CN107988587B - Gas flow dividing and converging device - Google Patents
Gas flow dividing and converging device Download PDFInfo
- Publication number
- CN107988587B CN107988587B CN201711121821.0A CN201711121821A CN107988587B CN 107988587 B CN107988587 B CN 107988587B CN 201711121821 A CN201711121821 A CN 201711121821A CN 107988587 B CN107988587 B CN 107988587B
- Authority
- CN
- China
- Prior art keywords
- valve
- air inlet
- air outlet
- communicated
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Abstract
The invention relates to the technical field of semiconductor film deposition equipment, in particular to a gas flow dividing and converging device capable of introducing multiple process gases. And a plurality of independent air inlet and outlet pipelines are arranged in the flow merging valve, the flow dividing valve and the cleaning valve. The invention has the advantages. The device integrates the flow divider, the flow merging valve and the cleaning valve, realizes the flow division of process gas, replaces the VCR with direct welding between the valves to obtain the shortest connecting distance, reduces the shortest gas dead time and the retention space in the valve body, and is provided with the heating substrate on the device, thereby effectively preventing the liquid source gas from condensing in the valve body and the pipeline.
Description
Technical Field
The invention relates to the technical field of semiconductor thin film deposition equipment, in particular to a gas flow dividing and converging device capable of introducing various process gases.
Background
In the process of a semiconductor coating process, various special gases introduced into a cavity are subjected to flow dividing, flow converging, flow mixing and flow discharging processes, and in order to avoid Particle generation caused by the fact that various gases react in a valve body in a meeting mode in different process stages, the valve body is required to be subjected to multiple times of blowing and air exhaust cleaning processes. The existing single V-block valve is relatively simple in function, the gas circuit inside the valve body is complex, dead angles are easily formed inside the valve body when the valve body is swept and exhausted, gas is enabled to remain inside the valve body, and therefore the novel gas distributing and converging device needs to be designed to meet the use requirements.
Disclosure of Invention
The invention provides a gas flow dividing and converging device which is applied to semiconductor coating deposition equipment and comprises a flow converging valve, a flow dividing valve and a cleaning valve, wherein the flow converging valve is provided with a plurality of gas inlets and a gas outlet, one gas inlet is connected with the cleaning valve, and the other gas inlets are respectively and correspondingly connected with the flow dividing valve.
Furthermore, a plurality of independent air inlet and outlet pipelines are arranged in the flow merging valve, the flow dividing valve and the cleaning valve.
Furthermore, the flow merging valve is provided with three air inlets and an air outlet, two shunt valves and a cleaning valve are correspondingly arranged at the same time, one of the three air inlets is connected with one cleaning valve, and the other two air inlets are respectively connected with one shunt valve.
Furthermore, the flow combination valve is provided with an air inlet A, an air inlet B, an air inlet C and an air outlet A, two identical diaphragm valves are arranged inside the flow combination valve, the first diaphragm valve comprises a groove A, an air inlet pipe B and an air outlet pipe A, one ends of the air inlet pipe A and the air inlet pipe B are both communicated and fixed at the bottom of the groove A, the other end of the air inlet pipe A is connected with the air inlet A, the other end of the air inlet pipe B is connected with the air inlet B, one end of the air outlet pipe A is communicated and fixed at the bottom of the groove A, and; in addition, the second diaphragm valve has the same structure as the first diaphragm valve and also comprises a groove D, the bottom of the groove D is communicated with an air inlet pipe C, an air inlet pipe D and an air outlet pipe B, the air inlet pipe C is communicated with the air inlet C, the air inlet pipe D is communicated with the air inlet B, and the air outlet pipe B is communicated with the air outlet A;
the number of the flow divider is 2, the flow divider respectively comprises an air inlet D, an air outlet B, an air outlet C and a group of diaphragm valves, a groove B, an air inlet pipe E and an air outlet pipe C are arranged in a first diaphragm valve of the flow divider, one end of the air inlet pipe E is communicated with the groove B, the other end of the air inlet pipe E is communicated with the air inlet D, one end of the air outlet pipe C is communicated and fixed with the groove, and the other end of the air outlet pipe C is communicated with the; a groove C, an air inlet pipe F and an air outlet pipe D are also arranged in the second diaphragm valve, one end of the air inlet pipe F in the second diaphragm valve is communicated with the groove C, the other end of the air outlet pipe D is communicated with the air inlet D, one end of the air outlet pipe D is fixedly communicated with the groove C, and the other end of the air outlet pipe D is communicated with the air outlet C;
the flow divider is provided with an air outlet pipe E which is communicated and fixed with the air inlet B of the flow merging valve; the air outlet pipe E of the flow divider is communicated with the air inlet A of the flow merging valve; and an air inlet C of the flow merging valve is communicated with a fixed flow dividing valve.
Furthermore, two diaphragm valves on the confluence valve are oppositely arranged, and each diaphragm valve forms an angle of 45 degrees with the middle symmetry axis.
Further, when the air outlet pipe D of the cleaning valve is fixed with the air inlet B of the confluence valve, the air inlet pipe D of the cleaning valve is fixedly connected with the air inlet B of the confluence valve in a flange mode, a dovetail groove is formed in an air inlet at the bottom of the confluence valve body, the dovetail groove is sealed through o-ring, and the air inlet flange is connected with the confluence valve through bolt connection.
Furthermore, the air inlet pipe B, the air inlet pipe D and the air outlet pipe E are communicated and integrally designed.
Further, when the device is used, the airflow dividing and converging devices can be arranged into a plurality of groups, the groups are arranged up and down, the heating substrate is clamped in the middle and is divided into three layers, the heating plate is arranged in the middle, and the fixing plates are arranged on the upper layer and the lower layer.
Furthermore, the air outlet pipe A and the air outlet pipe B are combined into a pipeline channel at the air outlet A.
Further, the flow dividing valve and the flow merging valve are fixed by welding.
The invention has the advantages that: the device integrates the flow divider, the flow merging valve and the cleaning valve, realizes the flow division of process gas, replaces the VCR with direct welding between the valves to obtain the shortest connecting distance, reduces the shortest gas dead time and the detention space in the valve body, and is provided with the heating substrate on the device, thereby effectively preventing the gas from condensing in the valve body.
Drawings
FIG. 1 is a schematic structural view of the apparatus;
FIG. 2 is an enlarged perspective view of the confluence valve;
FIG. 3 is a schematic diagram of the present apparatus arranged in multiple groups;
FIG. 4 is a schematic view of the internal structure and gas flow direction of the diverter valve;
FIG. 5 is a schematic view of the gas flow direction as it is directed to the process gas within the flow combining valve;
FIG. 6 is a schematic view of the gas flow direction when purge gas is introduced into the flow combining valve;
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-2, the invention provides a gas splitting and converging device, which is applied to semiconductor coating deposition equipment and comprises a converging valve 1, a diverting valve 2 and a cleaning valve 3, wherein the converging valve 1 is provided with a plurality of gas inlets and a gas outlet, one gas inlet is connected with the cleaning valve 3, and the other gas inlets are respectively and correspondingly connected with the diverting valve 2.
A plurality of independent air inlet and outlet pipelines are arranged in the flow merging valve 1, the flow dividing valve 2 and the cleaning valve 3.
The device is specifically set to be 2 shunt valves and a structure of a cleaning valve 3, specifically, the flow merging valve 1 is provided with three air inlets and an air outlet, namely two shunt valves 2 and a cleaning valve 3 are correspondingly arranged, one air inlet is connected with one cleaning valve 3, and the other two air inlets are respectively connected with one shunt valve 2. Specifically, the flow-combining valve 1 is provided with an air inlet A4, an air inlet B5, an air inlet C6 and an air outlet A7, two identical diaphragm valves are arranged inside the flow-combining valve 1, the first diaphragm valve 8 comprises a groove A9, an air inlet pipe A10, an air inlet pipe B11 and an air outlet pipe A12, the air inlet pipe A10 and the air inlet pipe B11 are communicated and fixed at one end of the groove A9, the other end of the air inlet pipe A10 is connected with an air inlet A4, the other end of the air inlet pipe B11 is connected with an air inlet B5, one end of the air outlet pipe A12 is communicated and fixed at the bottom of the groove A9, and the other end of the air outlet pipe A7.
The number of the flow dividing valves is 2, the flow dividing valves respectively comprise an air inlet D16, an air outlet B17, an air outlet C18 and a group of diaphragm valves, a groove B, an air inlet pipe E19 and an air outlet pipe C20 are arranged in a first diaphragm valve of the flow dividing valve 2, one end of the air inlet pipe E19 is communicated with the inside of the groove B, the other end of the air inlet pipe E19 is communicated with an air inlet D16, one end of the air outlet pipe C20 is fixedly communicated with the inside of the groove B, and the other end; a groove C, an air inlet pipe F21 and an air outlet pipe D22 are also arranged in the second diaphragm valve, one end of the air inlet pipe F21 in the second diaphragm valve is communicated with the groove C, the other end of the air inlet pipe F21 is communicated with the air inlet D16, one end of the air outlet pipe D22 is communicated and fixed with the groove C, and the other end of the air outlet pipe D22 is communicated with the air outlet C18. Meanwhile, a flow dividing valve which is the same as the flow dividing valve is connected to the air inlet C6 of the flow merging valve 1, and the two flow dividing valves are the same in structure and connection relation.
One end of the cleaning valve 3 is provided with an air inlet pipe G24, the other end of the cleaning valve is provided with an air outlet pipe E23, and the air outlet pipe E23 is fixedly communicated with an air inlet B5 of the confluence valve 1; the air outlet C18 of the flow divider 2 is communicated with the air inlet A4 of the flow merging valve 1; and an air inlet C6 of the flow-merging valve 1 is communicated with and fixed with a flow-dividing valve 2. In the present apparatus, the intake pipe E19 and the intake pipe F21 of the diverter valve 2 are connected to the intake port D16 after the intake ports merge into one main pipe. The air outlet pipe A12 and the air outlet pipe B15 are also connected with the air outlet A7 after being combined into a main pipeline channel in the flow combining valve.
As the improvement of the scheme, two diaphragm valves on the flow merging valve 1 and the flow dividing valve 2 in the device are symmetrically arranged relatively, and each diaphragm valve and a middle symmetric axis form an angle of 45 degrees, so that the manufacturing process of the whole device is simple, the trend of gas is facilitated, and the retention time of the gas in a pipeline is reduced.
As an improvement of the scheme, when the air outlet pipe E23 of the cleaning valve 3 is fixed with the air inlet B5 of the merging valve, the air outlet pipe E23 of the cleaning valve is connected and fixed at the air inlet B5 of the merging valve in a flange mode, a dovetail groove is formed in the air inlet at the bottom of the merging valve 1, o-ring sealing is used, and the air inlet flange is connected with the merging valve 1 through bolt connection.
As an improvement of the scheme, the air inlet pipe B11, the air inlet pipe D14 and the air outlet pipe E23 are communicated and integrally designed.
Referring to fig. 3, as an improvement of the scheme, the gas flow dividing and merging device can be arranged into multiple groups during use, the whole device can be connected in multiple groups and can also be used in a superposition mode, the gas flow dividing and merging device is assembled on the same heating substrate 25, the heating substrate 25 heats the upper device and the lower device simultaneously, the heating substrate is divided into three layers, the heating plate is arranged in the middle, the upper layer and the lower layer are fixing plates, the heating substrate 25 can heat the upper and the lower dividing and merging devices, and condensation and deposition of process gas in the pipeline are prevented. In practice, two groups of devices above and below the heating substrate do not need to be heated simultaneously at any time, and a heat insulation plate can be added between the side, which is not heated, of the upper part or the lower part of the heating substrate and the device according to needs.
As a modification, the outlet pipe A12 and the outlet pipe B15 are combined into a pipeline channel at the position of the outlet A7.
As an improvement of the scheme, the flow dividing valve 2 and the flow merging valve 1 are fixed by welding, and a short connecting pipe can be additionally arranged between two valves needing to be welded for welding.
Referring to fig. 5, for the flow combining valve 1, the process gas enters the gas inlet pipe a10 along the gas inlet a4, enters the groove a9 of the first diaphragm valve, flows out along the gas outlet pipe a12 and is discharged through the gas outlet a 7; the other process gas enters the gas inlet pipe C13 along the gas inlet C6, enters the groove of the second diaphragm valve, flows out along the gas outlet pipe B15 and is discharged through the gas outlet A7; the two diaphragm valves can control two gases to flow in and out simultaneously or singly by adjusting pressure, so that the two gases are divided or merged.
Referring to fig. 6, after the process gas is completely introduced, the cleaning gas enters from the cleaning valve 3, enters the gas inlet B5 through the gas outlet pipe E23 of the cleaning valve 3, and then enters the first diaphragm valve and the second diaphragm valve of the merging valve through the gas inlet pipe B11 and the gas inlet pipe D14, respectively, the cleaning gas in the first diaphragm valve tank is discharged through the gas outlet pipe a12 and then through the gas outlet a7, the cleaning gas in the second diaphragm valve tank is discharged through the gas outlet pipe B15 and then through the gas outlet a7, and the retained gas in the two diaphragm valves, the gas outlet pipe a12 and the gas outlet pipe B15 is blown out.
Referring to fig. 4, for two diverter valves, the two diverter valves have the same structure and function, the process gas enters the diverter valve 2 from the gas inlet D16 of one of the diverter valves 2, and is divided into two paths inside the valve body to respectively lead to two diaphragm valves, i.e., the process gas respectively passes through the gas inlet pipe E19 and the gas inlet pipe F21 to respectively lead into the grooves of the two diaphragm valves of the diverter valve, and finally flows out from respective gas outlet channels (the gas outlet B17 and the gas outlet C18). Wherein the process gas is discharged from a gas outlet C18 and enters the flow merging valve 1 to realize the introduction of the process gas. Wherein, the two diaphragm valves of the flow divider can control the process gas to flow in and out simultaneously or singly by adjusting the pressure, thereby realizing the flow division of the process gas.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A gas flow dividing and converging device is characterized in that: the device comprises a flow combination valve, a flow divider valve and a cleaning valve, wherein a plurality of air inlets and an air outlet are arranged on the flow combination valve, one air inlet is connected with the cleaning valve, and the other air inlets are respectively and correspondingly connected with the flow divider valve; a plurality of independent air inlet and outlet pipelines are arranged in the flow merging valve, the flow dividing valve and the cleaning valve; the flow-merging valve is provided with three air inlets and an air outlet, and two flow-dividing valves and a cleaning valve are correspondingly arranged at the same time; the first diaphragm valve comprises a groove A, an air inlet pipe B and an air outlet pipe A, one ends of the air inlet pipe A and the air inlet pipe B are both communicated and fixed at the bottom of the groove A, the other end of the air inlet pipe A is connected with the air inlet A, the other end of the air inlet pipe B is connected with the air inlet B, one end of the air outlet pipe A is communicated and fixed at the bottom of the groove A, and the other end of the air outlet pipe A is connected with the air outlet A; in addition, the second diaphragm valve has the same structure as the first diaphragm valve and also comprises a groove D, the bottom of the groove D is communicated with an air inlet pipe C, an air inlet pipe D and an air outlet pipe B, the air inlet pipe C is communicated with the air inlet C, the air inlet pipe D is communicated with the air inlet B, and the air outlet pipe B is communicated with the air outlet A;
the number of the flow divider is 2, the flow divider respectively comprises an air inlet D, an air outlet B, an air outlet C and a group of diaphragm valves, a groove B, an air inlet pipe E and an air outlet pipe C are arranged in a first diaphragm valve of the flow divider, one end of the air inlet pipe E is communicated with the groove B, the other end of the air inlet pipe E is communicated with the air inlet D, one end of the air outlet pipe C is communicated and fixed with the groove, and the other end of the air outlet pipe C is communicated with the; a groove C, an air inlet pipe F and an air outlet pipe D are also arranged in the second diaphragm valve, one end of the air inlet pipe F in the second diaphragm valve is communicated with the groove C, the other end of the air outlet pipe D is communicated with the air inlet D, one end of the air outlet pipe D is fixedly communicated with the groove C, and the other end of the air outlet pipe D is communicated with the air outlet C;
the cleaning valve is provided with an air outlet pipe E which is communicated and fixed with an air inlet B of the flow merging valve; the air outlet C of the flow divider is communicated with the air inlet A of the flow merging valve; and an air inlet C of the flow merging valve is communicated with a fixed flow dividing valve.
2. A gas flow dividing and merging apparatus as recited in claim 1, wherein: the two diaphragm valves on the flow merging valve are oppositely arranged, and each diaphragm valve forms an angle of 45 degrees with the middle symmetrical shaft.
3. A gas flow dividing and merging apparatus as recited in claim 1, wherein: when the air outlet pipe E of the cleaning valve is fixed with the air inlet B of the confluence valve, the air outlet pipe E of the cleaning valve is fixedly connected with the air inlet B of the confluence valve in a flange mode, a dovetail groove is formed in an air inlet at the bottom of the confluence valve body, the dovetail groove is sealed by using o-ring, and the air inlet flange is connected with the confluence valve through bolt connection.
4. A gas flow dividing and merging apparatus as recited in claim 1, wherein: and the air inlet pipe B, the air inlet pipe D and the air outlet pipe E are communicated and integrally designed.
5. A gas flow dividing and merging apparatus as recited in claim 1, wherein: when the gas flow dividing and converging device is used, the gas flow dividing and converging devices are arranged into a plurality of groups, the groups are arranged up and down, a heating substrate is clamped in the middle of the gas flow dividing and converging device, the heating substrate is divided into three layers, a heating plate is arranged in the middle of the gas flow dividing and converging device, and a fixing plate is arranged on each of the upper layer and the.
6. A gas flow dividing and merging apparatus as recited in claim 1, wherein: the air outlet pipe A and the air outlet pipe B are combined into a pipeline channel at the air outlet A.
7. A gas flow dividing and merging apparatus as recited in claim 1, wherein: and the flow divider and the flow merging valve are fixed by welding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711121821.0A CN107988587B (en) | 2017-11-14 | 2017-11-14 | Gas flow dividing and converging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711121821.0A CN107988587B (en) | 2017-11-14 | 2017-11-14 | Gas flow dividing and converging device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107988587A CN107988587A (en) | 2018-05-04 |
CN107988587B true CN107988587B (en) | 2020-04-24 |
Family
ID=62031348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711121821.0A Active CN107988587B (en) | 2017-11-14 | 2017-11-14 | Gas flow dividing and converging device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107988587B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2531199Y (en) * | 2002-03-29 | 2003-01-15 | 董志广 | Controllable two-way fluid interflowing and flow-dividing device |
CN1571863A (en) * | 2001-10-15 | 2005-01-26 | 微米技术公司 | Atomic layer deposition apparatus and process |
CN201792077U (en) * | 2010-09-27 | 2011-04-13 | 安徽西锐重工科技有限公司 | Gas pressure transducer of flame cutting machine |
CN103605267A (en) * | 2013-10-23 | 2014-02-26 | 上海华力微电子有限公司 | Isolation structure for remote radio-frequency plasma source |
CN103604475A (en) * | 2013-11-20 | 2014-02-26 | 东京计装(上海)仪表有限公司 | Cross distributing and converging device and flowmeter thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005175091A (en) * | 2003-12-09 | 2005-06-30 | Pioneer Electronic Corp | Device and method for peeling resist, and method for manufacturing flat display panel |
KR101150697B1 (en) * | 2005-11-26 | 2012-06-08 | 주성엔지니어링(주) | Chamber cleaning system using remote plasma |
-
2017
- 2017-11-14 CN CN201711121821.0A patent/CN107988587B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1571863A (en) * | 2001-10-15 | 2005-01-26 | 微米技术公司 | Atomic layer deposition apparatus and process |
CN2531199Y (en) * | 2002-03-29 | 2003-01-15 | 董志广 | Controllable two-way fluid interflowing and flow-dividing device |
CN201792077U (en) * | 2010-09-27 | 2011-04-13 | 安徽西锐重工科技有限公司 | Gas pressure transducer of flame cutting machine |
CN103605267A (en) * | 2013-10-23 | 2014-02-26 | 上海华力微电子有限公司 | Isolation structure for remote radio-frequency plasma source |
CN103604475A (en) * | 2013-11-20 | 2014-02-26 | 东京计装(上海)仪表有限公司 | Cross distributing and converging device and flowmeter thereof |
Also Published As
Publication number | Publication date |
---|---|
CN107988587A (en) | 2018-05-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8985152B2 (en) | Point of use valve manifold for semiconductor fabrication equipment | |
US10480077B2 (en) | PEALD apparatus to enable rapid cycling | |
TWI589726B (en) | Shared gas panels in plasma processing chambers employing multi-zone gas feeds | |
TWI586900B (en) | Shared gas panels, apparatus,and methods for supplying process gases in plasma processing systems | |
KR102564514B1 (en) | Azimuthal mixer | |
TW201442071A (en) | Radical source design for remote plasma atomic layer deposition | |
CN1067686A (en) | The device of spherical segment substrate coating and equipment | |
US11583816B2 (en) | Gas distribution plate for thermal deposition | |
TWI730532B (en) | Chamber air inlet structure and reaction chamber | |
CN112795905B (en) | Gas inlet structure and semiconductor deposition equipment | |
CN107988587B (en) | Gas flow dividing and converging device | |
TW201138978A (en) | Shower head and apparatus for manufacturing semiconductor substrate having the same | |
CN104103483B (en) | A kind of inlet duct and plasma processing device | |
US10910243B2 (en) | Thermal management system | |
US10763764B2 (en) | Stage and substrate processing apparatus | |
CN114893477A (en) | Semiconductor process equipment and gas homogenizing device thereof | |
CN103924216A (en) | Plasma generator gas mixing pipeline | |
JPH0526736Y2 (en) | ||
CN219637339U (en) | Air inlet pipeline module | |
CN109830451B (en) | Substrate drying device | |
CN110904438A (en) | Gas distribution device for multiple chemical sources | |
TWI752324B (en) | Mixing structure and reaction equipment | |
CN220520629U (en) | Continuous coating device | |
JP2013036060A (en) | Vapor deposition apparatus and vapor deposition method | |
CN211235444U (en) | Multi-cavity integrated barrier property testing cavity |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: No.900 Shuijia, Hunnan District, Shenyang City, Liaoning Province Patentee after: Tuojing Technology Co.,Ltd. Address before: No.900 Shuijia, Hunnan District, Shenyang City, Liaoning Province Patentee before: PIOTECH Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |