CN107994057B - Manufacturing method of touch sensing layer, display screen and display - Google Patents
Manufacturing method of touch sensing layer, display screen and display Download PDFInfo
- Publication number
- CN107994057B CN107994057B CN201711178039.2A CN201711178039A CN107994057B CN 107994057 B CN107994057 B CN 107994057B CN 201711178039 A CN201711178039 A CN 201711178039A CN 107994057 B CN107994057 B CN 107994057B
- Authority
- CN
- China
- Prior art keywords
- insulating
- intervals
- electrodes
- insulating layer
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a manufacturing method of a touch sensing layer, a display screen and a display. The display screen is manufactured by the manufacturing method, and the display comprises the display screen. According to the scheme, the insulator pattern and the electrode pattern in the touch sensing layer of the display screen can be manufactured only by one mask plate and one exposure process. Compared with the prior art, the process can be simplified, the capacity of the exposure machine is released, and the process cost is further reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing method of a touch sensing layer, a display screen and a display.
Background
The Touch display screen comprises a Touch sensing layer (Touch Sensor), and the Touch sensing layer is a device for realizing Touch sensing. The touch sensing layer generally includes a substrate on which an electrode, an insulator, a metal bridge, and an encapsulation layer are sequentially formed. The manufacturing process of the touch sensing layer uses a photoetching process, wherein the formation of the electrode and the insulator respectively needs one photoetching process, namely two mask plates are provided and the patterns of the electrode and the insulator are formed by using the two mask plates respectively. The process of the mode uses more mask plates and needs multiple exposures, which is not beneficial to the release of the production energy of the exposure machine and leads to the increase of the process cost.
Disclosure of Invention
In view of this, the invention provides a manufacturing method of a touch sensing layer, a display screen and a display, which can release the productivity of an exposure machine and reduce the process cost.
A manufacturing method of a touch sensing layer comprises the following steps: forming a conductive film over a substrate; forming an insulating layer covering the conductive film over the conductive film; patterning the insulating layer to form a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals, wherein the first insulating strips and the second insulating strips are crossed in a longitudinal direction and a transverse direction, the first insulating strips comprise a plurality of first insulating parts arranged at intervals, the second insulating strips comprise a plurality of second insulating parts arranged at intervals, every two first insulating parts are connected through a first connecting part, and two opposite sides of each first connecting part are respectively provided with one second insulating part arranged at intervals with the first connecting part; removing a part of the conductive film to form a plurality of first electrodes and a plurality of second electrodes, wherein every two first electrodes are connected through a second connecting portion, one first electrode corresponds to one first insulating portion, one second connecting portion corresponds to one first connecting portion, and one second electrode corresponds to one second insulating portion; and removing all the second insulating strips and the first insulating parts in each first insulating strip.
When the insulating layer is made of a non-metal material, the step of patterning the insulating layer to form a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals comprises: coating photoresist on the insulating layer; exposing and developing through a mask plate to transfer the pattern of the mask plate onto the photoresist; and etching the insulating layer, and transferring the pattern on the photoresist to the insulating layer to pattern the insulating layer to form a plurality of first insulating strips arranged at intervals in parallel and a plurality of second insulating strips arranged at intervals in parallel.
The step of removing all the second insulating strips and the first insulating part in each first insulating strip comprises: removing all the photoresist on each second insulating strip, all the photoresist on each first insulating part and part of the photoresist on each first connecting part; removing all the second insulating strips and all the first insulating parts; and removing the rest part of the photoresist on each first connecting part.
When the insulating layer is made of an organic material, the step of patterning the insulating layer to form a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals comprises: the insulating layer is exposed through a mask plate, patterns of the mask plate are transferred to the insulating layer in a patterned mode, and a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals are formed on the insulating layer.
Wherein, after the step of removing all of the second insulating strips and the first insulating portion in each of the first insulating strips, the manufacturing method includes: and forming a plurality of conductive bridges through a patterning process, wherein every two second electrodes are connected through one conductive bridge, one conductive bridge corresponds to one first connecting part, and the first connecting part is positioned between the conductive bridge and the second connecting part so as to electrically isolate the conductive bridge from the second connecting part.
In the step of removing a part of the material of the conductive film to form a plurality of first electrodes and a plurality of second electrodes, in a corresponding one of the second electrodes and one of the second insulating portions, a boundary of the second electrode close to the first connecting portion is recessed from a boundary of the second insulating portion close to the first connecting portion; in the step of forming a conductive bridge between every two second electrodes through a patterning process, two opposite ends of each conductive bridge form isolation parts respectively, one isolation part covers the side face, close to the second connecting part, of one second electrode, and each isolation part and the second connecting part are arranged at intervals.
The mask plate is a half-tone mask plate.
A display screen comprises a touch sensing layer, wherein the touch sensing layer is manufactured by the manufacturing method.
The touch sensing layer is integrated in the display screen by adopting an On-Cell structure.
A display includes the display screen.
According to the scheme of the invention, a patterned insulating layer (namely a first insulating part, a first connecting part and a second insulating part) can be formed by using a mask plate through a photoetching process; electrodes (i.e., the first electrode, the second connection portion, the second electrode) may be formed through a patterning process; after the first insulating portion and the second insulating portion are removed, a final pattern of the insulator and the electrode (i.e., the first electrode, the second connecting portion, the second electrode, and the first connecting portion) can be formed. Therefore, the insulator and the electrode pattern in the touch sensing layer can be manufactured by only one mask plate and one exposure process. Compared with the prior art, the process can be simplified, the capacity of the exposure machine is released, and the process cost is further reduced.
Drawings
To more clearly illustrate the structural features and effects of the present invention, a detailed description is given below with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic cross-sectional view of a unit in a touch sensing layer according to an embodiment of the invention;
FIG. 2 is a schematic plan view of the structure corresponding to the schematic cross-sectional structure shown in FIG. 1;
FIG. 3 is a schematic cross-sectional view of a conductive film and an insulating layer formed on a substrate;
FIG. 4 is a schematic cross-sectional structure diagram of patterning the insulating layer of FIG. 3 to form a plurality of first insulating strips disposed in parallel spaced apart relation and a plurality of second insulating strips disposed in parallel spaced apart relation when the insulating layer is an organic material;
FIG. 5 is a schematic plan view corresponding to the schematic cross-sectional view of FIG. 3;
FIGS. 6 and 7 are schematic cross-sectional views illustrating the insulating layer of FIG. 3 patterned to form a plurality of first insulating strips spaced apart in parallel and a plurality of second insulating strips spaced apart in parallel when the insulating layer is a non-metallic material;
FIG. 8 is a cross-sectional structure diagram of a portion of the conductive film of FIG. 7 removed to form a plurality of first electrodes and a plurality of second electrodes;
FIG. 9 is a schematic plan view corresponding to the schematic cross-sectional view of FIG. 8;
FIG. 10 is a schematic cross-sectional view of the first connection portion and the photoresist thereon after material removal;
FIG. 11 is a schematic plan view corresponding to the schematic cross-sectional view of FIG. 10;
fig. 12 is a schematic cross-sectional view of the photoresist on the first insulating strips and the second insulating strips of fig. 8, and a portion of the photoresist on the first connecting portion;
fig. 13 is a schematic cross-sectional view of the photoresist, the first insulating strips, and the second insulating strips of fig. 12 after removing the remaining portions of the photoresist on the first connecting portions;
fig. 14 is a schematic cross-sectional structure of a bridge formed by the method.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
The embodiment of the invention provides a manufacturing method of a touch sensing layer, which is used for manufacturing the touch sensing layer. The touch sensing layer may be formed of a plurality of film layers, and the touch sensing layer formed of the plurality of film layers may include a plurality of transmitting electrodes Tx and a plurality of receiving electrodes Rx arranged regularly. For example, the touch sensing layer may include a plurality of first electrode stripes arranged in parallel at intervals and a plurality of second electrode stripes arranged in parallel at intervals, and the first electrode stripes and the second electrode stripes are criss-cross. The first electrode strips comprise a plurality of first electrodes (Rx for example) arranged at intervals, the second electrode strips comprise a plurality of second electrodes (Tx for example) arranged at intervals, every two first electrodes are connected through a second connecting portion, and two opposite sides of each second connecting portion are respectively provided with one second electrode which is arranged at intervals with the second connecting portion.
For convenience of description, fig. 1 and 2 only schematically cut out one unit 10 of the touch sensing layer. In which fig. 2 is a schematic plan view of the unit 10 (without showing the substrate 11 and the encapsulation layer 13), and fig. 1 is a schematic cross-sectional view of the unit 10 taken along the extension of the bridge 15. The cell 10 includes a substrate 11, on which two first electrodes 123, two second electrodes 121, a first connection portion 141, a second connection portion 122, a conductive bridge 15, and an encapsulation layer 13 are formed over the substrate 11.
Specifically, the two first electrodes 123 belong to one first electrode strip, the two second electrodes 121 belong to one second electrode strip, and the first electrode strips and the second electrode strips are arranged in a criss-cross manner. Two first electrodes 123 and two second electrodes 121 are formed on the substrate 11, and the two first electrodes 123 are connected and conducted through the second connection portion 122 to separate the two second electrodes 121. The two second electrodes 121 are distributed on two sides of the second connection portion 122, and are opposite to the second connection portion 122 at intervals. The two second electrodes 121 are connected and conducted through the conductive bridge 15.
The first connection portion 141 is formed between the second connection portion 122 and the conductive bridge 15 to electrically isolate the second connection portion 122 from the conductive bridge 15, so as to prevent the two second electrodes 121 and the two first electrodes 123 from being short-circuited due to conduction.
The packaging layer 13 packages all the electrode patterns on the touch sensing layer, that is, the packaging layer 13 covers all the first electrodes, all the second connection portions, all the conductive bridges, all the second electrodes, and all the first connection portions on the touch sensing layer. Specifically, in the cell 10, the encapsulation layer 13 covers the two first electrodes 123 and the two second electrodes 121, and further covers the conductive bridge 15, the first connection portion 141, and the second connection portion 122.
The method for manufacturing the touch sensing layer according to the embodiment of the invention will be described in detail below. The manufacturing method comprises the following steps:
1. forming a conductive film over a substrate;
2. forming an insulating layer covering the conductive film over the conductive film;
3. patterning the insulating layer to form a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals, wherein the first insulating strips and the second insulating strips are crossed in a longitudinal direction and a transverse direction, the first insulating strips comprise a plurality of first insulating parts arranged at intervals, the second insulating strips comprise a plurality of second insulating parts arranged at intervals, every two first insulating parts are connected through a first connecting part, and two opposite sides of each first connecting part are respectively provided with one second insulating part arranged at intervals with the first connecting part;
4. removing a part of the material of the conductive film to form a plurality of first electrodes and a plurality of second electrodes, wherein every two first electrodes are connected through a second connecting portion, one first electrode corresponds to one first insulating portion, one second connecting portion corresponds to one first connecting portion, and one second electrode corresponds to one second insulating portion;
5. and removing all the second insulating strips and the first insulating parts in each first insulating strip.
Specifically, as shown in fig. 3, in step 1 and step 2, a conductive film 12 and an insulating layer 14 are formed on a substrate 11 in this order. The substrate 11 may be a rigid carrier such as glass, or a flexible carrier such as PI (polyethylenimine) film or the like. The conductive film 12 includes, but is not limited to, an ITO thin film (indium tin oxide semiconductor transparent conductive film). The insulating layer 14 may be made of a non-metallic material or an organic material. The conductive film 12 and the insulating layer 14 may be formed by physical or chemical deposition.
In step 3, a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals are formed by patterning the insulating layer 14 to remove a part of the material of the insulating layer 14, wherein the first insulating strips and the second insulating strips are crossed in a longitudinal and transverse direction. For convenience of description, fig. 4 and 5 cut out only a portion of one of the first insulating strips and a portion of one of the second insulating strips. As shown in fig. 4 and 5, the first insulating strip includes two first insulating portions 143 arranged at intervals, and the two first insulating portions 143 are connected by a first connection portion 141. The second insulating strip includes two second insulating portions 142 arranged at intervals, and the two second insulating portions 142 are respectively distributed at two opposite sides of the first connecting portion 141 and are both spaced apart from the first connecting portion 141.
Specifically, in the first embodiment of this embodiment, the insulating layer 14 may be an organic material layer. At this time, step 3 may include:
the insulating layer 14 is exposed through a mask plate, patterns of the mask plate are transferred onto the insulating layer 14 to pattern the insulating layer 14, and a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals are formed. In this embodiment, as shown in fig. 4 and 5, since the organic material layer has a characteristic similar to that of a photoresist, and can be dissolved in a developing solution and removed after exposure, the pattern of the mask can be directly transferred to the insulating layer 14 by a photolithography process at a time. The patterning process is simple, and the process cost is saved. The Mask in the first embodiment may be a conventional Mask (having only a completely transmissive region and a completely opaque region), or may be a Halftone Mask (Halftone Mask). The half-tone mask plate comprises a complete light transmission area, a complete light transmission area and a partial light transmission area, and the light quantity passing through different light transmission areas is different, so that the exposure quantity of corresponding positions on the photoresist is also different.
In a second embodiment of the present embodiment, the difference between the first embodiment and the second embodiment is that in the second embodiment, the insulating layer 14 may be a non-metallic material layer. At this time, as shown in fig. 6 and 7, step 3 may include:
31. a photoresist is coated on the insulating layer 14. In fig. 6 and 7, the black color blocks on the insulating layer 14 represent the applied photoresist. Wherein the dashed boxes in fig. 6 indicate the location of the photoresist when coating is complete.
32. And exposing and developing through a mask plate to transfer the pattern of the mask plate onto the photoresist. As shown in FIG. 6, the pattern on the photoresist layer after pattern transfer includes regions A-E. A. Less photoresist remains in the E region, the photoresist is completely removed in the B, D region, and the photoresist remains in the C region. In this embodiment, a Halftone Mask (Halftone Mask) may be used for pattern transfer. The halftone mask has several regions with different light transmittance, and the light quantity passing through different regions is different, so that the exposure at the corresponding positions on the photoresist is also different, thereby forming different patterns of regions a to E as shown in fig. 6.
33. The insulating layer 14 is etched, and the pattern on the photoresist is transferred onto the insulating layer 14 to pattern the insulating layer 14, thereby forming a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals. As shown in fig. 7 and 5, the B, D region of the insulating layer 14 may be etched to remove all the material in the thickness direction of the insulating layer 14, thereby finally forming the first connection portion 141, the two second insulating portions 142, and the two first insulating portions 143. In this embodiment, the insulating layer 14 may be etched using a dry etching process. The dry etching process has high etching rate, can be suitable for the design of the non-metal material of the insulating layer 14, and has mature and reliable process and high production yield.
Specifically, in step 4, a portion of the material of the conductive film 12 may be removed by a wet etching process. The pattern of the conductive film 12 formed in step 4 corresponds to the pattern of the insulating layer 14 formed in step 3, that is, the pattern formed on the conductive film 12 in step 4 includes a plurality of first electrode stripes arranged in parallel at intervals and a plurality of second electrode stripes arranged in parallel at intervals, and the first electrode stripes and the second electrode stripes are crossed in length and breadth. The first electrode strips comprise a plurality of first electrodes (Rx for example) arranged at intervals, the second electrode strips comprise a plurality of second electrodes (Tx for example) arranged at intervals, every two first electrodes are connected through a second connecting portion, and two opposite sides of each second connecting portion are respectively provided with one second electrode which is arranged at intervals with the second connecting portion. For convenience of description, only a portion of one of the first electrode bars and a portion of one of the second electrode bars are cut out in fig. 8 and 9. As shown in fig. 8 and 9, the first electrode bar includes two first electrodes 123 arranged at intervals, and the two first electrodes 123 are connected by the second connection part 122. The second electrode bar includes two second electrodes 121 arranged at intervals, and the two second electrodes 121 are respectively distributed on two opposite sides of the second connection portion 122 and are both spaced from the second connection portion 122. The second electrode 121 is shown in dashed lines in fig. 9, indicating that the second electrode 121 is recessed within the edges of the second insulating portion 142; the second connection portion 122 coincides with the first connection portion 141, which is merely an illustration. In fact, the second connection portion 122 only serves to connect the two first electrodes 123, the first connection portion 141 only serves to connect the two first insulation portions 143, and the size of the second connection portion 122 and the size of the first connection portion 141 can be set according to actual requirements. The first electrode 123 coincides with the first insulating portion 143, which is also merely illustrative. In fact, the first insulating portion 143 will be removed in the subsequent steps, and therefore the sizes of the first electrode 123 and the first insulating portion 143 can be set according to actual requirements.
When the insulating layer 14 is made of a non-metal material, since the photoresist is used in step 3, after step 4, as shown in fig. 8, the photoresist still remains on the first insulating portion 142 and the first connecting portion 141; when the insulating layer 14 is made of an organic material, no photoresist is used in step 3, so that there is no photoresist on the first insulating portion 142 and the first connecting portion 141 after step 4. I.e., the insulating layer 14 is an organic material, the cross-sectional view of the pattern formed in step 4 can be obtained by removing the photoresist layer in fig. 8.
Specifically, as shown in fig. 10 and 11, in step 5, after all the second insulating strips and the first insulating portions 143 in each first insulating strip are removed, only the first electrodes 123, the second connecting portions 122, the second electrodes 121, and the first connecting portions 141 remain. For convenience of description, fig. 10 and 11 only cut a part of the pattern formed in step 5.
When the insulating layer 14 is made of a non-metal material, as shown in fig. 10, after step 4, the first insulating portion 143, the first connecting portion 141, and the second insulating portion 142 still have a photoresist thereon, and the photoresist can be removed in step 5 (described below); when the insulating layer 14 is made of an organic material, after step 4, the first insulating portion 143, the first connecting portion 141, and the second insulating portion 142 have no photoresist, and all the second insulating strips and all the first insulating strips may be directly removed in step 5.
In addition, as shown in fig. 11, the first connection portion 141 is spaced apart from the second electrode 121 in a lateral direction of the viewing angle shown in fig. 11, in order to form a conductive bridge (to be described later) between the first connection portion 141 and the second electrode 121 in a subsequent step. The first connection portion 141 is spaced apart from the first electrode 123 in the longitudinal direction of the view angle shown in fig. 11, which is merely illustrative. Since the first connection portion 141 only serves to electrically isolate the two second electrodes 121, and the two first electrodes 123 can be conducted through the second connection portion 122, the first connection portion 141 does not need to be connected to the second connection portion 122. That is, the second connection portion 122 may be connected to or spaced apart from the first electrode 123 as long as it is spaced apart from the second electrode 121.
As described above, in step 3, the patterned insulating layer 14 (i.e., the first insulating portion 143, the first connecting portion 141, and the second insulating portion 142) can be formed by a photolithography process using a mask; in step 4, the patterned electrodes (i.e., the first electrode 123, the second connection portion 123, and the second electrode 121) can be formed by using an etching process; after the first insulating portion 143 and the second insulating portion 142 are removed in step 5, a final insulator-electrode pattern (i.e., the first electrode 123, the second connection portion 123, the second electrode 121, the first connection portion 141) can be formed. Therefore, the manufacturing method of the embodiment can manufacture the insulator and the electrode pattern in the touch sensing layer by only one mask and one exposure process. Therefore, compared with the scheme in the prior art, the manufacturing method can simplify the process, release the capacity of the exposure machine and further reduce the process cost.
Further, when the insulating layer 14 is made of a non-metal material, referring to fig. 12, 10, and 13 in sequence, step 5 includes:
51. removing all the photoresist on each second insulating strip and each first insulating portion 143 and a part of the photoresist on each first connecting portion 141;
52. removing all the second insulating strips and all the first insulating portions 143;
53. the remaining portion of the photoresist on each first connection portion 141 is removed.
Specifically, in sub-step 51, the photoresist may be removed by ashing and/or dry etching processes to obtain the pattern shown in fig. 12. The ashing process has low etching rate and gentle etching, and is suitable for removing photoresist. Of course, a dry etch process may be used to remove the photoresist.
In sub-step 52, all of the second insulating strips (i.e., all of the second insulating portions 142) and all of the first insulating portions 143 may be removed by a dry etching process, resulting in a pattern as shown in fig. 10. The dry etching process has high etching rate and is suitable for removing non-metallic materials. Other well-established processes may of course be used for the removal.
In step 53, the remaining portion of the photoresist on each first connection portion 141 may be removed by a lift-off photoresist process, resulting in a pattern as shown in fig. 13.
Further, after step 5, the manufacturing method of the present embodiment may further include:
6. and forming a plurality of conductive bridges through a patterning process, wherein every two second electrodes are connected through one conductive bridge, one conductive bridge corresponds to one first connecting part, and the first connecting part is positioned between the conductive bridge and the second connecting part so as to electrically isolate the conductive bridge from the second connecting part.
Specifically, referring to fig. 14 and fig. 2 in sequence, in step 6, a plurality of conductive bridges 15 may be formed by depositing a conductive material layer, coating a photoresist, exposing a mask, developing, etching (the dotted frame in fig. 14 represents the portion of the conductive material layer that is etched away), stripping the photoresist, and the like. Every two second electrodes 121 are connected to each other by a conductive bridge 15. One conductive bridge 15 corresponds to one first connection portion 141, and the first connection portion 141 is located between the conductive bridge 15 and the second connection portion 122 to electrically isolate the conductive bridge 15 from the second connection portion 122. The conductive bridge 15 is used to connect the two second electrodes 121, so as to ensure the transmission of electrode signals.
Further, as shown in fig. 8, 9, and 12, after step 4, in the corresponding one of the second electrodes 121 and the one of the second insulating portions 142, the boundary of the second electrode 121 close to the first connection portion 122 is recessed from the boundary of the second insulating portion 142 close to the first connection portion 122. That is, in step 4, the excess conductive film material may be removed so that the boundary on the side of the second electrode 121 is formed within the boundary of the second insulating portion 142. This is to facilitate the subsequent formation of correspondingly configured conducting bridges 15. Accordingly, as shown in fig. 14, the conductive bridge 15 formed in step 6 has two opposite ends respectively forming a separating portion 151, and one separating portion 151 covers one side 121a of the second electrode 121 close to the second connecting portion 122 and is spaced apart from the second connecting portion 122. The isolation portion 151 is used to isolate the second electrode 121 from the second connection portion 122, so as to prevent the second electrode 121 and the first electrode 123 from being electrically connected and short-circuited.
In other embodiments, on the premise that the second electrode 121 and the first electrode 123 are not in conduction, the boundary of the second electrode 121 side formed in step 4 may be located on the boundary of the second insulating portion 142 or outside the boundary of the second insulating portion 142; the conductive bridge 15 formed in step 6 may be free of the separator 151, i.e., the conductive bridge 15 is entirely located on the second electrode 121 and does not extend toward the side 121a of the second electrode 121.
In this embodiment, after step 6, the manufacturing method may further include:
7. forming an encapsulation layer by a patterning process, the encapsulation layer covering all of the first electrodes, all of the second connection portions, all of the conductive bridges, all of the second electrodes, and all of the first connection portions.
Specifically, as shown in fig. 1, the encapsulation layer 13 encapsulates the entire pattern to protect the pattern. The encapsulation layer 13 covers all of the first electrodes 123 and all of the second electrodes 121, and thus covers all of the second connection portions 122, all of the conductive bridges 15, and all of the first connection portions 141. In step 7, the encapsulation layer 13 may be formed by a patterning process.
An embodiment of the present invention further provides a display screen (not shown) having a touch sensing layer, where the touch sensing layer is manufactured by the manufacturing method described above. The display screen of the embodiment has low process cost.
Further, the touch sensing layer may be integrated in the display screen using an On-Cell structure. Namely, if the display screen is a liquid crystal display screen, the touch sensing layer is attached between the color green sheet and the polaroid; if the display screen is an OLED display screen, the touch sensing layer is attached to the OLED display panel. By adopting the On-Cell structure, the display screen can be thinned, the light transmittance is improved, and the sensitivity is greatly improved. Of course, the touch sensing layer may also be an independent touch sensing panel, and is attached to the display panel to form the display screen.
An embodiment of the present invention further provides a display (not shown), which includes the display screen described above. The display of the embodiment has low process cost.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. A method for manufacturing a touch sensing layer is characterized by comprising the following steps:
forming a conductive film over a substrate;
forming an insulating layer covering the conductive film over the conductive film;
patterning the insulating layer to form a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals, wherein the first insulating strips and the second insulating strips are crossed in a longitudinal direction and a transverse direction, the first insulating strips comprise a plurality of first insulating parts arranged at intervals, the second insulating strips comprise a plurality of second insulating parts arranged at intervals, every two first insulating parts are connected through a first connecting part, and two opposite sides of each first connecting part are respectively provided with one second insulating part arranged at intervals with the first connecting part;
removing a part of the conductive film by an etching process to form a plurality of first electrodes and a plurality of second electrodes, wherein the first electrodes are not connected to the second electrodes, every two first electrodes are connected by a second connection portion, one first electrode corresponds to one first insulation portion, one second connection portion corresponds to one first connection portion, one second electrode corresponds to one second insulation portion, and in the corresponding one second electrode and one second insulation portion, the boundary of the second electrode close to the first connection portion is located at or exceeds the boundary of the second insulation portion close to the first connection portion;
removing all the second insulating strips and the first insulating part in each first insulating strip;
forming a plurality of conducting bridges through a patterning process, wherein every two second electrodes are connected through one conducting bridge, each two opposite ends of each conducting bridge form an isolating part respectively, one isolating part coats one second electrode close to the side face of each second connecting part, each isolating part is arranged at intervals with the second connecting parts, each isolating part is used for electrically isolating the second electrodes from the second connecting parts, one conducting bridge corresponds to one first connecting part, and the first connecting part is positioned between the conducting bridges and the second connecting parts so as to electrically isolate the conducting bridges from the second connecting parts.
2. The manufacturing method according to claim 1,
when the insulating layer is a non-metal material, the step of patterning the insulating layer to form a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals comprises:
coating photoresist on the insulating layer;
exposing and developing through a mask plate to transfer the pattern of the mask plate onto the photoresist;
and etching the insulating layer, and transferring the pattern on the photoresist to the insulating layer to pattern the insulating layer to form a plurality of first insulating strips arranged at intervals in parallel and a plurality of second insulating strips arranged at intervals in parallel.
3. The manufacturing method according to claim 2,
the step of removing all of the second insulating strips and the first insulating portion of each of the first insulating strips includes:
removing all the photoresist on each second insulating strip, all the photoresist on each first insulating part and part of the photoresist on each first connecting part;
removing all the second insulating strips and all the first insulating parts;
and removing the rest part of the photoresist on each first connecting part.
4. The manufacturing method according to claim 1,
when the insulating layer is an organic material, the step of patterning the insulating layer to form a plurality of first insulating stripes arranged in parallel at intervals and a plurality of second insulating stripes arranged in parallel at intervals includes:
the insulating layer is exposed through a mask plate, patterns of the mask plate are transferred to the insulating layer in a patterned mode, and a plurality of first insulating strips arranged in parallel at intervals and a plurality of second insulating strips arranged in parallel at intervals are formed on the insulating layer.
5. The manufacturing method according to any one of claims 2 to 4,
the mask plate is a halftone mask plate.
6. A display screen comprises a touch sensing layer, which is characterized in that,
the touch sensing layer is manufactured by the manufacturing method of any one of claims 1 to 5.
7. The display screen of claim 6,
the touch sensing layer is integrated in the display screen by adopting an On-Cell structure.
8. A display device is characterized in that a display panel is provided,
comprising a display screen as claimed in claim 6 or 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711178039.2A CN107994057B (en) | 2017-11-20 | 2017-11-20 | Manufacturing method of touch sensing layer, display screen and display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711178039.2A CN107994057B (en) | 2017-11-20 | 2017-11-20 | Manufacturing method of touch sensing layer, display screen and display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107994057A CN107994057A (en) | 2018-05-04 |
| CN107994057B true CN107994057B (en) | 2021-09-28 |
Family
ID=62032719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711178039.2A Active CN107994057B (en) | 2017-11-20 | 2017-11-20 | Manufacturing method of touch sensing layer, display screen and display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107994057B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112001316B (en) * | 2020-08-25 | 2024-07-12 | 京东方科技集团股份有限公司 | Ultrasonic fingerprint identification module, manufacturing method thereof and display device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7936338B2 (en) * | 2002-10-01 | 2011-05-03 | Sony Corporation | Display unit and its manufacturing method |
| KR101049006B1 (en) * | 2010-02-22 | 2011-07-12 | 삼성모바일디스플레이주식회사 | Touch screen panel and fabricating method thereof |
| JP2012043583A (en) * | 2010-08-17 | 2012-03-01 | Sony Corp | Display device and method of manufacturing the same |
| TWI470677B (en) * | 2011-02-25 | 2015-01-21 | Hannstar Display Corp | Method for fabricating touch panel |
| KR102017155B1 (en) * | 2012-11-01 | 2019-09-03 | 삼성디스플레이 주식회사 | Touch screen panel and method for manufacturing the same |
| JP2017162032A (en) * | 2016-03-07 | 2017-09-14 | 株式会社ジャパンディスプレイ | Display device |
| CN107180852B (en) * | 2017-05-18 | 2019-11-15 | 上海天马有机发光显示技术有限公司 | A kind of touch-control display panel and display device |
-
2017
- 2017-11-20 CN CN201711178039.2A patent/CN107994057B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107994057A (en) | 2018-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105161505B (en) | A kind of array substrate and preparation method thereof, display panel | |
| CN105242467B (en) | Display device and its manufacturing method | |
| JP5777153B2 (en) | Method for manufacturing array substrate motherboard | |
| CN101609832B (en) | Display device and manufacturing method thereof, and semiconductor device and manufacturing method thereof | |
| CN106909258B (en) | Structure of touch screen functional sheet lead wire and manufacturing method thereof | |
| US9735183B2 (en) | TFT flat sensor and manufacturing method therefor | |
| CN103235659B (en) | A kind of touch panel and preparation method thereof, display device | |
| EP3242157B1 (en) | Colour film substrate, preparation method therefor and display device | |
| WO2014127587A1 (en) | Array substrate and manufacturing method therefor, and display device | |
| CN104900589B (en) | Array base palte and preparation method thereof, display device | |
| US20170060303A1 (en) | Method for manufacturing touch panel, touch panel and touch display device | |
| CN109461403B (en) | Display device, preparation method thereof and display device | |
| WO2014146358A1 (en) | Array substrate, method for manufacturing array substrate, and display device | |
| WO2014015631A1 (en) | Array panel, manufacture method thereof and display device | |
| KR101854197B1 (en) | Array substrate and method of manufacturing the same | |
| CN107579040A (en) | A kind of mask plate, array base palte and preparation method thereof | |
| KR20140003401A (en) | Tft array substrate, manufacturing method of the same and display device | |
| CN107994057B (en) | Manufacturing method of touch sensing layer, display screen and display | |
| US20130146333A1 (en) | Touch panel, method for forming the same, and display system | |
| WO2015090008A1 (en) | Array substrate and manufacturing method therefor, and display device | |
| CN108376749B (en) | Display panel packaging method, display panel and display device | |
| KR101611711B1 (en) | Pin diode manufacturing method and x-ray detector manufacturing method using the same | |
| CN104216562B (en) | Contact panel and its manufacture method and display device | |
| KR20150064856A (en) | Display substrate and method of manufacturing the same | |
| EP3495137B1 (en) | Touch control substrate and method for manufacturing same, and touch control device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |