CN107978664A - A kind of die-bonding method of three crystalline substances led products - Google Patents
A kind of die-bonding method of three crystalline substances led products Download PDFInfo
- Publication number
- CN107978664A CN107978664A CN201711102196.5A CN201711102196A CN107978664A CN 107978664 A CN107978664 A CN 107978664A CN 201711102196 A CN201711102196 A CN 201711102196A CN 107978664 A CN107978664 A CN 107978664A
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- China
- Prior art keywords
- chips
- points
- led
- die
- bonding method
- Prior art date
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- 239000000126 substance Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000002301 combined effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses the die-bonding method of a kind of three crystalline substance led products, comprise the following steps：Step 1：The not exactly the same led chips of 3 brightness degrees are selected, are respectively the first chips, the second chips and the 3rd chips；Step 2：Three points ranked into equilateral triangle are chosen on circuit board support, are respectively A points, B points and C points；Step 3：The central point of first chips is directed at A points, is fixed on circuit board support and toasts；Step 4：The central point of second chips is directed at B points, is fixed on circuit board support and toasts；Step 5：The central point of 3rd chips is directed at C points, is fixed on circuit board support and toasts；Step 6：3 SMD led chips are connected in circuit using the pattern of series circuit.Compared with prior art, the beneficial effects of the present invention are：Suitable for different chip matched combineds, there is the advantage for reducing production cost, while uniform in light emission.
Description
Technical field
The present invention relates to LED technology field, particularly a kind of die-bonding method of three crystalline substances led products.
Background technology
Existing led product technologies are more and more ripe, and the requirement to cost is also higher and higher, and particularly SMD products, SMD are
The abbreviation of Surface Mounted Devices, means：Surface mount device, it is SMT (Surface Mount
Technology）One kind in component.Client increasingly payes attention to its price, and through market analysis, three crystalline substance 1w products are mesh
The industry that moves ahead main product, in order to preferably cost-effective with improving product quality problem, the product design of led becomes our led
One of target of industry.
The content of the invention
The technical problems to be solved by the invention are overcome the deficiencies in the prior art and provide a kind of consolidating for three crystalline substance led products
Crystal method, the present invention, which has, saves gold thread, and uniform in light emission, has the advantage that different chip matched combined modes reduce cost.
The present invention uses following technical scheme to solve above-mentioned technical problem：
A kind of die-bonding method of three crystalline substances led products, comprises the following steps：
Step 1：The not exactly the same led chips of 3 brightness degrees are selected, are respectively the first chips, the second chips and the
Three chips；
Step 2：Three points ranked into equilateral triangle are chosen on circuit board support, respectively A points, B points and C points, A points
Positioned at the left vertex of equilateral triangle, A points, B points and C points are in arrangement clockwise；
Step 3：The central point of first chips is directed at A points, is fixed on the first chips with die bond primer by bonder
On circuit board support and toast；
Step 4：The central point of second chips is directed at B points and die bond positive and negative anodes and first direction are on the contrary, pass through bonder
The second chips are fixed on circuit board support and toasted with die bond primer；
Step 5：The central point of 3rd chips is directed at C points and die bond positive and negative anodes are identical with first direction, passes through bonder
The 3rd chips are fixed on circuit board support and toasted with die bond primer；
Step 6：3 led chips are connected in circuit using the pattern of series circuit.
Led chips are SMD led chips.
AB=BC=AC=10mm。
The brightness degree of 3 led chips selects between 15-700mw.
Step 2: the baking temperature in three and four is 160 ± 5 DEG C, baking time is 2h ± 10min.
A kind of three crystalline substance led products, the three crystalline substance led products are consolidated as three crystalline substance led products described in any of the above-described claim
Crystal method is made.
Compared with prior art, this beneficial effects of the present invention are：Suitable for different chip matched combineds, having reduces
The advantage of production cost, while uniform in light emission.
Brief description of the drawings
Fig. 1 is the structure diagram of three crystalline substance led products.
Wherein, the first chips of 1-,
The second chips of 2-,
The 3rd chips of 3-.
Embodiment
Technical scheme is described in further detail below：
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated.It should be understood that following embodiments are only used for
Illustrate the present invention rather than limit the scope of the invention.It should be noted that word " preceding " used in the following description,
" rear ", "left", "right", "up" and "down" refer to the direction in attached drawing, and word " interior " and " outer " refer respectively to direction or remote
From the direction of particular elements geometric center.
Figure is included with lower component：First chips 1, the second chips 2 and the 3rd chips 3.
A kind of die-bonding method of three crystalline substances led products, comprises the following steps：
Step 1：The not exactly the same led chips of 3 brightness degrees are selected, are respectively the first chips, the second chips and the
Three chips；
Step 2：Three points ranked into equilateral triangle are chosen on circuit board support, respectively A points, B points and C points, A points
Positioned at the left vertex of equilateral triangle, A points, B points and C points are in arrangement clockwise；
Step 3：The central point of first chips is directed at A points, is fixed on the first chips with die bond primer by bonder
On circuit board support and toast；
Step 4：The central point of second chips is directed at B points and die bond positive and negative anodes and first direction are on the contrary, pass through bonder
The second chips are fixed on circuit board support and toasted with die bond primer；
Step 5：The central point of 3rd chips is directed at C points and die bond positive and negative anodes are identical with first direction, passes through bonder
The 3rd chips are fixed on circuit board support and toasted with die bond primer；
Step 6：3 led chips are connected in circuit using the pattern of series circuit.
Led chips are SMD led chips.
AB=BC=AC=10mm。
The brightness degree of 3 led chips selects between 15-700mw.
Step 2: the baking temperature in three and four is 160 ± 5 DEG C, baking time is 2h ± 10min.
A kind of three crystalline substance led products, the three crystalline substance led products are consolidated as three crystalline substance led products described in any of the above-described claim
Crystal method is made.
It is complete by above-mentioned description, relevant staff using the above-mentioned desirable embodiment according to the present invention as enlightenment
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property scope is not limited to the content on specification, it is necessary to determines its technical scope according to right.
Claims (6)
- A kind of 1. die-bonding method of three crystalline substances led products, it is characterised in that：Comprise the following steps：Step 1：The not exactly the same led chips of 3 brightness degrees are selected, are respectively the first chips, the second chips and the Three chips；Step 2：Three points ranked into equilateral triangle are chosen on circuit board support, respectively A points, B points and C points, A points Positioned at the left vertex of equilateral triangle, A points, B points and C points are in arrangement clockwise；Step 3：The central point of first chips is directed at A points, is fixed on the first chips with die bond primer by bonder On circuit board support and toast；Step 4：The central point of second chips is directed at B points and die bond positive and negative anodes and first direction are on the contrary, pass through bonder The second chips are fixed on circuit board support and toasted with die bond primer；Step 5：The central point of 3rd chips is directed at C points and die bond positive and negative anodes are identical with first direction, passes through bonder The 3rd chips are fixed on circuit board support and toasted with die bond primer；Step 6：3 led chips are connected in circuit using the pattern of series circuit.
- A kind of 2. die-bonding method of three crystalline substances led products according to claim 1, it is characterised in that：Led chips are SMD Led chips.
- A kind of 3. die-bonding method of three crystalline substances led products according to claim 1, it is characterised in that：AB=BC=AC=10mm.
- A kind of 4. die-bonding method of three crystalline substances led products according to claim 1, it is characterised in that：3 led chips it is bright Degree grade selects between 15-700mw.
- A kind of 5. die-bonding method of three crystalline substances led products according to claim 1, it is characterised in that：Step 2: in three and four Baking temperature be 160 ± 5 DEG C, baking time is 2h ± 10min.
- A kind of 6. three crystalline substance led products, it is characterised in that：The three crystalline substance led products are as three crystalline substance led described in any of the above-described claim The die-bonding method of product is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711102196.5A CN107978664A (en) | 2017-11-10 | 2017-11-10 | A kind of die-bonding method of three crystalline substances led products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711102196.5A CN107978664A (en) | 2017-11-10 | 2017-11-10 | A kind of die-bonding method of three crystalline substances led products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107978664A true CN107978664A (en) | 2018-05-01 |
Family
ID=62013313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711102196.5A Pending CN107978664A (en) | 2017-11-10 | 2017-11-10 | A kind of die-bonding method of three crystalline substances led products |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107978664A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100171440A1 (en) * | 2006-08-11 | 2010-07-08 | Mitsubishi Chemical Corporation | Illuminating device |
| CN102239573A (en) * | 2008-09-25 | 2011-11-09 | Ge照明解决方案有限责任公司 | Adjustable color illumination source |
| CN102734658A (en) * | 2011-04-12 | 2012-10-17 | 犀德电子有限公司 | LED luminous body and LED lamp adopting same |
| CN103765086A (en) * | 2011-09-01 | 2014-04-30 | 株式会社小糸制作所 | Automotive headlamp apparatus |
| CN105070808A (en) * | 2015-07-14 | 2015-11-18 | 陕西光电科技有限公司 | Polycrystalline LED support improving light-emitting efficiency and crystal fixing method thereof |
-
2017
- 2017-11-10 CN CN201711102196.5A patent/CN107978664A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100171440A1 (en) * | 2006-08-11 | 2010-07-08 | Mitsubishi Chemical Corporation | Illuminating device |
| CN102239573A (en) * | 2008-09-25 | 2011-11-09 | Ge照明解决方案有限责任公司 | Adjustable color illumination source |
| CN102734658A (en) * | 2011-04-12 | 2012-10-17 | 犀德电子有限公司 | LED luminous body and LED lamp adopting same |
| CN103765086A (en) * | 2011-09-01 | 2014-04-30 | 株式会社小糸制作所 | Automotive headlamp apparatus |
| CN105070808A (en) * | 2015-07-14 | 2015-11-18 | 陕西光电科技有限公司 | Polycrystalline LED support improving light-emitting efficiency and crystal fixing method thereof |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20180906 Address after: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Applicant after: Wenrui Photoelectric Co., Ltd., Jiangsu Address before: 212009 No. 88 Weiyi Road, Ding Mao Development Area, Zhenjiang, Zhenjiang, Jiangsu Applicant before: Jiangsu Wenrun Optoelectronic Technology Co., Ltd. |
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Application publication date: 20180501 |
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