CN108103597A - Electrospinning wire material reception device and Electrospun manufacturing equipment - Google Patents
Electrospinning wire material reception device and Electrospun manufacturing equipment Download PDFInfo
- Publication number
- CN108103597A CN108103597A CN201810029615.5A CN201810029615A CN108103597A CN 108103597 A CN108103597 A CN 108103597A CN 201810029615 A CN201810029615 A CN 201810029615A CN 108103597 A CN108103597 A CN 108103597A
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- Prior art keywords
- tablet
- wire material
- reception device
- electrospun
- electrospinning wire
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- 239000000463 material Substances 0.000 title claims abstract description 59
- 238000001523 electrospinning Methods 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 42
- 239000007788 liquid Substances 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 25
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 239000012530 fluid Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 238000010041 electrostatic spinning Methods 0.000 abstract description 18
- 239000000835 fiber Substances 0.000 abstract description 10
- 239000013078 crystal Substances 0.000 abstract description 9
- 238000009987 spinning Methods 0.000 abstract description 9
- 239000004088 foaming agent Substances 0.000 abstract description 5
- 238000003032 molecular docking Methods 0.000 abstract description 4
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000002121 nanofiber Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007710 freezing Methods 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001606 poly(lactic acid-co-glycolic acid) Polymers 0.000 description 2
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- 108010037362 Extracellular Matrix Proteins Proteins 0.000 description 1
- 102000010834 Extracellular Matrix Proteins Human genes 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N Lactic Acid Natural products CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 210000002744 extracellular matrix Anatomy 0.000 description 1
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- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
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Classifications
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
- D01D5/00—Formation of filaments, threads, or the like
- D01D5/0007—Electro-spinning
- D01D5/0061—Electro-spinning characterised by the electro-spinning apparatus
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
- D01D5/00—Formation of filaments, threads, or the like
- D01D5/0007—Electro-spinning
- D01D5/0061—Electro-spinning characterised by the electro-spinning apparatus
- D01D5/0076—Electro-spinning characterised by the electro-spinning apparatus characterised by the collecting device, e.g. drum, wheel, endless belt, plate or grid
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Textile Engineering (AREA)
- Spinning Methods And Devices For Manufacturing Artificial Fibers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of electrospinning wire material reception device and Electrospun manufacturing equipments.The reception device includes:It receives tablet, the driving device that driving reception tablet rotates and docking and is closed flat the refrigerating plant that plate freezes, driving device is connected to reception tablet.The Electrospun manufacturing equipment includes high voltage power supply, the Electrospun syringe pusher being connected with high voltage power supply and above-mentioned electrospinning wire material reception device, and the jet port of Electrospun syringe pusher is correspondingly arranged with receiving the receiving plane of tablet.It can be docked by refrigerating plant and be closed flat plate and freeze so that in spinning process, the aqueous vapor in air condenses the ice crystal to be formed and constantly grows, and ice crystal obtains the 3 D stereo electrospinning wire material that spongy, hole is interconnected as pore-foaming agent and backing material.The fiber that different directions nozzle sprays can uniformly be received simultaneously under rotation by receiving tablet, realized bi-component or multicomponent electrostatic spinning, avoided due to like charges repel fiber being caused to be unevenly distributed.
Description
Technical field
The present invention relates to spinning manufacturing field, in particular to a kind of electrospinning wire material reception device and Electrospun
Manufacturing equipment.
Background technology
In recent years, nanometer technology has become the study frontier and research hotspot of scientific circles.Electrostatic spinning is a kind of prepares
The important method of nanofiber is put forward for the first time for 1934 by Fomhals.Electrostatic spinning is that polymer is added using electrostatic force
The spinning technique of work, principle are to make melt by high voltage power supply or polymer solution is charged overcomes surface tension and lasting spray
It penetrates, prepares nanofibers.
The range of work of electrostatic spinning technique covers almost all of natural material and synthetic material or even including albumen
Matter, polysaccharide, nucleic acid and bioactive substance are protected so as to be widely used in material science, biotechnology, organizational project, environment
The fields such as shield, the energy and electronic material.Electrostatic spinning is in the application of bioengineered tissue, since electrospun scaffolds can be with mould
The nanofibrous structures of apery extracellular matrix are conducive to cell adherence and multiplication and have attracted much attention.
However, traditional electrostatic spinning use plane receiver board, the obtained tightly packed high compression of nanofiber, mainly
Pore size there was only 1 to 2 μm, material thickness is no more than 500 μm.Although close two-dimensional nano fiber is conducive to cell point
It dissipates, but limits the migration of cell and the infiltration to material internal.Current conventional electrostatic spinning material is in organizational project
It is limited in injury repair of the film material applied to bone, skin, nerve, blood vessel and cartilage.But cell needs enough three
Dimension space come maintain its morphological feature and carry out physiological activity, stent needs to have corresponding porosity and pore diameter, with reality
The stereoscopic culture of existing seed cell, while promote the transport of the nutritional ingredient and waste in cell cultivation process.Therefore, there is an urgent need for realities
The manufacturing equipment of existing two-component and multi-component 3-D solid structure Electrospun.
The content of the invention
It is an object of the invention to provide a kind of electrospinning wire material reception devices, can realize and receive electrostatic spinning mistake
Two-component or multi-component 3 D stereo electrospinning wire material are obtained in journey.
Another object of the present invention is to provide a kind of Electrospun manufacturing equipment, two-component or multi-component three-dimensional are manufactured
Stereoscopic electric spinning material.
What the embodiment of the present invention was realized in:
A kind of electrospinning wire material reception device provided by the invention, including:It receives tablet, receive tablet turn for driving
Dynamic driving device and for docking the refrigerating plant for being closed flat plate and freezing, driving device is connected to reception tablet.
In preferred embodiments of the present invention, above-mentioned refrigerating plant includes semiconductor chilling plate, and semiconductor chilling plate is fixed
It is connected to reception tablet.
In preferred embodiments of the present invention, above-mentioned refrigerating plant further includes heat sink, and the hot junction of semiconductor chilling plate connects
Heat sink is connected to, heat sink is fixedly connected on driving device.
In preferred embodiments of the present invention, above-mentioned refrigerating plant further includes to contain the heat dissipation liquid bath of refrigerating fluid, dissipates
Hot plate is arranged in heat dissipation liquid bath.
In preferred embodiments of the present invention, above-mentioned heat sink is provided with heat radiating fin on one side away from semiconductor chilling plate,
Heat radiating fin includes multiple internal diameters annular cooling fin of different sizes, and multiple ring-type cooling fins are according to internal diameter from small to large along heat sink
Center set gradually to edge.
In preferred embodiments of the present invention, heat exchanger tube is additionally provided in above-mentioned heat dissipation liquid bath, heat exchanger tube, which is provided with, to be used for
The inlet connected with outer liquid SAPMAC method system outlet and the liquid outlet for being connected with outer liquid SAPMAC method system inlets.
In preferred embodiments of the present invention, the cold end of above-mentioned semiconductor chilling plate is connected to the bottom surface for receiving tablet, and half
Conductor cooling piece and receive tablet between and semiconductor chilling plate and heat sink between it is be bonded by conduction cooling silicone grease.
In preferred embodiments of the present invention, above-mentioned driving device is motor, and the shaft of motor is by conducting slip ring with connecing
Plate connection is closed flat, conducting slip ring is connected to refrigerating plant.
In preferred embodiments of the present invention, above-mentioned electrospinning wire material reception device further include to control motor switch and
The controller of rotating speed, controller are connected with its communications.
The invention further relates to a kind of Electrospun manufacturing equipment, including high voltage power supply, Electrospun syringe pusher and
Above-mentioned electrospinning wire material reception device, high voltage power supply are connected with Electrospun syringe pusher, Electrospun syringe push dress
The jet port put is correspondingly arranged with receiving the receiving plane of tablet.
The advantageous effect of the embodiment of the present invention is:It can be docked by refrigerating plant and be closed flat plate and freeze so that spinning
In the process, the aqueous vapor in air condenses the ice crystal to be formed and constantly grows, and ice crystal makes Electrospun fine as pore-foaming agent and backing material
Dimension is constantly accumulated in vertical direction, obtains the 3 D stereo electrospinning wire material that spongy, hole is interconnected.It is flat in reception simultaneously
The fiber that different directions nozzle sprays can be uniformly received under the rotation of plate simultaneously, bi-component or multicomponent electrostatic spinning is realized, keeps away
Exempt from due to like charges repel fiber to be caused to be unevenly distributed.
Description of the drawings
It in order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of scope, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structure diagram of the electrospinning wire material reception device of the embodiment of the present invention;
Fig. 2 is that the electrospinning wire material reception device removal of the embodiment of the present invention receives the structure diagram after tablet;
Fig. 3 is that the electrospinning wire material reception device removal of the embodiment of the present invention receives the structural representation after tablet and heat sink
Figure;
Fig. 4 is the structure diagram of the bottom surface of the heat sink of the refrigerating plant of the embodiment of the present invention;
Fig. 5 is pair of the three-dimensional Electrospun of the electrospinning wire material reception device acquisition of traditional Electrospun and the embodiment of the present invention
Than figure;
Fig. 6 is gelatin, the freezing of PCL two-components receives three-dimensional Electrospun material cross-section scanning electron microscope (SEM) photograph.
In figure:100- electrospinning wire material reception devices;110- receives tablet;120- driving devices;130- refrigerating plants;
131- heat exchanger tubes are imported and exported;132- semiconductor chilling plates;133- heat sinks;134- heat dissipation liquid baths;135- heat exchanger tubes;136- is conductive
Slip ring;137- heat radiating fins;140- stents.
Specific embodiment
The present invention is described in further detail below through specific implementation examples and in conjunction with the accompanying drawings.
Referring to attached drawing 1, a kind of electrospinning wire material reception device 100 is present embodiments provided, including:Reception tablet 110,
The driving device 120 of the rotation of tablet 110 is received for driving and for docking the refrigerating plant for being closed flat plate 110 and freezing
130, driving device 120, which is connected to, receives tablet 110.
It receives tablet 110 to rotate under the driving of driving device 120 so that it uniformly can receive not Tongfang simultaneously
The fiber sprayed to nozzle, realizes bi-component or multicomponent electrostatic spinning, avoids due to like charges repel fiber being caused to be distributed
It is uneven.Plate 110 is closed flat by the docking of refrigerating plant 130 simultaneously to freeze so that the surface low-temperature of tablet 110 is received, into
And so that the condensation vapor in spinning process through the air forms ice crystal, as pore-foaming agent and backing material, makes Electrospun
Fiber is accumulated in vertical direction, finally obtains spongiform 3 D stereo electrospinning wire material by freeze-drying.
In the present embodiment, it is that metal receives tablet to receive tablet 110, and material can be iron, copper etc..Receive tablet 110
With for receiving the receiving plane of electrostatic spinning, which is the preferable burnishing surface of smoothness, and electrostatic spinning is sprayed from nozzle
The accumulation molding on the receiving plane afterwards.Reception tablet 110 is thinner thickness, such as can be 0.5~5mm, certainly, other implementations
The adjusting of thickness can also be carried out in example according to the intensity and species of material, thinner thickness enables to refrigerating plant 130 right
When reception tablet 110 is freezed, cold can be transferred preferably so that heat transfer efficiency higher, refrigeration effect are more preferable.
Further, tablet 110 is received as circle, and enabling to can be better under the driving of driving device 120
It rotates, resistance is smaller during rotation, so that when receiving electrostatic spinning, electrostatic spinning can more uniformly be accumulated.Certainly,
In other embodiment, receiving tablet 110 can also be unlimited as needed using other geometries such as square, regular hexagons
In the present embodiment.Further, in the present embodiment, receive its thickness from centre position to outer edge of tablet 110 and gradually decrease, it can
Stability during 110 high-speed rotation of tablet is received to increase.
Refrigerating plant 130 in the present embodiment is that the surface temperature for receiving tablet 110 is enabled to reach 40 degrees below zero
Refrigeration equipment enables to the aqueous vapor in air preferably can condense to form ice crystal, as pore-foaming agent and backing material.Tool
Body, in the present embodiment, refrigerating plant includes semiconductor chilling plate 132, and semiconductor chilling plate 132 is fixedly connected on reception tablet
110.Semiconductor chilling plate 132 can be generated substantial amounts of cold under the action of electric current, and be convenient for temperature by external power supply
The control of degree.
Referring to Fig. 2, in the present embodiment, the cold end of semiconductor chilling plate 132, which is connected to, to be received the bottom surface of tablet 110 and receives
The opposite another side of the receiving plane of tablet 110, the cold end of semiconductor chilling plate and receives tablet 110 and comes into full contact with, so that half
Conductor cooling piece 132, which can be docked preferably, to be closed flat plate 110 and freezes, while its receiving plane will not be influenced again.Half
The quantity of conductor cooling piece 132 can consider according to size and material for receiving tablet 110 etc., in the present embodiment, half
The quantity of conductor cooling piece 132 be four pieces, four block semiconductor cooling pieces 132 be evenly distributed on receive tablet 110 bottom surface, four pieces
Semiconductor chilling plate 132 assumes diamond in shape arrangement.
Semiconductor chilling plate 132 equally generates substantial amounts of heat during refrigeration in the opposite hot junction of cold end, therefore,
In the present embodiment, above-mentioned refrigerating plant 130 further includes heat sink 133, and heat sink 133 is connected to the heat of semiconductor chilling plate 132
End, heat sink 133 are fixedly connected on driving device 120.The heat that semiconductor chilling plate 132 generates is dissipated by heat sink 133
Hair falls so that semiconductor chilling plate 132 can continue work, and refrigeration effect is more preferable.The driving of driving device 120 dissipates
Hot plate 133 rotates, and heat sink 133 drives semiconductor chilling plate 132, and then semiconductor chilling plate 132 drives and receives 110 turns of tablet
It is dynamic.In the present embodiment, heat sink 133 is also circle.Certainly, in other embodiment, driving device 120 can be put down with receiving simultaneously
Plate 110 and heat sink 133 connect, and then directly drive and receive tablet and heat sink and synchronize rotation.
In the present embodiment, between semiconductor chilling plate 132 and reception tablet 110 and semiconductor chilling plate 132 is with radiating
It is bonded between plate 133 by conduction cooling silicone grease.Further, corresponding card slot is additionally provided on heat sink for fixing semiconductor
The position of cooling piece 132, can be very firmly by heat sink 133, semiconductor chilling plate 132 and reception by conduction cooling silicone grease
Tablet 110 links together, and realizes the synchronous rotation of three.And semiconductor chilling plate 132 can be improved by conduction cooling silicone grease
To the cold conduction efficiency for receiving tablet 110, the heat transfer efficiency that semiconductor chilling plate 132 arrives heat sink can be also improved.
Referring to attached drawing 3, refrigerating plant 130 further includes to contain the heat dissipation liquid bath 134 of refrigerating fluid, and heat sink 133 is set
In in heat dissipation liquid bath 134.Electrospinning wire material reception device 100 is loaded with refrigeration in working condition in heat dissipation liquid bath 134
Liquid, the refrigerating fluid is for absorbing the heat that heat sink distributes, and heat sink 133 is arranged in heat dissipation liquid bath 134, with Sheng
Mounted in heat dissipation liquid bath 134 in refrigerating fluid contacted, and then heat sink 133 during rotation can fully with refrigeration
Heat exchange occurs for liquid so that the heat of heat sink 133 can be passed quickly.In the present embodiment, heat dissipation liquid bath 134 is cylinder
Shape, and then in heat sink rotation process, refrigerating fluid can be good at flowing in columned trough body structure, so that heat exchange
Effect is more preferable.
Further, referring to attached drawing 4, heat sink 133 is provided with heat radiating fin 137 on one side away from semiconductor chilling plate 132,
The heat dissipation effect of heat sink 133 can be further enhanced by heat radiating fin 137.In the present embodiment, heat radiating fin 137 is included in multiple
Footpath annular cooling fin of different sizes, it is multiple ring-type cooling fins according to internal diameter from small to large along the center of heat sink to edge successively
It sets.The set-up mode of above-mentioned heat radiating fin 137 is enabled to carry out during fully radiating the heat of heat sink 133, dissipated
When hot plate 133 rotates in refrigerating fluid, heat radiating fin 137 can be rotated preferably, when being rotated between refrigerating fluid, resistance
Smaller, smoothness is more preferable.
Referring again to attached drawing 3, be additionally provided with heat exchanger tube 135 in the liquid bath 134 that radiates, heat exchanger tube 135 be provided with for it is outer
The inlet of portion's liquid-cooling circulating system outlet and the liquid outlet for being connected with outer liquid SAPMAC method system inlets, jointly
Form the heat exchanger tube inlet and outlet 131 being connected with external liquid-cooling circulating system.It can be changed by heat exchanger tube 135 with refrigerating fluid
Heat takes away the heat in refrigerating fluid so that refrigerating fluid can persistently have good refrigeration effect, enabling constantly absorb
The heat of heat sink, so that the work that semiconductor chilling plate 132 can be continual and steady.External liquid-cooling circulating system is cold for liquid
Circulator can ensure that heat exchanger tube 135 can continuously and effectively carry out heat exchange operation by liquid SAPMAC method machine.
Referring to attached drawing 3, in the present embodiment, 135 annular of heat exchanger tube is arranged in heat dissipation liquid bath 134, so that refrigerating fluid
There can be larger contact area with heat exchanger tube so that heat transfer effect reaches more preferable.Further, heat exchanger tube 135 is copper pipe,
The heat transfer coefficient of copper pipe is higher, disclosure satisfy that heat exchange needs.Certainly, in other embodiments, heat exchanger tube can also use other
The set-up mode of shape and aluminum pipe or iron pipe etc. may be employed.
Further, referring to Fig. 3, in the present embodiment, driving device 120 is motor, and the shaft of motor passes through conducting slip ring
136 are connected with receiving tablet 110, and conducting slip ring 136 is connected to refrigerating plant 130.The shaft of conducting slip ring 136 is connected to heat dissipation
Plate 133 drives heat sink 133 to rotate, and then reception tablet 110 is driven to rotate.It is flat that reception is acted on by conducting slip ring 136
Plate 110, can be so that receive tablet 110 and semiconductor chilling plate 132 in rotation process so that 136 top of conducting slip ring leads to
Cross electric wire connection semiconductor chilling plate 132, the other end of electric wire is worn under heat dissipation liquid bath 134 in the lower part of conducting slip ring 136
Go out, connect external power supply so that receive tablet 110 and semiconductor chilling plate 132 being capable of continuous firing.Certainly, it is necessary to illustrate
, in other embodiments, driving device 120 can be the structure for the other forms that motor drives driving structure, only can
It is enough to realize that driving receives tablet 110 and rotates.
Participate in Fig. 1, Fig. 2, Fig. 3 again, the electrospinning wire material reception device 100 in the present embodiment further includes the machine of being used to support
The stent 140 of body, stent 140 is connected to the bottom of heat dissipation liquid bath 134, and stent 140 includes four support columns, four support columns
The support of four feet is played in the lower section of heat dissipation liquid bath 134 so that it is supported can be relatively more firm.Certainly, in other embodiments, prop up
Frame 140 can also be other supporting way such as trishores, and be not limited to this embodiment.
Further, in the present embodiment, electrospinning wire material reception device 100 further includes to control motor switch and rotating speed
Controller, controller is connected with its communications.The control to motor switch and rotating speed can be reached by controller so that electricity
The operation of spinning material reception device 100 is more convenient, but also its rotating speed is adjustable, and then according to different electrospun materials
Technique can select suitable rotating speed.Controller can be for controlling the remote controler of motor, with the control set on motor
Device communicates to connect.Certainly, in other embodiment, motor can also be that stepper motor of rotating speed etc. can be adjusted with itself.
The operation principle of the electrospinning wire material reception device 100 of the present embodiment is:, it is necessary to heat dissipation before Electrospun carries out
Liquid bath 134 adds in refrigerating fluid, and after powering on, semiconductor chilling plate 132 is started to work, front refrigeration, reverse side fever.Chill surface
I.e. cold end makes 110 surface temperature of reception tablet reach -40 degrees Celsius, builds topical hypothermia, is conducive to the condensation vapor in air
Into ice crystal, promote the formation of electrospun material three-dimensional structure in electro-spinning process.The heating surface of semiconductor chilling plate 132 is
Hot junction is transferred heat to by heat sink 133 in the refrigerating fluid of heat dissipation liquid bath 134, and heat exchanger tube 135 connects outer liquid SAPMAC method
System continues to take heat out of electrospinning wire material reception device 100, plays to be continuously the work of the heat dissipation of semiconductor chilling plate 132
With the low temperature for maintaining reception planar surface holding stable.
Referring to Fig. 5, first row is from left to right PLGA, PLA-TMC and PLLA of three-dimensional Electrospun poly- (mono- lactic acid of L) respectively
(PLLA) pictorial diagram;Second row is from left to right PLGA, PLA-TMC and PLLA pictorial diagram of traditional Electrospun respectively.It can see
The electrospinning wire material reception device 100 gone out through this embodiment can obtain the electrospinning wire material for being different from traditional two-dimensional structure
Three-dimensional structure electrostatic spinning.With further reference to Fig. 6, it can be seen that electrospinning wire material reception device through this embodiment
The structure of the electrostatic spinning of the three-dimensional structure of the two-component of 100 productions is highly uniform.
A kind of Electrospun manufacturing equipment is further related in other instances, is pushed including high voltage power supply, Electrospun syringe
Electrospinning wire material reception device in device and the present embodiment, high voltage power supply are connected with Electrospun syringe pusher, electrospinning
The jet port of silk syringe pusher is correspondingly arranged with receiving the receiving plane of tablet 110.
In conclusion 132 good refrigeration effect of the semiconductor chilling plate drop of the electrospinning wire material reception device 100 of the present embodiment
Warm speed is fast, can cool down in a short time below -40 degree, of low cost, easy to operate.In spinning process, in air
Aqueous vapor condense the ice crystal to be formed and constantly grow, ice crystal makes electricity spinning fibre in vertical direction as pore-foaming agent and backing material
Constantly accumulation finally obtains the 3 D stereo electrospinning wire material that spongy, hole is interconnected by freeze-drying.Semiconductor
The heating surface fever of cooling piece 132 is serious, and heat is transferred to liquid pool by metal chassis heat radiating fin 137, then by liquid cooling system,
Heat is timely and effectively taken away, electrostatic spinning is made to receive plate face and persistently keeps low temperature.Receive the reception tablet 110 of Electrospun at a high speed
Rotation can uniformly receive the fiber that different directions nozzle sprays, realize bi-component or multicomponent electrostatic spinning, avoid because same simultaneously
It plants electrical charge rejection and fiber is caused to be unevenly distributed.
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, above in conjunction in the embodiment of the present invention
Attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.Described in usual attached drawing here and represent of the invention real
Applying the component of example can configure to arrange and design with a variety of.
Therefore, the detailed description of the embodiment of the present invention more than to providing in the accompanying drawings is not intended to limit claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiments obtained without making creative work belong to the model that the present invention protects
It encloses.
In the description of the present invention, it is necessary to explanation, term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instructions such as " level ", " interior ", " outer " are based on orientation shown in the drawings or position relationship or are somebody's turn to do
Invention product using when the orientation usually put or position relationship, be for only for ease of the description present invention and simplify description, without
It is instruction or implies that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore not
It is understood that as limitation of the present invention.In addition, term " first ", " second ", " the 3rd " etc. are only used for distinguishing description, and cannot manage
It solves to indicate or imply relative importance.
In the description of the present invention, it is also necessary to explanation, unless otherwise clearly defined and limited, term " setting ",
" installation ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or one
It connects body;Can be mechanical connection or electrical connection;It can be directly connected, it can also be indirect by intermediary
It is connected, can is the connection inside two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
Claims (10)
1. a kind of electrospinning wire material reception device, which is characterized in that it includes:
Receive tablet;
For driving the driving device that the reception tablet rotates, the driving device is connected to the reception tablet;
For the refrigerating plant to freeze to the reception tablet.
2. electrospinning wire material reception device according to claim 1, which is characterized in that the refrigerating plant includes semiconductor
Cooling piece, the semiconductor chilling plate are fixedly connected on the reception tablet.
3. electrospinning wire material reception device according to claim 2, which is characterized in that the refrigerating plant further includes heat dissipation
Plate, the hot junction of the semiconductor chilling plate are connected to the heat sink, and the heat sink is fixedly connected on the driving device.
4. electrospinning wire material reception device according to claim 3, which is characterized in that the refrigerating plant, which further includes, to be used for
The heat dissipation liquid bath of refrigerating fluid is contained, the heat sink is arranged in the heat dissipation liquid bath.
5. electrospinning wire material reception device according to claim 4, which is characterized in that the heat sink is partly led away from described
Body cooling piece is provided with heat radiating fin on one side, and the heat radiating fin includes multiple internal diameters annular cooling fin of different sizes, Duo Gesuo
Annular cooling fin is stated to be set gradually to edge along the center of the heat sink from small to large according to internal diameter.
6. electrospinning wire material reception device according to claim 5, which is characterized in that be additionally provided in the heat dissipation liquid bath
Heat exchanger tube, the heat exchanger tube be provided with inlet for being connected with outer liquid SAPMAC method system outlet and for it is described outer
The liquid outlet of portion's liquid-cooling circulating system inlet communication.
7. electrospinning wire material reception device according to claim 3, which is characterized in that the cold end of the semiconductor chilling plate
Be connected to it is described reception tablet bottom surface, the semiconductor chilling plate and it is described reception tablet between and the semiconductor refrigerating
It is be bonded by conduction cooling silicone grease between piece and the heat sink.
8. electrospinning wire material reception device according to claim 1, which is characterized in that the driving device be motor, institute
The shaft for stating motor is connected by conducting slip ring with the reception tablet, and the conducting slip ring is connected to the refrigerating plant.
9. electrospinning wire material reception device according to claim 8, which is characterized in that the electrospinning wire material reception device
Further include to control the controller of the motor switch and rotating speed, the controller is connected with its communications.
10. a kind of Electrospun manufacturing equipment, which is characterized in that it includes high voltage power supply, Electrospun syringe pusher and such as
Claim 1~9 any one of them electrospinning wire material reception device, the high voltage power supply are pushed with the Electrospun syringe
Device connects, and the jet port of the Electrospun syringe pusher and the receiving plane of the reception tablet are correspondingly arranged.
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