CN108063607A - A kind of micro high-power ceramic substrate wave filter - Google Patents
A kind of micro high-power ceramic substrate wave filter Download PDFInfo
- Publication number
- CN108063607A CN108063607A CN201711304526.9A CN201711304526A CN108063607A CN 108063607 A CN108063607 A CN 108063607A CN 201711304526 A CN201711304526 A CN 201711304526A CN 108063607 A CN108063607 A CN 108063607A
- Authority
- CN
- China
- Prior art keywords
- capacitance
- spiral inductance
- ceramic substrate
- pass
- metal tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title claims abstract description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229920002492 poly(sulfone) Polymers 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 229910000679 solder Inorganic materials 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/542—Filters comprising resonators of piezoelectric or electrostrictive material including passive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Filters And Equalizers (AREA)
Abstract
The invention discloses a kind of micro high-power ceramic substrate wave filter, including signal input port IN, signal output port OUT, ground terminal GND, signal input port IN connection third-order low-pass LC filter circuits A, step low-pass LC filter circuits B；Third-order low-pass LC filter circuits A includes spiral inductance L2, capacitance C3 including spiral inductance L1, capacitance C1, capacitance C2, the step low-pass LC filter circuits B；Spiral inductance L1, spiral inductance L2 are printed on the aluminium oxide ceramic substrate of rectangle, are encapsulated outside the aluminium oxide ceramic substrate using polysulfones shell.The layout designs of component design for Striking symmetry in the present invention, can effectively reduce the interference between component；Package dimension is 92mm*78mm*10mm, and volume is less than 1/10th of traditional filter apparatus, can be installed to inside radio-frequency power supply, and can be mounted directly in cooled plate.
Description
Technical field
The present invention relates to radio-frequency power supply field more particularly to a kind of micro high-power ceramic substrate wave filters.
Background technology
Radio-frequency power supply is chiefly used in semicon industry, and output power is differed from more than ten watts to tens kilowatts, radio-frequency power supply pair
The purity of frequency spectrum of output power, the especially inhibition to higher hamonic wave, demand are higher and higher, it is therefore desirable to install and filter in output terminal
Wave device.Traditional filter apparatus is mounted on the external output terminal of radio-frequency power supply, the output for 1.5kW ~ 5.5kW radio-frequency power supplies
For power grade, according to the Kelvin effect of high frequency electric, the component size in filter apparatus is larger, and it is external general
With Metal shielding shell, the volume of filter apparatus entirety is also larger.
Highly integrated is the Main Trends of The Development of current semiconductor industry device, and wherein radio-frequency power supply will for package dimension
Trend is asked to standardize, the space of fuselage interior cannot change easily, and filter apparatus needs to be installed to fuselage interior, it is necessary to effective
Reduce package dimension.As integrated level raises, it is necessary to consider heat dissipation problem.
The content of the invention
The purpose of the present invention is design a kind of micro high-power ceramic substrate wave filter.
For achieving the above object, the technical scheme is that：A kind of micro high-power ceramic substrate wave filter, bag
Include signal input port IN, signal output port OUT, ground terminal GND, signal input port IN connection third-order low-pass LC filtered electricals
The input terminal of road A, the input terminal of the output terminal connection step low-pass LC filter circuits B of third-order low-pass LC filter circuits A, second order are low
The output terminal connection signal output port OUT of logical LC filter circuits B；
The third-order low-pass LC filter circuits A includes spiral inductance L1, capacitance C1, capacitance C2, the step low-pass LC filtered electricals
Road B includes spiral inductance L2, capacitance C3；The spiral inductance L1, spiral inductance L2 are printed on the aluminium oxide ceramic substrate of rectangle
On, spiral inductance L1, spiral inductance L2 are symmetrical, opposite, and rotation direction is printed；Welding signal inputs on the external solder joint of spiral inductance L1
The inside solder joint of port IN, spiral inductance L1 are connected to the first printing metal tape, the first printing metal by the first wire jumper copper sheet
Band prints metal tape by capacitance C2 connections second；The external solder joint welding signal leading-out terminal OUT of spiral inductance L2, spiral electricity
The inside solder joint of sense L2 is connected to the first printing metal tape by the second wire jumper copper sheet；The external solder joint of the spiral inductance L1 is also
Metal tape is printed by capacitance C1 connections the 3rd, the external solder joint of the spiral inductance L2 is also printed by capacitance C3 connections the 3rd
Metal tape；
The first printing metal tape, the second printing metal tape are arranged on one end of aluminium oxide ceramic substrate, the 3rd printing metal
Band is arranged on opposite end；Ground terminal GND is respectively welded on the second printing metal tape, the 3rd printing metal tape；The oxygen
Change and encapsulated outside aluminium ceramic substrate using polysulfones shell.
Further, the signal input port IN, signal output port OUT, ground terminal GND are connection copper sheet, connection
Copper sheet is extended to beyond polysulfones shell.
Further, the capacitance C1, capacitance C2, capacitance C3 are composed in parallel by one or more capacitances.
Further, the size after filter package is 92mm*78mm*10mm.
The beneficial effects of the invention are as follows：
The layout designs of component design for Striking symmetry in the present invention, can effectively reduce the interference between component；Encapsulation
Size is 92mm*78mm*10mm, and volume is less than 1/10th of traditional filter apparatus, can be installed to inside radio-frequency power supply, and
And it can be mounted directly in cooled plate.The present invention provides a kind of small, power that may be mounted inside radio-frequency power supply
Greatly, the strong low-pass filter of heat dissipation performance.
Description of the drawings
Fig. 1 is the circuit topology figure of the present invention；
Fig. 2 is the structure diagram of the present invention.
Specific embodiment
The technical solution in the embodiment of the present invention is clearly and completely described below in conjunction with attached drawing.
The technical solution adopted by the present invention includes, modularized encapsulation, and encapsulating structure is easily installed in radio-frequency power supply fuselage
Portion；Using aluminium oxide ceramic substrate technology, the highly integrated of wave filter is realized, and solve the heat dissipation problem that high integration is brought,
Aluminium oxide ceramic substrate has good electrical insulation performance, high heat conduction characteristic, and surface attachment intensity high, and the layers of copper on surface can picture
Pcb board is the same to etch various figures, have very big current capacity；In circuit topology design, using symmetric design scheme,
Reduce the interference between component；For the needs for inhibiting higher hamonic wave, using low-pass filtering scheme.
As shown in Figure 1, 2, a kind of micro high-power ceramic substrate wave filter, including signal input port IN, signal output
Port OUT, ground terminal GND, the input terminal of signal input port IN connection third-order low-pass LC filter circuits A, third-order low-pass LC filters
The input terminal of the output terminal connection step low-pass LC filter circuits B of wave circuit A, the output terminal of step low-pass LC filter circuits B connect
Meet signal output port OUT.
The third-order low-pass LC filter circuits A includes spiral inductance L1, capacitance C1, capacitance C2, the step low-pass LC filters
Wave circuit B includes spiral inductance L2, capacitance C3；The spiral inductance L1, spiral inductance L2 are printed on the aluminium oxide ceramics of rectangle
On substrate 1, spiral inductance L1, spiral inductance L2 are symmetrical, opposite, and rotation direction is printed；Welding signal on the external solder joint of spiral inductance L1
The inside solder joint of input port IN, spiral inductance L1 are connected to the first printing metal tape 3, the first print by the first wire jumper copper sheet 2
Metal tape 3 processed prints metal tape 4 by capacitance C2 connections second；The external solder joint welding signal leading-out terminal of spiral inductance L2
The inside solder joint of OUT, spiral inductance L2 are connected to the first printing metal tape 3 by the second wire jumper copper sheet 5；The spiral inductance L1
External solder joint metal tape 5 is also printed by capacitance C1 connections the 3rd, the external solder joint of the spiral inductance L2 also passes through capacitance
Metal tape 5 is printed in C3 connections the 3rd.
The layout designs of component design for Striking symmetry, can effectively reduce the interference between component；Due to capacitance
Pad size design have certain length, one or more capacitance can be installed in the debugging in later stage；The electricity
Holding C1, capacitance C2, capacitance C3 is composed in parallel by one or more capacitances.The pad size of capacitance C1 and capacitance C3 design tool
There is certain width, the capacitance of different package dimensions can be installed.
The first printing metal tape 3, second prints one end that metal tape 4 is arranged on aluminium oxide ceramic substrate 1, the 3rd print
Metal tape 5 processed is arranged on opposite end；The second printing metal tape the 4, the 3rd is printed is respectively welded ground terminal on metal tape 5
GND；It is encapsulated outside the aluminium oxide ceramic substrate 1 using polysulfones shell 6.
The signal input port IN, signal output port OUT, ground terminal GND are connection copper sheet, connection copper sheet extension
To beyond polysulfones shell 6.
The package dimension of micro high-power ceramic substrate wave filter of the present invention is 92mm*78mm*10mm, and volume is less than tradition
/ 10th of filter apparatus can be installed to inside radio-frequency power supply, and can be mounted directly to have in cooled plate and be come that
The heat dissipation performance of a number.Through experiment test, wave filter working frequency 13.56MHz of the invention, cutoff frequency 20MHz, on power
5KW is limited, to four times and more than above harmonics restraint degree 30dB, input and output standing-wave ratio is less than 1.05,50 Ω of input and output impedance.
Described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, the every other implementation that those of ordinary skill in the art are obtained without making creative work
Example, belongs to the scope of protection of the invention.
Claims (4)
1. a kind of micro high-power ceramic substrate wave filter, which is characterized in that including signal input port IN, signal output port
OUT, ground terminal GND, the input terminal of signal input port IN connection third-order low-pass LC filter circuits A, third-order low-pass LC filtered electricals
The input terminal of the output terminal connection step low-pass LC filter circuits B of road A, the output terminal connection letter of step low-pass LC filter circuits B
Number output port OUT；
The third-order low-pass LC filter circuits A includes spiral inductance L1, capacitance C1, capacitance C2, the step low-pass LC filtered electricals
Road B includes spiral inductance L2, capacitance C3；The spiral inductance L1, spiral inductance L2 are printed on the aluminium oxide ceramic substrate of rectangle
On, spiral inductance L1, spiral inductance L2 are symmetrical, rotation direction is opposite prints；Welding signal inputs on the external solder joint of spiral inductance L1
The inside solder joint of port IN, spiral inductance L1 are connected to the first printing metal tape, the first printing metal by the first wire jumper copper sheet
Band prints metal tape by capacitance C2 connections second；The external solder joint welding signal leading-out terminal OUT of spiral inductance L2, spiral electricity
The inside solder joint of sense L2 is connected to the first printing metal tape by the second wire jumper copper sheet；The external solder joint of the spiral inductance L1 is also
Metal tape is printed by capacitance C1 connections the 3rd, the external solder joint of the spiral inductance L2 is also printed by capacitance C3 connections the 3rd
Metal tape；
The first printing metal tape, the second printing metal tape are arranged on one end of aluminium oxide ceramic substrate, the 3rd printing metal
Band is arranged on opposite end；Ground terminal GND is respectively welded on the second printing metal tape, the 3rd printing metal tape；The oxygen
Change and encapsulated outside aluminium ceramic substrate using polysulfones shell.
2. micro high-power ceramic substrate wave filter according to claim 1, which is characterized in that the signal input port
IN, signal output port OUT, ground terminal GND are connection copper sheet, and connection copper sheet is extended to beyond polysulfones shell.
3. micro high-power ceramic substrate wave filter according to claim 1, which is characterized in that the capacitance C1, capacitance
C2, capacitance C3 are composed in parallel by one or more capacitances.
4. micro high-power ceramic substrate wave filter according to claim 1, which is characterized in that the ruler after filter package
Very little is 92mm*78mm*10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711304526.9A CN108063607B (en) | 2017-12-11 | 2017-12-11 | Miniature high-power ceramic substrate filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711304526.9A CN108063607B (en) | 2017-12-11 | 2017-12-11 | Miniature high-power ceramic substrate filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108063607A true CN108063607A (en) | 2018-05-22 |
| CN108063607B CN108063607B (en) | 2021-01-08 |
Family
ID=62136329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711304526.9A Active CN108063607B (en) | 2017-12-11 | 2017-12-11 | Miniature high-power ceramic substrate filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108063607B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649915A (en) * | 2018-06-20 | 2018-10-12 | 中国电子科技集团公司第十三研究所 | 3D integrates LC filters and electronic system |
| CN114400128A (en) * | 2021-12-27 | 2022-04-26 | 北京遥感设备研究所 | Planar spiral inductor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11122070A (en) * | 1997-10-09 | 1999-04-30 | Toyo Commun Equip Co Ltd | Ceramics package for piezoelectric filter |
| CN1372348A (en) * | 2001-04-04 | 2002-10-02 | 株式会社村田制作所 | Lumped constant wave filter, antenna shared device and communication thereof |
| CN2737067Y (en) * | 2004-01-06 | 2005-10-26 | 达方电子股份有限公司 | Low pass filter and multi-layer low pass filter with broadband suppression |
| CN103943923A (en) * | 2014-04-30 | 2014-07-23 | 南通大学 | LTCC (Low Temperature Co Fired Ceramic) technology based harmonic suppression band-pass filter and manufacturing method thereof |
| CN206281903U (en) * | 2016-11-23 | 2017-06-27 | 北京金自天正智能控制股份有限公司 | A kind of inductance detection device for cold rolling correction |
| CN107181030A (en) * | 2017-06-07 | 2017-09-19 | 孙超 | A kind of miniature T-shaped staircase resonant impedance capacitance loaded type triplexer |
-
2017
- 2017-12-11 CN CN201711304526.9A patent/CN108063607B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11122070A (en) * | 1997-10-09 | 1999-04-30 | Toyo Commun Equip Co Ltd | Ceramics package for piezoelectric filter |
| CN1372348A (en) * | 2001-04-04 | 2002-10-02 | 株式会社村田制作所 | Lumped constant wave filter, antenna shared device and communication thereof |
| CN2737067Y (en) * | 2004-01-06 | 2005-10-26 | 达方电子股份有限公司 | Low pass filter and multi-layer low pass filter with broadband suppression |
| CN103943923A (en) * | 2014-04-30 | 2014-07-23 | 南通大学 | LTCC (Low Temperature Co Fired Ceramic) technology based harmonic suppression band-pass filter and manufacturing method thereof |
| CN206281903U (en) * | 2016-11-23 | 2017-06-27 | 北京金自天正智能控制股份有限公司 | A kind of inductance detection device for cold rolling correction |
| CN107181030A (en) * | 2017-06-07 | 2017-09-19 | 孙超 | A kind of miniature T-shaped staircase resonant impedance capacitance loaded type triplexer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649915A (en) * | 2018-06-20 | 2018-10-12 | 中国电子科技集团公司第十三研究所 | 3D integrates LC filters and electronic system |
| CN114400128A (en) * | 2021-12-27 | 2022-04-26 | 北京遥感设备研究所 | Planar spiral inductor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108063607B (en) | 2021-01-08 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20200421 Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing, Daxing District Applicant after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 101318 No. 26, A District, Tianzhu Road, Tianzhu Airport Industrial Zone, Beijing, Shunyi District Applicant before: Beijing BBEF Science & Technology Co.,Ltd. |
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