CN102588792A - Ball bulb lamp - Google Patents
Ball bulb lamp Download PDFInfo
- Publication number
- CN102588792A CN102588792A CN2012100473966A CN201210047396A CN102588792A CN 102588792 A CN102588792 A CN 102588792A CN 2012100473966 A CN2012100473966 A CN 2012100473966A CN 201210047396 A CN201210047396 A CN 201210047396A CN 102588792 A CN102588792 A CN 102588792A
- Authority
- CN
- China
- Prior art keywords
- lamp housing
- lamp
- substrate
- lampshade
- sidewall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a ball bulb lamp which comprises a lamp housing, a lamp cover covering the lamp housing, a base plate and an LED (light-emitting diode) chip arranged on the base plate, wherein the lower part of the lamp cover is positioned on the side wall of the lamp housing, a contact point where the lower part of the lamp cover is in contact with the side wall of the lamp housing is lower than the highest point of the side wall of the lamp housing, and a light reflection layer is arranged on the side wall between the contact point and the highest point and is made of a light reflection material; the thickness of the lamp cover is gradually reduced from the center to the edge of the outer side; and an arc-shaped surface with the center protruding relative to the outer edge of the arc-shaped surface is arranged at the upper part of the lamp housing, and the base plate is attached on the arc-shaped surface of the lamp housing.
Description
Technical field
the present invention relates to a kind of bulb lamp.
Background technology
(Light Emitting Diode), light emitting diode is a kind of solid-state semiconductor devices, it can directly be converted into light to electricity.The heart of LED is a semi-conductive wafer.
light source is owing to encapsulate, and the lighting angle of common completion encapsulated LED chip is generally about 120 degree.In the prior art, for the lighting angle that enlarges the LED bulb lamp adopts following several method usually:
form or are provided with the outstanding boss of body of a relative substrate on substrate, each face of boss particularly sidewall is provided with led light source.But, be difficult for producing in enormous quantities processing because this kind structure structure is complicated;
are provided with lens in the LED bulb lamp, though increased lighting angle to a certain extent, also can correspondingly increase owing to independently be provided with the lens cost.
Summary of the invention
to the problems referred to above, main purpose of the present invention provides a kind of LED bulb lamp, to increase its lighting angle and brightness.
are in order to solve an above-mentioned difficult problem; The scheme that the present invention takes is: a kind of bulb lamp; It comprises lamp housing, cover on lampshade, substrate on the lamp housing, be arranged on the led chip on the substrate, and the bottom of said lampshade is positioned on the sidewall of lamp housing, and the contact point that forms of the bottom of lampshade and lamp housing sidewall is lower than the peak of the sidewall of lamp housing; Sidewall is provided with a reflector layer between contact point to the peak, and said reflector layer is processed by reflectorized material.
Preferably, the thickness of said lampshade successively decreases from the center to outer ledge gradually
.
preferably, the top of said lamp housing has the relatively protruding arcwall face of its outward flange of a center, said substrate pastes on the arcwall face of said lamp housing.
preferably, the center of lamp housing is provided with a positioning block, offers on the said substrate and said locating piece corresponding positioning hole.
preferably, said lamp housing top edge is provided with clamping block, gap between this clamping block and the said lamp housing top forms card, the edge of said substrate is provided with and the corresponding Access Division of card.
preferably, the top of said lamp housing has the relatively protruding arcwall face of its outward flange of a center, said lamp housing is provided with and is used for substrate is pasted the binding agent on its arcwall face.
preferably, a kind of in the epoxy resin of modified rubber phenolic resins system, modification, the polyimides glue system of said binding agent.
preferably, said reflector layer is processed by the vacuum coating of highly reflective nano metal.
Preferably, said reflector layer is processed by diffuse-reflective material
.
lampshade has the function of the light diffusion that led chip is sent, and it can be processed by PC or acrylic or PP material.
because the bottom of lampshade is positioned at the below on lamp housing top, therefore pastes at light that the led chip on the substrate sends to exhale from the lampshade that is positioned at below the sidewall peak.Sidewall is provided with a reflector layer between contact point to the peak.This reflector layer is processed by reflectorized material, can launch originally diffusing to the light that can't reflect on the sidewall, has increased reflective light intensity when having increased reflective angle again.
reflectorized material is meant the material that under dark, dim condition, can improve the visibility of its material.Civilian reflectorized material mainly is reflective cloth, reflective lattice sheet, reflective spray painting cloth etc.Industry mainly is meant five other reflective membranes of level, i.e. diamond reflecting film, high-strength reflecting film, engineering reflecting film, advertisement reflecting film and car plate reflecting film with reflectorized material.The reflecting clothes that modal reflectorized material is manufactured, various billboards or the like.
What
reflectorized material adopted is that the microprism principle of reflection mainly gives the credit to the high refractive index glass micro pearl that wherein contains.When Ray Of Light shone the microballon front surface within the specific limits at any angle, optically focused was on outermost reflector behind the microballon owing to the high refraction action of microballon, and the reflecting layer goes back to form retroreflecting with light along incident ray direction reflected in parallel.When many glass microballoons while reflex times, highlight scene will appear.
The present invention adopts above structure, has the following advantages:
1, lighting angle is bigger, and the luminous brightness of edge is brighter;
2, production technology are simple, and cost is low.
Description of drawings
accompanying drawing 1 is the front view in the first embodiment of the present invention.
accompanying drawing 2 is the vertical view of the lamp housing in the first embodiment of the present invention.
accompanying drawing 3 is the vertical view of the substrate in the first embodiment of the present invention.
accompanying drawing 4 is the local enlarged diagram in the first embodiment of the present invention.
accompanying drawing 5 is the front view in the second embodiment of the present invention.
accompanying drawing 6 is the local enlarged diagram in the second embodiment of the present invention.
In
accompanying drawing: 1, lamp housing; 2, lampshade; 3, substrate; 31, locating hole; 32, Access Division; 4, led chip; 5, binding agent; 6, contact point; 7, peak; 8, center; 9, outer ledge; 10, sidewall; 11, arcwall face; 12, locating piece; 13, reflector layer.
The specific embodiment
Set forth preferred embodiment of the present invention below in conjunction with accompanying drawing 1-6 in detail
; Thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to those skilled in the art will recognize that.
first embodiment of the present invention is shown in accompanying drawing 1-4; A kind of bulb lamp; It comprises lamp housing 1, cover on lampshade 2, substrate 3 on the lamp housing 1, be arranged on the led chip 4 on the substrate 3; The bottom of said lampshade 2 is positioned on the sidewall 10 of lamp housing 1, and sidewall 10 is provided with a reflector layer 13 between contact point 6 to the peak 7.Reflector layer 13 is processed by reflectorized material.
preferably; Reflectorized material of the present invention is processed by diffuse-reflective material composite high-molecular reflective membrane; It has extremely strong diffuse effect, makes reflection ray more even, has reduced the dazzle and the discontinuous spottiness of generation of light fixture simultaneously greatly.
preferably, reflectorized material of the present invention is processed by the vacuum coating of highly reflective nano metal.General adoptable metal is aluminium or copper.After plated film forms, be graininess, have good reflecting properties on the surface of reflector layer.
The thickness of
lampshade 2 from the center 8 laterally edge 9 successively decrease gradually.Because the bottom of lampshade 2 is positioned at the below on lamp housing 1 top; Therefore paste at light that the led chip on the substrate 34 sends and exhale from the lampshade 2 that is positioned at below sidewall 10 peaks 7; Simultaneously since the thickness of lampshade 2 from the center 8 laterally edge 9 successively decrease gradually; According to reflection of light and law of refraction, the refraction of thick more position penetrate lampshade 2 amount of light few more, the amount of light that lampshade 2 is penetrated in thin more position refraction is many more; The amount of light of thick more position refraction reflected back lampshade 2 is many more, and the amount of light of thin more position reflected back lampshade 2 is few more.Therefore, can there be more rays to exhale through said structure from the lampshade 2 that is positioned at sidewall 10 peaks 7 belows.
The top of
said lamp housing 1 has the protruding arcwall face 11 of a center 8 relative its outward flanges, and said substrate 3 pastes on the arcwall face 11 of said lamp housing 1.
have certain elasticity because substrate 3 is processed by elastomeric material, and when base pasted at the center for 8 protruding 11 last times of arcwall face, the shape of substrate 3 also becomes arc from cuboid, and the light that led light source sends scatters and comes.
The center 8 of
lamp housing 1 is provided with locating piece 12, offers on the substrate 3 and locating piece 12 corresponding positioning hole 31.Preferably, when the locating hole 31 of substrate 3 inserted in the locating piece 12, substrate 3 can also rotate around the center 8 of locating hole 31.Lamp housing 1 top edge is provided with clamping block, and the gap between this clamping block and said lamp housing 1 top forms card, and the edge of said substrate 3 is provided with and the corresponding Access Division 32 of card.In substrate 3 rotation processes, the Access Division 32 of substrate 3 can be inserted in the card of lamp housing 1, and substrate 3 pastes and is fixed on the lamp housing 1.
second embodiment of the present invention is shown in accompanying drawing 5-6; A kind of bulb lamp; It comprises lamp housing 1, cover on lampshade 2, substrate 3 on the lamp housing 1, be arranged on the led chip 4 on the substrate 3; The bottom of said lampshade 2 is positioned on the sidewall 10 of lamp housing 1, and the contact point 6 that forms of the bottom of lampshade 2 and lamp housing 1 sidewall 10 is lower than the peak 7 of the sidewall 10 of lamp housing 1, and sidewall 10 is provided with a reflector layer 13 between contact point 6 to the peak 7.Said reflector layer 13 is processed by reflectorized material.
The thickness of
said lampshade 2 from the center 8 laterally edge 9 successively decrease gradually; It also comprises a binding agent 5; The top of said lamp housing 1 has the protruding arcwall face 11 of a center 8 relative its outward flanges, and said substrate 3 pastes on the arcwall face 11 of said lamp housing 1 through binding agent 5.Because the bottom of lampshade 2 is positioned at the below on lamp housing 1 top; Therefore paste at light that the led chip on the substrate 34 sends and exhale from the lampshade 2 that is positioned at below sidewall 10 peaks 7; Simultaneously since the thickness of lampshade 2 from the center 8 laterally edge 9 successively decrease gradually; According to reflection of light and law of refraction, the refraction of thick more position penetrate lampshade 2 amount of light few more, the amount of light that lampshade 2 is penetrated in thin more position refraction is many more; The amount of light of thick more position refraction reflected back lampshade 2 is many more, and the amount of light of thin more position reflected back lampshade 2 is few more.Therefore, can there be more rays to exhale through said structure from the lampshade 2 that is positioned at sidewall 10 peaks 7 belows.
have certain elasticity because substrate 3 is processed by elastomeric material, and when base pasted at the center for 8 protruding 11 last times of arcwall face, the shape of substrate 3 also becomes arc from cuboid, and the light that led light source sends scatters and comes.
effect in order to guarantee to dispel the heat, binding agent 5 can adopt a kind of in the epoxy resin, polyimides glue system of modified rubber phenolic resins system, modification.
rubber toughened phenolic aldehyde is modal toughened system.Rubber toughened phenolic resins belongs to physics blending modification, but in various degree grafting or block copolymerization reaction are arranged in solidification process, and the addition of rubber generally is controlled at 6 %～15 %.In the mixture of solubility and linear phenol-aldehyde resin, add carboxylic acrylonitrile-butadiene rubber; Because of the two keys of the methylol in the resol resin and the butadiene in the acrylonitrile-butadiene rubber, carboxyl react; Make between phenolic resins and the acrylonitrile-butadiene rubber close-coupled by chemical bond; So can improve the mechanical property of phenolic resins, also can improve its hear resistance.Except acrylonitrile-butadiene rubber, contain the rubber of active group, like epoxy radicals liquid butadiene rubber, carboxy acrylic rubber, epoxy carboxyl butyronitrile addition product can plasticizing phenol formaldehydes, and toughening effect is remarkable.
The epoxy resin of
modification is that the adding nano material is a kind of effective method of modifying in epoxy resin.The surperficial non-matching courtyard of nano material is many, and is big with epoxy resin generation physics or chemically combined possibility, strengthened the adhesion at particle and interface, so have enhancing, toughness reinforcing performance.
Polyimides glue is like PI/SiO
2
Nano composite material, its Young's modulus increases, and hot strength and extension at break increase within the specific limits to some extent, SiO
2
Material played not only strengthen but also toughness reinforcing effect, and the thermal coefficient of expansion of PI reduces.Therefore they can be used for preparing the material of high modulus and intensity, high temperature resistant and low thermal coefficient of expansion, are widely used in microelectronic.
The present invention adopts above structure, has the following advantages:
1, lighting angle is bigger, and the luminous brightness of edge is brighter;
2, production technology are simple, and cost is low.
the foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to let the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (9)
1. bulb lamp; It comprises lamp housing, cover on lampshade, substrate on the lamp housing, be arranged on the led chip on the substrate; It is characterized in that: the bottom of said lampshade is positioned on the sidewall of lamp housing; And the contact point that the bottom of lampshade and lamp housing sidewall form is lower than the peak of the sidewall of lamp housing, and the sidewall between contact point to the peak is provided with a reflector layer, and said reflector layer is processed by reflectorized material.
2. bulb lamp according to claim 1 is characterized in that: the thickness of said lampshade successively decreases from the center to outer ledge gradually.
3. according to the described bulb lamp of one of claim 1-2, it is characterized in that: the top of said lamp housing has a center protruding arcwall face of its outward flange relatively, and said substrate pastes on the arcwall face of said lamp housing.
4. bulb lamp according to claim 3 is characterized in that: the center of lamp housing is provided with a positioning block, offers on the said substrate and said locating piece corresponding positioning hole.
5. bulb lamp according to claim 4 is characterized in that: said lamp housing top edge is provided with clamping block, and the gap between this clamping block and the said lamp housing top forms card, and the edge of said substrate is provided with and the corresponding Access Division of card.
6. according to the described bulb lamp of one of claim 1-2; It is characterized in that: the top of said lamp housing has the relatively protruding arcwall face of its outward flange of a center, and the arcwall face of said lamp housing is provided with lamp housing and is provided with and is used for substrate is pasted the binding agent on its arcwall face.
7. bulb lamp according to claim 6 is characterized in that: a kind of in the epoxy resin of modified rubber phenolic resins system, modification, the polyimides glue system of said binding agent.
8. according to the described bulb lamp of one of claim 1-2, it is characterized in that: said reflector layer is processed by the vacuum coating of highly reflective nano metal.
9. according to the described bulb lamp of one of claim 1-2, it is characterized in that: said reflector layer is processed by diffuse-reflective material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100473966A CN102588792A (en) | 2012-02-28 | 2012-02-28 | Ball bulb lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100473966A CN102588792A (en) | 2012-02-28 | 2012-02-28 | Ball bulb lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102588792A true CN102588792A (en) | 2012-07-18 |
Family
ID=46477833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100473966A Pending CN102588792A (en) | 2012-02-28 | 2012-02-28 | Ball bulb lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102588792A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103542301A (en) * | 2013-10-29 | 2014-01-29 | 广西桂林宇川光电科技有限公司 | LED (light-emitting diode) lamp |
| CN105299584A (en) * | 2014-06-06 | 2016-02-03 | 欧普照明股份有限公司 | Light source |
| CN106287323A (en) * | 2015-05-18 | 2017-01-04 | 东贝光电科技股份有限公司 | Axisymmetric light-emitting LED bulb lamp |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200968565Y (en) * | 2006-10-26 | 2007-10-31 | 政齐科技股份有限公司 | Light-emitting diode bulb |
| CN201237199Y (en) * | 2008-07-15 | 2009-05-13 | 东莞市贻嘉光电科技有限公司 | LED lamp |
| CN201377709Y (en) * | 2009-07-23 | 2010-01-06 | 深圳市长方照明工业有限公司 | LED bulb |
| CN102013842A (en) * | 2009-09-04 | 2011-04-13 | 梅岗 | Solar photovoltaic panel glass system |
| CN102032540A (en) * | 2010-12-21 | 2011-04-27 | 厦门立明光电有限公司 | Substrate group connected by flexible connecting bridges |
| CN202008025U (en) * | 2011-02-16 | 2011-10-12 | 厦门立明光电有限公司 | High-luminosity angle bulb with frustum table heat-conduction mounting body |
| CN102252265A (en) * | 2011-04-13 | 2011-11-23 | 胡文松 | Light transmission shell capable of transmitting strong light and wide-angle light of light source |
| CN202511044U (en) * | 2012-02-28 | 2012-10-31 | 苏州东亚欣业节能照明有限公司 | Bulb lamp |
-
2012
- 2012-02-28 CN CN2012100473966A patent/CN102588792A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200968565Y (en) * | 2006-10-26 | 2007-10-31 | 政齐科技股份有限公司 | Light-emitting diode bulb |
| CN201237199Y (en) * | 2008-07-15 | 2009-05-13 | 东莞市贻嘉光电科技有限公司 | LED lamp |
| CN201377709Y (en) * | 2009-07-23 | 2010-01-06 | 深圳市长方照明工业有限公司 | LED bulb |
| CN102013842A (en) * | 2009-09-04 | 2011-04-13 | 梅岗 | Solar photovoltaic panel glass system |
| CN102032540A (en) * | 2010-12-21 | 2011-04-27 | 厦门立明光电有限公司 | Substrate group connected by flexible connecting bridges |
| CN202008025U (en) * | 2011-02-16 | 2011-10-12 | 厦门立明光电有限公司 | High-luminosity angle bulb with frustum table heat-conduction mounting body |
| CN102252265A (en) * | 2011-04-13 | 2011-11-23 | 胡文松 | Light transmission shell capable of transmitting strong light and wide-angle light of light source |
| CN202511044U (en) * | 2012-02-28 | 2012-10-31 | 苏州东亚欣业节能照明有限公司 | Bulb lamp |
Non-Patent Citations (2)
| Title |
|---|
| 徐彬: "《钳工（中级）鉴定培训教材》", 30 April 2011, 北京市：机械工业出版社 * |
| 胡慰如: "《摄影知识手册》", 31 May 1989, 北京市：中国商业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103542301A (en) * | 2013-10-29 | 2014-01-29 | 广西桂林宇川光电科技有限公司 | LED (light-emitting diode) lamp |
| CN105299584A (en) * | 2014-06-06 | 2016-02-03 | 欧普照明股份有限公司 | Light source |
| CN106287323A (en) * | 2015-05-18 | 2017-01-04 | 东贝光电科技股份有限公司 | Axisymmetric light-emitting LED bulb lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101858570B (en) | High-efficiency photodiffusion material and production method and application thereof | |
| CN201053627Y (en) | Backlight board for decoration | |
| JP2006324623A (en) | Light emitting device and manufacturing method therefor | |
| CN1167958C (en) | Light guide plate and manufacture thereof, plane luminating device and liquid crystal display device | |
| CN102235594A (en) | Light-emitting diode (LED) light-emitting module | |
| JP2010192844A (en) | Processing sheet for sealing optical semiconductor | |
| CN109683394A (en) | Backlight and preparation method thereof | |
| CN102588792A (en) | Ball bulb lamp | |
| CN202511042U (en) | Bulb lamp | |
| JP2011215295A (en) | Method for producing light diffusion sheet for illumination | |
| CN110131681A (en) | A kind of optics spreads anti-dazzle structure and its preparation method | |
| CN201237165Y (en) | Lens type reflecting cup | |
| CN202511044U (en) | Bulb lamp | |
| CN102588793B (en) | Ball bulb lamp | |
| CN101792645A (en) | Micro-structure adhesive tape | |
| CN201378209Y (en) | Fancy reflection cloth | |
| JP2013130693A (en) | Light guide plate | |
| CN207318773U (en) | Backlight module of liquid crystal display | |
| CN201228924Y (en) | Structure for enhancing brightness of light conducting plate | |
| TW200921156A (en) | Method of fabricating reflection plate and reflection body and application thereof | |
| CN201306675Y (en) | Lens | |
| CN103165793A (en) | Reflection element and light emitting diode packaging device | |
| CN211350692U (en) | OLED light source | |
| CN208090605U (en) | A kind of anti-dazzle structure of optics diffusion | |
| CN101852371B (en) | Back light module, manufacture method thereof and electronic device adopting back light module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120718 |