置された方を「下」という。
【００１２】
図１に示すように、カメラモジュール１においては、例えばシリコン基板等からなる固体撮像素子２が、透明な材料で形成された保持部材３の上面（レンズ側の表面）に形成された凹面に、例えばＵＶ接着剤等からなる接着層４で接着・固定されている。ここで、固体撮像素子２は、容易に変形ないし湾曲できるように、５０μｍ程度の厚さに薄肉化されている。保持部材３の凹面は、曲率半径が２０ｍｍ程度の凹状の球面であり、固体撮像素子２はこの球面に沿って湾曲された状態で、保持部材３に接着・固定されている。
【００１３】
固体撮像素子２は、例えば金線６を用いたワイヤボンドにより、保持部材３の上面（凹面でない部分）に配置された上部電極パッド５に電気的に接続されている。上部電極パッド５と対応する位置において、保持部材３を、その上面から下面に貫通するように配置された貫通電極７が設けられている。貫通電極７の上端部は上部電極パッド５に結合されて電気的に接続され、下端部は下部電極８に結合されて電気的に接続されている。これにより、固体撮像素子２の受光面（画素面）で光電変換により生成された、被写体の結像に対応する電気信号が、順に、金線６と上部電極パッド５と貫通電極７と下部電極８とを介して、外部に伝送されるようになっている。下部電極８には半田ボール９が設けられ、この半田ボール９により、カメラモジュール１を、直接外部基板に容易にフリップチップ実装できるようになっている。
【００１４】
保持部材３の上側にはレンズマウント１０が配設され、このレンズマウント１０に、第１レンズ１１ａと第２レンズ１１ｂとからなるレンズ群１１が取り付けられている。レンズ群１１は、固体撮像素子２の上方において、その光軸（光軸中心）が固体撮像素子２の受光エリアの中心と一致するように設置されている。
【００１５】
保持部材３の下面には、光を吸収する光吸収材１２がコーティングされている。固体撮像素子２が薄肉化されているので、レンズ群１１から固体撮像素子２に入射した光の一部は、この固体撮像素子２を透過する。そして、この透過光は、さらに保持部材３を透過した後、光吸収材１２によって吸収される。また、保持部材３の側面とレンズマウント１０の外周とには、外部からカメラモジュール１に入射する光を反射させ、あるいは吸収する光反射／吸収材１３（遮光材）がコーティングされている。
【００１６】
このような構成によれば、固体撮像素子２が湾曲した状態で実装されているので、像面収差が非常に小さくなる。このため、像面収差を補正するためのレンズを設ける必要がなくなり、光学系を簡素化ないし小型化することができ、カメラモジュール１を薄型化することができる。ここで、固体撮像素子２は球面状に湾曲しているので、レンズ群１１から固体撮像素子２に光が均一に入射する。このため、固体撮像素子２が平板である場合に比較して、周辺部の解像度を向上させることができる。また、固体撮像素子２に設けられているマイクロレンズの配置を、周辺部の解像度を高めたり光量を増加させるためにずらせるなどといった複雑な対策を施す必要がなくなる。
【００１７】
実施の形態１では、前記のとおり、おおむね５０μｍの厚さの固体撮像素子２を曲率半径が２０ｍｍ程度となるように湾曲させ、２枚のレンズ１１ａ、１１ｂからなるレンズ群１１を用いて、固体撮像素子２に光を結像（集光）させるようにしている。しかし、本発明にかかる固体撮像装置１が、このような構成のものに限定されるものではないのはもちろんである。例えば、固体撮像素子２の厚さをさらに薄くし、より大きく湾曲させてその曲率半径を数ｍｍにすれば、１枚のレンズでも良好な画質を得ることができる。したがって、固体撮像素子２の湾曲度とレンズ系の組み合わせとは、カメラモジュール１の仕様に応じて、任意に設定することができる。
【００１８】
固体撮像素子２を湾曲した状態で実装する場合、この固体撮像素子２を保持する保持部材３が必要であるので、固体撮像素子２を直接基板に実装する場合に比べて、一般的には実装面積ないし実装容積は大きくなる。しかし、実施の形態１にかかるカメラモジュール１では、保持部材３の内部に貫通電極７が配設され、固体撮像素子２の電気信号が、この貫通電極７を介して、半田ボール９に伝達されるので、電気信号を外部に伝達するための配線系統を収容するスペースを保持部材３の外部に設ける必要はない。このため、カメラモジュール１を十分に小型化することができ、該カメラモジュール１を容易にフリップチップ実装することができる。
【００１９】
実施の形態１では、固体撮像素子２から上部電極パッド５へ電気信号を伝送するための電気的接続を、金線６を用いたワイヤボンドにより行っている。しかし、かかる電気的接続は、金線６を用いたワイヤーボンドに限定されるものではなく、固体撮像素子２と上部電極パッド５とを電気的に接続することができれば、どのようなものを用いてもよい。例えば、アルミ線を用いたワイヤボンド等で接続を行ってもよい。。
【００２０】
前記のとおり、固体撮像素子２は容易に変形ないし湾曲できるようにその厚さを薄くする必要があるが、固体撮像素子２を薄くすると、光が固体撮像素子２を透過するようになる。そして、固体撮像素子２を保持する保持部材３が光を反射させる部材で構成されている場合、固体撮像素子２を透過した光が保持部材３で反射して、裏面側から固体撮像素子２に入射して迷光として画像を劣化させる。しかし、実施の形態１にかかるカメラモジュール１では、保持部材３の下面が光吸収材料１２でコーティングされているので、固体撮像素子２の裏面からの光の入射がなくなり、迷光による画像の劣化が生じない。
【００２１】
さらに、実施の形態１にかかるカメラモジュール１では、保持部材３の側面とレンズマウント１０の外周とが光反射／吸収材１３（遮光材）でコーティングされているので、周辺から入射した光がカメラモジュール１内部に入射しない。このため、迷光による画像劣化をより確実に防止することができる。
【００２２】
実施の形態１にかかるカメラモジュール１では、固体撮像素子２はＵＶ接着剤からなる接着層４により保持部材３に接着・固定されている。しかし、接着剤はＵＶ接着剤に限定されるものではなく、固体撮像素子２と保持部材３とを接着・固定することができるものであればどのようなものでもよい。例えば、接着剤として、エポキシ系の熱硬化性接着剤、熱可塑性接着剤あるいは接着性のシート等を用いてもよい。
【００２３】
実施の形態２．
以下、図２を参照しつつ、本発明の実施の形態２を説明する。ただし、実施の形態２にかかるカメラモジュール１は、図１に示す実施の形態１にかかるカメラモジュール１と多くの共通点を有するので、以下では説明の重複を避けるため、主として実施の形態１と異なる点を説明する。
【００２４】
前記のとおり、実施の形態１にかかるカメラモジュール１では、固体撮像素子２と保持部材３とをＵＶ接着剤で接着・固定するようにしているので、保持部材３は光透過性材料で形成されている。このため、固体撮像素子２を透過した光の反射および外部からの光の入射による迷光を防止するために、光吸収材１２と光反射／吸収材１３とで、保持部材３の下面および側面と、レンズマウント１０の外周とをコーティングしている。
【００２５】
これに対して、実施の形態２にかかるカメラモジュール１では、図２に示すように、接着層４の材料として、エポキシ系の熱硬化性接着剤を用いる一方、保持部材３を光吸収材料で形成するとともに、レンズマウント１０を光吸収材料または光反射材料で形成している。その他の点は、実施の形態１にかかるカメラモジュール１の場合と同様である。
【００２６】
実施の形態２にかかるカメラモジュール１によれば、基本的には、実施の形態１にかかるカメラモジュールと同様の作用・効果が得られる。さらに、図１に示す光吸収材１２や光反射／吸収材１３が不要であるので、カメラモジュール１の製造プロセスが簡素化され、かつ製造コストが低減される。
【００２７】
実施の形態３．
以下、図３を参照しつつ、本発明の実施の形態３を説明する。ただし、実施の形態３にかかるカメラモジュール１は、図１に示す実施の形態１にかかるカメラモジュール１と多くの共通点を有するので、以下では説明の重複を避けるため、主として実施の形態１と異なる点を説明する。
【００２８】
実施の形態１にかかるカメラモジュール１では、保持部材３上の固体撮像素子２は、レンズマウント１０ないしレンズ群１１と直接対向し、レンズマウント側に開放されている。これに対して、実施の形態３にかかるカメラモジュール１では、図３に示すように、保持部材３の上部に保護カバー１４が設けられ、固定撮像素子２は保護カバー１４によって封止されている。また、実施の形態３では、レンズマウント１０は、実施の形態２と同様に光吸収材料または光反射材料で形成されている。その他の点は、実施の形態１にかかるカメラモジュール１と同様である。
【００２９】
実施の形態３にかかるカメラモジュール１によれば、基本的には、実施の形態１にかかるカメラモジュール１と同様の作用・効果が得られる。さらに、この構成によれば、固体撮像素子２、保持部材３等からなる固体撮像素子部１５と、レンズマウント１０、レンズ群１１等からなるレンズマウント部１６とを個別に製作することができ、固体撮像素子部１５の内部にゴミ等の異物が混入するのを防止することができ、歩留まりを向上させることができる。さらには、保護カバー１４に、レンズ機能、フィルタ機能等を付加することにより、高機能化を図ることができる。
【００３０】
実施の形態４．
以下、図４を参照しつつ、本発明の実施の形態４を説明する。ただし、実施の形態４にかかるカメラモジュール１は、図１に示す実施の形態１にかかるカメラモジュール１と多くの共通点を有するので、以下では説明の重複を避けるため、主として実施の形態１と異なる点を説明する。
【００３１】
前記のとおり、実施の形態１にかかるカメラモジュール１では、これを小型化するために、保持部材３内に貫通電極７が配設されている。これに対して、実施の形態４にかかるカメラモジュール１では、図４に示すように、貫通電極７は設けられず、保持部材３の上面に上部配線パターン１７が設けられ、かつ保持部材３の側面にピン１８が設けられている。ここで、ピン１８は上部配線パターン１７と電気的に接続されている。そして、固体撮像素子２と上部配線パターン１７とは、金線６によって電気的に接続されている。また、実施の形態３では、レンズマウント１０は、実施の形態２と同様に光吸収材料または光反射材料で形成されている。その他の点は、実施の形態１にかかるカメラモジュール１と同様である。
【００３２】
実施の形態４にかかるカメラモジュール１によれば、基本的には、実施の形態１にかかるカメラモジュール１と同様の作用・効果が得られる。さらに、上部配線パターン１７およびピン１８は、貫通電極７に比べて、簡素なプロセスで容易に形成することができる。このため、カメラモジュール１の製造コストを低減することができる。なお、高アスペクト比で微細な貫通電極７を形成することはやや困難であることから、高アスペクト比が要求される場合は、貫通電極７に代えて、上部配線パターン１７およびピン１８を設けるのが好ましい。
【００３３】
実施の形態５．
以下、図５および図６を参照しつつ、本発明の実施の形態５を説明する。ただし、実施の形態５にかかるカメラモジュール１は、図１に示す実施の形態１にかかるカメラモジュール１と多くの共通点を有するので、以下では説明の重複を避けるため、主として実施の形態１と異なる点を説明する。
【００３４】
図５に示すように、一般的には、固体撮像素子２の周辺には画素切換用のレジスタ等の周辺回路１９が形成されているので、受光エリア２０（すなわち、画素エリア）の中心は、固体撮像素子２の中心から偏心した位置にある。このため、実施の形態１にかかるカメラモジュール１では、レンズ群１１の光軸（光軸中心）と、受光エリア２０の中心とを一致させるために、固体撮像素子２を保持部材３に接着する際に、このずれを考慮して固体撮像装置２を、その中心が保持部材３の中心に対して偏心するように接着・固定している。
【００３５】
これに対して、実施の形態５にかかるカメラモジュール１では、図６に示すように、保持部材３を回転（ないしは、傾斜）した姿勢で配置することにより、固体撮像素子２を、その中心が保持部材３の中心と一致した状態で接着・固定している。すなわち、レンズ群１１の光軸（光軸中心）と受光エリア２０の中心とが一致するように、保持部材３を回転（ないしは、傾斜）させて取り付けるための固体撮像素子取り付けモジュール２１を設けている。そして、貫通電極７は、保持部材３ではなく、固体撮像素子取り付けモジュール２１をその上面から下面に貫通するように配設されている。また、実施の形態５では、レンズマウント１０は、実施の形態２と同様に光吸収材料または光反射材料で形成されている。その他の点は、実施の形態１にかかるカメラモジュール１と同様である。
【００３６】
一般に、固体撮像素子２を湾曲した状態で実装する場合、保持部材３の中心と固体撮像素子２の中心とを一致させる方が、製造プロセスが簡素化される。したがって、実施の形態５によれば、固体撮像素子２を湾曲した状態で実装するのが容易ないしは簡単となり、カメラモジュール１の製造コストを低減することができる。
【００３７】
また、レンズ群１１の光軸と固体撮像素子２の受光エリア２０の中心とが一致するように、保持部材３を回転（ないしは、傾斜）させて取り付けるための固体撮像素子取り付けモジュール２１を設けているので、カメラモジュール１の簡易な組み立てが可能となり、カメラモジュール１の製造コストをより低減することができる。さらに、固体撮像素子２ないし保持部材３の位置決めの精度を高めることができる。なお、このほか、基本的には、実施の形態１にかかるカメラモジュールと同様の作用・効果が得られるのはもちろんである。
【００３８】
実施の形態６．
以下、図７を参照しつつ、本発明の実施の形態６を説明する。ただし、実施の形態６にかかるカメラモジュールは、図５および図６に示す実施の形態５にかかるカメラモジュールと多くの共通点を有するので、以下では説明の重複を避けるため、主として実施の形態５と異なる点を説明する。
【００３９】
図７に示すように、実施の形態６にかかるカメラモジュール１では、保持部材２２の下面の一部は、該保持部材２２が固体撮像素子取り付けモジュール２３に取り付けられた（カメラモジュール１に実装された）状態では、レンズ群１１の光軸と垂直となるように形成されている。この状態では、この下面の一部は、固体撮像素子取り付けモジュール２３の下面と同一平面上にある。保持部材２２の下面のその他の部分は、保持部材２２の中心軸と垂直である。なお、実施の形態６では、貫通電極７は、保持部材２２と固体撮像素子取り付けモジュール２３とを貫通している。その他の点は、実施の形態５にかかるカメラモジュール１と同様である。
【００４０】
実施の形態６にかかるカメラモジュール１によれば、基本的には、実施の形態５にかかるカメラモジュール１と同様の作用・効果が得られる。さらに、実施の形態５に比べて、固体撮像素子取り付けモジュール２３を薄くすることができるので、カメラモジュール１の小型化を図ることができる。なお、固体撮像素子２を保持部材２２に取り付ける際には、固体撮像素子２と保持部材２２の中心を合わせるとともに、保持部材２２を固体撮像素子取り付けモジュール２３に取り付けることになる。このため、簡単な組み立てプロセスで、レンズ群１１の光軸と固体撮像素子２の受光エリア２０の中心を一致させることができる。
【００４１】
【発明の効果】
本発明によれば、固体撮像素子の表面と外部基板とが、保持部材の内部に配設された貫通電極により電気的に接続されるので、固体撮像素子の表面と外部基板とを接続する配線系統を設ける必要はなく、該配線系統を配置するためのスペースは必要とされない。このため、固体撮像装置を十分に小型化することができ、小型のカメラモジュールを実現することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態１にかかるカメラモジュールの立面断面図である。
【図２】本発明の実施の形態２にかかるカメラモジュールの立面断面図である。
【図３】本発明の実施の形態３にかかるカメラモジュールの立面断面図である。
【図４】本発明の実施の形態４にかかるカメラモジュールの立面断面図である。
【図５】固体撮像素子の平面図である。
【図６】本発明の実施の形態５にかかるカメラモジュールの立面断面図である。
【図７】本発明の実施の形態６にかかるカメラモジュールの立面断面図である。
【符号の説明】
１ カメラモジュール、 ２ 固体撮像素子、 ３ 保持部材、 ４ 接着層、 ５ 上部電極パッド、 ６ 金線、 ７ 貫通電極、 ８ 下部電極、 ９半田ボール、 １０ レンズマウント、 １１ レンズ群、 １１ａ 第１レンズ、 １１ｂ 第２レンズ、 １２ 光吸収材、 １３ 光反射／吸収材、 １４ 保護カバー、 １５ 固体撮像素子部、 １６ レンズマウント部、 １７ 上部配線パターン、 １８ ピン、 １９ 周辺回路、 ２０ 受光エリア、 ２１ 固体撮像素子取り付けモジュール、 ２２ 保持部材、 ２３ 固体撮像素子取り付けモジュール。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a solid-state imaging device in which a solid-state imaging device is mounted in a curved state.
[0002]
[Prior art]
Generally, a portable information terminal with a camera or a medical endoscope is equipped with a solid-state imaging device in which a lens and a solid-state imaging device such as a CCD (Charge Coupled Device) or an artificial retinal chip are mounted. In this type of solid-state imaging device, it is necessary to improve the resolution. Therefore, it is necessary to increase the number of lenses or to perform incomplete aberration correction called lens shift in order to avoid the influence of lens aberration. For this reason, there is a problem that the solid-state imaging device cannot be sufficiently reduced in size and the aberration cannot be sufficiently eliminated.
[0003]
Therefore, the solid-state image sensor (chip) is thinned to a thickness that allows deformation or bending, and the solid-state image sensor is mounted on a curved surface of the holding member with an adhesive or the like and mounted in a curved shape (concave shape). Accordingly, solid-state imaging devices have been proposed in which aberrations are reduced with a small number of lenses to improve resolution and reduce size (for example, see Patent Documents 1 to 4).
[0004]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 01-2021989 (page 2, FIG. 1)
[Patent Document 2]
JP-A-10-108078 (paragraph [0017], FIG. 1)
[Patent Document 3]
JP 2001-156278 A (paragraph [0012], FIG. 2)
[Patent Document 4]
JP 2001-284564 A (paragraph [0033], FIG. 7)
[0005]
[Problems to be solved by the invention]
However, the conventional solid-state imaging device in which the solid-state imaging device is mounted in a curved shape as described above has the following problems.
That is, in order to extract an electric signal from the solid-state imaging device mounted in a curved shape, a wiring system for connecting the surface of the solid-state imaging device to the external substrate is provided, but a space for arranging the wiring system is required. Therefore, there is a problem that the solid-state imaging device (camera module) cannot be sufficiently reduced in size.
[0006]
Generally, a peripheral circuit such as a pixel switching register is formed around the solid-state imaging device, so that the center of the pixel area (light receiving area) of the solid-state imaging device is eccentric from the center of the solid-state imaging device. Position (see FIG. 5). For this reason, when mounting (incorporating) the solid-state imaging device in the solid-state imaging device (camera module), it is necessary to perform alignment so that the optical axis (optical axis) of the lens coincides with the center of the pixel area. There is a problem that the device mounting process becomes complicated. When the solid-state imaging device is fixed to the holding member in a curved shape, if the center of the holding member coincides with the center of the solid-state imaging device, the fixing becomes easier in the manufacturing process. A problem arises in that the holding member must be eccentrically arranged so that the axis and the center of the pixel area coincide.
[0007]
As described above, in order to bend the solid-state imaging device, it is necessary to make the solid-state imaging device thin. However, if the silicon substrate constituting the solid-state imaging device is made thin, light passes through the solid-state imaging device. For this reason, part of the light incident on the solid-state imaging device from the lens is transmitted through the solid-state imaging device, reflected by a holding member or the like, re-enters the solid-state imaging device from the back surface side, and degrades an image as stray light. There is a problem.
[0008]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described conventional problems, and provides a solid-state imaging device which can be sufficiently miniaturized and can simplify a process of incorporating a solid-state imaging device or a holding member. Is a problem to be solved. Still another object is to provide a solid-state imaging device capable of preventing stray light from being generated due to light transmitted through the solid-state imaging device.
[0009]
[Means for Solving the Problems]
A solid-state imaging device according to the present invention, which has been made to solve the above-described problem, includes a lens attached to a lens mount, and a solid-state imaging device curved and fixed to a lens-side surface of a holding member. In the solid-state imaging device, a penetrating electrode disposed so as to penetrate the holding member from the surface on the lens side, and wiring for electrically connecting the solid-state imaging element and the penetrating electrode are provided. is there.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that components common to the camera modules according to the embodiments are denoted by the same reference numerals.
[0011]
Embodiment 1 FIG.
First, a camera module according to a first embodiment of the present invention will be described with reference to FIG.
FIG. 1 shows an elevational cross section of a camera module (solid-state imaging device) in which a lens and a solid-state imaging device are mounted according to the first embodiment. In the following, for convenience, the direction in which the lens and the solid-state imaging device are arranged is referred to as “up” when the lens is disposed, and the “down” when the solid-state imaging device is disposed.
[0012]
As shown in FIG. 1, in the camera module 1, a solid-state imaging device 2 made of, for example, a silicon substrate or the like is provided on a concave surface formed on an upper surface (a lens-side surface) of a holding member 3 formed of a transparent material. For example, they are bonded and fixed by an adhesive layer 4 made of a UV adhesive or the like. Here, the solid-state imaging device 2 is thinned to a thickness of about 50 μm so that it can be easily deformed or curved. The concave surface of the holding member 3 is a concave spherical surface having a radius of curvature of about 20 mm, and the solid-state imaging device 2 is bonded and fixed to the holding member 3 in a state of being curved along the spherical surface.
[0013]
The solid-state imaging device 2 is electrically connected to the upper electrode pad 5 disposed on the upper surface (a portion that is not a concave surface) of the holding member 3 by, for example, wire bonding using a gold wire 6. At a position corresponding to the upper electrode pad 5, a through electrode 7 is provided so as to penetrate the holding member 3 from the upper surface to the lower surface. The upper end of the through electrode 7 is coupled to and electrically connected to the upper electrode pad 5, and the lower end is coupled to and electrically connected to the lower electrode 8. As a result, the electric signals corresponding to the imaging of the subject, which are generated by the photoelectric conversion on the light receiving surface (pixel surface) of the solid-state imaging device 2, are sequentially transmitted to the gold wire 6, the upper electrode pad 5, the through electrode 7, and the lower electrode. 8 to be transmitted to the outside. A solder ball 9 is provided on the lower electrode 8, and the solder ball 9 allows the camera module 1 to be easily flip-chip mounted directly on an external substrate.
[0014]
A lens mount 10 is disposed above the holding member 3, and a lens group 11 including a first lens 11a and a second lens 11b is attached to the lens mount 10. The lens group 11 is installed above the solid-state imaging device 2 so that the optical axis (center of the optical axis) coincides with the center of the light receiving area of the solid-state imaging device 2.
[0015]
The lower surface of the holding member 3 is coated with a light absorbing material 12 that absorbs light. Since the solid-state imaging device 2 is thin, a part of the light that has entered the solid-state imaging device 2 from the lens group 11 passes through the solid-state imaging device 2. Then, the transmitted light further passes through the holding member 3 and is absorbed by the light absorbing material 12. The side surface of the holding member 3 and the outer periphery of the lens mount 10 are coated with a light reflecting / absorbing material 13 (light shielding material) that reflects or absorbs light incident on the camera module 1 from the outside.
[0016]
According to such a configuration, since the solid-state imaging device 2 is mounted in a curved state, image plane aberration is extremely reduced. For this reason, it is not necessary to provide a lens for correcting the image plane aberration, so that the optical system can be simplified or downsized, and the camera module 1 can be reduced in thickness. Here, since the solid-state imaging device 2 is curved in a spherical shape, light uniformly enters the solid-state imaging device 2 from the lens group 11. For this reason, the resolution of the peripheral portion can be improved as compared with the case where the solid-state imaging device 2 is a flat plate. Further, there is no need to take complicated measures such as shifting the arrangement of the microlenses provided in the solid-state imaging device 2 to increase the resolution of the peripheral portion or increase the amount of light.
[0017]
In the first embodiment, as described above, the solid-state imaging device 2 having a thickness of about 50 μm is curved so that the radius of curvature is about 20 mm, and the solid-state imaging device 2 is formed using the lens group 11 including the two lenses 11a and 11b. Light is imaged (condensed) on the image sensor 2. However, it goes without saying that the solid-state imaging device 1 according to the present invention is not limited to such a configuration. For example, if the thickness of the solid-state imaging device 2 is further reduced, the curvature is increased to several mm, and good image quality can be obtained even with a single lens. Therefore, the combination of the curvature of the solid-state imaging device 2 and the lens system can be arbitrarily set according to the specifications of the camera module 1.
[0018]
When the solid-state imaging device 2 is mounted in a curved state, a holding member 3 for holding the solid-state imaging device 2 is required. The area or mounting volume increases. However, in the camera module 1 according to the first embodiment, the through electrode 7 is provided inside the holding member 3, and an electric signal of the solid-state imaging device 2 is transmitted to the solder ball 9 via the through electrode 7. Therefore, it is not necessary to provide a space for accommodating a wiring system for transmitting an electric signal to the outside of the holding member 3. For this reason, the camera module 1 can be sufficiently reduced in size, and the camera module 1 can be easily flip-chip mounted.
[0019]
In the first embodiment, electrical connection for transmitting an electrical signal from the solid-state imaging device 2 to the upper electrode pad 5 is performed by wire bonding using a gold wire 6. However, such an electrical connection is not limited to the wire bond using the gold wire 6, and any electrical connection can be used as long as the solid-state imaging device 2 and the upper electrode pad 5 can be electrically connected. You may. For example, the connection may be made by a wire bond using an aluminum wire or the like. .
[0020]
As described above, it is necessary to reduce the thickness of the solid-state imaging device 2 so that the solid-state imaging device 2 can be easily deformed or curved. However, when the solid-state imaging device 2 is thinned, light passes through the solid-state imaging device 2. When the holding member 3 that holds the solid-state imaging device 2 is formed of a member that reflects light, light transmitted through the solid-state imaging device 2 is reflected by the holding member 3 and is reflected from the back surface to the solid-state imaging device 2. Incident light degrades the image as stray light. However, in the camera module 1 according to the first embodiment, since the lower surface of the holding member 3 is coated with the light-absorbing material 12, light does not enter from the back surface of the solid-state imaging device 2, and image deterioration due to stray light is reduced. Does not occur.
[0021]
Further, in the camera module 1 according to the first embodiment, since the side surface of the holding member 3 and the outer periphery of the lens mount 10 are coated with the light reflecting / absorbing material 13 (light shielding material), light incident from the periphery is Does not enter the module 1. For this reason, image degradation due to stray light can be more reliably prevented.
[0022]
In the camera module 1 according to the first embodiment, the solid-state imaging device 2 is bonded and fixed to the holding member 3 by an adhesive layer 4 made of a UV adhesive. However, the adhesive is not limited to the UV adhesive, and may be any adhesive as long as the solid-state imaging device 2 and the holding member 3 can be adhered and fixed. For example, an epoxy thermosetting adhesive, a thermoplastic adhesive, an adhesive sheet, or the like may be used as the adhesive.
[0023]
Embodiment 2 FIG.
Hereinafter, a second embodiment of the present invention will be described with reference to FIG. However, the camera module 1 according to the second embodiment has many points in common with the camera module 1 according to the first embodiment shown in FIG. The different points will be described.
[0024]
As described above, in the camera module 1 according to the first embodiment, since the solid-state imaging device 2 and the holding member 3 are bonded and fixed with the UV adhesive, the holding member 3 is formed of a light transmitting material. ing. For this reason, in order to prevent stray light due to reflection of light transmitted through the solid-state imaging device 2 and incidence of light from the outside, the light absorbing material 12 and the light reflecting / absorbing material 13 are used to reduce the distance between the lower surface and the side surface of the holding member 3. , The outer periphery of the lens mount 10 is coated.
[0025]
On the other hand, in the camera module 1 according to the second embodiment, as shown in FIG. 2, an epoxy-based thermosetting adhesive is used as the material of the adhesive layer 4, and the holding member 3 is made of a light absorbing material. At the same time, the lens mount 10 is formed of a light absorbing material or a light reflecting material. Other points are the same as those of the camera module 1 according to the first embodiment.
[0026]
According to the camera module 1 according to the second embodiment, basically, the same operation and effect as those of the camera module according to the first embodiment can be obtained. Further, since the light absorbing material 12 and the light reflecting / absorbing material 13 shown in FIG. 1 are unnecessary, the manufacturing process of the camera module 1 is simplified, and the manufacturing cost is reduced.
[0027]
Embodiment 3 FIG.
Hereinafter, a third embodiment of the present invention will be described with reference to FIG. However, the camera module 1 according to the third embodiment has many points in common with the camera module 1 according to the first embodiment shown in FIG. The different points will be described.
[0028]
In the camera module 1 according to the first embodiment, the solid-state imaging device 2 on the holding member 3 directly faces the lens mount 10 or the lens group 11 and is open to the lens mount. On the other hand, in the camera module 1 according to the third embodiment, as illustrated in FIG. 3, the protection cover 14 is provided on the upper part of the holding member 3, and the fixed imaging element 2 is sealed by the protection cover 14. . In the third embodiment, the lens mount 10 is formed of a light absorbing material or a light reflecting material as in the second embodiment. Other points are the same as those of the camera module 1 according to the first embodiment.
[0029]
According to the camera module 1 according to the third embodiment, basically, the same operation and effect as those of the camera module 1 according to the first embodiment can be obtained. Furthermore, according to this configuration, the solid-state imaging device unit 15 including the solid-state imaging device 2 and the holding member 3 and the lens mount unit 16 including the lens mount 10 and the lens group 11 can be separately manufactured. It is possible to prevent foreign matter such as dust from entering the inside of the solid-state imaging device section 15, and to improve the yield. Furthermore, by adding a lens function, a filter function, and the like to the protective cover 14, higher functionality can be achieved.
[0030]
Embodiment 4 FIG.
Hereinafter, the fourth embodiment of the present invention will be described with reference to FIG. However, the camera module 1 according to the fourth embodiment has many points in common with the camera module 1 according to the first embodiment shown in FIG. The different points will be described.
[0031]
As described above, in the camera module 1 according to the first embodiment, the penetrating electrodes 7 are provided in the holding member 3 in order to reduce the size. On the other hand, in the camera module 1 according to the fourth embodiment, as shown in FIG. 4, the through electrode 7 is not provided, the upper wiring pattern 17 is provided on the upper surface of the holding member 3, and the A pin 18 is provided on the side surface. Here, the pins 18 are electrically connected to the upper wiring pattern 17. The solid-state imaging device 2 and the upper wiring pattern 17 are electrically connected by the gold wire 6. In the third embodiment, the lens mount 10 is formed of a light absorbing material or a light reflecting material as in the second embodiment. Other points are the same as those of the camera module 1 according to the first embodiment.
[0032]
According to the camera module 1 according to the fourth embodiment, basically, the same operation and effect as those of the camera module 1 according to the first embodiment can be obtained. Further, the upper wiring patterns 17 and the pins 18 can be easily formed by a simple process as compared with the through electrodes 7. Therefore, the manufacturing cost of the camera module 1 can be reduced. Since it is somewhat difficult to form a fine through electrode 7 with a high aspect ratio, an upper wiring pattern 17 and a pin 18 are provided instead of the through electrode 7 when a high aspect ratio is required. Is preferred.
[0033]
Embodiment 5 FIG.
Hereinafter, a fifth embodiment of the present invention will be described with reference to FIGS. However, the camera module 1 according to the fifth embodiment has many points in common with the camera module 1 according to the first embodiment shown in FIG. The different points will be described.
[0034]
As shown in FIG. 5, generally, a peripheral circuit 19 such as a pixel switching register is formed around the solid-state imaging device 2, so that the center of the light receiving area 20 (that is, the pixel area) is It is located at a position eccentric from the center of the solid-state imaging device 2. For this reason, in the camera module 1 according to the first embodiment, the solid-state imaging device 2 is bonded to the holding member 3 so that the optical axis (center of the optical axis) of the lens group 11 and the center of the light receiving area 20 match. At this time, the solid-state imaging device 2 is bonded and fixed such that the center thereof is eccentric with respect to the center of the holding member 3 in consideration of the shift.
[0035]
On the other hand, in the camera module 1 according to the fifth embodiment, as shown in FIG. 6, by arranging the holding member 3 in a rotated (or inclined) posture, the solid-state imaging device 2 is moved The holding member 3 is bonded and fixed so as to coincide with the center of the holding member 3. That is, the solid-state imaging device mounting module 21 for rotating (or tilting) the holding member 3 and mounting the holding member 3 so that the optical axis (optical axis center) of the lens group 11 and the center of the light receiving area 20 are provided. I have. The through electrode 7 is provided so as to penetrate the solid-state imaging device mounting module 21 from the upper surface to the lower surface instead of the holding member 3. In the fifth embodiment, the lens mount 10 is formed of a light absorbing material or a light reflecting material as in the second embodiment. Other points are the same as those of the camera module 1 according to the first embodiment.
[0036]
In general, when the solid-state imaging device 2 is mounted in a curved state, the manufacturing process is simplified by making the center of the holding member 3 coincide with the center of the solid-state imaging device 2. Therefore, according to the fifth embodiment, it is easy or easy to mount the solid-state imaging device 2 in a curved state, and the manufacturing cost of the camera module 1 can be reduced.
[0037]
Further, a solid-state image sensor mounting module 21 for rotating (or tilting) the holding member 3 and mounting the holding member 3 so that the optical axis of the lens group 11 and the center of the light receiving area 20 of the solid-state image sensor 2 are provided. Therefore, the camera module 1 can be easily assembled, and the manufacturing cost of the camera module 1 can be further reduced. Further, the positioning accuracy of the solid-state imaging device 2 or the holding member 3 can be improved. In addition, it goes without saying that basically the same operation and effect as those of the camera module according to the first embodiment can be obtained.
[0038]
Embodiment 6 FIG.
Hereinafter, a sixth embodiment of the present invention will be described with reference to FIG. However, the camera module according to the sixth embodiment has many points in common with the camera module according to the fifth embodiment shown in FIGS. 5 and 6, and therefore, in order to avoid redundant description, the camera module according to the fifth embodiment will be mainly described below. The following describes the differences.
[0039]
As shown in FIG. 7, in the camera module 1 according to the sixth embodiment, a part of the lower surface of the holding member 22 has the holding member 22 attached to the solid-state imaging device attachment module 23 (mounted on the camera module 1). In the state (1), it is formed to be perpendicular to the optical axis of the lens group 11. In this state, a part of the lower surface is flush with the lower surface of the solid-state imaging device mounting module 23. Other portions of the lower surface of the holding member 22 are perpendicular to the central axis of the holding member 22. In the sixth embodiment, the penetrating electrode 7 penetrates the holding member 22 and the solid-state imaging device mounting module 23. Other points are the same as those of the camera module 1 according to the fifth embodiment.
[0040]
According to the camera module 1 according to the sixth embodiment, basically, the same operation and effect as those of the camera module 1 according to the fifth embodiment can be obtained. Furthermore, since the solid-state imaging device mounting module 23 can be made thinner than in the fifth embodiment, the camera module 1 can be downsized. When attaching the solid-state imaging device 2 to the holding member 22, the center of the solid-state imaging device 2 and the holding member 22 are aligned, and the holding member 22 is attached to the solid-state imaging device attachment module 23. For this reason, the optical axis of the lens group 11 and the center of the light receiving area 20 of the solid-state imaging device 2 can be matched with a simple assembly process.
[0041]
【The invention's effect】
According to the present invention, the surface of the solid-state imaging device and the external substrate are electrically connected to each other by the through electrodes provided inside the holding member, so that the wiring connecting the surface of the solid-state imaging device to the external substrate is provided. There is no need to provide a system, and no space is required for arranging the wiring system. Therefore, the solid-state imaging device can be sufficiently reduced in size, and a small-sized camera module can be realized.
[Brief description of the drawings]
FIG. 1 is an elevational sectional view of a camera module according to a first embodiment of the present invention.
FIG. 2 is an elevational sectional view of a camera module according to a second embodiment of the present invention.
FIG. 3 is an elevational sectional view of a camera module according to a third embodiment of the present invention;
FIG. 4 is an elevational sectional view of a camera module according to a fourth embodiment of the present invention.
FIG. 5 is a plan view of the solid-state imaging device.
FIG. 6 is an elevational sectional view of a camera module according to a fifth embodiment of the present invention.
FIG. 7 is an elevational sectional view of a camera module according to a sixth embodiment of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 camera module, 2 solid-state image sensor, 3 holding member, 4 adhesive layer, 5 upper electrode pad, 6 gold wire, 7 through electrode, 8 lower electrode, 9 solder ball, 10 lens mount, 11 lens group, 11a first lens , 11b second lens, 12 light absorbing material, 13 light reflecting / absorbing material, 14 protective cover, 15 solid-state imaging device portion, 16 lens mount portion, 17 upper wiring pattern, 18 pins, 19 peripheral circuit, 20 light receiving area, 21 22. A solid-state imaging device mounting module, 22 holding member, 23 solid-state imaging device mounting module.

Claims (6)

レンズマウントに取り付けられたレンズと、保持部材のレンズ側の表面に湾曲して固定された固体撮像素子とを実装している固体撮像装置において、
上記保持部材をレンズ側の表面から貫通して配置された貫通電極と、
上記固体撮像素子と上記貫通電極とを電気的に接続する配線とが設けられていることを特徴とする固体撮像装置。In a solid-state imaging device mounted with a lens attached to a lens mount and a solid-state imaging element that is curved and fixed to a lens-side surface of a holding member,
A through electrode disposed through the holding member from the lens side surface,
A solid-state imaging device, comprising: a wiring for electrically connecting the solid-state imaging device and the through electrode. レンズマウントに取り付けられたレンズと、保持部材のレンズ側の表面に湾曲して固定された固体撮像素子とを実装している固体撮像装置において、
上記保持部材のレンズ側の表面に配置された配線パターンと、
上記保持部材の側面に配置され、上記配線パターンと電気的に接続されたピンと、
上記固体撮像素子と上記配線パターンとを電気的に接続する配線とが設けられていることを特徴とする固体撮像装置。In a solid-state imaging device mounted with a lens attached to a lens mount and a solid-state imaging element that is curved and fixed to a lens-side surface of a holding member,
A wiring pattern disposed on the lens-side surface of the holding member,
A pin disposed on a side surface of the holding member and electrically connected to the wiring pattern;
A solid-state imaging device, comprising: a wiring for electrically connecting the solid-state imaging element and the wiring pattern. レンズマウントに取り付けられたレンズと、保持部材のレンズ側の表面に湾曲して固定された固体撮像素子とを実装している固体撮像装置において、
上記レンズの光軸と上記固体撮像素子の受光エリアの中心とが一致するように上記保持部材を回転させた姿勢で固定する固体撮像素子取り付けモジュールが設けられていることを特徴とする固体撮像装置。In a solid-state imaging device mounted with a lens attached to a lens mount and a solid-state imaging element that is curved and fixed to a lens-side surface of a holding member,
A solid-state imaging device mounting module for fixing the holding member in a rotated posture such that the optical axis of the lens coincides with the center of the light-receiving area of the solid-state imaging device; . 上記保持部材のレンズ側の表面とは反対側の表面の少なくとも一部は、上記保持部材が該固体撮像装置に実装された状態では上記レンズの光軸と垂直な面であり、上記固体撮像素子取り付けモジュールに覆われていないことを特徴とする請求項３に記載の固体撮像装置。At least a part of the surface of the holding member opposite to the surface on the lens side is a surface perpendicular to the optical axis of the lens when the holding member is mounted on the solid-state imaging device, and the solid-state imaging device The solid-state imaging device according to claim 3, wherein the solid-state imaging device is not covered by the mounting module. 上記保持部材もしくは上記固体撮像素子取り付けモジュールのレンズ側の表面とは反対側の表面が光吸収材で被覆され、または、上記保持部材もしくは上記固体撮像素子取り付けモジュールが光吸収材料で形成されていることを特徴とする請求項１〜４のいずれか１つに記載の固体撮像装置。The surface opposite to the lens-side surface of the holding member or the solid-state imaging device mounting module is coated with a light absorbing material, or the holding member or the solid-state imaging device mounting module is formed of a light absorbing material. The solid-state imaging device according to claim 1, wherein: 上記保持部材または上記固体撮像素子取り付けモジュールのレンズ側の表面を覆って、上記固体撮像素子を密封する保護カバーが設けられていることを特徴とする請求項１〜５のいずれか１つに記載の固体撮像装置。6. A protective cover for covering the lens-side surface of the holding member or the solid-state imaging device mounting module and sealing the solid-state imaging device is provided. Solid-state imaging device.
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JP2013020271A (en) * 2005-11-15 2013-01-31 Trustees Of Princeton Univ Organic electric camera
KR101420934B1 (en) * 2011-12-06 2014-07-17 옵티즈 인코포레이티드 Wire bond interposer package for cmos image sensor and method of making same
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JP2013020271A (en) * 2005-11-15 2013-01-31 Trustees Of Princeton Univ Organic electric camera
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