CN107978542A - Wafer supporting arrangement and wafer processing device - Google Patents
Wafer supporting arrangement and wafer processing device Download PDFInfo
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- CN107978542A CN107978542A CN201710974318.3A CN201710974318A CN107978542A CN 107978542 A CN107978542 A CN 107978542A CN 201710974318 A CN201710974318 A CN 201710974318A CN 107978542 A CN107978542 A CN 107978542A
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- clamping pin
- rotating mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A kind of wafer supporting arrangement, it flatly supports wafer, and the wafer for enabling to be supported rotates, which includes：Tables, top is supported on by the wafer；Branched clamping pin, configures in the upper surface of the tables in a manner of around the wafer, and with the contacts side surfaces of the wafer, and can be from the side support wafer；Clamping pin rotating mechanism, is disposed in the tables in a manner of penetrating through the tables upper surface, can rotate and the clamping pin prejudicially erects on the top of the clamping pin rotating mechanism relative to rotation axis；Arrestment mechanism, can brake the rotation of the clamping pin rotating mechanism；And tables' support shaft, it from the supported underneath tables, can rotate the tables.
Description
Technical field
The present invention is on a kind of wafer supporting arrangement and wafer processing device.
Background technology
In supply liquid to the surface of wafer, while make at the wet type of the one chip of the clean processing of the rotating rotation of wafer etc.
In reason, wafer can be supported by using, and make the rotating wafer supporting arrangement of wafer (referenced patent document 1) at the same time.For example, such as
As shown in Figure 5, general wafer supporting arrangement 101 possess have supporting wafer W in top tables 102 and can be from supported underneath
Tables 102 and make its rotating tables' support shaft 103.
Furthermore for wafer supporting arrangement 101 in the upper surface of tables 102, possessing can be from the branched clamping of side support wafer W
Pin 104.These branched clamping pins 104 configure in a manner of around wafer W as illustrated in the top plan view of fig. 6.Furthermore branched folder
Pin 104 is held respectively by clamping pin rotating mechanism 105 from supported underneath, and is to transfer to make clamping certainly in clamping pin rotating mechanism 105
Pin 104 is prejudicially set for revolution in the mode of the axis of rotation of clamping pin rotating mechanism 105.Pass through this revolution, the branched folder
The side that pin 104 contacts the side of wafer W and is able to supporting wafer W is held, and by making clamping pin rotating mechanism 105 inversely revolve
Turn, and clamping pin 104 and wafer W is become non-contact, be able to decontrol wafer W.In addition, such as Fig. 5 institutes of clamping pin rotating mechanism 105
Show ground, can be the mechanism with clamping drive gear 107, which is with passing on the circular of power to be driven
The external tooth of gear 106 is meshed.In mechanism as this, the rotation of travelling gear 106 is transmitted through clamping drive gear 107, and
Make 105 rotation of clamping rotating mechanism.
Then, rotation clean processing when fabrication process when, through supporting wafer W and at the same time make tables 102 with tables
Support shaft 103 rotates, and is able to making that supported wafer W is rotating to be carried out at the same time clean processing.
[prior art literature]
[patent document]
[patent document 1] Japanese Unexamined Patent Publication 2002-367946 publications
The content of the invention
As above-mentioned, in wafer supporting arrangement 101, after branched clamping pin 104 supporting wafer W, once for fabrication process
And rotate tables 102, because start tables 102 rotation when acceleration when or stop tables rotation when deceleration when centrifugation
Power, clamping pin 104 can release direction movement to clamping for the moment.Therefore, the chucking power that will have clamping pin 104 reduces, and sends out
The problem of wafer that raw wafer W dallies relative to clamping pin 104 slides.Once generation wafer slides, for example, cleaning place in rotation
There occurs the splash of detergent remover in reason, with the clean bad generation of wafer W, due to wafer slides and with upper tables or clamping pin
Friction, and scar can be caused to produce.
In view of as the problem of foregoing, it is an object of the invention to provide a kind of wafer supporting arrangement and wafer-process to fill
Put, the movement of the clamping pin of the non-original idea caused by centrifugal force when can be by preventing that tables from rotating, and prevent what wafer from sliding
Occur, so as to prevent bad and wafer scar the generation of processing caused by splash.
In order to achieve the above objectives, the present invention provides a kind of wafer supporting arrangement, it flatly supports wafer, and can make institute
The wafer rotation of supporting, the wafer supporting arrangement include：
Tables, top is supported on by the wafer；
Branched clamping pin, configures in the upper surface of the tables in a manner of around the wafer, can be with the side of the wafer
Face contacts, and from the side support wafer；
Clamping pin rotating mechanism, is disposed in a manner of the upper surface for penetrating through the tables in the tables, and it is rotatable and should
Clamping pin is on the top of the clamping pin rotating mechanism prejudicially to be erected relative to rotation axis；
Arrestment mechanism, brakes the rotation of the clamping pin rotating mechanism；And
Tables' support shaft, from the supported underneath tables, obtains so that the tables rotate,
Wherein the clamping pin rotating mechanism rotates, and is prejudicially erected on the branched clamping pin of the clamping pin rotating mechanism to connect
The mode for touching the side of the wafer it is mobile around the rotation axis revolution of the clamping pin rotating mechanism and from the side support wafer, and
The arrestment mechanism brakes the rotation of the clamping pin rotating mechanism after the supporting, so as to fixing the clamping pin.
The wafer supporting arrangement of the present invention, after wafer is supported with clamping pin, brakes clamping pin by arrestment mechanism and revolves
Rotation mechanism, is able to fixed clamp pin, therefore even if there is the centrifugal force caused by tables' rotation, clamping pin will not still be solved towards clamping
Except the direction changing of the relative positions.Therefore, wafer supporting arrangement of the invention is due to that can prevent wafer from sliding, thus is able to prevent caused by splash
Bad and wafer scar the generation of processing.
At this time, clamping pin rotating mechanism, can be the folder being meshed with the travelling gear with being disposed in the tables
Drive gear is held, rotates the clamping drive gear by the rotation of the travelling gear, and revolves the clamping pin rotating mechanism
Switch to good.
The wafer supporting arrangement of the present invention, can be that clamping pin rotating mechanism so rotates.
Furthermore at this time, there is hole with the travelling gear, which is penetrated to the travelling gear by banking pin
Hole, and the travelling gear is fixed, the revolver of the braked clamping pin rotating mechanism is preferred.
If such person, the rotation of the non-original idea of travelling gear can simply and be positively prevented, consequently, it is possible to can brake clip
Drive division is held with clamping the rotation of follower and the revolution of the non-original idea of clamping pin.
Furthermore wafer supporting arrangement of the invention, with by headed into upwards below hole from the travelling gear and
The upper ejector pin for removing the banking pin from hole is able to, through ejector pin on this, that is, is able to release in the clamping and clamping of the wafer
When, by the way that the banking pin is removed from the hole of the travelling gear, and release the fixation of the clamping pin.
If such person, by upper ejector pin, the fixation of clamping pin and fixed releasing can simply and be positively carried out.
Furthermore in order to achieve the above objectives, the present invention provides wafer processing device, it possesses chamber, wherein above-mentioned crystalline substance
The tables of circle supporting arrangement are contained in the inside of chamber.
Make the supported rotation of wafer if the wafer supporting arrangement by the present invention, can become and be not susceptible to wafer cunning
Move, and the wafer processing device that can prevent splash from occurring.
Furthermore the wafer processing device is preferred with the revolving wet type processing device of monolithic.
The wafer processing device of the present invention, caused by wafer sliding during suitable for preventing the revolving wet processed of monolithic
Medicament splash.
Furthermore the wafer processing device is handled with the clean processing unit, spin etch processing unit, rotary coating of wafer
Device, photoresist lift-off processing device and polymer remove any one in processing unit and are preferred.
More particularly, the processing of wafer processing device of the invention especially suitable for these types, can be by preventing medicine
The splash of liquid, and prevent from cleaning, etch, rotary coating, photoresist are peeled off, handle undesirable generation among polymer removal processing.
If the wafer supporting arrangement and wafer processing device of the present invention, centrifugal force institute when tables rotate can be prevented
The movement of the clamping pin of the non-original idea caused, and be able to prevent wafer from sliding.As a result, it is the place that can be prevented caused by splash
Manage bad and wafer scar generation.
Brief description of the drawings
Fig. 1 is the side cut away view for the outline that the wafer supporting arrangement of the present invention is presented.
Fig. 2 is the top view for the outline that the wafer supporting arrangement of the present invention is presented.
Fig. 3 is in the wafer supporting arrangement for present the present invention, through the side of the state after arrestment mechanism fixed clamp pin
Profile.
Fig. 4 is the schematic diagram for the example that the wafer processing device of the present invention is presented.
Fig. 5 is the side cut away view of the outline of wafer supporting arrangement known to presentation.
Fig. 6 is the top view of the outline of wafer supporting arrangement known to presentation.
Embodiment
Hereinafter, embodiments of the present invention, however, the present invention is not limited thereto will be illustrated.
First, will be explained for the wafer supporting arrangement of the present invention.The wafer supporting arrangement of the present invention, can horizontal twelve Earthly Branches
Wafer is held, and the wafer for making to be supported rotates.As shown in Figure 1, the wafer supporting arrangement 1 of the present invention possesses wafer W branch
Hold in the tables 2 of top and from supported underneath tables 2 and the rotating tables' support shaft 3 of tables 2 can be made.
Such as Fig. 2, branched clamping pin 4 is configured at the upper surface of tables 2 in a manner of around wafer W.These 4 energy of clamping pin
The side of wafer W is contacted, supports the side of wafer.Furthermore if clamping pin 4 departs from from the side of wafer W, wafer W can be released
Supporting.
Furthermore such as Fig. 1,2, wafer supporting arrangement 1 of the invention, possesses to have and is matched somebody with somebody in a manner of penetrating through the upper surface of tables 2
Clamping pin rotating mechanism 5 in tables 2.This clamping pin rotating mechanism 5 can rotate, and clamping pin 4 relative to clamping pin to revolve
The rotation axis of rotation mechanism 5 and prejudicially erect to its upper.
Clamping pin rotating mechanism 5, though being not particularly limited, can have what is be meshed with the travelling gear 6 being disposed in tables 2
Clamp drive gear 7.If such person, by the rotation of the travelling gear 6, clamping drive gear 7 rotates, and revolves the clamping
Rotation mechanism 5 rotates.
Furthermore wafer supporting arrangement 1 of the invention has the rotating arrestment mechanism that can brake clamping rotating mechanism 5.This
Arrestment mechanism, for example, can be such as following person.
As shown in figure 3, arrestment mechanism 8 can be that can be penetrated by the banking pin 10 of arrestment mechanism 8 to the hole of travelling gear 6
9, fixed conveyor gear 6, and brake the rotation of clamping pin rotating mechanism 5.Consequently, it is possible to can simply and positively fixed clamp
Pin 4.
Furthermore such as Fig. 1, wafer supporting arrangement 1 of the invention, with can by by banking pin 10 from travelling gear 6
The lower section of hole 9 is pushed up upwards, and the upper ejector pin 11 removed from hole 9 is preferred., can be in crystalline substance if in this way, through upper ejector pin 11
When the clamping and clamping of circle W release, by the way that banking pin 10 is removed from the hole 9 of travelling gear 6, and consolidating for clamping pin 4 is released
It is fixed.Furthermore in waiting time fixed clamp pin 4 after the supporting of wafer W, such as Fig. 3, if declining ejector pin 11, will can make
Dynamic pin 10 is penetrated to hole 9, fixed clamp pin 4.Consequently, it is possible to by upper ejector pin 11, it just can switch in simple method and clamp
The fixation of pin 4 and fixed releasing.In addition, moving up and down for upper ejector pin 11 can be carried out through cylinder 12.
In addition, in Fig. 1,3, although figure illustrate only an arrestment mechanism 8, the quantity of arrestment mechanism 8 is not limited
In this, wafer supporting arrangement 1 of the invention can also possess multiple arrestment mechanisms 8.In the case where possessing multiple arrestment mechanisms 8,
Can suitably it set in response to hole 9, upper ejector pin 11 and cylinder 12 of the quantity in arrestment mechanism 8 etc..
Furthermore arrestment mechanism 8 also as above can be not limited to banking pin 10, as long as can be braking clamping pin rotation
The rotation of mechanism 5.For example, such as from sandwiching up and down and the so-called braking mechanism of brake gear 6 also may be used.
Furthermore sayed as above-mentioned, the fixation of clamping pin 4 in the clamping of wafer W and when clamping releases, can be released,
And rotate travelling gear 6.At this time, such as Fig. 1, although upper ejector pin 11 inserts hole 9, using hole 9 as according to travelling gear 6
Direction of rotation extension elongated hole from the point of view of, as long as by making upper ejector pin 11 thinner than the width in elongated hole, enable ejector pin 11
Travelling gear 6 is not interfered, upper ejector pin 11 just will not hinder the rotation of travelling gear 6.In this situation, the length in elongated hole, as long as
It is clamping pin rotating mechanism 5 is rotated in the case where the degree of the clamping of clamping pin 4 and clamping releasing can be carried out.
In wafer supporting arrangement 1 of the invention as more than, clamping pin rotating mechanism 5 rotates, and is prejudicially erected on clamping
Rotation axis of the branched clamping pin 4 of rotating mechanism 5 around clamping pin rotating mechanism 5 in a manner of contacting the side of wafer W is sold to revolve round the sun
It is mobile and from side support wafer W.Afterwards, the rotation of clamping pin rotating mechanism 5 is braked by arrestment mechanism 8, is able to geometrical clamp
Hold pin 4.If wafer supporting arrangement 1 of the invention so, even if during the rotating acceleration of tables during wafer-process and deceleration
When centrifugal force produce, since clamping pin 4 is fixed through arrestment mechanism 8, therefore the direction changing of the relative positions will not be released to clamping.Therefore,
The wafer supporting arrangement 1 of the present invention can prevent the generation that wafer slides.
Then, will be explained for the wafer processing device of the present invention.Such as Fig. 4, wafer processing device 20 of the invention, its
Possesses chamber 21, wherein the tables 2 of above-mentioned wafer supporting arrangement 1 of the invention are contained in the inside of chamber.In addition, also can be in
The tables 2 of the multiple wafer supporting arrangements 1 of inner containment of chamber 21., can be in wafer W if wafer processing device 20 so
Processing when prevent wafer slide generation.
If wafer processing device 20 so, for example, can be the revolving wet type processing device of monolithic.For example, energy
While the liquid of wet processed is supplied to wafer W from nozzle 22, flatly support wafer W and make its rotation, and at the same time into
The set processing of row.When carrying out this wet processed, since the wafer processing device 20 of the present invention can prevent the hair of wafer sliding
It is raw, therefore can prevent bad and wafer scar the generation of processing caused by liquid splash.
For example, although the wafer processing device 20 that can apply the wafer supporting arrangement of the present invention can be the clean processing of wafer
Device, spin etch processing unit, rotary coating processing unit, photoresist lift-off processing device and polymer are removed in processing unit
Any one, but it's not limited to that.Processing of the wafer processing device 20 of the present invention especially suitable for these types, by preventing
The splash of liquid used in each processing, and can prevent from cleaning, etch, rotary coating, photoresist are peeled off, polymer removal processing
Among handle undesirable generation.Furthermore it can also prevent the generation of wafer scar.
Though in addition, be not particularly limited on the wafer for being supported by, handling, for example, can propose Silicon Wafer, SiC wafers,
GaN wafers, quartz base plate etc..
[embodiment]
It is lower that the embodiment of the present invention and comparative example is presented, more specific description is done to the present invention, but it is of the invention and unlimited
Due to embodiment.
(embodiment)
As shown in Figure 1, flatly support the Silicon Wafer of diameter 300nm using the wafer supporting arrangement of the present invention and make its rotation
Turn, be carried out at the same time and clean processing using the rotation of the one chip of mixed acid.At this time, first, the banking pin of arrestment mechanism is passed through
Upper ejector pin jacks up, and travelling gear is rotated according to clamping direction in the state of it departs from the hole of travelling gear, makes branched folder
Revolve round the sun in a manner of the side for holding wafer of the pin to contact clean object movement, and flatly support Silicon Wafer whereby.Then, pass through
Cylinder declines ejector pin, is penetrated by banking pin to the hole of travelling gear, fixed branched clamping pin.Then, revolve tables
Turn, and supply detergent remover to the surface of Silicon Wafer, and be carried out at the same time rotation and clean.After rotation is cleaned, by arrestment mechanism
Banking pin is jacked up through upper ejector pin, is allowed to the hole removal from travelling gear, and releases the fixation of branched clamping pin.Then, make
Travelling gear releases direction towards clamping and rotates, and releases fixation of the branched clamping pin to wafer, and takes out Silicon Wafer.
As more than, processing is cleaned in the rotation for imposing one chip to 100 Silicon Wafers.Then, light microscope inspection is passed through
The cleanliness factor and scar of Silicon Wafer after cleaning.As a result, all Silicon Wafers all obtain enough cleanliness factors, do not confirm
To there is clean undesirable generation.In addition, also without the generation for confirming to have scar.From this result it will be appreciated that can prevent rotation from washing
Wafer sliding in net.
(comparative example)
Such as Fig. 5, except supporting wafer using the known wafer supporting arrangement for not possessing arrestment mechanism and making its rotation,
And with one chip rotate at the same time and clean beyond processing, under the same conditions, rotate with embodiment and clean 100 silicon wafers
Circle.
As a result, bright spot is observed on the wafer of part, it is bad there occurs cleaning.In addition, also observed on 5 Silicon Wafers
Produced to scar.From this result it will be appreciated that there occurs wafer sliding during rotation is clean.
In addition, the present invention is not limited to above-mentioned implementation kenel.Above-mentioned implementation kenel is for example, all have and this
The substantially same composition of technological thought described in the claim of invention, produce the effect of identical, no matter being what
All it is included in the technical scope of the present invention.
Claims (10)
1. a kind of wafer supporting arrangement, it flatly supports wafer, and the wafer for making to be supported can be rotation, which supports
Device includes：
Tables, top is supported on by the wafer；
More clamping pins, configure in the upper surface of the tables in a manner of around the wafer, and with the contacts side surfaces of the wafer,
And from side can be support the wafer；
Clamping pin rotating mechanism, is disposed in a manner of the upper surface for penetrating through the tables in the tables, can be rotation and the clamping
Sell on the top of the clamping pin rotating mechanism prejudicially to be erected relative to rotation axis；
Arrestment mechanism, can be the rotation for braking the clamping pin rotating mechanism；And
Tables' support shaft, from the supported underneath tables, obtains so that the tables rotate,
Wherein the clamping pin rotating mechanism rotates, and is prejudicially erected on more clamping pins of the clamping pin rotating mechanism and is somebody's turn to do with contact
The mode of the side of wafer it is mobile around the rotation axis revolution of the clamping pin rotating mechanism and from the side support wafer and in the branch
The arrestment mechanism brakes the rotation of the clamping pin rotating mechanism after holding, so as to fixing the clamping pin.
2. wafer supporting arrangement as claimed in claim 1, wherein the clamping pin rotating mechanism have with being disposed in the tables
The clamping drive gear that is meshed of travelling gear, rotate the clamping drive gear by the rotation of the travelling gear, and
Rotate the clamping pin rotating mechanism.
3. wafer supporting arrangement as claimed in claim 1, the wherein travelling gear have hole, which passes through braking
Pin is penetrated to the hole of the travelling gear, and fixes the travelling gear, the rotation of the braked clamping pin rotating mechanism.
4. wafer supporting arrangement as claimed in claim 2, the wherein travelling gear have hole, which passes through braking
Pin is penetrated to the hole of the travelling gear, and fixes the travelling gear, the rotation of the braked clamping pin rotating mechanism.
5. wafer supporting arrangement as claimed in claim 3, with more by being headed into upwards below the hole from the travelling gear
And the floating weight for removing the banking pin from hole is able to, through the floating weight, that is, it is able to the fixation in the wafer and fixed solution
Except when, by the way that the banking pin is removed from the hole of the travelling gear, and release the fixation of the clamping pin.
6. wafer supporting arrangement as claimed in claim 4, with more by being headed into upwards below the hole from the travelling gear
And the floating weight for removing the banking pin from hole is able to, through the floating weight, that is, it is able to the fixation in the wafer and fixed solution
Except when, by the way that the banking pin is removed from the hole of the travelling gear, and release the fixation of the clamping pin.
A kind of 7. wafer processing device, wherein the tables tool of the wafer supporting arrangement as any one of claim 1 to 6
Have the chamber for being contained in inside.
8. wafer processing device as claimed in claim 7, the wherein wafer processing device are the revolving wet processed of monolithic
Device.
9. wafer processing device as claimed in claim 7, the wherein wafer processing device are the clean processing unit of wafer, rotation
Turn etching process device, rotary coating processing unit, photoresist lift-off processing device and polymer and remove any one in processing unit.
10. wafer processing device as claimed in claim 8, the wherein wafer processing device for wafer clean processing unit,
Spin etch processing unit, rotary coating processing unit, photoresist lift-off processing device and polymer remove any in processing unit
Person.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016207022A JP6322256B2 (en) | 2016-10-21 | 2016-10-21 | Wafer holding apparatus and wafer processing apparatus |
| JP2016-207022 | 2016-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107978542A true CN107978542A (en) | 2018-05-01 |
Family
ID=62012516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710974318.3A Pending CN107978542A (en) | 2016-10-21 | 2017-10-19 | Wafer supporting arrangement and wafer processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6322256B2 (en) |
| KR (1) | KR20180044205A (en) |
| CN (1) | CN107978542A (en) |
| TW (1) | TW201828398A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113604862B (en) * | 2021-07-29 | 2022-07-26 | 复旦大学 | Safe, reliable and intelligent semiconductor electroplating equipment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3695772B2 (en) * | 1994-03-31 | 2005-09-14 | エム・セテック株式会社 | Dry scrubber |
| JPH11233474A (en) * | 1997-10-22 | 1999-08-27 | Hitachi Ltd | Device for fluid treatment of sheet parts |
| JP3956350B2 (en) * | 2002-03-25 | 2007-08-08 | 東京エレクトロン株式会社 | Substrate processing apparatus having positioning function and substrate processing method having positioning function |
| JP5301505B2 (en) * | 2009-08-27 | 2013-09-25 | 東京エレクトロン株式会社 | Liquid processing apparatus and liquid processing method |
| US9190310B2 (en) * | 2010-04-16 | 2015-11-17 | Lam Research Ag | Grounded chuck |
| US9147593B2 (en) * | 2012-10-10 | 2015-09-29 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles |
| JP6400977B2 (en) * | 2013-09-25 | 2018-10-03 | 芝浦メカトロニクス株式会社 | Spin processing device |
-
2016
- 2016-10-21 JP JP2016207022A patent/JP6322256B2/en active Active
-
2017
- 2017-10-19 CN CN201710974318.3A patent/CN107978542A/en active Pending
- 2017-10-19 TW TW106135803A patent/TW201828398A/en unknown
- 2017-10-19 KR KR1020170135841A patent/KR20180044205A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6322256B2 (en) | 2018-05-09 |
| TW201828398A (en) | 2018-08-01 |
| KR20180044205A (en) | 2018-05-02 |
| JP2018067684A (en) | 2018-04-26 |
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