CN108015502A - PCB high accurate holes position processing technology and its processing unit (plant) - Google Patents

PCB high accurate holes position processing technology and its processing unit (plant) Download PDF

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Publication number
CN108015502A
CN108015502A CN201810027091.6A CN201810027091A CN108015502A CN 108015502 A CN108015502 A CN 108015502A CN 201810027091 A CN201810027091 A CN 201810027091A CN 108015502 A CN108015502 A CN 108015502A
Authority
CN
China
Prior art keywords
high accurate
position processing
holes position
pcb high
accurate holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810027091.6A
Other languages
Chinese (zh)
Inventor
彭镜辉
黎钦源
郑剑坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guanghe Science And Technology (guangzhou) Co Ltd
Original Assignee
Guanghe Science And Technology (guangzhou) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guanghe Science And Technology (guangzhou) Co Ltd filed Critical Guanghe Science And Technology (guangzhou) Co Ltd
Priority to CN201810027091.6A priority Critical patent/CN108015502A/en
Publication of CN108015502A publication Critical patent/CN108015502A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P23/00Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
    • B23P23/04Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P23/00Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
    • B23P23/06Metal-working plant comprising a number of associated machines or apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Abstract

The present invention relates to a kind of PCB high accurate holes position processing technology, it is characterised in that includes the following steps:S1, screening internal layer supplied materials, select internal layer supplied materials of the harmomegathus stability within ± 200ppm;S2, using IS415 programs be laminated internal layer supplied materials, and will cold pressing time lengthening 30 minutes;S3, drilled using drilling machine;S4, carry out electrical measurement;S5, use reflow machine progress reflow soldering.The present invention can be by connecter hole position precision controlling within ± 0.050mm.

Description

PCB high accurate holes position processing technology and its processing unit (plant)
Technical field
The present invention relates to wiring board art, especially a kind of PCB high accurate holes position processing technology and its processing unit (plant).
Background technology
Hole position precision is within ± 0.075mm in High-Speed PCB at present, but for a new generation's Purley Platform Servers New connector hole position precision needs to control within ± 0.050mm, it is necessary to control in this precision interval, it is necessary to supplied materials, Lamination, the progress Special controlling such as flow processing after drilling and material.
The content of the invention
Based on this, it is necessary to provide a kind of PCB high accurate holes position processing technology, it is characterised in that include the following steps:
S1, screening internal layer supplied materials, select internal layer supplied materials of the harmomegathus stability within ± 200ppm;
S2, using IS415 programs be laminated internal layer supplied materials, and will cold pressing time lengthening 30 minutes;
S3, drilled using drilling machine;
S4, carry out electrical measurement;
S5, use reflow machine progress reflow soldering.
Preferably, the time of lamination is extended 30 minutes on the basis of the IS415 programs original time.
Further, internal layer interlayer harmomegathus coefficient is adapted to 100.02%.
Preferably, in step S3, drilled using single drill.
Further, the grinding number of the drill is less than twice.
A kind of PCB high accurate holes position processing unit (plant), including rack, and be arranged in the rack laminate mechanism, drilling Mechanism and Reflow Soldering mechanism, the laminate mechanism include housing and the horizontally disposed support plate and the pressing plate that are arranged in housing, The support plate is fixedly connected by support column with the bottom plate of the housing, and the support plate encloses heating with the housing Chamber, is equably provided with some through holes in the support plate, heating arrangements, the heating is additionally provided with the bottom plate of the housing Mechanism is located at the lower section of the support plate, and the pressing plate is connected by driving mechanism with the top plate of the housing.
When being laminated, internal layer supplied materials of the harmomegathus stability screened within ± 200ppm is positioned over pressing plate and branch Between fagging, then driving mechanism driving pressing plate pushes, and is laminated, while the heating arrangements below support plate will can heat The air heating of intracavitary, so that support plate is heated, and the hot-air in heating chamber can be delivered to internal layer through through hole On supplied materials, so that the effect that internal layer supplied materials is heated is more preferable, and uniformly through hole respectively can make it that internal layer supplied materials is equal Even heating so that internal layer supplied materials pressed after thickness evenly, bubble is less, so that follow-up bore process In hole precision higher.
Preferably, the heating arrangements include heating module and the fan being arranged above the heating arrangements.
The heat that fan apparatus gives out heating module is quickly full of whole heating chamber, while is formed in heating chamber Convection current so that the uniformity of temperature profile of heating chamber, when thereby may be ensured that pressing internal layer supplied materials, can make it that its thickness is more equal It is even, so that the precision higher in the hole in follow-up bore process.
Preferably, the quantity of the support column is at least 4, and the support column is uniformly arranged.
4 equally distributed support columns can the run-off the straight in lamination process to avoid support plate, to improve lamination process The uniformity.
Further, the driving mechanism includes first hydraulic cylinder and the second liquid being connected respectively with the housing and pressing plate Cylinder pressure, the first hydraulic cylinder and second hydraulic cylinder are symmetrical on the revenue centre of the pressing plate.
First hydraulic cylinder and second hydraulic cylinder synchronously move up and down, and to drive pressing plate to move up and down, and can ensure pressing plate It will not shift, be bundled into interior during lamination because of the effect for being subject to external force during moving up and down and in lamination process The uniformity of layer supplied materials thickness.
Further, the laminate mechanism further includes control module, the control module and the driving mechanism, heated mould Block is connected with fan signal.
Control module is used to realize the automatic control for connecting driving mechanism, heating module and fan signal after inputting program System.
Brief description of the drawings
Fig. 1 is the cross-sectional view of laminate mechanism described in the embodiment of the present invention;
Description of reference numerals:
1- laminate mechanisms, 11- housings, 12- support plates, 121- through holes, 122- support columns, 13- pressing plates, 131- first hydraulic cylinders, 132- second hydraulic cylinders, 141- heating modules, 142- fans, 15- heating chambers.
Embodiment
In order to facilitate the understanding of those skilled in the art, the present invention is done further in detail below in conjunction with attached drawing and embodiment Thin description:
Such as Fig. 1, a kind of PCB high accurate holes position processing technology, it is characterised in that include the following steps:
S1, screening internal layer supplied materials, select internal layer supplied materials of the harmomegathus stability within ± 200ppm;
S2, using IS415 programs be laminated internal layer supplied materials, and will cold pressing time lengthening 30 minutes;
S3, drilled using drilling machine;
S4, carry out electrical measurement;
S5, use reflow machine progress reflow soldering.
One of which embodiment, extends 30 minutes by the time of lamination on the basis of the IS415 programs original time.
One of which embodiment, 100.02% is adapted to by internal layer interlayer harmomegathus coefficient.
One of which embodiment, in step S3, is drilled using single drill.
One of which embodiment, the grinding number of the drill are less than twice.
One of which embodiment, a kind of PCB high accurate holes position processing unit (plant), including rack, and be arranged in the rack Laminate mechanism 1, borehole drill construction and Reflow Soldering mechanism, the laminate mechanism 1 includes housing 11 and the water that is arranged in housing 11 The flat support plate 12 set and pressing plate 13, the support plate 12 are fixedly connected by support column 122 with the bottom plate of the housing 11, The support plate 12 encloses heating chamber 15 with the housing 11, and some through holes 121 are equably provided with the support plate 12, Heating arrangements are additionally provided with the bottom plate of the housing 11, the heating arrangements are located at the lower section of the support plate 12, the pressure Plate 13 is connected by driving mechanism with the top plate of the housing 11.
One of which embodiment, the heating arrangements include heating module 141 and are arranged above the heating arrangements Fan 142.
One of which embodiment, the quantity of the support column 122 is at least 4, and the support column 122 is uniformly arranged.
One of which embodiment, the driving mechanism include the first hydraulic pressure being connected respectively with the housing 11 and pressing plate 13 Cylinder 131 and second hydraulic cylinder 132, the revenue centre of the first hydraulic cylinder 131 and second hydraulic cylinder 132 on the pressing plate 13 Symmetrically.
One of which embodiment, the laminate mechanism 1 further include control module, the control module and the driving machine Structure, heating module 141 are connected with 142 signal of fan.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

1. a kind of PCB high accurate holes position processing technology, it is characterised in that include the following steps:
S1, screening internal layer supplied materials, select internal layer supplied materials of the harmomegathus stability within ± 200ppm;
S2, using IS415 programs be laminated internal layer supplied materials, and will cold pressing time lengthening 30 minutes;
S3, drilled using drilling machine;
S4, carry out electrical measurement;
S5, use reflow machine progress reflow soldering.
2. PCB high accurate holes position processing technology according to claim 1, it is characterised in that in step S1, by lamination Time extends 30 minutes on the basis of the IS415 programs original time.
3. PCB high accurate holes position processing technology according to claim 2, it is characterised in that by internal layer interlayer harmomegathus coefficient It is adapted to 100.02%.
4. PCB high accurate holes position processing technology according to claim 1, it is characterised in that in step S3, using independent Drill drill.
5. PCB high accurate holes position processing technology according to claim 4, it is characterised in that the grinding number of the drill Less than twice.
A kind of 6. PCB high accurate holes position processing unit (plant), it is characterised in that including rack, and the lamination being arranged in the rack Mechanism, borehole drill construction and Reflow Soldering mechanism, the laminate mechanism include housing and the horizontally disposed support being arranged in housing Plate and pressing plate, the support plate are fixedly connected by support column with the bottom plate of the housing, and the support plate is enclosed with the housing Heating chamber is synthesized, some through holes is equably provided with the support plate, heating arrangements is additionally provided with the bottom plate of the housing, The heating arrangements are located at the lower section of the support plate, and the pressing plate is connected by driving mechanism with the top plate of the housing.
7. PCB high accurate holes position processing unit (plant) according to claim 6, it is characterised in that the heating arrangements include adding Thermal modules and the fan being arranged above the heating arrangements.
8. PCB high accurate holes position processing unit (plant) according to claim 6, it is characterised in that the quantity of the support column is extremely It is 4 less, and the support column is uniformly arranged.
9. PCB high accurate holes position processing unit (plant) according to claim 8, it is characterised in that the driving mechanism includes dividing The first hydraulic cylinder and second hydraulic cylinder not being connected with the housing and pressing plate, the first hydraulic cylinder and second hydraulic cylinder on The revenue centre of the pressing plate is symmetrical.
10. PCB high accurate holes position processing unit (plant) according to claim 9, it is characterised in that the laminate mechanism further includes Control module, the control module are connected with the driving mechanism, heating module and fan signal.
CN201810027091.6A 2018-01-11 2018-01-11 PCB high accurate holes position processing technology and its processing unit (plant) Pending CN108015502A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810027091.6A CN108015502A (en) 2018-01-11 2018-01-11 PCB high accurate holes position processing technology and its processing unit (plant)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810027091.6A CN108015502A (en) 2018-01-11 2018-01-11 PCB high accurate holes position processing technology and its processing unit (plant)

Publications (1)

Publication Number Publication Date
CN108015502A true CN108015502A (en) 2018-05-11

Family

ID=62071480

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810027091.6A Pending CN108015502A (en) 2018-01-11 2018-01-11 PCB high accurate holes position processing technology and its processing unit (plant)

Country Status (1)

Country Link
CN (1) CN108015502A (en)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2571573Y (en) * 2002-10-09 2003-09-10 黄世海 Lamination press for PVC identification card
CN102026484A (en) * 2009-09-22 2011-04-20 奈电软性科技电子(珠海)有限公司 Pressing and breakover process and laminating board structure of circuit board
CN102523693A (en) * 2011-12-30 2012-06-27 深圳崇达多层线路板有限公司 Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures
CN202685496U (en) * 2012-06-28 2013-01-23 特新电路材料(东莞)有限公司 Laminating device for circuit board laminating machine
CN104023485A (en) * 2014-04-18 2014-09-03 昆山市鸿运通多层电路板有限公司 High-precision step-type multiplayer printed circuit board (PCB) technology
CN104270889A (en) * 2014-09-28 2015-01-07 广州兴森快捷电路科技有限公司 Local high-precision printed circuit board and manufacturing method thereof
CN105472886A (en) * 2015-11-13 2016-04-06 惠州市金百泽电路科技有限公司 Manufacturing method of PCB board internally provided with active device
CN106332476A (en) * 2016-11-09 2017-01-11 珠海杰赛科技有限公司 Multi-layer PCB manufacturing process
CN107124817A (en) * 2017-06-06 2017-09-01 深圳市旗众智能自动化有限公司 Move up formula paster hot press
CN107231070A (en) * 2017-06-15 2017-10-03 黄志洁 A kind of oiling device manufactured for rotor
CN206551646U (en) * 2017-01-19 2017-10-13 林金发 A kind of energy-saving luminous material press fit device
CN208231184U (en) * 2018-01-11 2018-12-14 广合科技(广州)有限公司 PCB high-precision hole location processing unit (plant)

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2571573Y (en) * 2002-10-09 2003-09-10 黄世海 Lamination press for PVC identification card
CN102026484A (en) * 2009-09-22 2011-04-20 奈电软性科技电子(珠海)有限公司 Pressing and breakover process and laminating board structure of circuit board
CN102523693A (en) * 2011-12-30 2012-06-27 深圳崇达多层线路板有限公司 Process for manufacturing printed circuit boards having high-frequency and low-frequency mixed board structures
CN202685496U (en) * 2012-06-28 2013-01-23 特新电路材料(东莞)有限公司 Laminating device for circuit board laminating machine
CN104023485A (en) * 2014-04-18 2014-09-03 昆山市鸿运通多层电路板有限公司 High-precision step-type multiplayer printed circuit board (PCB) technology
CN104270889A (en) * 2014-09-28 2015-01-07 广州兴森快捷电路科技有限公司 Local high-precision printed circuit board and manufacturing method thereof
CN105472886A (en) * 2015-11-13 2016-04-06 惠州市金百泽电路科技有限公司 Manufacturing method of PCB board internally provided with active device
CN106332476A (en) * 2016-11-09 2017-01-11 珠海杰赛科技有限公司 Multi-layer PCB manufacturing process
CN206551646U (en) * 2017-01-19 2017-10-13 林金发 A kind of energy-saving luminous material press fit device
CN107124817A (en) * 2017-06-06 2017-09-01 深圳市旗众智能自动化有限公司 Move up formula paster hot press
CN107231070A (en) * 2017-06-15 2017-10-03 黄志洁 A kind of oiling device manufactured for rotor
CN208231184U (en) * 2018-01-11 2018-12-14 广合科技(广州)有限公司 PCB high-precision hole location processing unit (plant)

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Address after: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong

Applicant after: Guangzhou Guanghe Technology Co., Ltd

Address before: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong

Applicant before: DELTON TECHNOLOGY (GUANGZHOU) Inc.