CN107995783A - Board structure of circuit and its manufacture method - Google Patents
Board structure of circuit and its manufacture method Download PDFInfo
- Publication number
- CN107995783A CN107995783A CN201610956315.2A CN201610956315A CN107995783A CN 107995783 A CN107995783 A CN 107995783A CN 201610956315 A CN201610956315 A CN 201610956315A CN 107995783 A CN107995783 A CN 107995783A
- Authority
- CN
- China
- Prior art keywords
- layer
- ceramic
- resistor
- circuit
- connection gaskets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A kind of board structure of circuit and its manufacture method, the board structure of circuit include multi-layer board and the ceramic-type resistor assembly being embedded in multi-layer board.Ceramic-type resistor assembly include potsherd, alternately form in potsherd multiple connection gaskets and be formed at multiple resistive layers of potsherd.There is at least one resistive layer being electrically connected, to provide a resistance value between any two connection gaskets.The resistance value species of ceramic-type resistor assembly is more than the quantity of multiple resistive layers.Multi-layer board, which has, to be separated from each other and multiple contacts in multiple connection gaskets is electrically connected.Whereby, the board structure of circuit can be by embedded ceramic-type resistor assembly, to provide accurate and a greater variety of resistance values.
Description
Technical field
The present invention is to be related to a kind of circuit board, and further relate to it is a kind of in bury ceramic-type resistor assembly board structure of circuit and its
Manufacture method.
Background technology
It is that resistor assembly is embedded in a multi-layer board in the embedding available circuit harden structure for having a resistor assembly, and electricity
Resistance component is welded on multiple-plate interior bond pad.Therefore, when multiple-plate outer pad of available circuit harden structure is carrying out
During weld job, above-mentioned interior bond pad easily produces thawing (or softening) because of high temperature so that interior bond pad and resistor assembly
Connected problem is produced, so that the resistance value that available circuit harden structure is provided is inaccurate.
Furthermore available circuit harden structure is only capable of according to the resistance value needed for designer, and is embedded in multi-layer board corresponding
Resistor assembly, so different resistance values demand can not be suitable for.In other words, if available circuit harden structure is to meet difference
Resistance value demand, and corresponding multiple resistor assemblies are embedded in multi-layer board, then it can make the volume mistake of available circuit harden structure
Greatly, and when multiple-plate outer pad of available circuit harden structure is carrying out weld job, interior bond pad and resistor assembly
The probability meeting higher of connectivity problem is produced, and then makes resistance value inaccurate.
Then, inventors believe that drawbacks described above can improve, concentrate on studies and coordinate the utilization of scientific principle, propose finally a kind of
Design is reasonable and is effectively improved the present invention of drawbacks described above.
The content of the invention
The embodiment of the present invention is to provide a kind of board structure of circuit and its manufacture method, and can effectively improve embedding has resistance
Available circuit harden structure institute there may be the problem of.
The embodiment of the present invention discloses a kind of manufacture method of board structure of circuit, including：By multiple first connection gaskets with it is multiple
First resistor layer forms in a first surface of a potsherd, and sinters and to form a ceramic-type resistor assembly；Wherein, any two institutes
At least one first resistor layer for having between the first connection gasket and being electrically connected is stated, to provide a resistance value；The ceramics
Formula resistor assembly is more than by the resistance value species that multiple first connection gaskets can be provided with multiple first resistor layers
The quantity of multiple first resistor layers；The ceramic-type resistor assembly is arranged on a base board unit；In the substrate list
An insulating substrate is formed in member, and the insulating substrate is coated the ceramic-type resistor assembly；And optionally in described
One first conductive layer of one of shaping of base board unit and the insulating substrate, to form a board structure of circuit；Wherein, it is described
First conductive layer includes and is separated from each other and is electrically connected in multiple first contacts of multiple first connection gaskets.
Preferably, in the step of ceramic-type resistor assembly is arranged on the base board unit, the base board unit shape
Cheng Youyi notches, fill a cushion in the notch, by multiple first connection gaskets and multiple first resistor layers
Be at least partially arranged in the notch, to coat multiple first connection gaskets and multiple described the by the cushion
One resistive layer；In the step of shaping first conductive layer, multiple first contacts of first conductive layer pass through institute
State insulating layer and the cushion and be connected to multiple first connection gaskets.
Preferably, in the step of forming the ceramic-type resistor assembly, first multiple first connection gaskets are formed in
Multiple first resistor layers are then formed in the ceramics by the first surface of the potsherd by screen painting again
The first surface of piece；Wherein, each first resistor layer be respectively overlay in that it is connected at least two described first
The part of connection gasket.
Preferably, in the step of forming the insulating substrate, the thickness of the insulating substrate is controlled, so that the ceramics
Formula resistor assembly is located at the centre of the board structure of circuit.
The embodiment of the present invention also discloses a kind of board structure of circuit, including：One ceramic-type resistor assembly, comprising：One potsherd,
With the first surface and a second surface positioned at opposite side；Multiple first connection gaskets, alternately form in the potsherd
The first surface；And multiple first resistor layers, it is formed at the first surface of the potsherd, and each described the
One resistive layer connects at least two first connection gaskets, and has between any two described first connection gaskets and be electrically connected extremely
A few first resistor layer, to provide a resistance value；Wherein, the ceramic-type resistor assembly connects by multiple described first
The resistance value species that connection pad can be provided with multiple first resistor layers is more than the quantity of multiple first resistor layers；And
One multi-layer board, inside is embedding the ceramic-type resistor assembly, and the multi-layer board has one first conductive layer, and described first
Conductive layer includes and is separated from each other and is electrically connected in multiple first contacts of multiple first connection gaskets.
Preferably, the distance of the first surface and the second surface is not more than 1 millimeter, and multiple-plate phase
Anti- two plate faces are all identical to the distance of the ceramic-type resistor assembly.
Preferably, the ceramic-type resistor assembly includes multiple second connection gaskets and multiple second resistance layers, multiple described
Second connection gasket alternately forms the second surface in the potsherd, and has between any two described second connection gaskets
There is at least one second resistance layer of electric connection, to provide a resistance value；The multi-layer board has one second conductive layer,
And second conductive layer is included to be separated from each other and be electrically connected and connect in multiple the second of multiple second connection gaskets
Point.
Preferably, the ceramic-type resistor assembly includes at least conductive post being embedded in the potsherd, and
The both ends of at least one conductive post are connected to first connection gasket and second connection gasket.
Preferably, each first resistor layer includes a main part and at least two coverings from main part extension
Portion, and at least two covering parts of each first resistor layer are respectively overlay at least two described the of its connection
One connection gasket.
Preferably, the multi-layer board includes a base board unit and a cushion, and the base board unit includes an insulating layer
And a metal layer of the insulating layer and first conductive layer are arranged at, the metal layer is multiple described formed with a notch
First connection gasket is at least partially disposed in the notch with multiple first resistor layers, and the cushion is filled in institute
State notch and coat multiple first connection gaskets and multiple first resistor layers, multiple described the of first conductive layer
One contact is connected to multiple first connection gaskets through the insulating layer and the cushion.
In conclusion board structure of circuit and its manufacture method disclosed in the embodiment of the present invention, due to ceramic-type resistance group
First connection gasket of part need not be used to weld, so as to use fusing point be more than weld pad material so that above-mentioned multiple first connect
When soldered, the first connection gasket of ceramic-type resistor assembly is unaffected and can provide accurate resistance value point, and
The board structure of circuit can provide different resistance values by above-mentioned multiple first contacts thoroughly.
For the enabled feature and technology contents for being further understood that the present invention, refer to below in connection with the present invention specifically
Bright and attached drawing, but these explanations are only used for illustrating the present invention with attached drawing, rather than make any limit to protection scope of the present invention
System.
Brief description of the drawings
Fig. 1 is the schematic diagram (one) of the manufacture method step S110 of board structure of circuit of the present invention.
Fig. 2 is the schematic diagram (two) of the manufacture method step S110 of board structure of circuit of the present invention.
Fig. 3 is the schematic diagram of the manufacture method step S120 of board structure of circuit of the present invention.
Fig. 4 is the close-up schematic view of Fig. 3.
Fig. 5 is the bottom view of the ceramic-type resistor assembly in Fig. 3.
Fig. 6 is the schematic diagram of the manufacture method step S130 of board structure of circuit of the present invention.
Fig. 7 is the schematic diagram of the manufacture method step S140 of board structure of circuit of the present invention.
Fig. 8 is the schematic diagram of the manufacture method step S150 of board structure of circuit of the present invention.
Fig. 9 is the schematic diagram that another implementation of board structure of circuit of the present invention constructs.
Embodiment
Please refer to Fig.1 to Fig. 9, be the embodiment of the present invention, need to first illustrate, mentioned by the present embodiment respective figure
Correlated measure and external form, are only used for specifically describing embodiments of the present invention, in order to understand present disclosure, Er Feiyong
To limit to protection scope of the present invention.
The present embodiment discloses a kind of board structure of circuit and its manufacture method, and foregoing circuit harden structure 100 is capable of providing
Accurate and multiple types resistance values, so as to meeting different resistance values demand.For ease of understanding the present embodiment, below first described in explanation
The manufacture method of board structure of circuit 100, it includes step S110~S150.
Step S110：As depicted in figs. 1 and 2, there is provided a base board unit 21, and lacked in aforesaid substrate unit 21 formed with one
Mouth 211.Wherein, the base board unit 21 includes an insulating layer 22 and is located at 22 two opposite sides of insulating layer respectively in this present embodiment
Two metal layers 23,23 ', and one of metal layer 23 is formed with above-mentioned notch 211.Furthermore above-mentioned notch 211 is preferable
It is to refer to make insulating layer 22 be exposed to outside from metal layer 23.
Step S120：As shown in Figures 3 to 5, multiple first connection gaskets 12 and multiple first resistor layers 13 are formed in one
One first surface 111 of potsherd 11, and sinter and to form a ceramic-type resistor assembly 1.Wherein, the present embodiment is first by multiple institutes
The first surface 111 that the first connection gasket 12 forms in the potsherd 11 is stated, then again leads to multiple first resistor layers 13
The first surface 111 that screen painting forms in the potsherd 11 is crossed, but the present invention is not only restricted to this.
Furthermore there is at least one first resistor layer being electrically connected between any two above-mentioned first connection gaskets 12
13, to provide a resistance value.Whereby, since the first connection gasket of any two 12 is capable of providing a resistance value, so above-mentioned pottery
Porcelain formula resistor assembly 1 is big by above-mentioned multiple first connection gaskets 12 and resistance value species that multiple first resistor layers 13 can be provided
In the quantity of multiple first resistor layers 13.
For example, as shown in figure 5, first connection gasket 12 of the present embodiment with four first connection gasket 12A, 12B, 12C,
Exemplified by 12D, and the first resistor layer 13 of the present embodiment has different three resistance Zs 1, Z2, Z3 respectively.When selecting any the
During two the first connection gaskets 12 that one resistive layer 13 is connected, ceramic-type resistor assembly 1 be capable of providing three kinds of resistance Zs 1, Z2,
Z3；When selecting described first connection gasket 12A, 12C, the resistance value that ceramic-type resistor assembly 1 can provide is Z1+Z2；Work as selection
During described first connection gasket 12B, 12D, the resistance value that ceramic-type resistor assembly 1 can provide is Z2+Z3；Connect when selecting described first
During connection pad 12A, 12D, the resistance value that ceramic-type resistor assembly 1 can provide is Z1+Z2+Z3.Therefore, the ceramic-type electricity of the present embodiment
Six kinds of resistance values can be provided by first connection gasket 12 and first resistor layer 13 by hindering component 1.In addition, above-mentioned is with three
The first resistor layer 13 of arranged in series explains, but in another embodiment not illustrated, the first resistor layer 13 can also
It is multiple parallel with one another or connection in series-parallel, so as to providing more resistance value species.
Similarly, can also be by multiple second connection gaskets 14 and multiple second before sintering forms ceramic-type resistor assembly 1
Resistive layer 15 forms in a second surface 112 of potsherd 11, then re-sinters to form above-mentioned ceramic-type resistor assembly 1, so that
The two opposite sides of the ceramic-type resistor assembly 1 can be all employed.Wherein, the present embodiment is first by multiple second connection gaskets
14 form in the second surface 112 of the potsherd 11, then again by multiple second resistance layers 15 by screen painting into
Shape is in the second surface 112 of the potsherd 11, but the present invention is not only restricted to this.
Furthermore there is at least one second resistance layer being electrically connected between any two described second connection gaskets 14
15, to provide a resistance value.Whereby, since the first connection gasket of any two 12 is capable of providing a resistance value, so above-mentioned pottery
Porcelain formula resistor assembly 1 is big by above-mentioned multiple first connection gaskets 12 and resistance value species that multiple first resistor layers 13 can be provided
In the quantity of multiple second resistance layers 15.
In addition, due to above-mentioned second connection gasket 14 and second resistance layer 15 property and implementation steps in this present embodiment substantially
Such as the property and implementation steps of first connection gasket 12 and first resistor layer 13, thus it is not repeated here.It is but above-mentioned
The layout patterns (layout) of second connection gasket 14 and second resistance layer 15 are can be according to the demand of designer, and is different from institute
State the layout patterns of the first connection gasket 12 and first resistor layer 13.
Step S130：As shown in fig. 6, the ceramic-type resistor assembly 1 is arranged on the base board unit 21.Wherein,
One cushion 24 of filling in notch 211, at least part quilt of above-mentioned multiple first connection gaskets 12 and multiple first resistor layers 13
Be arranged in the notch 211 of the base board unit 21, with by the cushion 24 (such as：Above-mentioned multiple first are coated completely) to connect
Connection pad 12 and multiple first resistor layers 13.Whereby, the present embodiment passes through the notch 211 of base board unit 21 and taking for cushion 24
With use so that above-mentioned ceramic-type resistor assembly 1 can be stably positioned on base board unit 21, and can also ceramic-type
When first connection gasket 12 of resistor assembly 1 is placed in base board unit 21 with first resistor layer 13, avoid being damaged.
Step S140：As shown in fig. 7, forming an insulating substrate 25 on the base board unit 21, and make the insulation base
25 coating ceramic formula resistor assembly 1 of material.Then a metal layer 23 " is provided with above-mentioned insulating substrate 25.Wherein, in formation
In the step of stating insulating substrate 25, the present embodiment is preferably the thickness by controlling the insulating substrate 25, so that above-mentioned ceramics
Formula resistor assembly 1 is located at the centre of whole circuit board structure 100, but is not only restricted to this.
In addition, can also be designer's demand in the insulating substrate 25, and (do not marked in figure formed with an at least line layer
Show), and above-mentioned line layer is not electrically connected at ceramic-type resistor assembly 1.
Step S150：As shown in figure 8, optionally in one of shaping of the base board unit 21 and insulating substrate 25
One first conductive layer 26, to form a board structure of circuit 100.Wherein, the present embodiment is that base board unit 21 is formed without notch
211 metal layer 23 ' (most bottom side and not etched metal layer 23 ' in such as Fig. 7) is configured to above-mentioned first conductive layer 26.Into one
Say that first conductive layer 26, which includes, to be separated from each other and be electrically connected in the more of multiple first connection gaskets 12 in step ground
A first contact 261, and multiple first contacts 261 of first conductive layer 26 be all through the insulating layer 22 with
Cushion 24 and then it is connected to multiple first connection gaskets 12.
Whereby, the first connection gasket 12 (and second connection gasket 14) of the ceramic-type resistor assembly 1 need not be used to weld, institute
So as to it is more than the material of weld pad (such as using fusing point：Silver alloy) so that above-mentioned multiple first contacts 261 are when soldered, pottery
First connection gasket 12 (and second connection gasket 14) of porcelain formula resistor assembly 1 is unaffected and can provide accurate resistance value,
And the board structure of circuit 100 can provide different resistance values by above-mentioned multiple first contacts 261 thoroughly.
Furthermore be adjacent to the metal layer 23 " of the second connection gasket 14 and the multi-layer board 2 of second resistance layer 15, can also by into
Shape is one second conductive layer 27.Wherein, second conductive layer 27 includes and is separated from each other and is electrically connected in multiple described
Multiple second contacts 271 of second connection gasket 14.
In addition, in another embodiment not illustrated, the ceramic-type resistor assembly 1 can also be in above-mentioned steps S130
In, change and the second surface 112 of ceramic-type resistor assembly 1 is arranged on base board unit 21, step S150 is then to be changed to most to push up
The metal layer 23 " of side is configured to above-mentioned first conductive layer 26, and the metal layer 23 ' of most bottom side is then configured to the second conductive layer 27.
That is, the position of the first conductive layer 26 and the second conductive layer 27 can exchange.
A bit, each step described in the present embodiment, is that can add the order of step in the case of rational to supplementary notes
With adjustment, in other words, the present invention is not limited with above-mentioned step order.For example, above-mentioned steps S120 can also be in step
Implement before rapid S110 or implement at the same time；Alternatively, the board structure of circuit 100 of the present invention can also be without formed with the second connection gasket
14th, 15 and second conductive layer 27 of second resistance layer.
The present embodiment also provide it is a kind of via the board structure of circuit 100 (such as Fig. 8) formed manufactured by above-mentioned steps, it is following
The board structure of circuit 100 that will be directed to shown in Fig. 8 is described.Wherein, since many constructions have referred in above-mentioned manufacture method,
Therefore, part something in common is then no longer repeated.
The board structure of circuit 100 includes a ceramic-type resistor assembly 1 and internal embedding has above-mentioned ceramic-type resistor assembly 1
A multi-layer board 2, and opposite two plate faces of the multi-layer board 2 to ceramic-type resistor assembly 1 distance be preferably it is all identical,
Board structure of circuit 100 so as to avoiding the present embodiment produces damage because of rising-heat contracting-cold, but the present invention is not only restricted to this.
The ceramic-type resistor assembly 1 include a potsherd 11, multiple first connection gaskets 12, multiple first resistor layers 13,
Multiple second connection gaskets 14 and multiple second resistance layers 15.Wherein, the potsherd 11 has one first table positioned at opposite side
111 and one second surface 112 of face, and the first surface 111 and the distance of second surface 112 are not more than in this present embodiment
1 millimeter.
Above-mentioned multiple first connection gaskets 12 are alternately formed in the first surface 111 of the potsherd 11, multiple first electricity
Resistance layer 13 is formed at the first surface 111 of the potsherd 11, and each first resistor layer 13 connects at least two institutes
State the first connection gasket 12.Above-mentioned multiple second connection gaskets 14 are alternately formed in the second surface 112 of the potsherd 11, multiple
Second resistance layer 15 is formed at the second surface 112 of the potsherd 11, and each second resistance layer 15 connects at least
Two second connection gaskets 14.
In more detail, each first resistor layer 13 include the main part 131 that is attached at first surface 111 and from
At least two covering parts 132 that the main part 131 extends, and covered described at least two of each first resistor layer 13
Cap 132 is respectively overlay at least two first connection gaskets 12 of its connection.
Furthermore there is at least one first resistor layer being electrically connected between any two described first connection gaskets 12
13, to provide a resistance value.Whereby, the ceramic-type resistor assembly 1 passes through multiple first connection gaskets 12 and multiple first
The resistance value species that resistive layer 13 can be provided is more than the quantity of multiple first resistor layers 13.Any two described second connections
There is at least one second resistance layer 15 being electrically connected, to provide a resistance value between pad 14.
The multi-layer board 2 has an insulating substrate 25, the base board unit 21 and one positioned at 25 two opposite sides of insulating substrate
Second conductive layer 27 and the cushion 24 between insulating substrate 25 and base board unit 21.
Wherein, the base board unit 21 includes an insulating layer 22 and is arranged at a metal layer 23 and one of above-mentioned insulating layer 22
First conductive layer 26.The metal layer 23 is formed with a notch 211, above-mentioned multiple first connection gaskets 12 and multiple first resistor layers
13 are at least partially disposed in the notch 211, and the cushion 24 is filled in simultaneously (complete) cladding multiple the of notch 211
One connection gasket 12 and multiple first resistor layers 13.In addition, the cushion 24 of the present embodiment is be attached at above-mentioned potsherd 11
On one surface 111, but the present invention is not limited.
First conductive layer 26 includes and is separated from each other and is electrically connected in the more of above-mentioned multiple first connection gaskets 12
A first contact 261, and the second conductive layer 27 includes and is separated from each other and is electrically connected in above-mentioned multiple second connection gaskets 14
Multiple second contacts 271.Wherein, multiple first contacts 261 of first conductive layer 26 through the insulating layer 22 and delay
Rush layer 24 and be connected to multiple first connection gaskets 12, and multiple second contacts 271 of second conductive layer 27 are
Multiple second connection gaskets 14 are connected to through insulating substrate 25.
In addition, as shown in figure 9, the ceramic-type resistor assembly 1 can also further include and be embedded in the potsherd
An at least conductive post 16 in 11, and the both ends difference (electrical) of at least one conductive post 16 is connected to one described first
Connection gasket 12 and second connection gasket 14.
Furthermore " first " used in above-mentioned various components and " second ", is to be used for distinguishing respectively when illustrating the present embodiment
Component, but do not have the meaning such as other functions, structure, order of priority.That is, in the situation for being enough to distinguish various components
Under, " first " used in various components can also delete with " second ".
The foregoing is merely the preferable possible embodiments of the present invention, are not used for limiting to protection scope of the present invention, it is all according to
The equivalent changes and modifications that the claims in the present invention are done, should all belong to protection scope of the present invention.
Claims (10)
1. a kind of manufacture method of board structure of circuit, it is characterised in that the manufacture method of the board structure of circuit includes：
Multiple first connection gaskets and multiple first resistor layers are formed in into a first surface of a potsherd, and sinters and to form a pottery
Porcelain formula resistor assembly；Wherein, there is at least one first resistor being electrically connected between any two described first connection gaskets
Layer, to provide a resistance value；The ceramic-type resistor assembly passes through multiple first connection gaskets and multiple first resistors
The resistance value species that layer can be provided is more than the quantity of multiple first resistor layers；
The ceramic-type resistor assembly is arranged on a base board unit；
An insulating substrate is formed on the base board unit, and the insulating substrate is coated the ceramic-type resistor assembly；With
And
Optionally in the base board unit and one first conductive layer of one of shaping of the insulating substrate, to form an electricity
Road harden structure；Wherein, first conductive layer includes and is separated from each other and is electrically connected in multiple first connection gaskets
Multiple first contacts.
2. the manufacture method of board structure of circuit as claimed in claim 1, it is characterised in that set in the ceramic-type resistor assembly
Put in the step of base board unit, the base board unit fills a cushion in the notch, incite somebody to action formed with a notch
Multiple first connection gaskets are at least partially arranged in the notch with multiple first resistor layers, with by described slow
Rush layer and coat multiple first connection gaskets and multiple first resistor layers；In the step of shaping first conductive layer,
Multiple first contacts of first conductive layer connect respectively through insulating layer and the cushion of the base board unit
It is connected to multiple first connection gaskets.
3. the manufacture method of board structure of circuit as claimed in claim 1, it is characterised in that forming the ceramic-type resistance group
In the step of part, multiple first connection gaskets are first formed in the first surface of the potsherd, then again will be multiple
The first resistor layer forms in the first surface of the potsherd by screen painting；Wherein, each first electricity
Resistance layer is respectively overlay in the part at least two first connection gaskets that it is connected.
4. the manufacture method of board structure of circuit as claimed any one in claims 1 to 3, it is characterised in that described in formation
In the step of insulating substrate, the thickness of the insulating substrate is controlled, so that the ceramic-type resistor assembly is located at the circuit board
The centre of structure.
5. a kind of board structure of circuit, it is characterised in that the board structure of circuit includes：
One ceramic-type resistor assembly, comprising：
One potsherd, has a first surface and a second surface positioned at opposite side；
Multiple first connection gaskets, alternately form the first surface in the potsherd；And
Multiple first resistor layers, are formed at the first surface of the potsherd, and each first resistor layer connection
At least two first connection gaskets, and there is at least one described the be electrically connected between any two described first connection gaskets
One resistive layer, to provide a resistance value；Wherein, the ceramic-type resistor assembly passes through multiple first connection gaskets and multiple institutes
State the quantity that the resistance value species that first resistor layer can be provided is more than multiple first resistor layers；And
One multi-layer board, inside is embedding the ceramic-type resistor assembly, and the multi-layer board has one first conductive layer, and described
First conductive layer includes and is separated from each other and is electrically connected in multiple first contacts of multiple first connection gaskets.
6. board structure of circuit as claimed in claim 5, it is characterised in that the distance of the first surface and the second surface
No more than 1 millimeter, and multiple-plate opposite two plate faces are all identical to the distance of the ceramic-type resistor assembly.
7. board structure of circuit as claimed in claim 5, it is characterised in that the ceramic-type resistor assembly includes multiple second and connects
Connection pad and multiple second resistance layers, multiple second connection gaskets alternately form the second surface in the potsherd,
And there is at least one second resistance layer being electrically connected, to provide a resistance between any two described second connection gaskets
Value；The multi-layer board has one second conductive layer, and second conductive layer include be separated from each other and be electrically connected in
Multiple second contacts of multiple second connection gaskets.
8. board structure of circuit as claimed in claim 7, it is characterised in that the ceramic-type resistor assembly, which includes, is embedded in institute
At least conductive post in potsherd is stated, and the both ends of at least one conductive post are connected to first connection
Pad and second connection gasket.
9. board structure of circuit as claimed in claim 5, it is characterised in that each first resistor layer include a main part and
From at least two covering parts of main part extension, and each at least two covering parts of the first resistor layer
At least two first connection gaskets of its connection are not covered in.
10. the board structure of circuit as any one of claim 5 to 9, it is characterised in that the multi-layer board includes a base
Slab element and a cushion, the base board unit include an insulating layer and the metal layer for being arranged at the insulating layer and described the
One conductive layer, the metal layer is formed with a notch, and multiple first connection gaskets and multiple first resistor layers are at least
Part in the notch, and the cushion be filled in the notch and coat multiple first connection gaskets with it is multiple
The first resistor layer, multiple first contacts of first conductive layer divide through the insulating layer and the cushion
Multiple first connection gaskets are not connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610956315.2A CN107995783A (en) | 2016-10-26 | 2016-10-26 | Board structure of circuit and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610956315.2A CN107995783A (en) | 2016-10-26 | 2016-10-26 | Board structure of circuit and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995783A true CN107995783A (en) | 2018-05-04 |
Family
ID=62028516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610956315.2A Pending CN107995783A (en) | 2016-10-26 | 2016-10-26 | Board structure of circuit and its manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107995783A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114763292A (en) * | 2021-01-14 | 2022-07-19 | 东莞华科电子有限公司 | Sintering aid for buffer layer, resistor comprising buffer layer and resistor manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040036780A (en) * | 2002-10-24 | 2004-05-03 | 대덕전자 주식회사 | Method of manufacturing resistor-embedded printed circuit board |
| CN101039551A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Substrate with embedded element and manufacturing method thereof |
| CN101038886A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Method for manufacturing substrate of embedded element |
| CN101258564A (en) * | 2005-09-06 | 2008-09-03 | 罗姆股份有限公司 | Chip resistor and method for producing the same |
-
2016
- 2016-10-26 CN CN201610956315.2A patent/CN107995783A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040036780A (en) * | 2002-10-24 | 2004-05-03 | 대덕전자 주식회사 | Method of manufacturing resistor-embedded printed circuit board |
| CN101258564A (en) * | 2005-09-06 | 2008-09-03 | 罗姆股份有限公司 | Chip resistor and method for producing the same |
| CN101039551A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Substrate with embedded element and manufacturing method thereof |
| CN101038886A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Method for manufacturing substrate of embedded element |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114763292A (en) * | 2021-01-14 | 2022-07-19 | 东莞华科电子有限公司 | Sintering aid for buffer layer, resistor comprising buffer layer and resistor manufacturing method |
| CN114763292B (en) * | 2021-01-14 | 2023-09-08 | 东莞华科电子有限公司 | Sintering aid for buffer layer, resistor comprising buffer layer and resistor manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20050126682A1 (en) | Monolithic ceramic substrate and method for making the same | |
| CN104797083B (en) | The method and its printed circuit board of embedding resistance in printed circuit board | |
| CN105765671B (en) | Resistive element and its manufacture method | |
| US11930598B2 (en) | Three dimensional printed resistor for downhole applications | |
| CN106158314A (en) | Chip-shaped coil block and manufacture method thereof | |
| CN104160459A (en) | Chip resistor for incorporation into substrate, and method for producing same | |
| CN107995783A (en) | Board structure of circuit and its manufacture method | |
| US20220272837A1 (en) | Circuit board and method for manufacturing circuit board | |
| JPWO2020031844A1 (en) | Resistor | |
| US7110241B2 (en) | Substrate | |
| JP2019054117A (en) | Wiring board and planar transformer | |
| JP7011563B2 (en) | Circuit boards and electronic components | |
| CN108029203A (en) | Ceramic multi-layer baseplate | |
| JP2017195309A (en) | Lamination coil component | |
| JP2017199797A (en) | Electronic component | |
| JP2522180B2 (en) | Ceramic multilayer wiring board | |
| JP5527048B2 (en) | Ceramic multilayer substrate | |
| CN204560028U (en) | There is the printed circuit board of embedding resistance | |
| JP2019160992A (en) | Chip resistor, and manufacturing method of chip resistor | |
| JPH08264859A (en) | Magnetoresistive effect element and manufacture thereof | |
| JP2022516960A (en) | Thermistor and manufacturing method of thermistor | |
| TW201817294A (en) | Circuit board structure and manufacturing method thereof | |
| KR102417821B1 (en) | Manufacturing method for ceramic substrate | |
| JP2010010394A (en) | Ceramic wiring board | |
| JP2874686B2 (en) | Multilayer board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180504 |
|
| WD01 | Invention patent application deemed withdrawn after publication |