CN207677734U - CXP optical modules and optical communication apparatus - Google Patents
CXP optical modules and optical communication apparatus Download PDFInfo
- Publication number
- CN207677734U CN207677734U CN201721578059.4U CN201721578059U CN207677734U CN 207677734 U CN207677734 U CN 207677734U CN 201721578059 U CN201721578059 U CN 201721578059U CN 207677734 U CN207677734 U CN 207677734U
- Authority
- CN
- China
- Prior art keywords
- driving chip
- optical
- host
- cxp
- microcontroller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Optical Communication System (AREA)
- Semiconductor Lasers (AREA)
Abstract
A kind of CXP optical modules of the utility model offer and optical communication apparatus, the CXP optical modules include at least microcontroller, laser driving chip, VCSEL lasers, detector driving chip and PIN optical detectors, host is connect with laser driving chip, and laser driving chip is connect with VCSEL lasers；PIN optical detectors are connect with detector driving chip, and detector driving chip is connect with host；Host is further connect by I2C interface with microcontroller, microcontroller is connect with laser driving chip and detector driving chip respectively, job information for obtaining CXP optical modules, host control laser driving chip and detector driving chip according to job information by microcontroller.The CXP optical modules of the utility model can avoid signal disorder, and transmission rate is fast.
Description
Technical field
The utility model is related to optical fiber transmission technique fields, more particularly to a kind of CXP optical modules and optical communication apparatus.
Background technology
Optical module in the prior art generally comprises multi-channel optical fibre channel, and each optical-fibre channel is equipped with independent optical fiber and connects
Receive device and transmitter.(such as receiving channel and sendaisle be arranged side by side) is easy to make however, being arranged side by side of multiple channels
At the interference of the fiber-optic signal between different channels, to cause signal disorder.
Utility model content
A kind of CXP optical modules of the utility model offer and optical communication apparatus, can avoid signal disorder, and transmission rate
Soon.
The one side of the utility model provides a kind of CXP optical modules, is connect with host, the CXP optical modules at least wrap
Include microcontroller, laser driving chip, VCSEL lasers, detector driving chip and PIN optical detectors, the host
It is connect with the laser driving chip, the laser driving chip is connect with the VCSEL lasers, in the laser
When driving chip obtains the first electric signal from the host, the laser driving chip generates drive according to first electric signal
Dynamic signal, the drive signal is for driving the VCSEL lasers to generate the first optical signal；The PIN optical detectors and institute
The connection of detector driving chip is stated, the detector driving chip connect with the host, received in the PIN optical detectors
Second optical signal, and electric current is generated according to second optical signal, the detector driving chip amplifies the electric current, and will put
Electric current after big is sent to the host；The host is further connect by I2C interface with the microcontroller, the micro-control
Device processed is connect with the laser driving chip and the detector driving chip respectively, for obtaining the CXP optical modules
Job information, the host control the laser driving chip and described according to the job information by the microcontroller
Detector driving chip.
Wherein, the CXP includes the first pcb board and the second pcb board, the microcontroller, the laser driving chip
It is arranged on first pcb board with the VCSEL lasers, the detector driving chip and the PIN optical detectors are set
It sets on the second pcb board.
Wherein, the microcontroller, the laser driving chip and the VCSEL lasers are arranged described first
Precision on pcb board is ± 2 μm, and the precision in the second pcb board is arranged in the detector driving chip and the PIN optical detectors
It is ± 2 μm.
Wherein, the laser driving chip includes cascade input buffer circuit, differential amplifier circuit, source follower stage
Circuit and current switch grade circuit, the input buffer circuit is for impedance matching and biases first electric signal.
Wherein, the detector driving chip includes cascade trans-impedance amplifier and linear amplifier, described to amplify across resistance
For device for amplifying the electric current, amplified electric current is converted to differential signal by the linear amplifier, and is sent to the master
Machine.
The another aspect of the utility model provides a kind of optical communication apparatus comprising host and CXP optical modules, the CXP
Optical module is connect with host, and the CXP optical modules include at least microcontroller, laser driving chip, VCSEL lasers, visit
It surveys device driving chip and PIN optical detectors, the host is connect with the laser driving chip, the laser drives core
Piece is connect with the VCSEL lasers, described to swash when the laser driving chip obtains the first electric signal from the host
Light device driving chip generates drive signal according to first electric signal, and the drive signal is for driving the VCSEL laser
Device generates the first optical signal；The PIN optical detectors are connect with the detector driving chip, the detector driving chip with
The host connection receives the second optical signal in the PIN optical detectors, and generates electric current according to second optical signal,
The detector driving chip amplifies the electric current, and amplified electric current is sent to the host；The host is further
Connect with the microcontroller by I2C interface, the microcontroller respectively with the laser driving chip and the detection
Device driving chip connects, and the job information for obtaining the CXP optical modules, the host passes through institute according to the job information
It states microcontroller and controls the laser driving chip and the detector driving chip.
Wherein, the CXP includes the first pcb board and the second pcb board, the microcontroller, the laser driving chip
It is arranged on first pcb board with the VCSEL lasers, the detector driving chip and the PIN optical detectors are set
It sets on the second pcb board.
Wherein, the microcontroller, the laser driving chip and the VCSEL lasers are arranged described first
Precision on pcb board is ± 2 μm, and the precision in the second pcb board is arranged in the detector driving chip and the PIN optical detectors
It is ± 2 μm.
Wherein, the laser driving chip includes cascade input buffer circuit, differential amplifier circuit, source follower stage
Circuit and current switch grade circuit, the input buffer circuit is for impedance matching and biases first electric signal.
Wherein, the detector driving chip includes cascade trans-impedance amplifier and linear amplifier, described to amplify across resistance
For device for amplifying the electric current, amplified electric current is converted to differential signal by the linear amplifier, and is sent to the master
Machine.
Through the above scheme, the utility model has the beneficial effects that：It is different from the prior art, the CXP light of the utility model
Module is by being arranged microcontroller, laser driving chip, VCSEL lasers, detector driving chip and PIN optical detections
Device generates the first optical signal by laser driving chip and VCSEL lasers, is visited by detector driving chip and PIN light
It surveys device and receives the second optical signal, signal disorder can be avoided, and transmission rate is fast.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the utility model
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.Wherein：
Fig. 1 is the structural schematic diagram of the CXP optical modules of the utility model first embodiment；
Fig. 2 is the structural schematic diagram of the CXP optical modules of the utility model second embodiment；
Fig. 3 be the utility model 3rd embodiment CXP optical modules in laser driving chip structural schematic diagram；
Fig. 4 be the utility model 3rd embodiment CXP optical modules in detector driving chip structural schematic diagram；
Fig. 5 is the structural schematic diagram of the optical communication apparatus of the utility model first embodiment.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than all real
Apply example.Based on the embodiments of the present invention, those of ordinary skill in the art are not under the premise of making performing creative labour
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Shown in Figure 1, Fig. 1 is the structural schematic diagram of the CXP optical modules of the utility model first embodiment.This implementation
The revealed CXP optical modules 10 of example are connect with host 20, and CXP optical modules 10 include at least microcontroller 11, laser drives core
Piece 12, VCSEL (Vertical Cavity Surface Emitting Laser, vertical cavity surface emitting laser) laser
13, detector driving chip 14 and PIN optical detectors 15.
As shown in Figure 1, CXP optical modules 10 further comprise first interface 16, second interface 17 and optical fiber interface 31,
CXP optical modules 10 are connect by first interface 16 and second interface 17 with host 20, CXP optical modules 10 by optical fiber interface 31 with
Optical fiber 30 connects, which is multidiameter delay optical fiber interface.
Wherein, host 20 is connect with laser driving chip 12, and laser driving chip 12 connects with VCSEL lasers 13
Connect, i.e., host 20 is connect by first interface 16 with laser driving chip 12, VCSEL lasers 13 by optical fiber interface 31 with
Optical fiber 30 connects.PIN optical detectors 15 are connect with detector driving chip 14, and detector driving chip 14 is connect with host 20,
I.e. PIN optical detectors 15 are connect by optical fiber interface 31 with optical fiber 30, and detector driving chip 14 passes through second interface 17 and master
Machine 20 connects.
Emit the first optical signal to optical fiber 30 in CXP optical modules 10, i.e. laser driving chip 12 passes through first interface 16
When obtaining the first electric signal from host 20, laser driving chip 12 generates drive signal, driving letter according to the first electric signal
Number for driving VCSEL lasers 13 to generate the first optical signal, the first optical signal is transmitted to optical fiber 30 by optical fiber interface 31.
Receive the second optical signal from optical fiber 30 in CXP optical modules 10, i.e., PIN optical detectors 15 by optical fiber interface 31 from
When optical fiber 30 receives the second optical signal, PIN optical detectors 15 generate electric current according to the second optical signal, and detector driving chip 14 is used
In amplification electric current, and amplified electric current is sent to host 30.
Wherein, host 20 is further connect by I2C interface 21 with microcontroller 11, microcontroller 11 respectively with laser
Driving chip 12 and detector driving chip 14 connect.Microcontroller 11 is used to obtain the job information of CXP optical modules 10, i.e., micro-
Controller 11 is used to obtain the working condition of the working condition and detector driving chip 14 of laser driving chip 12.Host 20
Laser driving chip 12 and detector driving chip 14 are controlled by microcontroller 11 according to job information.
The present embodiment CXP optical modules 10 by be arranged microcontroller 11, laser driving chip 12, VCSEL lasers 13,
Detector driving chip 14 and PIN optical detectors 15 generate first by laser driving chip 12 and VCSEL lasers 13
Optical signal receives the second optical signal by detector driving chip 14 and PIN optical detectors 15, can avoid signal disorder.Separately
Outside, the CXP optical modules 10 of the present embodiment can be achieved at the same time 12 tunnels and receive or emit signal, can per the transmission rate of road signal
For 10Gbps, transmission rate is fast.In addition, the CXP optical modules 10 of the present embodiment use integrated chip technology, it is multiple that circuit can be simplified
Miscellaneous degree saves space.
The utility model further provides for the CXP optical modules of second embodiment, in the CXP optical modules 10 of first embodiment
On the basis of be described.As described in Figure 2, the CXP optical modules 10 of the present embodiment further comprise the first pcb board 18 and second
Pcb board 19, wherein microcontroller 11, laser driving chip 12 and VCSEL lasers 13 are arranged on the first pcb board 18, visit
It surveys device driving chip 14 and PIN optical detectors 15 is arranged on the second pcb board 19, detector driving chip 14 passes through flexible circuit
Plate FPC is connect with microcontroller 11.
When microcontroller 11, laser driving chip 12 and VCSEL lasers 13 are arranged in the first pcb board 18, laser
It is ± 2 μm that the precision on the first pcb board 18, which is arranged, in device driving chip 12 and VCSEL lasers 13；In detector driving chip
14 and PIN optical detectors 15 are arranged in the second pcb board 19, and detector driving chip 14 and the setting of PIN optical detectors 15 are the
The precision of two pcb boards 19 is ± 2 μm, and then improves the performance of CXP optical modules 10, saves the area of PCB, reduces cost.
The utility model further provides for the CXP optical modules of 3rd embodiment, in the CXP optical modules 10 of first embodiment
On the basis of be described.As described in Figure 3, laser driving chip 12 includes cascade input buffer circuit 121, differential amplification
Circuit 122, source follower stage circuit 123 and current switch grade circuit 124, wherein input buffer circuit 121 are used for impedance
Match and bias the first electric signal, i.e. input buffer circuit 121 biases the DC level for the first electric signal that host 20 inputs.Input
121 impedance matching of buffer circuit reaches reflection caused by laser driving chip 12 for reducing the first electric signal, and input is slow
It rushes circuit 121 and the first electric signal is further adjusted to preset working range.Differential amplifier circuit 122 can be triode or
CMOS differential amplifier circuits for carrying out signal amplification to the first electric signal, and are printed common mode interference.Source electrode follows
Grade circuit 123 changes for output impedance, due to the impedance very little that source follower stage circuit 123 exports, has extremely strong band negative
Loading capability.Current switch grade circuit 124 can be a pair of difference channel claimed, for providing difference tune for VCSEL lasers 13
Electric current processed.
As shown in figure 4, detector driving chip 14 includes cascade trans-impedance amplifier 141 and linear amplifier 142, across resistance
Amplifier 141 is for amplifying electric current, so that amplified electric current can drive linear amplifier 142；Linear amplifier 142 will be put
Electric current after big is converted to differential signal, and is sent to host 20.
The utility model further provides for a kind of optical communication apparatus 50, as shown in figure 5, optical communication apparatus 50 includes host
51, CXP optical modules 52 and optical fiber 53, wherein host 51 are connect by CXP optical modules 52 with optical fiber 53, the CXP optical modules 52
For the revealed CXP optical modules 10 of above-described embodiment, details are not described herein.
In conclusion the CXP optical modules of the utility model are swashed by the way that microcontroller, laser driving chip, VCSEL is arranged
Light device, detector driving chip and PIN optical detectors generate the first light by laser driving chip and VCSEL lasers
Signal receives the second optical signal by detector driving chip and PIN optical detectors, can avoid signal disorder.In addition, this reality
12 tunnels are can be achieved at the same time with novel CXP optical modules and receive or emit signal, and the transmission rate per road signal can be
10Gbps, transmission rate are fast.In addition, the CXP optical modules of the utility model use integrated chip technology, circuit complexity can be simplified
Degree saves space.
The above description is only the embodiments of the present invention, and it does not limit the scope of the patent of the present invention, every
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other related technical areas are equally included in the patent within the scope of the utility model.
Claims (10)
1. a kind of CXP optical modules, which is characterized in that the CXP optical modules are connect with host, and the CXP optical modules include at least
Microcontroller, laser driving chip, VCSEL lasers, detector driving chip and PIN optical detectors, the host with
The laser driving chip connection, the laser driving chip are connect with the VCSEL lasers, are driven in the laser
When dynamic chip obtains the first electric signal from the host, the laser driving chip generates driving according to first electric signal
Signal, the drive signal is for driving the VCSEL lasers to generate the first optical signal；The PIN optical detectors with it is described
Detector driving chip connects, and the detector driving chip connect with the host, and the is received in the PIN optical detectors
Two optical signals, and electric current is generated according to second optical signal, the detector driving chip amplifies the electric current, and will amplification
Electric current afterwards is sent to the host；The host is further connect by I2C interface with the microcontroller, the microcontroller
Device is connect with the laser driving chip and the detector driving chip respectively, the work for obtaining the CXP optical modules
Make information, the host controls the laser driving chip and the spy according to the job information by the microcontroller
Survey device driving chip.
2. CXP optical modules according to claim 1, which is characterized in that the CXP includes the first pcb board and the 2nd PCB
Plate, the microcontroller, the laser driving chip and the VCSEL lasers are arranged on first pcb board, described
Detector driving chip and the PIN optical detectors are arranged on the second pcb board.
3. CXP optical modules according to claim 2, which is characterized in that the microcontroller, the laser driving chip
It is ± 2 μm that the precision on first pcb board, which is arranged, with the VCSEL lasers, the detector driving chip and described
PIN optical detectors be arranged the second pcb board precision be ± 2 μm.
4. CXP optical modules according to claim 1, which is characterized in that the laser driving chip includes cascade defeated
Enter buffer circuit, differential amplifier circuit, source follower stage circuit and current switch grade circuit, the input buffer circuit to be used for
Impedance matching and biasing first electric signal.
5. CXP optical modules according to claim 4, which is characterized in that the detector driving chip include it is cascade across
Impedance amplifier and linear amplifier, for the trans-impedance amplifier for amplifying the electric current, the linear amplifier will be amplified
Electric current is converted to differential signal, and is sent to the host.
6. a kind of optical communication apparatus, which is characterized in that the optical communication apparatus includes host and CXP optical modules, the CXP optical modes
Block is connect with host, and the CXP optical modules include at least microcontroller, laser driving chip, VCSEL lasers, detector
Driving chip and PIN optical detectors, the host are connect with the laser driving chip, the laser driving chip with
The VCSEL lasers connection, when the laser driving chip obtains the first electric signal from the host, the laser
Driving chip generates drive signal according to first electric signal, and the drive signal is for driving the VCSEL lasers to produce
Raw first optical signal；The PIN optical detectors are connect with the detector driving chip, the detector driving chip with it is described
Host connects, and receives the second optical signal in the PIN optical detectors, and generate electric current according to second optical signal, described
Detector driving chip amplifies the electric current, and amplified electric current is sent to the host；The host further passes through
I2C interface is connect with the microcontroller, and the microcontroller drives with the laser driving chip and the detector respectively
Dynamic chip connection, the job information for obtaining the CXP optical modules, the host passes through described micro- according to the job information
Controller controls the laser driving chip and the detector driving chip.
7. optical communication apparatus according to claim 6, which is characterized in that the CXP includes the first pcb board and the 2nd PCB
Plate, the microcontroller, the laser driving chip and the VCSEL lasers are arranged on first pcb board, described
Detector driving chip and the PIN optical detectors are arranged on the second pcb board.
8. optical communication apparatus according to claim 7, which is characterized in that the microcontroller, the laser drive core
It is ± 2 μm that the precision on first pcb board, which is arranged, in piece and the VCSEL lasers, the detector driving chip and institute
State PIN optical detectors be arranged the second pcb board precision be ± 2 μm.
9. optical communication apparatus according to claim 6, which is characterized in that the laser driving chip includes cascade defeated
Enter buffer circuit, differential amplifier circuit, source follower stage circuit and current switch grade circuit, the input buffer circuit to be used for
Impedance matching and biasing first electric signal.
10. optical communication apparatus according to claim 9, which is characterized in that the detector driving chip includes cascade
Trans-impedance amplifier and linear amplifier, the trans-impedance amplifier is for amplifying the electric current, after the linear amplifier will amplify
Electric current be converted to differential signal, and be sent to the host.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721578059.4U CN207677734U (en) | 2017-11-21 | 2017-11-21 | CXP optical modules and optical communication apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721578059.4U CN207677734U (en) | 2017-11-21 | 2017-11-21 | CXP optical modules and optical communication apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207677734U true CN207677734U (en) | 2018-07-31 |
Family
ID=62966143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721578059.4U Active CN207677734U (en) | 2017-11-21 | 2017-11-21 | CXP optical modules and optical communication apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207677734U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979420A (en) * | 2017-11-21 | 2018-05-01 | 深圳市光为光通信科技有限公司 | CXP optical modules and optical communication apparatus |
| CN113114368A (en) * | 2021-04-09 | 2021-07-13 | 山东中和光电科技有限公司 | Optical module for serial port communication |
-
2017
- 2017-11-21 CN CN201721578059.4U patent/CN207677734U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979420A (en) * | 2017-11-21 | 2018-05-01 | 深圳市光为光通信科技有限公司 | CXP optical modules and optical communication apparatus |
| CN107979420B (en) * | 2017-11-21 | 2024-04-02 | 深圳市光为光通信科技有限公司 | CXP optical module and optical communication device |
| CN113114368A (en) * | 2021-04-09 | 2021-07-13 | 山东中和光电科技有限公司 | Optical module for serial port communication |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10205531B2 (en) | Distributed traveling-wave Mach-Zehnder modulator driver | |
| CN207677734U (en) | CXP optical modules and optical communication apparatus | |
| EP2846483A1 (en) | Optical receiver module including plurality of photo detectors | |
| JP2017532909A (en) | Method for determining receiver coupling efficiency, link margin and link topology in active optical cables | |
| US20120251128A1 (en) | Optical transmitter and method for optical signal waveform compensation | |
| CN107979420A (en) | CXP optical modules and optical communication apparatus | |
| CN104518751A (en) | Optical reception circuit, optical reception device, and optical transmission system | |
| CN103916193B (en) | The optical transceiver module that a kind of manipulator both arms can independently be modulated | |
| CN207570667U (en) | The detection device and equipment of luminous power | |
| US8009940B2 (en) | Photonic integrated circuit with improved signal quality and electrostatic discharge threshold | |
| Verbrugghe et al. | Multichannel 25 Gb/s low-power driver and transimpedance amplifier integrated circuits for 100 Gb/s optical links | |
| CN109586787A (en) | Optical module | |
| CN209767539U (en) | Device for generating test signal and test system | |
| US20070189768A1 (en) | Optical network unit and control method thereof | |
| CN203813792U (en) | Optical transmit-receive module with independently-modulated double arms of modulator | |
| CN103808401B (en) | Rear orientation light distributed air-defense device and control method thereof | |
| US20230379060A1 (en) | Optical transmitter | |
| US20220150395A1 (en) | Electronic device and method for an electronic device | |
| CN103326790A (en) | Optical transmitter capable of automatically controlling power | |
| KR20190059354A (en) | External Modulator Based Hybrid Optical Transceiver using Silicon Photonics and manufacturing method thereof | |
| CN104320196B (en) | A kind of noise suppression circuit, method, optical module and optical communication system | |
| CN113132021B (en) | Underwater audio-optical communication system and method with direction sensing auxiliary function | |
| CN105259728B (en) | A kind of method for extracting non-linear fiber amplifier multi-channel signal gain degree of polarization relationship characteristic parameter | |
| CN206226394U (en) | A kind of burst pulse generation device | |
| CN115528529A (en) | Method of controlling semiconductor optical amplifier and optical amplifying apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |