CN107979420B - CXP optical module and optical communication device - Google Patents
CXP optical module and optical communication device Download PDFInfo
- Publication number
- CN107979420B CN107979420B CN201711170106.6A CN201711170106A CN107979420B CN 107979420 B CN107979420 B CN 107979420B CN 201711170106 A CN201711170106 A CN 201711170106A CN 107979420 B CN107979420 B CN 107979420B
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- driving chip
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- optical
- cxp
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- 230000003287 optical effect Effects 0.000 title claims abstract description 104
- 238000004891 communication Methods 0.000 title claims abstract description 14
- 239000013307 optical fiber Substances 0.000 claims description 29
- 230000003321 amplification Effects 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 230000016615 flocculation Effects 0.000 abstract description 5
- 238000005189 flocculation Methods 0.000 abstract description 5
- MVXIJRBBCDLNLX-UHFFFAOYSA-N 1,3-dichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=C(Cl)C=CC=C1Cl MVXIJRBBCDLNLX-UHFFFAOYSA-N 0.000 description 4
- DCMURXAZTZQAFB-UHFFFAOYSA-N 1,4-dichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC=CC=2)Cl)=C1 DCMURXAZTZQAFB-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
- H04B10/2589—Bidirectional transmission
- H04B10/25891—Transmission components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/27—Arrangements for networking
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
Abstract
The invention provides a CXP optical module and an optical communication device, wherein the CXP optical module at least comprises a microcontroller, a laser driving chip, a VCSEL (vertical cavity surface emitting laser) laser, a detector driving chip and a PIN photodetector, the host is connected with the laser driving chip, and the laser driving chip is connected with the VCSEL; the PIN photodetector is connected with the detector driving chip, and the detector driving chip is connected with the host; the host is further connected with the microcontroller through the I2C interface, and the microcontroller is respectively connected with the laser driving chip and the detector driving chip and is used for acquiring working information of the CXP optical module, and the host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information. The CXP optical module can avoid signal flocculation and has high transmission rate.
Description
Technical Field
The present invention relates to the field of optical fiber transmission technologies, and in particular, to a CXP optical module and an optical communication device.
Background
Prior art optical modules typically include multiple fiber channels, each with separate fiber optic receivers and transmitters. However, the side-by-side arrangement of multiple channels (e.g., the side-by-side arrangement of receive channels and transmit channels) tends to cause interference in the fiber optic signal between the different channels, thereby causing signal hogging.
Disclosure of Invention
The invention provides a CXP optical module and an optical communication device, which can avoid signal flocculation and have high transmission rate.
An aspect of the present invention provides a CXP optical module connected to a host, the CXP optical module including at least a microcontroller, a laser driver chip, a VCSEL laser, a detector driver chip, and a PIN photodetector, the host being connected to the laser driver chip, the laser driver chip being connected to the VCSEL laser, the laser driver chip generating a driving signal according to a first electrical signal when the laser driver chip obtains the first electrical signal from the host, the driving signal being configured to drive the VCSEL laser to generate a first optical signal; the PIN optical detector is connected with the detector driving chip, the detector driving chip is connected with the host, a second optical signal is received by the PIN optical detector, current is generated according to the second optical signal, and the detector driving chip amplifies the current and sends the amplified current to the host; the host is further connected with the microcontroller through an I2C interface, the microcontroller is respectively connected with the laser driving chip and the detector driving chip and is used for acquiring working information of the CXP optical module, and the host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information.
The CXP comprises a first PCB and a second PCB, the microcontroller, the laser driving chip and the VCSEL are arranged on the first PCB, and the detector driving chip and the PIN photodetector are arranged on the second PCB.
The precision that microcontroller, laser drive chip and VCSEL laser set up on the first PCB board is + -2 mu m, the precision that detector drive chip and PIN light detector set up at the second PCB board is + -2 mu m.
The laser driving chip comprises a cascade input buffer circuit, a differential amplification circuit, a source electrode following stage circuit and a current switching stage circuit, wherein the input buffer circuit is used for impedance matching and biasing the first electric signal.
The detector driving chip comprises a transimpedance amplifier and a linear amplifier which are connected in cascade, wherein the transimpedance amplifier is used for amplifying the current, and the linear amplifier converts the amplified current into a differential signal and sends the differential signal to the host.
Another aspect of the present invention provides an optical communication apparatus, including a host and a CXP optical module, the CXP optical module being connected to the host, the CXP optical module including at least a microcontroller, a laser driving chip, a VCSEL laser, a detector driving chip, and a PIN photodetector, the host being connected to the laser driving chip, the laser driving chip being connected to the VCSEL laser, the laser driving chip generating a driving signal according to a first electrical signal when the laser driving chip obtains the first electrical signal from the host, the driving signal being used to drive the VCSEL laser to generate the first optical signal; the PIN optical detector is connected with the detector driving chip, the detector driving chip is connected with the host, a second optical signal is received by the PIN optical detector, current is generated according to the second optical signal, and the detector driving chip amplifies the current and sends the amplified current to the host; the host is further connected with the microcontroller through an I2C interface, the microcontroller is respectively connected with the laser driving chip and the detector driving chip and is used for acquiring working information of the CXP optical module, and the host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information.
The CXP comprises a first PCB and a second PCB, the microcontroller, the laser driving chip and the VCSEL are arranged on the first PCB, and the detector driving chip and the PIN photodetector are arranged on the second PCB.
The precision that microcontroller, laser drive chip and VCSEL laser set up on the first PCB board is + -2 mu m, the precision that detector drive chip and PIN light detector set up at the second PCB board is + -2 mu m.
The laser driving chip comprises a cascade input buffer circuit, a differential amplification circuit, a source electrode following stage circuit and a current switching stage circuit, wherein the input buffer circuit is used for impedance matching and biasing the first electric signal.
The detector driving chip comprises a transimpedance amplifier and a linear amplifier which are connected in cascade, wherein the transimpedance amplifier is used for amplifying the current, and the linear amplifier converts the amplified current into a differential signal and sends the differential signal to the host.
Through the scheme, the invention has the beneficial effects that: compared with the prior art, the CXP optical module provided by the invention is characterized in that the microcontroller, the laser driving chip, the VCSEL laser, the detector driving chip and the PIN optical detector are arranged, the laser driving chip and the VCSEL laser generate a first optical signal, and the detector driving chip and the PIN optical detector receive a second optical signal, so that signal flocculation can be avoided, and the transmission rate is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
fig. 1 is a schematic structural view of a CXP light module according to a first embodiment of the present invention;
fig. 2 is a schematic structural view of a CXP light module according to a second embodiment of the present invention;
FIG. 3 is a schematic diagram of a laser driving chip in a CXP optical module according to a third embodiment of the present invention;
FIG. 4 is a schematic diagram of a structure of a detector driving chip in a CXP optical module according to a third embodiment of the invention;
fig. 5 is a schematic structural view of an optical communication apparatus according to a first embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a CXP optical module according to a first embodiment of the present invention. The CXP optical module 10 disclosed in this embodiment is connected to a host 20, and the CXP optical module 10 includes at least a microcontroller 11, a laser driving chip 12, a VCSEL (Vertical Cavity Surface Emitting Laser ) laser 13, a detector driving chip 14, and a PIN photodetector 15.
As shown in fig. 1, the CXP optical module 10 further includes a first interface 16, a second interface 17, and an optical fiber interface 31, the CXP optical module 10 is connected to the host 20 via the first interface 16 and the second interface 17, and the CXP optical module 10 is connected to the optical fiber 30 via the optical fiber interface 31, and the optical fiber interface 31 is a multiple parallel optical fiber interface.
The host 20 is connected to the laser driving chip 12, the laser driving chip 12 is connected to the VCSEL laser 13, that is, the host 20 is connected to the laser driving chip 12 through the first interface 16, and the VCSEL laser 13 is connected to the optical fiber 30 through the optical fiber interface 31. The PIN photo detector 15 is connected with the detector driving chip 14, the detector driving chip 14 is connected with the host 20, namely the PIN photo detector 15 is connected with the optical fiber 30 through the optical fiber interface 31, and the detector driving chip 14 is connected with the host 20 through the second interface 17.
When the CXP optical module 10 transmits the first optical signal to the optical fiber 30, that is, the laser driver chip 12 obtains the first electrical signal from the host 20 through the first interface 16, the laser driver chip 12 generates a driving signal according to the first electrical signal, and the driving signal is used to drive the VCSEL laser 13 to generate the first optical signal, and the first optical signal is transmitted to the optical fiber 30 through the optical fiber interface 31.
When the CXP optical module 10 receives the second optical signal from the optical fiber 30, that is, the PIN photodetector 15 receives the second optical signal from the optical fiber 30 through the optical fiber interface 31, the PIN photodetector 15 generates a current according to the second optical signal, and the detector driving chip 14 is configured to amplify the current and transmit the amplified current to the host 30.
The host 20 is further connected to the microcontroller 11 through an I2C interface 21, and the microcontroller 11 is connected to the laser driving chip 12 and the detector driving chip 14, respectively. The microcontroller 11 is used for acquiring the working information of the CXP optical module 10, i.e., the microcontroller 11 is used for acquiring the working state of the laser driving chip 12 and the working state of the detector driving chip 14. The host 20 controls the laser driving chip 12 and the detector driving chip 14 through the microcontroller 11 according to the operation information.
The CXP optical module 10 of this embodiment can avoid signal flocculation by providing the microcontroller 11, the laser driving chip 12, the VCSEL laser 13, the detector driving chip 14, and the PIN photodetector 15, generating the first optical signal by the laser driving chip 12 and the VCSEL laser 13, and receiving the second optical signal by the detector driving chip 14 and the PIN photodetector 15. In addition, the CXP optical module 10 of this embodiment can simultaneously implement 12 paths of receiving or transmitting signals, and the transmission rate of each path of signal may be 10Gbps, and the transmission rate is fast. In addition, the CXP optical module 10 of the present embodiment employs an integrated chip technology, which can simplify the complexity of the circuit and save space.
The present invention further provides the CXP light module of the second embodiment described on the basis of the CXP light module 10 of the first embodiment. As shown in fig. 2, the CXP optical module 10 of the present embodiment further includes a first PCB 18 and a second PCB 19, wherein the microcontroller 11, the laser driving chip 12, and the VCSEL laser 13 are disposed on the first PCB 18, the probe driving chip 14 and the PIN photodetector 15 are disposed on the second PCB 19, and the probe driving chip 14 is connected to the microcontroller 11 through a flexible circuit board FPC.
When the microcontroller 11, the laser driving chip 12 and the VCSEL laser 13 are disposed on the first PCB 18, the accuracy with which the laser driving chip 12 and the VCSEL laser 13 are disposed on the first PCB 18 is ±2 μm; when the detector driving chip 14 and the PIN photodetector 15 are arranged on the second PCB 19, the precision of the detector driving chip 14 and the PIN photodetector 15 arranged on the second PCB 19 is +/-2 mu m, so that the performance of the CXP optical module 10 is improved, the area of the PCB is saved, and the cost is reduced.
The present invention further provides the CXP light module of the third embodiment described on the basis of the CXP light module 10 of the first embodiment. As shown in fig. 3, the laser driving chip 12 includes a cascaded input buffer circuit 121, a differential amplifying circuit 122, a source follower stage circuit 123, and a current switch stage circuit 124, where the input buffer circuit 121 is used for impedance matching and biasing the first electrical signal, that is, the input buffer circuit 121 biases the dc level of the first electrical signal input by the host 20. The input buffer circuit 121 is impedance matched to reduce reflection of the first electrical signal from reaching the laser driver chip 12, and the input buffer circuit 121 further adjusts the first electrical signal to a predetermined operating range. The differential amplifying circuit 122 may be a triode or CMOS differential amplifying circuit for amplifying the first electric signal and printing the common mode interference. The source follower stage circuit 123 is used for outputting impedance variation, and has extremely strong load capacity due to the small impedance outputted by the source follower stage circuit 123. The current switching stage circuit 124 may be a symmetrical differential circuit for providing differential modulation current to the VCSEL laser 13.
As shown in fig. 4, the detector driving chip 14 includes a transimpedance amplifier 141 and a linear amplifier 142 in cascade, the transimpedance amplifier 141 being configured to amplify a current so that the amplified current can drive the linear amplifier 142; the linear amplifier 142 converts the amplified current into a differential signal and transmits the differential signal to the host 20.
The present invention further provides an optical communication device 50, as shown in fig. 5, the optical communication device 50 includes a host 51, a CXP optical module 52, and an optical fiber 53, wherein the host 51 is connected to the optical fiber 53 through the CXP optical module 52, and the CXP optical module 52 is the CXP optical module 10 disclosed in the foregoing embodiment, which is not described herein.
In summary, the CXP optical module of the present invention can avoid signal flocculation by providing the microcontroller, the laser driving chip, the VCSEL laser, the detector driving chip, and the PIN photodetector, generating the first optical signal by the laser driving chip and the VCSEL laser, and receiving the second optical signal by the detector driving chip and the PIN photodetector. In addition, the CXP optical module can simultaneously realize 12 paths of receiving or transmitting signals, and the transmission rate of each path of signal can be 10Gbps, so that the transmission rate is high. In addition, the CXP optical module adopts an integrated chip technology, so that the circuit complexity can be simplified, and the space can be saved.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (10)
1. The CXP optical module is characterized by being connected with a host, the CXP optical module is connected with an optical fiber, the CXP optical module at least comprises a microcontroller, a laser driving chip, a VCSEL laser, a detector driving chip and a PIN photodetector, the host is connected with the laser driving chip, the laser driving chip is connected with the VCSEL laser, when the laser driving chip acquires a first electric signal from the host, the laser driving chip generates a driving signal according to the first electric signal, and the driving signal is used for driving the VCSEL laser to generate a first optical signal; the PIN optical detector is connected with the detector driving chip, the detector driving chip is connected with the host, a second optical signal is received by the PIN optical detector, current is generated according to the second optical signal, and the detector driving chip amplifies the current and sends the amplified current to the host; the host is further connected with the microcontroller through an I2C interface, the microcontroller is respectively connected with the laser driving chip and the detector driving chip and is used for acquiring working information of the CXP optical module, and the host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information;
the CXP optical module further comprises a first interface, a second interface and an optical fiber interface, the CXP optical module is connected with the host through the first interface and the second interface, the CXP optical module is connected with the optical fiber through the optical fiber interface, and the optical fiber interface is a multipath parallel optical fiber interface.
2. The CXP light module of claim 1, wherein the CXP comprises a first PCB and a second PCB, the microcontroller, the laser driver chip, and the VCSEL laser being disposed on the first PCB, the detector driver chip, and the PIN photodetector being disposed on the second PCB.
3. The CXP light module of claim 2, wherein the microcontroller, the laser driver chip, and the VCSEL laser are disposed on the first PCB with a precision of ±2 μιη, and the detector driver chip and the PIN photodetector are disposed on the second PCB with a precision of ±2 μιη.
4. The CXP light module of claim 1, wherein the laser driver chip comprises a cascaded input buffer circuit for impedance matching and biasing the first electrical signal, a differential amplifier circuit, a source follower stage circuit, and a current switch stage circuit.
5. The CXP optical module of claim 4, wherein the detector driver chip comprises a cascaded transimpedance amplifier for amplifying the current and a linear amplifier for converting the amplified current to a differential signal and transmitting to the host.
6. The optical communication device is characterized by comprising a host and a CXP optical module, wherein the CXP optical module is connected with the host, the CXP optical module at least comprises a microcontroller, a laser driving chip, a VCSEL (vertical cavity surface emitting laser) laser, a detector driving chip and a PIN (personal digital assistant) optical detector, the host is connected with the laser driving chip, the laser driving chip is connected with the VCSEL, and when the laser driving chip acquires a first electric signal from the host, the laser driving chip generates a driving signal according to the first electric signal, and the driving signal is used for driving the VCSEL to generate a first optical signal; the PIN optical detector is connected with the detector driving chip, the detector driving chip is connected with the host, a second optical signal is received by the PIN optical detector, current is generated according to the second optical signal, and the detector driving chip amplifies the current and sends the amplified current to the host; the host is further connected with the microcontroller through an I2C interface, the microcontroller is respectively connected with the laser driving chip and the detector driving chip and is used for acquiring working information of the CXP optical module, and the host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information;
the CXP optical module further comprises a first interface, a second interface and an optical fiber interface, the CXP optical module is connected with the host through the first interface and the second interface, the CXP optical module is connected with the optical fiber through the optical fiber interface, and the optical fiber interface is a multipath parallel optical fiber interface.
7. The optical communication device of claim 6, wherein the CXP comprises a first PCB board and a second PCB board, the microcontroller, the laser driver chip, and the VCSEL laser are disposed on the first PCB board, and the detector driver chip and the PIN photodetector are disposed on the second PCB board.
8. The optical communication device of claim 7, wherein the microcontroller, the laser driver chip, and the VCSEL laser are disposed on the first PCB with a precision of ±2 μm, and the detector driver chip and the PIN photodetector are disposed on the second PCB with a precision of ±2 μm.
9. The optical communication device of claim 6, wherein the laser driver chip comprises a cascaded input buffer circuit, a differential amplification circuit, a source follower stage circuit, and a current switch stage circuit, the input buffer circuit being configured to impedance match and bias the first electrical signal.
10. The optical communication device of claim 9, wherein the detector driver chip comprises a cascaded transimpedance amplifier for amplifying the current and a linear amplifier for converting the amplified current into a differential signal and transmitting to the host.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711170106.6A CN107979420B (en) | 2017-11-21 | 2017-11-21 | CXP optical module and optical communication device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711170106.6A CN107979420B (en) | 2017-11-21 | 2017-11-21 | CXP optical module and optical communication device |
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| Publication Number | Publication Date |
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| CN107979420A CN107979420A (en) | 2018-05-01 |
| CN107979420B true CN107979420B (en) | 2024-04-02 |
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| CN201711170106.6A Active CN107979420B (en) | 2017-11-21 | 2017-11-21 | CXP optical module and optical communication device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111427829B (en) * | 2020-03-13 | 2022-03-01 | 浙江华睿科技股份有限公司 | Low-speed uplink signal demodulation circuit of CoaXPres protocol and driving circuit of CoaXPres protocol |
| CN113054912A (en) * | 2021-03-09 | 2021-06-29 | 中国科学院半导体研究所 | Photoelectric monolithic integrated chip of PIN detector and trans-impedance amplifier and preparation method |
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Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2530069A (en) * | 2014-09-12 | 2016-03-16 | Bae Systems Plc | Signal processing apparatus |
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| CN202503520U (en) * | 2011-12-30 | 2012-10-24 | 武汉烽火众智数字技术有限责任公司 | High-speed Ethernet optical module and radio-frequency data transmission device thereof |
| CN203590231U (en) * | 2013-05-30 | 2014-05-07 | 武汉电信器件有限公司 | CXP optical transmit-receive module |
| CN204190773U (en) * | 2014-11-18 | 2015-03-04 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
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| CN107979420A (en) | 2018-05-01 |
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