KR20070118205A - Chuck Structure of Wafer Cleaning Device - Google Patents

Chuck Structure of Wafer Cleaning Device Download PDF

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Publication number
KR20070118205A
KR20070118205A KR1020070019481A KR20070019481A KR20070118205A KR 20070118205 A KR20070118205 A KR 20070118205A KR 1020070019481 A KR1020070019481 A KR 1020070019481A KR 20070019481 A KR20070019481 A KR 20070019481A KR 20070118205 A KR20070118205 A KR 20070118205A
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KR
South Korea
Prior art keywords
wafer
finger
clamp
chuck
turntable
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KR1020070019481A
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Korean (ko)
Inventor
이상면
Original Assignee
김경희
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Priority to KR1020070019481A priority Critical patent/KR20070118205A/en
Publication of KR20070118205A publication Critical patent/KR20070118205A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02082Cleaning product to be cleaned
    • H01L21/0209Cleaning of wafer backside

Abstract

A chuck structure of a wafer cleaning apparatus is provided to prevent a wafer from being separated from a chuck when a chuck rotates, by positioning a clamp of a finger on the wafer through a non-contact method while using centrifugal force. A chuck includes a turntable(100) of a disk plate type and a plurality of fingers(200) that are installed at regular intervals in the outer part of the turntable to avoid the separation of a wafer(400). The finger has a finger body buried into the upper part of the turntable. Placement protrusions are built in the front part of the finger body so that the edge of the wafer is placed on the protrusions, and a clamp(260) axially rotating forward from the finger body is installed in the finger body. A separation preventing protrusion is formed in the front part of the body of a clamp, and a weight part is built in the rear part of the clamp body so that more weight is applied to the rear part than the front part. When the turntable rotates, the separation preventing protrusion of the clamp is structure to be position on the edge of the wafer. Grooves can be formed in the center direction of the turntable to mount the clamp, and coupling holes can be respectively formed in the finger body and the clamp body so that the finger body and the clamp body can rotate by a coupling pin.

Description

웨이퍼 세정 장치의 척 구조{omitted}Chuck Structure of Wafer Cleaning Apparatus
도 1은 종래의 웨이퍼 세정 장치를 보인 도.1 shows a conventional wafer cleaning apparatus.
도 2는 본 발명에 의한 웨이퍼 세정 장치의 척 구조를 보인 사시도.Figure 2 is a perspective view showing the chuck structure of the wafer cleaning apparatus according to the present invention.
도 3은 핑거의 분해 사시도.3 is an exploded perspective view of a finger;
도 4는 도 2의 측면도.4 is a side view of FIG. 2;
도 5는 핑거의 작동 상태를 설명하기 위한 도.5 is a view for explaining the operating state of the finger.
* 도면의 주요부분에 대한 부호설명* Explanation of symbols on the main parts of the drawings
100 - 턴테이블 200 - 핑거100-turntable 200-finger
210 - 핑거 몸체 220 - 클램프 장착홈210-Finger Body 220-Clamp Mounting Groove
230,240 - 안착 돌기 250 - 결합공230,240-Seating protrusions 250-Clutches
260 - 클램프 261 - 클램프 몸체260-Clamp 261-Clamp Body
262 - 이탈 방지 돌기 263 - 결합공262-Breakaway protrusion 263-Clutches
264 - 중량부 270 - 결합핀264-Weight 270-Coupling Pin
300 - 모터 400 - 웨이퍼300-Motor 400-Wafer
본 발명은 웨이퍼 세정 장치의 척 구조에 관한 것으로, 좀 더 자세하게는 웨이퍼의 세정을 위한 척 구조를 단순화함과 아울러 웨이퍼의 후면까지도 세정이 가능하도록 하고, 또한 비접촉식으로 웨이퍼를 고정하도록 하는 웨이퍼 세정 장치의 척 구조에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chuck structure of a wafer cleaning apparatus, and more particularly, to simplify the chuck structure for cleaning a wafer, to clean the back surface of the wafer, and to fix the wafer in a non-contact manner. Of the chuck structure.
일반적으로, 웨이퍼에 식각 등의 포토 공정을 행한 다음, 잔여 물질 등을 세정하기 위하여
Figure 112007502077507-PAT00006
(wet) 공정을 수행하게 된다.
In general, a photo process such as etching is performed on a wafer, and then, in order to clean the remaining material, etc.
Figure 112007502077507-PAT00006
(wet) perform the process.
이러한
Figure 112007502077507-PAT00007
공정을 수행하기 위하여 도 1과 같이 세정컵(1)의 내부에 웨이퍼를 고정하기 위한 척(5)이 위치하고, 이러한 척(5)을 고속으로 회전시키게 위하여 컵(1)의 하부에 모터(3)가 위치하게 된다.
Such
Figure 112007502077507-PAT00007
In order to perform the process as shown in FIG. ) Will be located.
모터(3)의 축에 척(5)이 설치되고, 이 척(5)의 상부에 웨이퍼(7)가 놓여지게 되면, 모터(3)가 구동하여 척(5)이 회전됨으로써 웨이퍼(7)가 고속 회전하게 된다.When the chuck 5 is installed on the shaft of the motor 3 and the wafer 7 is placed on the chuck 5, the motor 3 is driven to rotate the chuck 5 so that the wafer 7 is rotated. Will rotate at high speed.
이때, 척(5)은 웨이퍼(7)를 진공 흡착함으로써 이탈이 방지되도록 하고, 컵(1)의 내부에 세정액을 분사하는 세정 노즐(도시하지 않음)이 구비되어 웨이퍼(7)의 상부면 및 하부면에 세정액을 분사하게 된다.At this time, the chuck 5 is vacuum-adsorbed to the wafer 7 to prevent the separation, and a cleaning nozzle (not shown) for spraying the cleaning liquid is provided inside the cup 1 to provide an upper surface of the wafer 7 and The cleaning liquid is sprayed on the lower surface.
그런데, 이러한 종래의 척 구조는 다음과 같은 문제점을 가지게 된다.However, such a conventional chuck structure has the following problems.
1) 척(5)의 상부에 웨이퍼(7)를 고정하기 위해서는 진공을 발생하기 위한 장치가 필요하며, 또한 척(5)의 구조 또한 진공 흡입력을 웨이퍼(7)에 전달하기 위한 복잡한 구조를 가져야 한다.1) In order to fix the wafer 7 on top of the chuck 5, a device for generating a vacuum is required, and the structure of the chuck 5 must also have a complicated structure for transmitting the vacuum suction force to the wafer 7. do.
2) 웨이퍼(7)의 하부 가운데 부분을 척(5)이 흡착하고 있으므로, 그 흡착 부위에는 세정액이 분사될 수 없어서 완벽한 세정이 이루어지지 못하므로 불량의 발 생 소지가 매우 높다.2) Since the chuck 5 adsorbs the lower center portion of the wafer 7, the cleaning solution cannot be injected to the adsorption site and thus the perfect cleaning cannot be achieved.
3) 또한, 척(5)이 웨이퍼(7)의 하부에 직접 접촉하여 흡착하고 있으므로, 웨이퍼(7)가 물리적으로 손상될 가능성이 매우 높다.3) In addition, since the chuck 5 is in direct contact with the lower portion of the wafer 7 and adsorbed, it is very likely that the wafer 7 is physically damaged.
따라서, 본 발명은 이러한 문제점을 감안하여, 진공 흡착 방식을 배제하고, 턴테이블 형태의 척의 상부에 웨이퍼가 단순히 놓여져 지지되도록 하는 핑거 구조를 척의 외곽에 설치하고, 척의 회전시에 웨이퍼가 부상되어 이탈되는 경우를 방지하기 위하여 원심력에 의하여 핑거의 클램프가 웨이퍼의 상부에 비접촉식으로 위치하도록 함으로써 종래의 문제점을 해결하도록 한다.Therefore, in view of the above problems, the present invention excludes the vacuum adsorption method and installs a finger structure on the outer side of the chuck so that the wafer is simply placed and supported on the top of the turntable type chuck, and the wafer is floated and released during rotation of the chuck. In order to prevent the case by the centrifugal force to solve the conventional problem by the non-contact position of the clamp of the finger on the top of the wafer.
이러한 목적을 달성하기 위하여 본 발명의 웨이퍼 세정 장치의 척 구조는, 웨이퍼의 세정을 위하여 컵의 내부에 웨이퍼를 회전시키기 위한 척이 구비되며, 척의 하부에 척을 회전시키기 위한 모터가 설치되어 세정 노즐을 통하여 세정액을 웨이퍼에 분사하도록 구성된 웨이퍼 세정 장치에 있어서,In order to achieve the above object, the chuck structure of the wafer cleaning apparatus of the present invention is provided with a chuck for rotating the wafer in the cup for cleaning the wafer, and a motor for rotating the chuck is installed at the lower part of the cup for cleaning the nozzle. A wafer cleaning apparatus configured to spray a cleaning liquid onto a wafer through
척은, 원판 형태의 턴테이블과, 그 턴테이블 외곽부에 일정 간격으로 설치되어 웨이퍼의 이탈을 방지하는 복수개의 핑거가 구비되며,The chuck is provided with a turntable in the form of a disc and a plurality of fingers provided at an outer portion of the turntable to prevent separation of the wafer.
핑거는, 턴테이블의 상부로 입설되는 핑거 몸체를 가지며, 그 핑거 몸체의 전방부에는 웨이퍼의 가장자리가 놓여지도록 안착 돌기가 일체로 형성되며, 또한 핑거 몸체에는 그 핑거 몸체로부터 전방으로 축 회전하는 클램프가 설치되고,The finger has a finger body which is entered into the top of the turntable, the front part of the finger body having a seating protrusion integrally formed so that the edge of the wafer is placed, and the finger body has a clamp axially rotating forward from the finger body. Installed,
클램프는, 클램프 몸체의 전방부에 이탈 방지 돌기가 형성되고, 그 몸체의 후방부에는 전방부보다 중량이 더 부가되도록 중량부가 일체로 형성되어, 턴테이블의 회전시 원심력에 의하여 클램프의 이탈 방지 돌기가 웨이퍼의 가장자리 상부에 위치되도록 구성된다.The clamp is provided with a release preventing protrusion at the front portion of the clamp body, and the weight portion is integrally formed at the rear portion of the body so as to add more weight than the front portion, and the release preventing protrusion of the clamp is caused by centrifugal force during rotation of the turntable. And is positioned above the edge of the wafer.
또한, 핑거 몸체는 턴테이블의 중심 방향으로 클램프를 장착하기 위한 홈이 형성되고, 핑거 몸체와 클램프 몸체에는 각각 결합공이 형성되어 결합핀에 의하여 회전이 가능하도록 형성된다.In addition, the finger body is formed with a groove for mounting the clamp in the direction of the center of the turntable, the coupling hole is formed in each of the finger body and the clamp body is formed to be rotatable by the coupling pin.
이와 같이 구성되는 본 발명의 동작과정들을 첨부한 도면들을 참조하여 설명하면 아래와 같다.Referring to the accompanying drawings, the operation of the present invention configured as described above is as follows.
먼저, 도 2에서와 같이 본 발명의 척은 원판 형태의 턴테이블(100)과, 그 턴테이블(100)의 상부 가장자리에 원주방향으로 일정 간격마다 설치된 핑거(200)로 구성된다.First, as shown in FIG. 2, the chuck of the present invention includes a turntable 100 having a disc shape and a finger 200 installed at regular intervals in a circumferential direction on an upper edge of the turntable 100.
턴테이블(100)은 도4에서와 같이 그 하부에 모터(300)가 위치하여 모터(300)의 회전에 의하여 고속 회전하도록 구성된다.As shown in FIG. 4, the turntable 100 is configured to rotate at a high speed by the rotation of the motor 300.
핑거(200)는 턴테이블(100)의 가장자리에서 그 전방부가 턴테이블(100)의 중심부를 향하여 설치되며, 핑거(200)의 개수로는 6개가 적당하며, 60도 간격으로 일정하게 설치됨이 바람직할 것이다.Fingers 200 is installed at the edge of the turntable 100 toward the center of the turntable 100, the number of the fingers 200 is suitable for six, it will be preferable to be installed at regular intervals of 60 degrees. .
이러한 핑거(200)의 상부에 웨이퍼가 놓여지게 되고, 턴테이블의 고속 회전에 의하여 웨이퍼도 고속 회전함으로써 도면에는 나타나지 않았으나 세정 노즐에 의하여 세정액이 분사되면 식각 공정에서 제거되지 않은 이물질 등이 세정되는 것이다.The wafer is placed on the upper portion of the finger 200, and the wafer is also rotated at a high speed by the high speed rotation of the turntable. However, when the cleaning liquid is sprayed by the cleaning nozzle, foreign matters not removed in the etching process are cleaned.
또한, 턴테이블(100)의 외측에는 도1에서와 같이 세정컵(1)이 당연히 구비되어진다.In addition, the cleaning cup 1 is naturally provided on the outside of the turntable 100 as shown in FIG.
한편, 웨이퍼의 고속 회전시에 웨이퍼가 턴테이블로부터 부상되어 이탈되는 경우를 방지하기 위하여 핑거(200)가 웨이퍼의 이탈 방지를 담당하게 되는데, 이러한 핑거(200)의 구조를 도3을 참조하여 설명한다.On the other hand, in order to prevent the wafer is lifted off the turntable during high-speed rotation of the wafer to prevent the separation of the wafer 200, the structure of the finger 200 will be described with reference to FIG. .
핑거(200)는 핑거 몸체(210)와 클램프(260)로 이루어지는데, 핑거 몸체(210)는 턴테이블(100)의 가장자리 상부에 입설되며, 그 핑거 몸체(210)의 가운데 부분은 턴테이블(100)의 중심부를 향하여 클램프 장착홈(220)이 형성되어 이에 클램프(260)가 결합핀(270)에 의하여 회전 가능하도록 설치된다.Finger 200 is composed of a finger body 210 and the clamp 260, the finger body 210 is placed on the upper edge of the turntable 100, the center portion of the finger body 210 is the turntable 100 Clamp mounting groove 220 is formed toward the center of the clamp 260 is installed to be rotatable by the coupling pin 270.
또한, 핑거 몸체(210)의 전방부 즉, 턴테이블(100)의 중심부를 향하는 방향에는 웨이퍼가 놓여지기 위한 한 쌍의 안착 돌기(230,240)가 형성되어 웨이퍼를 하부에서 지지하게 된다.In addition, a pair of mounting protrusions 230 and 240 for placing the wafer are formed at the front of the finger body 210, that is, toward the center of the turntable 100 to support the wafer from below.
그리고, 핑거 몸체(210)의 전방부 상단은 경사를 가지고 있어서, 웨이퍼를 안착 돌기(230,240)의 상부로 유도함으로써 턴테이블(100)의 상부에서 센터링을 행하게 되는 것이다.In addition, since the upper end of the front portion of the finger body 210 has an inclination, the centering is performed at the top of the turntable 100 by guiding the wafer to the top of the seating protrusions 230 and 240.
클램프(260)는 그 클램프 몸체(261)가 삼각형 형태를 가지며, 그 몸체(261)의 상부 모서리에는 전방으로 이탈 방지 돌기(262)가 형성되고, 몸체(261)의 후방부는 전방부보다 무게를 더하기 위하여 중량부(264)가 형성되어 있다.The clamp 260 has a triangular shape, the clamp body 261, the front edge of the body 261 is formed with a release preventing projection 262 forward, the rear portion of the body 261 is more weight than the front portion The weight part 264 is formed in order to add.
중량부(264)는 클램프 몸체(261)의 두께를 전방부보다 더 두껍게 함으로써 형성될 수 있다.The weight portion 264 may be formed by making the clamp body 261 thicker than the front portion.
핑거 몸체(210)와 클램프 몸체(261)에는 각각 결합공(250,263)이 각각 설치되어 결합핀(270)에 의하여 클램프(260)가 핑거 몸체(210)의 클램프 장착홈(220)에서 전후 방향으로 회전이 가능하게 된다.Coupling holes 250 and 263 are installed in the finger body 210 and the clamp body 261, respectively, so that the clamp 260 is moved forward and backward in the clamp mounting groove 220 of the finger body 210 by the coupling pin 270. Rotation is possible.
이때, 클램프(260)의 결합공(263)의 지름은 결합핀(270)의 지름보다 크게 형성됨으로써 자유 회전이 가능하도록 하여야 한다.At this time, the diameter of the coupling hole 263 of the clamp 260 is to be formed larger than the diameter of the coupling pin 270 to enable free rotation.
이와 같이 척이 구성되어지면 도4와 같이 핑거(200)의 안착 돌기(230)에 웨이퍼(400)가 놓여지게 되고, 턴테이블(100)을 모터(300)에 의하여 고속 회전시키면서 웨이퍼의 상부면 및 하부면에 세정액을 세정노즐에 의하여 분사하게 된다.When the chuck is configured as described above, the wafer 400 is placed on the seating protrusion 230 of the finger 200 as shown in FIG. 4, and the upper surface of the wafer is rotated at a high speed by the motor 300. The cleaning liquid is sprayed on the lower surface by the cleaning nozzle.
웨이퍼 하부면의 세정액 분사는 턴테이블(100)의 측면에서 분사할 수 있을 것이고, 또 다른 방안으로는 턴테이블(100)에 형성된 통공을 통하여 분사가 이루어질 수 있으며, 웨이퍼(400)를 종래와 같이 중심부를 진공흡착하지 않으므로 하부면 전체에 대하여 골고루 세정을 행할 수 있다.The cleaning liquid spray on the lower surface of the wafer may be sprayed on the side of the turntable 100. In another method, the spray may be sprayed through the through hole formed in the turntable 100. Since vacuum suction is not carried out, the whole lower surface can be wash | cleaned evenly.
한편, 웨이퍼(400)가 턴테이블(100)의 상부에서 고속회전을 하는 경우 상부로 부상하여 핑거(200)로부터 이탈하는 경우가 발생하게 되는데, 이를 클램프(260)가 방지하게 된다.On the other hand, when the wafer 400 rotates at the top of the turntable 100 at a high speed, the wafer 400 rises and escapes from the finger 200, which is prevented by the clamp 260.
클램프(260)의 동작을 도5를 참조하여 설명하면, 턴테이블(100)이 회전하지 않는 경우는 (a)와 같이 클램프 몸체(261)가 중량부(264)에 의하여 뒤로 젖혀진 상태가 되므로 이탈방지돌기(262)가 핑거 몸체(210)의 상부를 향하게 된다.The operation of the clamp 260 will be described with reference to FIG. 5. When the turntable 100 does not rotate, the clamp body 261 is turned upside down by the weight part 264 as shown in (a). Prevention protrusion 262 is directed to the upper portion of the finger body (210).
그러므로, 안착돌기(230)에 웨이퍼(400)를 올려놓을 수 있다.Therefore, the wafer 400 may be placed on the seating protrusion 230.
웨이퍼(400)가 놓여진 상태에서 턴테이블(100)이 고속 회전하게 되면, (b)와 같이 원심력에 의하여 클램프 몸체(261)의 중량부(264)가 들려지게 되어 이탈방지돌기(262)가 웨이퍼(400)의 상부에 위치하게 된다.When the turntable 100 rotates at a high speed in the state where the wafer 400 is placed, the weight part 264 of the clamp body 261 is lifted by the centrifugal force as shown in (b) so that the release preventing protrusion 262 is moved to the wafer ( 400 is located on the top.
이때, 이탈방지돌기(262)는 웨이퍼(400)에 직접적으로 닿지 않고 1mm정도의 간격을 유지함으로써 웨이퍼(400)의 손상을 방지하고, 다만 웨이퍼(400)가 부상하는 경우에만 비로소 접촉되므로 이탈을 방지하게 된다.At this time, the departure prevention protrusion 262 prevents damage to the wafer 400 by maintaining an interval of about 1 mm without directly contacting the wafer 400, but only because the wafer 400 is in contact with the wafer 400 so as to be detached. Will be prevented.
또한, 클램프 몸체(261)가 삼각형으로 되어 있어서, 그 모서리 부분이 클램프 장착홈(220)의 바닥부(221)에 닿게 되어 회전하는 각도가 제한된다.In addition, since the clamp body 261 has a triangular shape, the corner portion of the clamp body 261 contacts the bottom portion 221 of the clamp mounting groove 220, thereby limiting the rotation angle.
즉, 이탈 방지 돌기(262)가 형성된 부분을 제외한 2개의 모서리 부분이 도5에서와 같이 번갈아 클램프 장착홈(220)의 바닥부(221)에 접촉함으로써 클램프(260)가 웨이퍼(400)에 직접 접촉하는 것이 방지되는 것이다.That is, the two corner portions except for the portion where the separation preventing protrusion 262 is formed alternately contact the bottom portion 221 of the clamp mounting groove 220 as shown in FIG. 5 so that the clamp 260 directly contacts the wafer 400. Contact is prevented.
이와 같이 본 발명은, 웨이퍼를 세정함에 있어서, 진공 흡착 방식을 배제하고, 턴테이블 형태의 척의 상부에 웨이퍼가 단순히 놓여져 지지되도록 하는 핑거 구조를 척의 외곽에 설치하고, 척의 회전시에 웨이퍼가 부상되어 이탈되는 경우를 방지하기 위하여 원심력에 의하여 핑거의 클램프가 웨이퍼의 상부에 비접촉식으로 위치하도록 함으로써 종래의 문제점을 해결하였다.Thus, in the present invention, in cleaning the wafer, the vacuum suction method is eliminated, and a finger structure is provided on the outer side of the chuck so that the wafer is simply placed and supported on the top of the turntable type chuck, and the wafer is floated and released during rotation of the chuck. In order to prevent the case is to solve the conventional problem by the non-contact position of the clamp of the finger by the centrifugal force on the top of the wafer.
즉, 진공흡입장치를 배제하였고, 진공흡입을 위한 복잡한 구조를 없애서 단순화 하였으며, 웨이퍼의 후면까지 완벽한 세정이 이루어지도록 함과 아울러 웨이퍼가 물리적으로 척에 접촉하는 경우를 최대한 배제함으로써 웨이퍼의 손상에 따른 불량을 최소화였다.In other words, the vacuum suction device was eliminated, the complicated structure for vacuum suction was eliminated, and the cleaning was performed to the back side of the wafer, and the wafer was physically contacted with the chuck as much as possible. The defect was minimized.
이러한 본 발명은
Figure 112007502077507-PAT00008
공정뿐만 아니라 포토 공정, 디벨롭 공정 등의 다양한 반도체 웨이퍼 처리 공정에 이용될 수 있을 것이다.
This invention is
Figure 112007502077507-PAT00008
In addition to the process, it can be used in various semiconductor wafer processing processes such as photo process, development process and the like.

Claims (2)

  1. 웨이퍼의 세정을 위하여 컵의 내부에 웨이퍼를 회전시키기 위한 척이 구비되며, 척의 하부에 척을 회전시키기 위한 모터가 설치되어 세정 노즐을 통하여 세정액을 웨이퍼에 분사하도록 구성된 웨이퍼 세정 장치에 있어서,In the wafer cleaning apparatus is provided with a chuck for rotating the wafer inside the cup for cleaning the wafer, a motor for rotating the chuck in the lower portion of the cup is configured to spray the cleaning liquid to the wafer through the cleaning nozzle,
    척은, 원판 형태의 턴테이블과, 그 턴테이블 외곽부에 일정 간격으로 설치되어 웨이퍼의 이탈을 방지하는 복수개의 핑거가 구비되며,The chuck is provided with a turntable in the form of a disc and a plurality of fingers provided at an outer portion of the turntable to prevent separation of the wafer.
    핑거는, 턴테이블의 상부로 입설되는 핑거 몸체를 가지며, 그 핑거 몸체의 전방부에는 웨이퍼의 가장자리가 놓여지도록 안착 돌기가 일체로 형성되며, 또한 핑거 몸체에는 그 핑거 몸체로부터 전방으로 축 회전하는 클램프가 설치되고,The finger has a finger body which is entered into the top of the turntable, the front part of the finger body having a seating protrusion integrally formed so that the edge of the wafer is placed, and the finger body has a clamp axially rotating forward from the finger body. Installed,
    클램프는, 클램프 몸체의 전방부에 이탈 방지 돌기가 형성되고, 그 몸체의 후방부에는 전방부보다 중량이 더 부가되도록 중량부가 일체로 형성되어,The clamp is formed in the front of the clamp body to prevent the separation projection, the rear portion of the body is integrally formed with a weight portion so that the weight is added to the front portion,
    턴테이블의 회전시 원심력에 의하여 클램프의 이탈 방지 돌기가 웨이퍼의 가장자리 상부에 위치되도록 구성된 것을 특징으로 하는 웨이퍼 세정 장치의 척 구조.The chuck structure of the wafer cleaning apparatus, characterized in that the clamping prevention projection of the clamp is located above the edge of the wafer by the centrifugal force during rotation of the turntable.
  2. 제1 항에 있어서, 핑거 몸체는 턴테이블의 중심 방향으로 클램프를 장착하기 위한 홈이 형성되고, 핑거 몸체와 클램프 몸체에는 각각 결합공이 형성되어 결합핀에 의하여 회전이 가능하도록 형성된 것을 특징으로 하는 웨이퍼 세정 장치의 척 구조.The wafer cleaning apparatus according to claim 1, wherein the finger body is provided with a groove for mounting the clamp in the direction of the center of the turntable, and a coupling hole is formed in each of the finger body and the clamp body to be rotatable by the coupling pin. Chuck structure of the device.
KR1020070019481A 2007-02-23 2007-02-23 Chuck Structure of Wafer Cleaning Device KR20070118205A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109727890A (en) * 2017-10-30 2019-05-07 台湾积体电路制造股份有限公司 Substrate processing apparatus, rotary fixed base and substrate processing method using same
US11133200B2 (en) 2017-10-30 2021-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate vapor drying apparatus and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109727890A (en) * 2017-10-30 2019-05-07 台湾积体电路制造股份有限公司 Substrate processing apparatus, rotary fixed base and substrate processing method using same
KR20200086249A (en) * 2017-10-30 2020-07-16 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Substrate vapor dryibg apparatus and method
US11133200B2 (en) 2017-10-30 2021-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate vapor drying apparatus and method

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