CN108015502A - PCB high accurate holes position processing technology and its processing unit (plant) - Google Patents
PCB high accurate holes position processing technology and its processing unit (plant) Download PDFInfo
- Publication number
- CN108015502A CN108015502A CN201810027091.6A CN201810027091A CN108015502A CN 108015502 A CN108015502 A CN 108015502A CN 201810027091 A CN201810027091 A CN 201810027091A CN 108015502 A CN108015502 A CN 108015502A
- Authority
- CN
- China
- Prior art keywords
- high accurate
- position processing
- holes position
- pcb high
- accurate holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 21
- 238000005516 engineering process Methods 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000003825 pressing Methods 0.000 claims abstract description 21
- 238000005476 soldering Methods 0.000 claims abstract description 7
- 238000005553 drilling Methods 0.000 claims abstract description 6
- 238000005259 measurement Methods 0.000 claims abstract description 4
- 238000012216 screening Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 30
- 230000007246 mechanism Effects 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 19
- 238000003475 lamination Methods 0.000 claims description 9
- 239000011229 interlayer Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 5
- 238000005111 flow chemistry technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/06—Metal-working plant comprising a number of associated machines or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of PCB high accurate holes position processing technology, it is characterised in that includes the following steps：S1, screening internal layer supplied materials, select internal layer supplied materials of the harmomegathus stability within ± 200ppm；S2, using IS415 programs be laminated internal layer supplied materials, and will cold pressing time lengthening 30 minutes；S3, drilled using drilling machine；S4, carry out electrical measurement；S5, use reflow machine progress reflow soldering.The present invention can be by connecter hole position precision controlling within ± 0.050mm.
Description
Technical field
The present invention relates to wiring board art, especially a kind of PCB high accurate holes position processing technology and its processing unit (plant).
Background technology
Hole position precision is within ± 0.075mm in High-Speed PCB at present, but for a new generation's Purley Platform Servers
New connector hole position precision needs to control within ± 0.050mm, it is necessary to control in this precision interval, it is necessary to supplied materials,
Lamination, the progress Special controlling such as flow processing after drilling and material.
The content of the invention
Based on this, it is necessary to provide a kind of PCB high accurate holes position processing technology, it is characterised in that include the following steps：
S1, screening internal layer supplied materials, select internal layer supplied materials of the harmomegathus stability within ± 200ppm；
S2, using IS415 programs be laminated internal layer supplied materials, and will cold pressing time lengthening 30 minutes；
S3, drilled using drilling machine；
S4, carry out electrical measurement；
S5, use reflow machine progress reflow soldering.
Preferably, the time of lamination is extended 30 minutes on the basis of the IS415 programs original time.
Further, internal layer interlayer harmomegathus coefficient is adapted to 100.02%.
Preferably, in step S3, drilled using single drill.
Further, the grinding number of the drill is less than twice.
A kind of PCB high accurate holes position processing unit (plant), including rack, and be arranged in the rack laminate mechanism, drilling
Mechanism and Reflow Soldering mechanism, the laminate mechanism include housing and the horizontally disposed support plate and the pressing plate that are arranged in housing,
The support plate is fixedly connected by support column with the bottom plate of the housing, and the support plate encloses heating with the housing
Chamber, is equably provided with some through holes in the support plate, heating arrangements, the heating is additionally provided with the bottom plate of the housing
Mechanism is located at the lower section of the support plate, and the pressing plate is connected by driving mechanism with the top plate of the housing.
When being laminated, internal layer supplied materials of the harmomegathus stability screened within ± 200ppm is positioned over pressing plate and branch
Between fagging, then driving mechanism driving pressing plate pushes, and is laminated, while the heating arrangements below support plate will can heat
The air heating of intracavitary, so that support plate is heated, and the hot-air in heating chamber can be delivered to internal layer through through hole
On supplied materials, so that the effect that internal layer supplied materials is heated is more preferable, and uniformly through hole respectively can make it that internal layer supplied materials is equal
Even heating so that internal layer supplied materials pressed after thickness evenly, bubble is less, so that follow-up bore process
In hole precision higher.
Preferably, the heating arrangements include heating module and the fan being arranged above the heating arrangements.
The heat that fan apparatus gives out heating module is quickly full of whole heating chamber, while is formed in heating chamber
Convection current so that the uniformity of temperature profile of heating chamber, when thereby may be ensured that pressing internal layer supplied materials, can make it that its thickness is more equal
It is even, so that the precision higher in the hole in follow-up bore process.
Preferably, the quantity of the support column is at least 4, and the support column is uniformly arranged.
4 equally distributed support columns can the run-off the straight in lamination process to avoid support plate, to improve lamination process
The uniformity.
Further, the driving mechanism includes first hydraulic cylinder and the second liquid being connected respectively with the housing and pressing plate
Cylinder pressure, the first hydraulic cylinder and second hydraulic cylinder are symmetrical on the revenue centre of the pressing plate.
First hydraulic cylinder and second hydraulic cylinder synchronously move up and down, and to drive pressing plate to move up and down, and can ensure pressing plate
It will not shift, be bundled into interior during lamination because of the effect for being subject to external force during moving up and down and in lamination process
The uniformity of layer supplied materials thickness.
Further, the laminate mechanism further includes control module, the control module and the driving mechanism, heated mould
Block is connected with fan signal.
Control module is used to realize the automatic control for connecting driving mechanism, heating module and fan signal after inputting program
System.
Brief description of the drawings
Fig. 1 is the cross-sectional view of laminate mechanism described in the embodiment of the present invention；
Description of reference numerals：
1- laminate mechanisms, 11- housings, 12- support plates, 121- through holes, 122- support columns, 13- pressing plates, 131- first hydraulic cylinders,
132- second hydraulic cylinders, 141- heating modules, 142- fans, 15- heating chambers.
Embodiment
In order to facilitate the understanding of those skilled in the art, the present invention is done further in detail below in conjunction with attached drawing and embodiment
Thin description：
Such as Fig. 1, a kind of PCB high accurate holes position processing technology, it is characterised in that include the following steps：
S1, screening internal layer supplied materials, select internal layer supplied materials of the harmomegathus stability within ± 200ppm；
S2, using IS415 programs be laminated internal layer supplied materials, and will cold pressing time lengthening 30 minutes；
S3, drilled using drilling machine；
S4, carry out electrical measurement；
S5, use reflow machine progress reflow soldering.
One of which embodiment, extends 30 minutes by the time of lamination on the basis of the IS415 programs original time.
One of which embodiment, 100.02% is adapted to by internal layer interlayer harmomegathus coefficient.
One of which embodiment, in step S3, is drilled using single drill.
One of which embodiment, the grinding number of the drill are less than twice.
One of which embodiment, a kind of PCB high accurate holes position processing unit (plant), including rack, and be arranged in the rack
Laminate mechanism 1, borehole drill construction and Reflow Soldering mechanism, the laminate mechanism 1 includes housing 11 and the water that is arranged in housing 11
The flat support plate 12 set and pressing plate 13, the support plate 12 are fixedly connected by support column 122 with the bottom plate of the housing 11,
The support plate 12 encloses heating chamber 15 with the housing 11, and some through holes 121 are equably provided with the support plate 12,
Heating arrangements are additionally provided with the bottom plate of the housing 11, the heating arrangements are located at the lower section of the support plate 12, the pressure
Plate 13 is connected by driving mechanism with the top plate of the housing 11.
One of which embodiment, the heating arrangements include heating module 141 and are arranged above the heating arrangements
Fan 142.
One of which embodiment, the quantity of the support column 122 is at least 4, and the support column 122 is uniformly arranged.
One of which embodiment, the driving mechanism include the first hydraulic pressure being connected respectively with the housing 11 and pressing plate 13
Cylinder 131 and second hydraulic cylinder 132, the revenue centre of the first hydraulic cylinder 131 and second hydraulic cylinder 132 on the pressing plate 13
Symmetrically.
One of which embodiment, the laminate mechanism 1 further include control module, the control module and the driving machine
Structure, heating module 141 are connected with 142 signal of fan.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of PCB high accurate holes position processing technology, it is characterised in that include the following steps：
S1, screening internal layer supplied materials, select internal layer supplied materials of the harmomegathus stability within ± 200ppm；
S2, using IS415 programs be laminated internal layer supplied materials, and will cold pressing time lengthening 30 minutes；
S3, drilled using drilling machine；
S4, carry out electrical measurement；
S5, use reflow machine progress reflow soldering.
2. PCB high accurate holes position processing technology according to claim 1, it is characterised in that in step S1, by lamination
Time extends 30 minutes on the basis of the IS415 programs original time.
3. PCB high accurate holes position processing technology according to claim 2, it is characterised in that by internal layer interlayer harmomegathus coefficient
It is adapted to 100.02%.
4. PCB high accurate holes position processing technology according to claim 1, it is characterised in that in step S3, using independent
Drill drill.
5. PCB high accurate holes position processing technology according to claim 4, it is characterised in that the grinding number of the drill
Less than twice.
A kind of 6. PCB high accurate holes position processing unit (plant), it is characterised in that including rack, and the lamination being arranged in the rack
Mechanism, borehole drill construction and Reflow Soldering mechanism, the laminate mechanism include housing and the horizontally disposed support being arranged in housing
Plate and pressing plate, the support plate are fixedly connected by support column with the bottom plate of the housing, and the support plate is enclosed with the housing
Heating chamber is synthesized, some through holes is equably provided with the support plate, heating arrangements is additionally provided with the bottom plate of the housing,
The heating arrangements are located at the lower section of the support plate, and the pressing plate is connected by driving mechanism with the top plate of the housing.
7. PCB high accurate holes position processing unit (plant) according to claim 6, it is characterised in that the heating arrangements include adding
Thermal modules and the fan being arranged above the heating arrangements.
8. PCB high accurate holes position processing unit (plant) according to claim 6, it is characterised in that the quantity of the support column is extremely
It is 4 less, and the support column is uniformly arranged.
9. PCB high accurate holes position processing unit (plant) according to claim 8, it is characterised in that the driving mechanism includes dividing
The first hydraulic cylinder and second hydraulic cylinder not being connected with the housing and pressing plate, the first hydraulic cylinder and second hydraulic cylinder on
The revenue centre of the pressing plate is symmetrical.
10. PCB high accurate holes position processing unit (plant) according to claim 9, it is characterised in that the laminate mechanism further includes
Control module, the control module are connected with the driving mechanism, heating module and fan signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810027091.6A CN108015502A (en) | 2018-01-11 | 2018-01-11 | PCB high accurate holes position processing technology and its processing unit (plant) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810027091.6A CN108015502A (en) | 2018-01-11 | 2018-01-11 | PCB high accurate holes position processing technology and its processing unit (plant) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108015502A true CN108015502A (en) | 2018-05-11 |
Family
ID=62071480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810027091.6A Pending CN108015502A (en) | 2018-01-11 | 2018-01-11 | PCB high accurate holes position processing technology and its processing unit (plant) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108015502A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2571573Y (en) * | 2002-10-09 | 2003-09-10 | 黄世海 | Lamination press for PVC identification card |
| CN102026484A (en) * | 2009-09-22 | 2011-04-20 | 奈电软性科技电子(珠海)有限公司 | Pressing and breakover process and laminating board structure of circuit board |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN202685496U (en) * | 2012-06-28 | 2013-01-23 | 特新电路材料（东莞）有限公司 | Laminating device for circuit board laminating machine |
| CN104023485A (en) * | 2014-04-18 | 2014-09-03 | 昆山市鸿运通多层电路板有限公司 | High-precision step-type multiplayer printed circuit board (PCB) technology |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
| CN105472886A (en) * | 2015-11-13 | 2016-04-06 | 惠州市金百泽电路科技有限公司 | Manufacturing method of PCB board internally provided with active device |
| CN106332476A (en) * | 2016-11-09 | 2017-01-11 | 珠海杰赛科技有限公司 | Multi-layer PCB manufacturing process |
| CN107124817A (en) * | 2017-06-06 | 2017-09-01 | 深圳市旗众智能自动化有限公司 | Move up formula paster hot press |
| CN107231070A (en) * | 2017-06-15 | 2017-10-03 | 黄志洁 | A kind of oiling device manufactured for rotor |
| CN206551646U (en) * | 2017-01-19 | 2017-10-13 | 林金发 | A kind of energy-saving luminous material press fit device |
| CN208231184U (en) * | 2018-01-11 | 2018-12-14 | 广合科技（广州）有限公司 | PCB high-precision hole location processing unit (plant) |
-
2018
- 2018-01-11 CN CN201810027091.6A patent/CN108015502A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2571573Y (en) * | 2002-10-09 | 2003-09-10 | 黄世海 | Lamination press for PVC identification card |
| CN102026484A (en) * | 2009-09-22 | 2011-04-20 | 奈电软性科技电子(珠海)有限公司 | Pressing and breakover process and laminating board structure of circuit board |
| CN102523693A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures |
| CN202685496U (en) * | 2012-06-28 | 2013-01-23 | 特新电路材料（东莞）有限公司 | Laminating device for circuit board laminating machine |
| CN104023485A (en) * | 2014-04-18 | 2014-09-03 | 昆山市鸿运通多层电路板有限公司 | High-precision step-type multiplayer printed circuit board (PCB) technology |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
| CN105472886A (en) * | 2015-11-13 | 2016-04-06 | 惠州市金百泽电路科技有限公司 | Manufacturing method of PCB board internally provided with active device |
| CN106332476A (en) * | 2016-11-09 | 2017-01-11 | 珠海杰赛科技有限公司 | Multi-layer PCB manufacturing process |
| CN206551646U (en) * | 2017-01-19 | 2017-10-13 | 林金发 | A kind of energy-saving luminous material press fit device |
| CN107124817A (en) * | 2017-06-06 | 2017-09-01 | 深圳市旗众智能自动化有限公司 | Move up formula paster hot press |
| CN107231070A (en) * | 2017-06-15 | 2017-10-03 | 黄志洁 | A kind of oiling device manufactured for rotor |
| CN208231184U (en) * | 2018-01-11 | 2018-12-14 | 广合科技（广州）有限公司 | PCB high-precision hole location processing unit (plant) |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong Applicant after: Guangzhou Guanghe Technology Co., Ltd Address before: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong Applicant before: DELTON TECHNOLOGY (GUANGZHOU) Inc. |