CN101466202A - Method for manufacturing printed circuit board using base material of high thermal conductivity suitable for being inserted into non-surface component - Google Patents
Method for manufacturing printed circuit board using base material of high thermal conductivity suitable for being inserted into non-surface component Download PDFInfo
- Publication number
- CN101466202A CN101466202A CNA2008101906319A CN200810190631A CN101466202A CN 101466202 A CN101466202 A CN 101466202A CN A2008101906319 A CNA2008101906319 A CN A2008101906319A CN 200810190631 A CN200810190631 A CN 200810190631A CN 101466202 A CN101466202 A CN 101466202A
- Authority
- CN
- China
- Prior art keywords
- boring
- printed circuit
- circuit board
- surface component
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
- B23B41/14—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor for very small holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
Abstract
The invention relates to a method for producing a printing circuit board by using a high heat conductivity substrate material suitable for inserting in a non-surface component comprising the following steps: molding a metal plate (1) to get a drilling (2) with enough number and position to insert in the surface component, arranging the metal substrate (1) on an aspiration formwork (3) which has an aspiration hole (4) corresponding to the drilling (2) so that an injection head (5) of a conventional printing machine falls on the metal substrate (1), filling an insulation resin (7) by an injection hole (6), simultaneously pumping the air from the drilling (2) by the aspiration hole (4), and molding the obtained component to get an insertion mould (12) with a diameter less than that of the corresponding initial drilling (2).
Description
Technical field
The present invention relates to based on using metal material (being generally aluminium) to introduce technological improvement, so that strengthen the functional and effect of the printed circuit board (PCB) of use high conductivity material (IMS) manufacturing as being used for the physical support part on one face of thin metal layer (being generally copper).
This type of material and printed circuit board (PCB) be for adapt to electron trade with owing to the differentiation of using high heating power assembly to make working temperature become the relevant requirement of the new application of problem develops.
It is in the extensive multiple application of deciding factor, for example that the printed circuit board (PCB) that obtains by method of the present invention can be advantageously used in wherein dispelling the heat:
-lighting industry (led circuit)
-automobile (ignition system, illumination etc.)
-solid state relay
-distribution panelboard (transducer, inverter etc.).
Background technology
Because the increase of the use of high heating power assembly must be based on the new technology development printed circuit, described new technology permits by means of using new technology and new material making necessary improvement aspect the dissipation of the heat of described assembly generation.Therefore, developed new material, thereby brought new technology and new technology with high-termal conductivity.
As the physical support part that is used for printed circuit, new material has been introduced the metallic substrates that is mainly aluminium or copper, providing above generally is the thin metal layer of copper, produce the conductive trace that defines by circuit design at this place, thereby produce the connection between the different electronic modules that fully is welded to described trace.For the necessary electric insulation between conductive trace and the metallic substrates is provided, introduce dielectric material betwixt, it has guaranteed to have the required electric insulation of minimum thermal resistance.
In this way, avoided electrically contacting between the metal, provide simultaneously and will permit the necessary heat transmission that metallic substrates is absorbed in the temperature of accumulating in the circuit and helps its dissipation subsequently.
Structure described above has guaranteed high heat radiation, but it has been introduced in the major limitation that is applicable to aspect the electronic building brick type of this type of printed circuit, wherein must use surface-mount devices (SMD), because need the assembling of any kind of assembly of insertion must cause the loss of insulation, this owing to via actual component (insertion pin) being electrically connected between the metal of dissipation substrate and the conductive trace, or owing to the welding process of reality.
Therefore, the purpose of this invention is to provide a kind of printed circuit board (PCB), it keeps higher heat dissipation capacity, thereby permits the electronic building brick that is used to insert is installed, and then its manufacture method is necessitated.
Summary of the invention
The purpose that proposes in order to realize visualizes a kind of printed circuit board (PCB), and wherein the boring of the metallic substrates that provides for the pin that holds plug-in package is fully insulated.The program that make described printed circuit board (PCB), produces and keep the insulation of boring therein is a purpose of the present invention.
For this reason, the metallic substrates from as the dissipator of printed circuit is drilled with the hole above in several regions, must electronic building brick be inserted the printed circuit board (PCB) that finish at place, described hole after a while.
Then, continue to fill the boring of having processed, make the hole fill up by complete submergence and by described resin by means of applying resin with insulating property (properties).This operation is a most careful operation, can not overflow the bottom of passing boring and adhere to the surface of the metallic substrates relative with conductive trace more important because guarantee resin.
In order to realize this purpose, the resin of filling with and insulating property (properties) also must have inner mobile of the boring of penetrating and will guarantee the thixotropy of coating fully that boring is inner providing some characteristic, described characteristic to permit it again aspect its physical property.Yet this is not enough to realize the purpose that proposed, therefore must take certain measures at the member that is used to apply potting resin.In our situation, suction system has been used for the silk screen printing of conductive trace, and it is through suitably revising.
Usually, the printing machine that is used to make printed circuit comprises the suction system as a machine part.This system is provided on the printed panel, in other words, and on the surface of the placement material that will print above being provided in.Purpose is connection location, the flatness and fastening that guarantees material, so that can carry out silk screen printing with necessary accuracy.
Suction system is by means of pump and SS array and realize that described SS is distributed on the printed panel and is used to regular spaces and holds materials printed.
Cover fully under the situation of boring with insulating resin our seeking of paying close attention to, identical suction system can be suitable for guaranteeing that resin " falls " in the hole.Problem to be solved is, if the metallic substrates through boring is deposited on the flat surfaces, become in the open boring of the other end so and be plugged, and by being blocked in wherein air applied pressure greater than the injection pressure of potting resin, so resin can't penetrate in the boring equably.The air that stops up via the little SS sucking-off that provides on the surface of shelving in metallic substrates is provided the solution that is proposed.
Yet the distribution of the custom of suction point is regular on the plate of printing machine, does not have the plate of material of boring to be maintained fixed because its purpose comprises making.Therefore, must provide the suction template, it is arranged in the plate top of machine and separates with it, and possess with we need be corresponding and the SS of locating with the metallic substrates boring that potting resin covers.In this way, and, guaranteed to fill up the necessary suction of all boring acquisitions of resin, will stop the pressure of resin " whereabouts " to avoid script by the correct relative positioning between metallic substrates and the suction template.
SS will always have remarkable diameter less than bore diameter to be filled, introduce resin so that prevent between metallic substrates and suction template.In the injection process of potting resin, the intensity of suction and the injection pressure of resin are the key factors that obtains required quality.The combination of two parameters and SS diameter and resin physical characteristic is depended on the design of manufacturing circuit and must be regulated by experimental technique repeatedly.
In case the boring of making on metallic substrates is filled up by resin, so just continue to apply dielectric, it permits correct adhesiving metal thin layer, will finish the design after a while of conductive trace at described thin metal layer place, and it guarantees the electric insulation between described two metal partss again.
After incorporating the process of thin metal layer into, obtain to constitute the sub-assembly of proper plate, forming conductive trace on the described plate so that it will permit connecting after a while after fully forming trace between different electronic modules to be made up.
Next can apply solder mask, identification ink or new conductive ink, so that finish the design of required printed circuit.
At last, plate is carried out mold pressing, so that plug-in package permit to be installed, should keep firmly in mind, mould must have the diameter less than the initial bore hole of before making and filling up insulating resin (as institute's descriptions), and mould must be positioned at the center thereon fully and also locatees.In this way, owing to cover the insulating resin of the wall of new boring, guaranteed the correct insulation between the metal parts of sub-assembly.
Description of drawings
Describe for more than replenishing, and be intended to help to understand feature of the present invention better, will be described in detail preferred embodiment based on one group of plane graph following this specification, and wherein based on pointing to and presenting following graphic without limitation:
Fig. 1 shows the printed circuit board (PCB) of producing according to prior art.
Fig. 2 shows the cross section of the metallic substrates that constitutes dissipative element.
Fig. 3 is illustrated in the cross section of metallic substrates after the boring stage.
Fig. 4 shows the cross section of filling the layout of the different elements that relates in the stage of boring with insulating resin.
Fig. 5 shows the cross section of the Metal Substrate base plate with the boring of filling up insulating resin.
Fig. 6 shows the cross section of the layout of insulation dielectric.
Fig. 7 is illustrated in the cross section that applies thin metal layer sub-assembly afterwards.
Fig. 8 is illustrated in the cross section of the sub-assembly after the ink that applies chemical resistance of concrete.
Fig. 9 is illustrated in the cross section of the sub-assembly after the chemical erosion.
Figure 10 is illustrated in the cross section of the sub-assembly after the printing solder mask.
Figure 11 shows the cross section of the final mould that is used for plug-in package.
In above figure, reference number refers to lower member and element:
1. Metal Substrate base plate
2. boring
3. suction template
4. SS
5. injection head
6. injection orifice
7. insulating resin
8. dielectric
9. thin metal layer
10. not protected zone
11. auxiliary ink
12. insertion mould
13. anti-etching ink
Embodiment
As seen in FIG., program starts from metallic substrates (1), will implement mold pressing operation thereon, thereby obtains boring (2), and it quantitatively with on the position is enough to be used for inserting after a while the electronic building brick of circuit.Referring to Fig. 2 and 3.
Next, Metal Substrate base plate (1) is deposited on the suction template (3), described suction template (3) possesses the suitable SS of arranging accordingly with boring (2) (4).The injection head (5) that possesses the printing machine of the injection orifice (6) that has and hole (2) same diameter is positioned on the metallic substrates (1).Referring to Fig. 4.
Then under a certain pressure insulating resin (7) is applied to sub-assembly, the while, is filled up to boring (2), as shown in Figure 5 from boring (2) evacuate air via SS (4).Being advantageously used for insulating resin (7) by being exposed to the acrylate polymer that ultraviolet light obtains, more particularly is the Durashield V42 Mono Filter of ELECTRA company.
In this way, obtain compact block once more, apply dielectric layer (8) thereon.Referring to Fig. 6.
Thin metal layer (9) is deposited on the formed sub-assembly transport element of described thin layer forming circuit.Referring to Fig. 7.
By means of applying anti-etching ink (13) and it being printed (those skilled in the art is well-known), make the specific region of thin metal layer (9) not protected by photographic printing and/or screen printing technique.Referring to Fig. 8.
In chemical erosion (those skilled in the art is well-known) afterwards; and in case anti-etching ink (13) is eliminated; to stay the circuit that defines so; it is made up of the formed conductive trace of thin metal layer (9), and described thin metal layer (9) is corroded by anti-etching ink (13) in not protected zone (10).Referring to Fig. 9.
Next, continuing to apply auxiliary ink (11), for example may be solder mask, identification ink, conductive ink etc., and it constitutes printed circuit board (PCB).Referring to Figure 10.
Finally, as shown in figure 11, sub-assembly is proceeded mold pressing, thereby obtain to have insertion mould (12) less than the diameter of correspondence boring (2), therefore its maintenance is coated with insulating resin (7), and this has guaranteed can't exist between the pin of metallic substrates (1) and plug-in package and has anyly electrically contacted.Referring to Figure 11.
Believe and there is no need to carry out any more description again so that any technical staff in affiliated field can understand scope of the present invention and from its advantage that obtains.For the same reason, do not describe extensive some known technology in the printed circuit manufacturing in detail.
Claims (2)
1. the use high heat conductivity substrate material that is suitable for inserting non-surface component is made the method for printed circuit board (PCB), it is characterized in that may further comprise the steps:
-stamped metal plate (1) so as to obtain quantitatively with the position on be enough to be used to insert non-surface component boring (2);
-described Metal Substrate base plate (1) is arranged on the suction template (3), described suction template (3) possesses the SS of arranging accordingly with described boring (2) (4);
-injection head of common printing machine (5) being dropped to described Metal Substrate base plate (1) upward and via injection orifice (6) inject insulating resin (7), the air in the described boring simultaneously (2) is via described SS (4) emptying;
-dielectric layer (8) application is applied on the sub-assembly of above-mentioned steps acquisition;
-deposition forms thin metal layer (9);
-use anti-etching ink (13) and use routine techniques according to the described circuit of design and printing;
-chemical erosion is not subjected to the zone (10) of described anti-etching ink (13) protection so that go up the generation conductive trace at described thin metal layer (9);
-application applies for example auxiliary ink of solder mask (11) in a usual manner,
The sub-assembly that-mold pressing obtains in the above described manner is so that acquisition has the insertion mould (12) less than the diameter of described corresponding boring (2).
2. the high heat conductivity substrate material that a kind of use according to claim 1 is suitable for inserting non-surface component is made the method for printed circuit board (PCB), it is characterized in that described insulating resin (7) comprises by being exposed to a kind of acrylate polymer that ultraviolet light obtains.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES200703342A ES2334193B1 (en) | 2007-12-17 | 2007-12-17 | PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH HIGH THERMAL CONDUCTIBILITY BASED MATERIALS SUITABLE FOR THE INSERTION OF NON-SURFACE COMPONENTS. |
| ESP200703342 | 2007-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101466202A true CN101466202A (en) | 2009-06-24 |
Family
ID=40806491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101906319A Pending CN101466202A (en) | 2007-12-17 | 2008-12-17 | Method for manufacturing printed circuit board using base material of high thermal conductivity suitable for being inserted into non-surface component |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20090065474A (en) |
| CN (1) | CN101466202A (en) |
| ES (1) | ES2334193B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106004043A (en) * | 2015-03-25 | 2016-10-12 | 康代有限公司 | Selective solder mask printing on printed circuit board (PCB) |
| CN110291633A (en) * | 2016-12-12 | 2019-09-27 | 维迪科研究所 | For can parallelization integrated power chip method and electric power electronic module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102171021B1 (en) | 2014-03-14 | 2020-10-28 | 삼성전자주식회사 | Method for manufacturing circuit board and semiconductor package |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4445952A (en) * | 1981-11-03 | 1984-05-01 | Trw Inc. | Apparatus and method for filling holes in a circuit board |
| US4791248A (en) * | 1987-01-22 | 1988-12-13 | The Boeing Company | Printed wire circuit board and its method of manufacture |
| JPH05206615A (en) * | 1992-01-27 | 1993-08-13 | Hitachi Chem Co Ltd | Manufacture of printed wiring board with metal core |
-
2007
- 2007-12-17 ES ES200703342A patent/ES2334193B1/en active Active
-
2008
- 2008-12-17 CN CNA2008101906319A patent/CN101466202A/en active Pending
- 2008-12-17 KR KR1020080128878A patent/KR20090065474A/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106004043A (en) * | 2015-03-25 | 2016-10-12 | 康代有限公司 | Selective solder mask printing on printed circuit board (PCB) |
| TWI704853B (en) * | 2015-03-25 | 2020-09-11 | 以色列商肯提克有限公司 | Selective solder mask printing on a printed circuit board (pcb) |
| CN110291633A (en) * | 2016-12-12 | 2019-09-27 | 维迪科研究所 | For can parallelization integrated power chip method and electric power electronic module |
| CN110291633B (en) * | 2016-12-12 | 2023-05-30 | 维迪科研究所 | Method for parallelizable integrated power chip and power electronics module |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090065474A (en) | 2009-06-22 |
| ES2334193B1 (en) | 2011-01-17 |
| ES2334193A1 (en) | 2010-03-05 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20090624 |