CN107960135B - The manufacturing method of light emitting device, back lighting device and light emitting device - Google Patents

The manufacturing method of light emitting device, back lighting device and light emitting device Download PDF

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Publication number
CN107960135B
CN107960135B CN201680047239.1A CN201680047239A CN107960135B CN 107960135 B CN107960135 B CN 107960135B CN 201680047239 A CN201680047239 A CN 201680047239A CN 107960135 B CN107960135 B CN 107960135B
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China
Prior art keywords
light emitting
emitting device
resin
led element
light
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Expired - Fee Related
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CN201680047239.1A
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CN107960135A (en
Inventor
川井若浩
大竹和幸
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Europa Corp
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Europa Corp
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/06181—On opposite sides of the body
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
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    • H01L2224/2518—Disposition being disposed on at least two different sides of the body, e.g. dual array
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
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    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L33/56—Materials, e.g. epoxy or silicone resin
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
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    • H10K50/805—Electrodes
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Abstract

The present invention realizes a kind of manufacturing method of light emitting device, back lighting device and light emitting device for more minimizing and being thinned.In light emitting device (1), LED element (3~6) is to be exposed by illumination region (32~62) in the side (22) of resin-formed body (2) and anode (33~63) and cathode (34~64) are embedded in resin-formed body (2) in such a way that the back side (23) orthogonal with side (22) of resin-formed body (2) is exposed.

Description

The manufacturing method of light emitting device, back lighting device and light emitting device
Technical field
The present invention relates to one kind to have the light-emitting components such as light emitting diode (Light Emitting Diode, LED) element Light emitting device, back lighting device and light emitting device manufacturing method.
Background technique
In the past, usually used to have multiple light emitting diodes as the electronic component for illuminating liquid crystal display from the back side (LED) backlight of element.In addition, the backlight has marginal mode and straight-down negative, the small-sized liquid crystal used in Mobile terminal etc., Marginal mode is used in notebook PC and LCD monitor etc..
Marginal mode backlight makes multiple LED element proper alignments be configured at the either side of plate light guide plate, passes light through and leads Tabula rasa and the entire surface for being irradiated in liquid crystal display.This mode required LED element number compared with straight-down negative is few, therefore has low cost And energy conservation or the advantages that liquid crystal display can be made to be thinned.
In recent years, marginal mode backlighting requirements are more thinned than before, have had developed and has been set as plate light guide plate The LED element of 0.3mm processing and forming below or thickness 0.3mm.
In the past, it for multiple LED elements of proper alignment backlight, is substantially carried out and is welded on LED element using solder Method on printed base plate.However, in the method backlight it is further slimming there are the limit.
Fig. 7 (a) and Fig. 7 (b) is the figure for indicating the composition of light emitting device 101 of the prior art.As shown in Fig. 7 (a), shine Device 101 has printed base plate 102 and multiple LED elements 103.In addition, LED element 103 has as shown in Fig. 7 (a) and Fig. 7 (b) Standby base portion 131, illumination region 132, anode 133 and cathode 134.
On the surface of printed base plate 102, wiring 121 is formed with by the methods of etching.In addition, by printed base plate 102 assemble with resin framework 105.
The illumination region 132 including light emitting diode is equipped on the first face of base portion 131.In turn, in base portion 131 and The second orthogonal face is equipped with anode 133 and cathode 134 on one side.Each LED element 103 is by using solder 122 by anode 133 And cathode 134 is connected to the surface for being routed 121 and being installed on printed base plate 102.
However, in the surface of printed base plate 102 installation LED member as the light emitting device 101 as shown in Fig. 7 (a) and Fig. 7 (b) The composition of part 103 has the following problems: the engagement due to needing the thickness of printed base plate 102, the thickness, solder 122 of wiring 121 The thickness in partial projection thickness and space required for assembling printed base plate 102 and resin framework 105, therefore shine The height (thickness in the direction H) of device 101 becomes the thickness of LED element 103 plus at least thickness of 0.1mm or so.
As the countermeasure for being directed to such problem, it is contemplated that the light emitting device 101a of the composition as shown in Fig. 8 (a) and Fig. 8 (b).
Fig. 8 (a) and Fig. 8 (b) is the figure for indicating the composition of light emitting device 101a of the prior art.This is shown in figure luminous In device 101a, anode 133 and cathode 134 are set to the side opposite with illumination region 132 of LED element 103, via solder 104 and connect with the wiring 121 on printed base plate 102.This constitute in, the height (thickness in the direction H) of printed base plate 102 with The height of LED element 103 is roughly equal, therefore the thickness of light emitting device 101a can be made to be thinned to the thickness with LED element 103 Identical degree.
However, the light emitting device 101a in order to realize the composition, needs to prepare the narrow printed base plate of the width of 0.3mm etc. 102.Processing for obtaining such printed base plate 102 is extremely difficult, therefore generating increases the manufacturing cost of light emitting device 101a The problems such as high.In turn, it is also possible to lead to LED element 103 due to the connection area of LED element 103 and printed base plate 102 becomes smaller Installation strength is insufficient.
In turn, the requirement in recent years to the miniaturization of electronic device and slimming is surging, it is therefore desirable to realize light emitting device Miniaturization.However, by the resulting light emitting device 101 (101a) of the existing installation method using solder 122, due to solder 122 soak diffusion or in order to ensure viewpoints such as installation strengths, it is necessary to ensure that solder 122 in light emitting device 101 (101a) is set Between emptying.Therefore, there are the limit for the miniaturization of light emitting device 101 (101a).
Therefore, have following various as the countermeasure that should be deviated to LED location when carrying out surface installation using wlding in the past Motion.
Disclose following methods in patent document 1: the LED installation site on printed base plate forms slot, inserts in this slot Enter to engage the LED component of dummy member (dummy, size is with the clipping room of LED away from identical), thus fixes the installation position of LED It sets.
Following methods are disclosed in patent document 2: being put into sticker in the hole being formed in printed base plate, adhered herein The top installation LED of agent is simultaneously solidified, and the installation site of LED is thus fixed.
Following methods are disclosed in patent document 3: by LED with after component assembling after positioning for the time being, LED being welded on print The installation site of LED is fixed on the circuit of brush substrate.
Existing technical literature
Patent document
Patent document 1: Japanese Laid-Open Patent Publication " Japanese Patent Laid-Open No. Sho 64-25582 bulletin (on January 27th, 1989 It is open) "
Patent document 2: Japanese Laid-Open Patent Publication " Japanese Patent Laid-Open 11-219961 bulletin (August 10 in 1999 Day is open) "
Patent document 3: Japanese Laid-Open Patent Publication " Japanese Patent Laid-Open 2008-16297 bulletin (on January 24th, 2008 It is open) "
Patent document 4: Japanese Laid-Open Patent Publication " Japanese Patent Laid-Open 5-150807 bulletin (on July 30th, 1993 It is open) "
Patent document 5: Japanese Laid-Open Patent Publication " Japanese Patent Laid-Open 9-179512 bulletin (on July 11st, 1997 It is open) "
Summary of the invention
Problem to be solved by the invention
However, these prior arts are come from the viewpoint of the machining accuracy of processing, dummy member, assembled component to substrate etc. It sees, it is difficult to realize the precision of the LED installation site of micron (micron) unit.In turn, due to need slot or hole processing space, Or the installation space of dummy member or assembled component, therefore have the problems such as light emitting device is enlarged.And then also there are following problems: Additional processing or production assembled component are implemented to printed base plate and lead to that manufacturing cost rises or manufacturing process is complicated and make Manufacturing yield reduction etc..
The present invention is to form in order to solve described problem.Moreover, it is an object of the invention to realize that one kind more minimizes And slimming light emitting device, have the back lighting device of such light emitting device and more simply manufacture the manufacture of such light emitting device Method.
Technical means to solve problem
In order to solve described problem, the light emitting device of one embodiment of the present invention is characterized in that having: resin forming Body；Light-emitting component at least has illumination region and electrode, is showed out and institute with the illumination region the first of the resin-formed body Second mode showed out orthogonal with first face that electrode is stated in the resin-formed body is embedded in the resin forming In body；And wiring, it is formed on second face of the resin-formed body, and connect with the electrode.
In order to solve described problem, the back lighting device of one embodiment of the present invention be characterized in that having light guide plate and Opposite and configuration the light emitting device with the either side of the light guide plate.
In order to solve described problem, the manufacturing method of the light emitting device of one embodiment of the present invention be characterized in that include Following process: the light-emitting component at least with illumination region and electrode is temporary in the form of the electrode is contacted with temporary fixed film It is fixed on the temporary fixed film, wherein the electrode is formed in one orthogonal with the one side for being formed with the illumination region Face；The temporary fixed film for being temporarily fixed with the light-emitting component is configured in the gap in mold, is injected in the gap The resin-formed body for being embedded with the light-emitting component is consequently formed in resin material；By the temporary fixed film from the resin at The removing of type body；And the wiring connecting with the electrode is formed in the one side of the electrode exposing of the resin-formed body.
The effect of invention
According to an embodiment of the present invention, it can be realized a kind of light emitting device for more minimizing and being thinned, have The back lighting device of such light emitting device and the manufacturing method for more simply manufacturing such light emitting device.
Detailed description of the invention
Fig. 1 (a) to Fig. 1 (c) is the figure for indicating the composition of light emitting device of embodiments of the present invention 1.
Fig. 2 is the figure for indicating the equivalent circuit of light emitting device of embodiments of the present invention 1.
Fig. 3 (a) to Fig. 3 (c) is the figure for indicating the composition of light emitting device of embodiments of the present invention 2.
Fig. 4 is the figure for indicating the equivalent circuit of light emitting device of embodiments of the present invention 2.
Fig. 5 (a) to Fig. 5 (d) is the figure being illustrated to the method for the light emitting device of manufacture embodiments of the present invention 2.
Fig. 6 (a) and Fig. 6 (b) is the figure for indicating the composition of back lighting device of embodiments of the present invention 3.
Fig. 7 (a) and Fig. 7 (b) is the figure for indicating the composition of light emitting device of the prior art.
Fig. 8 (a) and Fig. 8 (b) is the figure for indicating the composition of light emitting device of the prior art.
[explanation of symbol]
1,1a, 101,101a: light emitting device
2: resin-formed body
3~6,103:LED element (light-emitting component)
11,12: temporarily fixing film
13,14: mold
21: surface (third face)
22: side (the first face)
23: the back side (the second face)
31,41,51,61,131: base portion
32,42,52,62,132: illumination region
33,43,53,63,133: anode
33a, 43a, 53a, 63a: anode (other electrodes)
33b, 43b, 53b, 63b: anode (electrode)
34,44,54,64,134: cathode
34a, 44a, 54a, 64a: cathode (other electrodes)
34b, 44b, 54b, 64b: cathode (electrode)
71~75,121: wiring
81~86: wiring (wiring, other wirings)
90: back lighting device
91: resin frame
92: light guide plate
102: printed base plate
104,122: solder
105: resin framework
A: distance
Specific embodiment
[embodiment 1]
Hereinafter, (a) is illustrated embodiments of the present invention 1 to Fig. 1 (c) and Fig. 2 referring to Fig.1.
Fig. 1 (a) to Fig. 1 (c) is the figure for indicating the composition of light emitting device 1 of embodiments of the present invention 1.Fig. 1 (a) be from The light-emitting surface (surface) of light emitting device 1 observes the figure of this light emitting device 1, and Fig. 1 (b) is from the orthogonal with light-emitting surface of light emitting device 1 One side (side) observe the figure of this light emitting device 1, Fig. 1 (c) is the one side (back side) opposite with light-emitting surface from light emitting device 1 Observe the figure of this light emitting device 1.
As shown in Fig. 1 (a) to Fig. 1 (c), light emitting device 1 have resin-formed body 2, LED element (light-emitting diode, Light-emitting component) 3~LED element 6 and wiring 71~wiring 75.
Resin-formed body 2 has the function of the matrix as light emitting device 1, includes various resin materials.Such material example Polycarbonate (Polycarbonate, PC) or acronitrile-butadiene-styrene (Acrylonitrile- can such as be enumerated Butadiene-Styrene, ABS).
3~LED element of LED element 6 is the LED element that (Surface Mounted Devices, SMD) type is installed on surface. As shown in Fig. 1 (a) to Fig. 1 (c), LED element 3 has base portion 31, illumination region 32, anode (electrode) 33 and cathode (electrode) 34. LED element 4 has base portion 41, illumination region 42, anode (electrode) 43 and cathode (electrode) 44.LED element 5 has base portion 51, hair Light portion 52, anode (electrode) 53 and cathode (electrode) 54.LED element 6 have base portion 61, illumination region 62, anode (electrode) 63 and Cathode (electrode) 64.
Base portion 31 is the body part of LED element 3.The illumination region 32 including LED is formed in the side of base portion 31.When When LED element 3 shines, light is issued from illumination region 32.Anode 33 and cathode 34 are and the exterior part of light emitting device 1 or the dress that shines Set the connection electrode of either one or two of other LED elements 4~6 in 1 connection.Anode 33 and cathode 34 are formed in base portion 31 and side On the orthogonal back side in face (the second face).
The detailed composition of 4~LED element of LED element 6 is identical as LED element 3, therefore detailed description will be omitted.
3~LED element of LED element 6 is to be embedded in the inside of resin-formed body 2.As shown in Fig. 1 (a) to Fig. 1 (c), shine Straight line configuration has multiple (4) LED elements 3~6 in device 1.As shown in Fig. 1 (b), 32~illumination region of illumination region 62 resin at Expose the side 22 of type body 2.Therefore, as shown in the arrow of Fig. 1 (a), when light emitting device 1 shines, light is from resin-formed body 2 Side 22 issues.
As shown in Fig. 1 (c), 33~anode of anode 63 and 34~cathode of cathode 64 resin-formed body 2 with side 22 just Expose at the back side 23 of friendship.
Wiring 71~wiring 75 is formed on the back side 23 of resin-formed body 2, with corresponding 33~anode of anode 63 or At least any one connection of 34~cathode of cathode 64.Wiring 71~wiring 75 is, for example, to be borrowed by using the printing process of silver inks etc. It is formed on the back side 23 of resin-formed body 2 by printing.Therefore, wiring 71~wiring 75 and 33~anode of anode 63 or cathode The connection of 34~cathode 64 does not need solder.
As shown in Fig. 1 (a) to Fig. 1 (c), the one end for being routed 71 is connected to anode 33.The other end of wiring 71 is connected to position Driving circuit (not shown) in the outside of light emitting device 1.One end of wiring 72 is connected to cathode 34, and the other end is connected to anode 43.In this way, wiring 72 has the function of LED element 3 and 4 line of LED element.
One end of wiring 73 is connected to cathode 44, and the other end is connected to anode 53.In this way, wiring 73 has LED element 4 With the effect of 5 line of LED element.
One end of wiring 74 is connected to cathode 54, and the other end is connected to anode 63.In this way, wiring 74 has LED element 5 With the effect of 6 line of LED element.
One end of wiring 75 is connected to cathode 64.The other end of wiring 75 is connected to the drive positioned at the outside of light emitting device 1 Dynamic circuit (not shown).
Fig. 2 is the figure for indicating the equivalent circuit of light emitting device 1 of embodiments of the present invention 1.Such as Fig. 1 (a) to Fig. 1 (c) It is shown, 3~LED element of LED element 6 is mutually connected in series using wiring 71~wiring 75.Therefore, as shown in Fig. 2, light emitting device 1 It is middle to be formed the mutual concatenated equivalent circuit of 3~LED element of LED element 6.When the driving circuit by outside drives LED simultaneously When 3~LED element 6 of element, 3~LED element of LED element 6 shines simultaneously.
The light emitting device 1 of present embodiment suitably flexibly can enter inciting somebody to action into marginal mode back lighting device with work energy group The light emitting device of the configuration of 3~LED element of LED element 6 on straight line.
(the advantages of present embodiment)
Light emitting device 1 shown in Fig. 1 (a) to Fig. 1 (c), which does not have, prints base required for the light emitting device of the prior art Plate, and also do not need for the solder connecting with electrode (anode, cathode) will to be routed.Can get as a result, facilitates light emitting device 1 Miniaturization and slimming following effect.
(1) height of light emitting device 1 can be set as the minimum roughly equal with the height of 3~LED element of LED element 6 Highly, so as to make light emitting device 1 be thinned.
(2) not needing in light emitting device 1 in the prior art will be required for the electrode of LED element and wiring connection using solder 3~LED element of LED element 6 between space can reduce and LED is installed in light emitting device 1 therefore compared with prior art Spacing (interval of 3~LED element of LED element 6) when 3~LED element 6 of element.
(3) since 3~LED element of LED element 6 to be embedded in the inside of resin-formed body 2, the installation of LED element 3 Intensity is more existing higher using the connection structure of solder.
(variation)
Light emitting device 1 can also be light-emitting component, such as organic electroluminescent having other than 3~LED element of LED element 6 The composition of (Electroluminescence, EL) element etc..
[embodiment 2]
Hereinafter, being said referring to Fig. 3 (a) to Fig. 3 (c), Fig. 4 and Fig. 5 (a) to Fig. 5 (d) to embodiments of the present invention 2 It is bright.In addition, for purposes of illustration only, to symbol identical as the component illustrated in the embodiment component mark with the same function Number, the description thereof will be omitted.
Fig. 3 (a) to Fig. 3 (c) is the figure for indicating the composition of light emitting device 1a of embodiments of the present invention 2.Fig. 3 (a) is The figure of this light emitting device 1a from the light-emitting surface (surface) of light emitting device 1a, Fig. 3 (b) be from light emitting device 1a's and light-emitting surface Orthogonal one side (side) observes the figure of this light emitting device 1a, and Fig. 3 (c) is the one side opposite with light-emitting surface from light emitting device 1a (back side) observes the figure of this light emitting device 1a.
As shown in Fig. 3 (a) to Fig. 3 (c), light emitting device 1a has resin-formed body 2, LED element (light emitting diode member Part, light-emitting component) 3~LED element 6 and wiring 81~wiring 86.LED element 3 has base portion 31, illumination region 32, anode 33a (other electrodes) and anode 33b (electrode) and cathode 34a (other electrodes) and cathode 34b (electrode).LED element 4 has base Portion 41, illumination region 42, anode 43a (other electrodes) and anode 43b (electrode) and cathode 44a (other electrodes) and cathode 44b (electrode).LED element 5 has base portion 51, illumination region 52, anode 53a (other electrodes) and anode 53b (electrode) and cathode 54a (other electrodes) and cathode 54b (electrode).LED element 6 have base portion 61, illumination region 62, anode 63a (other electrodes) and Anode 63b (electrode) and cathode 64a (other electrodes) and cathode 64b (electrode).
In LED element 3, anode 33a and cathode 34a are formed in the surface of base portion 31 (with the one side for forming illumination region 32 Orthogonal one side).On the other hand, anode 33b and cathode 34b is formed in the back side opposite with surface of base portion 31 (with formation Illumination region 32 while orthogonal).Anode 33a and anode 33b are integrally formed in LED element 3.Also that is, anode 33a And anode 33b is electrically connected to each other.Similarly, cathode 34a and cathode 34b are integrally formed in LED element 3.Also that is, cathode 34a and cathode 34b are electrically connected to each other.
The detailed composition of 4~LED element of LED element 6 is identical as LED element 3, therefore detailed description will be omitted.
As shown in Fig. 3 (a), anode 33a~anode 63a and cathode 34a~cathode 64a resin-formed body 2 and side Expose on the orthogonal surface 21 (third face) in 22 (the first faces).On the other hand, as shown in Fig. 3 (b), anode 33b~anode 63b and yin Pole 34b~cathode 64b exposes at the back side 23 (the second face) orthogonal with side 22 and opposite with surface 21 of resin-formed body 2.
Wiring 81~wiring 86 is formed on the surface 21 or the back side 23 of resin-formed body 2, with corresponding anode 33a~ Anode 63a, anode 33b~anode 63b, cathode 34a~cathode 64a or cathode 34b~cathode 64b at least any one connection. Wiring 81~wiring 85 is, for example, the surface for being formed in resin-formed body 2 by printing by using the printing process of silver inks etc. 21 or the back side 23 on.Therefore, wiring 81~wiring 85 with anode 33a~anode 63a, anode 33b~anode 63b, cathode 34a~ Cathode 64a or cathode 34b~cathode 64b connection do not need solder.
As shown in Fig. 3 (c), the one end for being routed 81 is connected to anode 33b.The other end of wiring 81, which is connected to, is located at the dress that shines Set the driving circuit (not shown) of the outside of 1a.One end of wiring (other wirings) 82 is connected to anode 33a, and the other end is connected to Anode 43a.In this way, wiring 82 has the function of the anode 43a line of the anode 33a of LED element 3 and LED element 4.
One end of wiring 83 is connected to cathode 34b, and the other end is connected to anode 53b.In this way, wiring 73 has LED member The effect of part 3 and 5 line of LED element.
One end of wiring 84 (other wirings) is connected to cathode 44a, and the other end is connected to anode 63a.In this way, 84 tool of wiring Play the role of LED element 4 and 6 line of LED element.
One end of wiring 85 is connected to cathode 54b, and the other end is connected to cathode 64b.In this way, wiring 85 has LED member The effect of the cathode 64b line of the cathode 54b and LED element 6 of part 5.
One end of wiring 86 is connected to cathode 64b.The other end of wiring 86 is connected to positioned at the outside of light emitting device 1a Driving circuit (not shown).
As previously discussed, wiring is formed in 23 the two of the surface of resin-formed body 2 21 and the back side in light emitting device 1a Group.The anode 33b of LED element 3 is by 83 common connection of wiring of the wiring 82 on surface 21 and the back side 23.The cathode of LED element 6 64b is by 85 common connection of wiring of the wiring 84 on surface 21 and the back side 23.By such composition, Fig. 4 is formed in light emitting device 1a Shown in equivalent circuit.
Fig. 4 is the figure for indicating the equivalent circuit of light emitting device 1a of embodiments of the present invention 2.Such as Fig. 3 (a) to Fig. 3 (c) It is shown, in light emitting device 1a, LED element 3 and LED element 5 are mutually connected in series using wiring 82 and wiring 84.In addition, using cloth LED element 4 and LED element 6 are mutually connected in series by line 83 and wiring 85.In turn, by LED element 3 and LED element 5 and LED element 4 And LED element 6 is mutually in parallel.Therefore, LED element 3 and LED element 5 are gone here and there mutually as shown in Fig. 2, being formed in light emitting device 1a Connection, LED element 4 and LED element 6 are mutually connected in series, and LED element 3 and LED element 5 and LED element 4 and LED element 6 is mutual The equivalent circuit being in parallel.
When driving 3~LED element 6 of LED element simultaneously by external driving circuit, 3~LED element of LED element 6 is same Shi Faguang.Even if causing LED first in addition, broken string occurs for the wiring 82 or wiring 84 that are formed on the surface 21 of resin-formed body 2 Part 3 and LED element 5 are extinguished, and will not interfere the power supply to 6 side of LED element 4 and LED element, thus LED element 4 and LED element 6 continues bright light.Conversely, even if the wiring 83 or wiring 85 because being formed on the back side 23 of resin-formed body 2 occur to break Line causes LED element 4 and LED element 6 to be extinguished, and will not interfere the power supply to LED element 3 and LED element 5, therefore LED Element 3 and LED element 5 continue bright light.In this way, even if even if either one or two of wiring 82~wiring 84 occurs to break in light emitting device 1a Line, since also only half is extinguished in 3~LED element of LED element 6, remaining semi-continuous bright light, therefore also can when breaking The enough illumination maintained to a certain degree.
The light emitting device 1a of present embodiment suitably can also flexibly be used as energy group and enter inciting somebody to action into marginal mode back lighting device The light emitting device of the configuration of 3~LED element of LED element 6 on straight line.
(manufacturing method of light emitting device 1a)
Fig. 5 (a) to Fig. 5 (d) is the figure being illustrated to the method for the light emitting device 1a of manufacture present embodiment.Hereinafter, It is illustrated referring to manufacturing method of this figure to the light emitting device 1a of present embodiment.
(temporary fixed step)
First as shown in Fig. 5 (a), preparation is for the temporarily temporary fixed film 11 of fixed 3~LED element of LED element 6 and temporarily When fixed film 12,3~LED element of LED element 6 is temporarily fixed to these temporarily fixed films 11 and temporarily on fixed film 12.Temporarily When fixed film 11 and temporarily polyethylene terephthalate (Polyethylene for example can be used in fixed film 12 Terephthalate, PET) film.
In present embodiment, with the anode 33a~anode 63a and cathode 34a~cathode 64a of 3~LED element of LED element 6 Contacted with temporary fixed film 11, and the anode 33b~anode 63b and cathode 34b~cathode 64b of 3~LED element of LED element 6 with 3~LED element of LED element 6, is temporarily fixed to temporarily fix film 11 using sticker etc. by the temporarily mode that fixed film 12 contacts And temporarily on fixed film 12.When this is temporarily fixed, it is able to use and has been coated on temporary fixed film 11 and temporarily fixed film 12 Such as ultraviolet hardening sticker (not shown).Specifically, manufactured using Ge Lulabai (Gluelabo) Co., Ltd GL-3005H is temporarily fixed on film 11 as sticky material, by sticker with the PET system that 2 μm~3 μm of thickness is coated on 50 μm.
Then, temporarily fixed film 11 and the temporarily position of 3~LED element of LED element 6 on fixed film 12 are determined, by LED 3~LED element of element 6 is arranged on temporarily fixed film 11 and temporarily the decision position in fixed film 12.Then, to temporary fixed Film 11 and temporarily fixed film 12 and the irradiation of 3~LED element of LED element 6 3000mJ/cm2Ultraviolet light, thus consolidate sticker Change.Whereby, 3~LED element of LED element 6 is temporarily fixed to temporarily fix on film 11 and 12.
(injection molding processes)
Then, as shown in Fig. 5 (b), 3~LED element of LED element 6 is temporarily fixed with by what is made in temporary fixed step Temporary fixed film 11 and temporarily fixed film 12 configures in the gap between mold 13 and mold 14, then infused in this gap Enter resin material.Whereby, 3~LED element of LED element 6 is embedded in the mode in resin-formed body 2 and carries out resin material Injection molding.
It is more that resin material used in this process can enumerate PC (polycarbonate) and ABS (acronitrile-butadiene-styrene) etc. Kind resin material.Using PC, PC is used with 270 DEG C of injection temperature and injection pressure 100Mpa.Using ABS's In the case of, with 180 DEG C of injection temperature and injection pressure 20kgf/cm2Use ABS.
(stripping process)
Then, as shown in Fig. 5 (c), by injection-molded article obtained in injection molding processes from mold 13 and mold 14 it Between gap in take out, then will temporarily fix film 11 and temporarily fixed film 12 is removed from injection-molded article.LED element 3 as a result, 32~illumination region of illumination region 62 of~LED element 6 exposes in the side of resin-formed body 2 22.On the other hand, LED element 3~ Anode 33a~anode the 63a and cathode 34a~cathode 64a of LED element 6 expose on the surface of resin-formed body 2 21, in addition, Anode 33b~anode the 63b and cathode 34b~cathode 64b of 3~LED element of LED element 6 reveal at the back side of resin-formed body 2 23 Out.
In addition, being used as hot and big amplitude variation of the PET film of temporarily fixed film 11 when the injection molding in injection molding processes Shape becomes the state removed from injection-molded article.Therefore, easily film 11 will temporarily can be fixed to separate from injection-molded article.
(wiring formation process)
Finally, wiring 82 and wiring 84 are formed on the surface of resin-formed body 2 21 as shown in Fig. 5 (d), this wiring 82 And the anode 33a~anode 63a and cathode 34a of wiring 84 and each LED element 3~6 exposed on the surface of resin-formed body 2 21 The 64a connection of~cathode.In turn, wiring 81, wiring 83, wiring 85 and wiring 86 are formed on the back side of resin-formed body 2 23, this The anode of wiring 81, wiring 83, wiring 85 and wiring 86 and each LED element 3~6 exposed at the back side of resin-formed body 2 23 33b~anode 63b and cathode 34b~cathode 64b connection.Thus light emitting device 1 is made.
When forming wiring 81~wiring 86, it is able to use various methods.Such as it can enumerate: using the injection such as ink-jet printer Conductive material (such as silver inks etc.) and print formed wiring 81~wiring 86 method；Cloth is formed using aerosol (aerosol) Line 81~wiring 86 method；Or wiring 81~wiring 86 method etc. is formed using dispenser (dispenser).
The thickness of manufactured light emitting device 1a can be set as and LED member by manufacturing method according to the present embodiment The equal minimum thinness of the height (thickness in the direction H) of part 3.In addition, mounting distance (Fig. 5 between 3~LED element of LED element 6 Minimum range, that is, 0.2mm that resin material flows when (a) and if distance a) shown in Fig. 5 (d) is injection molding processes~ 0.3mm or so, therefore can be realized 3~LED element of LED element 6 of narrow spacing impossible in the prior art Arrangement.
(the advantages of present embodiment)
In the manufacturing method of the light emitting device 1a of present embodiment, by the way that 3~LED element of LED element 6 is embedded in resin It is fixed in resin-formed body 2, therefore can consolidate according in temporary fixed step to temporary fixation film 11 and temporarily in formed body 2 Determine film 12 position of 3~LED element of LED element 6 is arranged and accurately determines 3~LED element of LED element in light emitting device 1a 6 installation site.It can get following effect whereby.
(4) installation position about 3~LED element of LED element 6 in light emitting device 1a on in-plane (direction X-Y) Precision is set, can get the accurate precision of precision ± 50 μm of LED element installation equipment or so.
It (5) in turn, can be by the position of the short transverse (direction H) of 3~LED element of LED element 6 in light emitting device 1a Precision inhibits within several μm of the coating thickness extent of deviation of the sticker used in temporary fixed step.
In addition, not needed needed for solder solidification in the prior art in the manufacturing method of the light emitting device 1a of present embodiment 260 DEG C or more of the heat treatment wanted, therefore can get following effect.
(6) high fever is not applied to 3~LED element of LED element 6, therefore is able to suppress 3~LED element of LED element 6 The variation of the characteristics of luminescence.
In turn, in the manufacturing method of the light emitting device 1a of present embodiment, there is no the addition processes of printed base plate, printing The extremely narrow wiring formation process of substrate or the group of wiring formation process and his component and 3~LED element of LED element 6 on two sides The complicated procedures of forming such as dress, therefore can get following effect.
(7) the reason of reducing the manufacturing yield of light emitting device 1a can be eliminated, or makes the cost of parts of light emitting device 1a And manufacturing cost reduces.
In addition, the light emitting device 1 of embodiment 1 shown in Fig. 1 (a) to Fig. 1 (c) can utilize and Fig. 5 (a) to Fig. 5 (d) Shown in manufacturing method it is essentially identical method manufacture.In addition, when manufacturing light emitting device 1 shown in Fig. 1 (a) to Fig. 1 (c), As long as 3~LED element of LED element 6 is only temporarily fixed to temporarily fix on film 12 in temporary fixed step, therefore nothing Temporarily fixed film 11 need to be used.In turn, as long as only forming wiring on the back side of resin-formed body 2 23 when being routed formation process , therefore do not need the wiring formation process on the surface 21 of resin-formed body 2 shown in Fig. 5 (d) yet.
[embodiment 3]
Hereinafter, being illustrated referring to Fig. 6 (a) and Fig. 6 (b) to embodiments of the present invention 3.In addition, for purposes of illustration only, right With the component component mark the same symbol with the same function illustrated in the embodiment, the description thereof will be omitted.
Fig. 6 (a) and Fig. 6 (b) is the figure for indicating the composition of back lighting device 90 of embodiments of the present invention 3.Fig. 6 (a) is The figure of this back lighting device 90 from the upper surface of back lighting device 90, Fig. 6 (b) are from the luminous dress being mounted in back lighting device 90 The light-emitting surface for setting 1a observes the figure of this light emitting device 1a.
As shown in Fig. 6 (a), back lighting device 90 has resin frame 91, light guide plate 92 and light emitting device 1a.Resin frame 91 passes through It is configured and lightguide plate fixing 92 in a manner of surrounding light guide plate 92.Light emitting device 1a is times so that its light-emitting surface and light guide plate 92 The opposite form configuration of one side.In addition, light emitting device 1a is embedded in resin frame 91.
In the light emitting device 1a of the composition, the side quilt of light that the light-emitting surface of selfluminous device 1a issues from light guide plate 92 Import light guide plate 92 inside, light guide plate 92 internal reflection and from the upper surface of light guide plate 92 irradiate.Therefore, it can will carry on the back Electro-optical device 90 is suitably used for various display devices as marginal mode back lighting device.
(the advantages of present embodiment)
Marginal mode back lighting device is largely used to the display module, notebook PC and liquid of portable terminal device In the various display devices such as brilliant monitor.Currently, being strongly required marginal mode back lighting device along with the slimming of these devices Slimming.Herein, as shown in Fig. 6 (b), can make the light emitting device 1a of present embodiment thickness 93 and LED element 3~ The thickness of LED element 6 is roughly equal, therefore the installation section LED for the back lighting device 90 for having light emitting device 1a can be made minimum Change to the thickness of 3~LED element of LED element 6.Therefore, back lighting device 90 can be made more to be thinned.
In addition, light emitting device 1a is embedded in resin frame 91 in back lighting device 90, therefore it can also further reduce back Size on the in-plane of electro-optical device 90.
[summary]
In order to solve described problem, the light emitting device of one embodiment of the present invention is characterized in that having: resin forming Body；Light-emitting component at least has illumination region and electrode, is showed out and institute with the illumination region the first of the resin-formed body Second mode showed out orthogonal with first face that electrode is stated in the resin-formed body is embedded in the resin forming In body；And wiring, it is formed on second face of the resin-formed body, and connect with the electrode.
According to the composition, light-emitting component is mounted in light emitting device in the form of being embedded in resin forming body.By In the printed base plate without the need for installation light-emitting component, therefore the height and light-emitting component (resin forming of light emitting device can be made Body) height it is substantially uniform.In addition, the wiring energy being connect with the electrode for the light-emitting component showed out the second of resin-formed body Enough to be formed by printing, there is no need to use the solder being attached.In this way, being used due to not needing the solder that light-emitting component is asked Space, therefore can be by the clipping room between light-emitting component away from being set as minimum limit.
As previously discussed, according to the composition, it can be realized the light emitting device for more minimizing and being thinned.
The feature of the light emitting device of one embodiment of the present invention is in turn: multiple light-emitting components are embedded in institute It states in resin forming body, is interconnected by the electrode that the wiring respectively has the light-emitting component.
According to the composition, the light emitting device for having a plurality of light-emitting elements can be realized.
The feature of the light emitting device of one embodiment of the present invention is in turn: multiple light-emitting components are embedded in institute State in resin forming body, the light-emitting component is each provided with other electrodes, other described electrodes the resin-formed body with Orthogonal and opposite with second face third in first face is showed out, and the light emitting device is also equipped with other wirings, described Other wirings are formed on the third face of the resin-formed body and connect with other described electrodes.
According to the composition, the light emitting device for having a plurality of light-emitting elements can be realized.
The feature of the light emitting device of one embodiment of the present invention and then be: the electrode and other described electrodes are one Formed to body.
According to the composition, can by electrode or other electrodes by the second face of resin-formed body wiring and resin Wiring on the third face of formed body is electrically connected to each other.Thereby, it is possible to realize to make the luminous member of a part in a plurality of light-emitting elements The light emitting device of the part composition in parallel with remaining light-emitting component.
The feature of the light emitting device of one embodiment of the present invention is in turn: multiple light-emitting component straight lines are arranged Column.
According to the composition, can be realized suitably group to enter light emitting device in marginal mode back lighting device.
The feature of the light emitting device of one embodiment of the present invention is in turn: the light-emitting component is light emitting diode member Part.
According to the composition, the light emitting device of low consumption electric power can be realized.
In order to solve described problem, the back lighting device of one embodiment of the present invention be characterized in that having light guide plate and Opposite and configuration any light emitting device with the either side of the light guide plate.
According to the composition, the back lighting device for more minimizing and being thinned can be realized.
The feature of the back lighting device of one embodiment of the present invention is to be also equipped with the resin of the fixed light guide plate in turn Frame, and the light emitting device is embedded in the resin frame.
According to the composition, the size on the in-plane of back lighting device can be further reduced.
In order to solve described problem, the manufacturing method of the light emitting device of one embodiment of the present invention be characterized in that include Following process: the light-emitting component at least with illumination region and electrode is temporary in the form of the electrode is contacted with temporary fixed film It is fixed on the temporary fixed film, wherein the electrode is formed in one orthogonal with the one side for being formed with the illumination region Face；The temporary fixed film for being temporarily fixed with the light-emitting component is configured in the gap in mold, is injected in the gap The resin-formed body for being embedded with the light-emitting component is consequently formed in resin material；By the temporary fixed film from the resin at The removing of type body；And the wiring connecting with the electrode is formed in the one side of the electrode exposing of the resin-formed body.
According to the composition, the light emitting device for more minimizing and being thinned can be more simply manufactured.
The present invention is not limited to each embodiments, can make various changes in the range shown in claim.It will The disclosed appropriately combined resulting embodiment of technological means is also included within technology model of the invention respectively in different embodiments In enclosing.Also new technical characteristic can be formed and by disclosed technological means combines respectively in each embodiment.

Claims (9)

1. a kind of light emitting device, characterized by comprising:
Resin-formed body；
Light-emitting component at least has illumination region and electrode, showed out with the illumination region the first of the resin-formed body and The electrode second mode showed out orthogonal with first face of the resin-formed body be embedded in the resin at In type body；And
Wiring, is formed on second face of the resin-formed body, and connect with the electrode,
On the direction perpendicular to second face, the consistency of thickness of the thickness of the illumination region and the resin-formed body.
2. light emitting device according to claim 1, it is characterised in that: multiple light-emitting components are embedded in the resin In formed body, interconnected by the electrode that the light-emitting component is each provided with by the wiring.
3. light emitting device according to claim 1, it is characterised in that: multiple light-emitting components are embedded in the resin In formed body,
The light-emitting component is each provided with other electrodes,
Other described electrodes are in the third face orthogonal and opposite with second face with first face of the resin-formed body Expose,
The light emitting device further includes other wirings, other described wirings are formed in the third face of the resin-formed body Above and with other described electrodes it connect.
4. light emitting device according to claim 3, it is characterised in that: the electrode and other described electrodes are integrated landform At.
5. light emitting device according to any one of claim 2 to 4, it is characterised in that: multiple light-emitting components are straight Line arrangement.
6. light emitting device according to any one of claim 1 to 4, it is characterised in that: the light-emitting component is luminous two Pole pipe element.
7. a kind of back lighting device, characterized by comprising:
Light guide plate；And
Opposite and configuration the light emitting device according to any one of claim 1 to 6 with the either side of the light guide plate.
8. back lighting device according to claim 7, it is characterised in that: it further include the resin frame of the fixed light guide plate, and
The light emitting device is embedded in the resin frame.
9. a kind of manufacturing method of light emitting device, which is characterized in that including following process:
Light-emitting component at least with illumination region and electrode is temporarily fixed in the form of the electrode is contacted with temporary fixed film On the temporary fixed film, wherein electrode is formed in second face orthogonal with the first face of the illumination region is formed with；
The temporary fixed film for being temporarily fixed with the light-emitting component is configured in the gap in mold, is injected in the gap The resin-formed body for being embedded with the light-emitting component is consequently formed in resin material, on the direction perpendicular to second face, institute State the thickness of illumination region and the consistency of thickness of the resin-formed body；
The temporary fixed film is removed from the resin-formed body；And
The wiring connecting with the electrode is formed in the one side that the electrode of the resin-formed body exposes.
CN201680047239.1A 2016-01-27 2016-11-25 The manufacturing method of light emitting device, back lighting device and light emitting device Expired - Fee Related CN107960135B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-013708 2016-01-27
JP2016013708A JP6645213B2 (en) 2016-01-27 2016-01-27 Light emitting device and method of manufacturing light emitting device
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