CN102032540B - Substrate group connected by flexible connecting bridges - Google Patents

Substrate group connected by flexible connecting bridges Download PDF

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Publication number
CN102032540B
CN102032540B CN2010105985406A CN201010598540A CN102032540B CN 102032540 B CN102032540 B CN 102032540B CN 2010105985406 A CN2010105985406 A CN 2010105985406A CN 201010598540 A CN201010598540 A CN 201010598540A CN 102032540 B CN102032540 B CN 102032540B
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connects
substrate
flexibility
bridge
flexible
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CN2010105985406A
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CN102032540A (en
Inventor
王辉炎
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Leeleds Lighting Xiamen Co Ltd
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XIAMEN LIMING PHOTOELECTRIC CO Ltd
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Abstract

The invention discloses a flexible connection bridge substrate group comprising: substrates provided with light sources, wherein front surfaces are provided with welding points for mutual connection; flexible connection bridge connected and arranged between the substrates, the flexible connection bridge connecting a plurality of individual substrates into a combo in parallel or in series, and the flexible connection bridge substrate group is installed in a lamp. The substrate group connected by the flexible connecting bridges is a group formed by arranging a plurality of substrates subjected to light distribution design and arrangement according to specific requirements and connecting N independent substrates in parallel or in series by using the flexible connecting bridges; and due to the adoption of a flexible way, the substrate group can be arranged at any position and any angle in any shape. Therefore, the substrate group is convenient to operate, highly flexible, highly practical and widely applicable, and has a novel structure which can be used for lamps and related applicable industries.

Description

Flexibility connects bridging and connects substrate in batch
Technical field
The invention belongs to electronic technology field or illuminating industry, relate to the substrate that a kind of not light requirement is learned the element luminous intensity distribution, especially to connect the substrate in batch that bridging connects relevant with a kind of flexibility.
Background technology
In optics and lamp applications, existing substrate is planar structure, and its shortcoming is, the light irradiating firing angle is limited, is difficult to realize multi-faceted comprehensive using up, and due to the angle that can not change light source, causes the bad adjustment of scattering of light angle.And adopt the single chip architecture combination mostly to be the manually-operated welding, connecting line is numerous and diverse, namely affects visual effect, and operation link is many, and inefficiency is difficult to realize automated production.
Summary of the invention
The object of the invention is to solve above problem, provide a kind of flexibility to connect the substrate in batch that bridging connects, it is by multi-piece substrate any combination design, but arbitrary shape, arbitrarily angled setting, changeability is strong, substrate can be any shape, and flexible paste chip (wire jumper) connects bridge can be arbitrarily crooked, arranges substantially unrestricted, greatly increase work efficiency, ensure the quality of products, reduce costs, can realize large-scale production.
For reaching above-mentioned purpose, the present invention adopts following technical scheme:
Flexibility connects the substrate in batch that bridging connects, and comprises substrate: which is provided with light source, front is provided with for interconnective solder joint; Flexibility connects bridge: connect to be arranged between substrate and locates, this flexibility connects bridge and connects into association with parallel connection or the series system substrate that polylith is independent, and this flexibility connects bridging and connects substrate in batch and be arranged in light fixture.
The described bridge that connects is that the flexible paste chip connects bridge, is comprised of flexible insulating barrier coated with conductive sheet, and it is welded between adjacent substrate.
The described bridge that connects is that flexible wire-jumper type connects bridge, is comprised of the flexible piece coated wire, and it is welded between adjacent substrate.
Described flexible paste chip connects the assembly that bridge is two phosphor-copper conducting strips of silicon rubber coating that flexibility and insulating properties are high.
It is that flexibility and insulating properties layer coat circular phosphor-copper wire or enamel-covered wire wire jumper that described flexible wire-jumper type connects bridge.
Adopt technique scheme, it is through luminous intensity distribution design and the layout of the substrate of arranging by specific requirement by multi-disc that flexible paste chip of the present invention connects bridge (wire jumper) connection substrate group, utilize the flexible paste chip to connect bridge (wire jumper), connect association with parallel connection or the series system substrate that the N piece is independent.Front surface copper-clad and insulating barrier processing mode and conventional substrate are identical, just in substrate front side, having increased can interconnective solder joint, for connecing bridge welding, connect, after substrate in batch has connected, can assemble, due to what adopt, it is flexible way, can optional position, arbitrary shape and arbitrarily angled placement, easy to operate, flexibility, practical, widely applicable, all utilizable new structures of light fixture and relevant applicable industry, can be suitable for various SMD and directly welded light source uses, contour substrate and position can arrange flexibly, can meet different luminous intensity distributions and put requirement.
The accompanying drawing explanation
Below with accompanying drawing to the detailed description of the invention:
Fig. 1 is the structural representation one of the embodiment of the present invention one front;
Fig. 2 is the structural representation two of the embodiment of the present invention one front;
Fig. 3 is the expansion schematic diagram of the embodiment of the present invention one front;
Fig. 4 is the structural representation one of the embodiment of the present invention one back;
Fig. 5 is the structural representation two of the embodiment of the present invention one back;
Fig. 6 is the structural representation one of the embodiment of the present invention two fronts;
Fig. 7 is the structural representation two of the embodiment of the present invention two fronts;
Fig. 8 is the expansion schematic diagram of the embodiment of the present invention two fronts;
Fig. 9 is the structural representation one of the embodiment of the present invention two back;
Figure 10 is the structural representation two of the embodiment of the present invention two back;
Schematic diagram one when Figure 11 is automated production of the present invention;
Schematic diagram two when Figure 12 is automated production of the present invention.
The specific embodiment
Below in conjunction with drawings and Examples, the present invention is described in detail
As Fig. 1-embodiments of the present invention shown in Figure 12, flexibility connects the substrate in batch that bridging connects, and includes substrate 1: which is provided with light source 2, front is provided with for interconnective solder joint; Flexibility connects bridge: be welded between adjacent substrate.This flexibility connects bridging and connects substrate in batch and be arranged in light fixture.
The described bridge that connects can be the flexible paste chip and connects bridge 3, is comprised of flexible piece 31 coated with conductive sheets 32, and concrete can be coated the assembly of two phosphor-copper conducting strips 32 by flexibility and insulating silicon rubber 31, and it is connected between adjacent substrate.The described bridge that connects also can be flexible wire-jumper type and connects bridge 4, is comprised of the flexible piece coated wire, and concrete can coat circular phosphor-copper wire wire jumper by flexibility and insulated plastic, and it is connected between adjacent substrate.
It is through luminous intensity distribution design and the layout of the substrate of arranging by specific requirement by multi-disc that flexible paste chip of the present invention connects bridge (wire jumper) connection substrate group, utilize flexibility to connect bridge, with parallel connection or the series system substrate that the N piece is independent, connect association, front surface copper-clad and insulating barrier processing mode and conventional substrate are identical, just in substrate front side, having increased can interconnective solder joint, for connecing bridge welding, connect, after substrate in batch has connected, can assemble, due to what adopt, it is flexible way, can optional position, arbitrary shape and arbitrarily angled placement, easy to operate, flexibility, practical, widely applicable, all utilizable new structures of light fixture and relevant applicable industry, can be suitable for various SMD and directly welded light source uses, contour substrate and position can arrange flexibly, can meet different luminous intensity distributions and put requirement.
Wherein the substrate of substrate in batch can be identical topology or different layout, substrate in batch just meets by flexibility the association that the bridge mode connects together them, can be designed to various difformities and structure according to actual requirement, substantially be not subjected to the restriction of shape and position, changeability is strong, but flexible Application, substrate before assembling is the disjunctor plate (also independent body) that can divide, after with chip mounter, light source and flexibility being connect to the bridge location, weld, then remove unnecessary coupling part, because the flexibility adopted connects bridge (can be SMD or wire-jumper type), lock out operation is very convenient, after separation, proceed to next procedure after bending on demand, finally substrate in batch pasted or be fastened on application site, as adopt the automation mode to realize producing in enormous quantities.
In substrate in batch, to connect bridge portion (can be SMD or wire-jumper type) be the bridge connected between each substrate circuit with conduction to flexibility, to adopt the assembly of good insulating and soft silicon rubber coated with conductive sheet or coat circular phosphor-copper wire wire jumper by flexibility and insulated plastic, to form the carrier that between each substrate, circuit is interconnected, because the flexibility adopted connects bridge, can realize electrical signal conduction, the also very good pliability of tool, bendability is strong, flexural deformation easily realizes, BENDING PROCESS to phosphor-copper conducting strip and silicone rubber insulation layer and phosphor-copper conductive jumper and plastic insulating layer without any infringement, substrate circuit is had no effect, brake forming on request before installing in the later stage, both can reach final matching requirements, the enforcement of bending operation, both can reach final matching requirements, the enforcement of bending operation, both can adopt manual specific purpose tool brake forming, also can adopt the brake forming of automation mechanism, to realize production in enormous quantities.
Owing to being the multi-piece substrate syndeton, with the artificial line welding operation of single chip architecture, compare, removed the loaded down with trivial details of connecting welding between substrate circuit from, and the phenomenon such as the dry joint caused in production process, solder skip, save many connecting lines, can eliminate the trouble of driver output line when wiring operations, reduce operation link, also make the regularity of whole light source installed surface have the utmost point improvement, do not have many connecting lines and light source mutually to mix poor bad sensation, can not cause shade because the line body is in the light, improve light source installed surface perception, can increase work efficiency, reduce costs.
More considerable is, with the substrate of slate structure independently, compare, connect the bridge-type substrate in batch and can form any many planes cone section body, many planes arbitrary arrangement, the staggered fluctuating in many planes arranged, cylindrical arrangement, the non-single planes such as cross section cone arrangement, flexible and changeable, the structure application request, design meets the substrate in batch of appearance requirement and arranges and geometry, be applied to suitable product, if any specific (special) requirements, the substrate distortion can also be obtained to desirable cylinder and taper seat, can be applicable to not showing installing and using of structure, applicable very wide.

Claims (5)

1. flexibility connects bridging and connects substrate in batch, it is characterized in that: comprise substrate: which is provided with light source, front is provided with for interconnective solder joint; Flexibility connects bridge: connect to be arranged between substrate and locates, this flexibility connects bridge and connects into association with parallel connection or the series system substrate that polylith is independent, and this flexibility connects bridging and connects substrate in batch and be arranged in light fixture.
2. flexibility as claimed in claim 1 connects bridging and connects substrate in batch, it is characterized in that: the described bridge that connects is that the flexible paste chip connects bridge, is comprised of flexible insulating barrier coated with conductive sheet, and it is connected between adjacent substrate.
3. flexibility as claimed in claim 1 connects bridging and connects substrate in batch, it is characterized in that: the described bridge that connects is that flexible wire-jumper type connects bridge, is comprised of the flexible insulation layer circular phosphor-copper wire of coating or enamel-covered wire, and it is connected between adjacent substrate.
4. flexibility as claimed in claim 2 connects bridging and connects substrate in batch, it is characterized in that: it is the assembly that flexibility and insulating silicon rubber coat two phosphor-copper conducting strips that described flexible paste chip connects bridge.
5. flexibility as claimed in claim 3 connects bridging and connects substrate in batch, it is characterized in that: it is that flexibility and insulating properties layer coat circular phosphor-copper wire wire jumper that described flexible wire-jumper type connects bridge.
CN2010105985406A 2010-12-21 2010-12-21 Substrate group connected by flexible connecting bridges Active CN102032540B (en)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102588792A (en) * 2012-02-28 2012-07-18 苏州东亚欣业节能照明有限公司 Ball bulb lamp
CN103196070B (en) * 2013-04-26 2015-02-18 广东金达照明科技股份有限公司 Light emitting diode (LED) candle lamp
CN103542308A (en) * 2013-11-08 2014-01-29 江苏华英光宝科技股份有限公司 All-angle bendable LED (Light Emitting Diode) filament strip and antique LED bulb comprising same
WO2017185340A1 (en) * 2016-04-29 2017-11-02 华为技术有限公司 Mobile terminal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201000002Y (en) * 2007-01-08 2008-01-02 赖金鸿 Programming all-colour LED lamp string
CN101387373A (en) * 2008-10-21 2009-03-18 田德华 Flexible color changing neon lamp for thin LED
CN201594360U (en) * 2009-11-24 2010-09-29 东莞市邦臣光电有限公司 Connecting structure of flexible LED display screen
CN201655800U (en) * 2010-04-02 2010-11-24 江苏史福特光电科技有限公司 Novel flexible circuit board of LED lighting array

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201000002Y (en) * 2007-01-08 2008-01-02 赖金鸿 Programming all-colour LED lamp string
CN101387373A (en) * 2008-10-21 2009-03-18 田德华 Flexible color changing neon lamp for thin LED
CN201594360U (en) * 2009-11-24 2010-09-29 东莞市邦臣光电有限公司 Connecting structure of flexible LED display screen
CN201655800U (en) * 2010-04-02 2010-11-24 江苏史福特光电科技有限公司 Novel flexible circuit board of LED lighting array

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Owner name: XIAMEN LEEDARSON LIGHTING CO., LTD.

Free format text: FORMER NAME: XIAMEN LIMING PHOTOELECTRIC CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Software Park Siming District of Xiamen city in Fujian province 361009 two sunrise Road No. 20

Patentee after: LEELEDS LIGHTING (XIAMEN) CO., LTD.

Address before: Software Park Siming District of Xiamen city in Fujian province 361009 two sunrise Road No. 20

Patentee before: Xiamen Liming Photoelectric Co., Ltd.