CN217639870U - Backlight module, display module and display device - Google Patents

Abstract

A backlight module, a display module and a display device are provided. The backlight module comprises a light-emitting substrate, a chip on film and a back plate. The light emitting substrate includes a signal line group and a plurality of light emitting cells electrically connected to the signal line group. The chip on film is arranged on the non-light-emitting side of the light-emitting substrate and is electrically connected with the signal wire group. The back plate is arranged on the non-light-emitting side of the light-emitting substrate, and the chip on film is positioned between the back plate and the light-emitting substrate; the back plate is provided with a groove, the notch of the groove faces the light-emitting substrate, and at least part of the chip on film is arranged in the groove.

Description

Backlight module, display module and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a backlight module, a display module and a display device.

Background

With the rising and maturing of Organic Light-Emitting Diode (OLED) technology, OLED products are becoming new markets, however, the cost of OLED products is high and the reliability is poor. In order to achieve the characteristics of high contrast, light weight and the like of an OLED product, and simultaneously retain the price and reliability advantages of a Liquid Crystal Display (LCD) product, a micro LED is produced as a product of a backlight source.

The Micro LED includes Micro Light Emitting Diode (Micro LED) and sub-millimeter Light Emitting Diode (Mini LED). Wherein the Micro LED has a size (e.g., length) less than 50 micrometers, e.g., 10 micrometers to 50 micrometers; the Mini LEDs have a size (e.g., length) of 50 microns to 150 microns, such as 80 microns to 120 microns.

The LCD panel matched with the micro LED backlight has the advantages of high peak brightness, high contrast, low power consumption, high reliability and the like, and has a wide development prospect.

SUMMERY OF THE UTILITY MODEL

In one aspect, a backlight module is provided, which includes a light-emitting substrate, a chip on film, and a back plate.

The light emitting substrate includes a signal line group and a plurality of light emitting cells electrically connected to the signal line group. The chip on film is arranged on the non-light-emitting side of the light-emitting substrate and is electrically connected with the signal wire group. The back plate is arranged on the non-light-emitting side of the light-emitting substrate, and the chip on film is positioned between the back plate and the light-emitting substrate; the back plate is provided with a groove, the notch of the groove faces the light-emitting substrate, and at least part of the chip on film is arranged in the groove.

In some embodiments, the flip chip film includes a flexible film and a driving chip. The flexible film is electrically connected with the signal line group. The driving chip is electrically connected with the flexible film; the driving chip is arranged in the groove.

In some embodiments, the side wall of the groove has a step structure, and is directed from the notch of the groove to the bottom surface along the thickness direction of the light-emitting substrate, and the side wall of the groove includes a first sub-wall surface, a step surface, and a second sub-wall surface that are connected in sequence, and both the first sub-wall surface and the second sub-wall surface intersect with the step surface.

The groove comprises a first sub-groove and a second sub-groove, the first sub-groove comprises the first sub-wall surface and the step surface, and the second sub-groove comprises the second sub-wall surface and the bottom surface of the groove. The driving chip is arranged in the second sub-groove, and at least part of the flexible film is arranged in the first sub-groove.

In some embodiments, the groove comprises a plurality of the second sub-grooves arranged along a first direction; the first direction is parallel to an extending direction of a binding side edge of the light emitting substrate. The backlight module comprises a plurality of chip on films, and the chip on films are sequentially arranged along the first direction. Each chip on film comprises at least one driving chip, and all the driving chips belonging to the same chip on film are arranged in the same second sub-groove.

In some embodiments, the groove includes a plurality of the first sub-grooves, and the first sub-grooves and the second sub-grooves are alternately arranged in the first direction. Along the first direction, two side edges of a flexible film of each chip on film respectively exceed two side edges of a driving chip of the chip on film, the two side edges of the flexible film are respectively located in two first sub-grooves on two sides of a second sub-groove where the driving chip is located.

In some embodiments, the backlight module further includes a heat dissipation layer disposed between the bottom surface of the groove and the driving chip, and the heat dissipation layer is connected to the bottom surface of the groove.

In some embodiments, the backplate further comprises a backplate body disposed around the recess, the top of the side walls of the recess being connected to the backplate body. In the thickness direction of the light emitting substrate, the bottom surface of the groove is farther away from the light emitting substrate relative to the back plate main body.

In some embodiments, the backlight module further comprises a second flexible printed circuit board, one end of which is electrically connected to the light-emitting substrate. The backboard is provided with a first opening, and the other end of the second flexible circuit board penetrates through the first opening and extends to one side, far away from the light-emitting substrate, of the backboard.

In some embodiments, the first opening is located at a side of the groove close to the binding side edge of the light emitting substrate.

In some embodiments, the backlight module further includes a first fixing adhesive layer disposed between the light-emitting substrate and the back plate; the first fixing adhesive layer is arranged to avoid the groove and the chip on film.

In some embodiments, the backlight module further comprises an optical adjusting film and a rubber frame. The optical adjusting film is arranged on the light emitting side of the light emitting substrate. The glue frame surrounds the optical adjusting film, and is arranged on the light emitting side of the light emitting substrate.

In some embodiments, the backlight module further includes a second fixing adhesive layer disposed between the light-emitting substrate and the adhesive frame.

In another aspect, a display module is provided, which includes a display panel and the backlight module according to any of the foregoing embodiments. The display panel is arranged on the light emitting side of the backlight module.

In some embodiments, the display module further includes a circuit board disposed on a side of the backlight module away from the display panel and on a side of the groove of the back plate of the backlight module; the circuit board is electrically connected with the second flexible circuit board of the backlight module.

In some embodiments, the display module further comprises a third flexible printed circuit board, and the display panel is electrically connected to the circuit board through the third flexible printed circuit board.

In some embodiments, the display module further comprises a connector disposed on a side of the circuit board away from the backlight module; the second flexible circuit board is connected with the connector in an inserting mode.

In another aspect, a display device is provided, which includes the display module according to any one of the foregoing embodiments.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a block diagram of a backlight module according to some embodiments;

fig. 2 is a top view of a light emitting substrate provided in accordance with some embodiments;

FIG. 3 is a rear view of a backlight module according to some embodiments;

fig. 4 is a rear view of a light-emitting substrate with a flip-chip on film disposed on a backlight side thereof according to some embodiments;

FIG. 5 isbase:Sub>A cross-sectional view of the back plate taken along section line A-A' in FIG. 3;

FIG. 6 isbase:Sub>A cross-sectional view of the backlight module along the sectional line A-A' of FIG. 3;

FIG. 7 is another cross-sectional view of the back plate taken along section line A-A' in FIG. 3;

FIG. 8 is another sectional view of the backlight module taken along the section line A-A' in FIG. 3;

FIG. 9 is a cross-sectional view of the backlight module along the section line B-B' in FIG. 3;

FIG. 10 is a cross-sectional view of the back plate taken along section line C-C' in FIG. 3;

FIG. 11 is a cross-sectional view of the backlight module taken along the section line C-C' in FIG. 3;

FIG. 12 is another sectional view of the backlight module taken along the section line B-B' in FIG. 3;

FIG. 13 is another cross-sectional view of the backlight module taken along the line B-B' in FIG. 3;

FIG. 14 is a rear view of a display module provided in accordance with some embodiments;

FIG. 15 is a cross-sectional view of the display module along the section line D-D' in FIG. 14;

FIG. 16 is another cross-sectional view of the display module taken along the section line D-D' in FIG. 14;

FIG. 17 is a cross-sectional view of the display module along section line E-E' in FIG. 14;

FIG. 18 is a top view of a display device provided in accordance with some embodiments.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the terms used above are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "electrically connected" and "connected," along with their derivatives, may be used. For example, the term "electrically connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "at least one of A, B or C" and includes combinations of the following A, B and C: a alone, B alone, C alone, a combination of A and B, A and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "configured to" herein means open and inclusive language that does not exclude devices that are suitable or configured to perform additional tasks or steps.

As used herein, "about," "approximately" or "approximately" includes the stated value as well as average values within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measuring the particular quantity (i.e., the limitations of the measurement system).

As used herein, "parallel," "perpendicular," and "equal" include the stated case and cases that approximate the stated case to within an acceptable range of deviation as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where an acceptable deviation from approximately parallel may be, for example, within 5 °; "perpendicular" includes absolute perpendicular and approximately perpendicular, where an acceptable deviation from approximately perpendicular may also be within 5 °, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal within an acceptable deviation of approximately equal, is less than or equal to 5% of either.

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.

Example embodiments are described herein with reference to cross-sectional and/or plan views as idealized example figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

In the related art, the Mini LED backlight module mostly adopts a passive driving method.

In the backlight module adopting the passive driving mode, one output channel of the driving chip lights a plurality of light-emitting units on the light-emitting substrate in a time-sharing manner, and the cost of the backlight module is relatively low, but the research of the inventor of the present disclosure finds that the Mini LED display device adopting the passive driving mode has many defects, and the specific defects are as follows:

1. the refreshing frequency is low, and the risk of screen flashing exists in the display process;

2. there is a large signal delay problem;

3. there is a serious howling problem;

4. the wiring design space required by the backlight module 10 'is large, and the size of a corresponding circuit board assembled with the backlight module 10' is large;

5. the power consumption is high, the generated heat is more, and the problems of film drum, clearing points and the like of the display device are easily caused;

6. the backlight module 10 'has a large number of wires and correspondingly a large number of pins corresponding to the wires, and the backlight module 10' is difficult to assemble with the circuit board through the pins and has a low yield;

7. the backlight module 10' has a weak structural strength and a large amount of deformation generated under an external force.

To solve the above technical problem, as shown in fig. 1, some embodiments of the present disclosure provide a backlight module 10, which includes a light-emitting substrate 1, a chip on film 2, and a back plate 3.

Exemplarily, as shown in fig. 1, the light-emitting substrate 1 includes a light-emitting side 1a and a backlight side 1b, the light-emitting side 1a is a side of the light-emitting substrate 1 emitting light, the light generated by the light-emitting substrate 1 is emitted toward the light-emitting side 1a, and the backlight side 1b is a side away from the light-emitting side 1a.

As shown in fig. 2, the light emitting substrate 1 includes a signal line group 11 and a plurality of light emitting cells 12.

Here, exemplarily, as shown in fig. 2, a plurality of signal lines D may be included in the signal line group 11.

The signal line D is configured to transmit a light emission control signal.

The signal line D is electrically connected to the light emitting unit 12 to drive the light emitting unit 12 to emit light. For example, each signal line D is electrically connected to one light emitting unit 12, respectively, and individual control of each light emitting unit 12 can be realized.

Illustratively, at least one light emitting element G may be included in the light emitting unit 12, and the at least one light emitting element G is electrically connected to each other. For example, the plurality of light-emitting elements G in one light-emitting unit 12 may have a one-to-many string and/or a plurality-to-many string connection structure.

Here, the one-to-many string structure is understood to mean that all the light emitting elements G in one light emitting unit 12 are connected in series. Correspondingly, the multi-string and multi-parallel structure can be understood that at least two light emitting element strings are included in one light emitting unit 12, at least one light emitting element string includes at least two light emitting elements G connected in series, wherein all the light emitting element strings in one light emitting unit 12 are in parallel relation with each other.

Illustratively, the plurality of light emitting elements G in one light emitting unit 12 may be arranged in a rectangular shape, a diamond shape, etc., without being limited thereto. In addition, the number of the light emitting elements G in one light emitting unit 12 may be 4, 6, 8, 16, etc., and is not limited herein.

Illustratively, the light-emitting elements G in one light-emitting unit 12 emit light synchronously under the control of the same light-emitting control signal, so the light-emitting brightness of all the light-emitting elements G in one light-emitting unit 12 is the same or approximately the same.

Illustratively, the light emitting element G may be a sub-millimeter light emitting diode; for example, the Light Emitting Diode G may also be a Micro Light-Emitting Diode (Micro LED).

By providing the signal line group 11, that is, by adopting the active driving mode, the above-mentioned defects of the display device in the passive driving mode can be effectively solved.

For example, the active driving method can realize individual control of each light emitting unit 12, so that the refresh frequency of the display device can be increased, and the frequency band audible to human ears can be avoided, thereby solving the problem of howling of the display device; the active drive has low power consumption and less generated heat, can solve the problems of film bulging and clearing points of the display device and effectively prolong the service life of the display device; in the active driving display device, the wiring on the light-emitting substrate 1 is simple, the number of pins required to be assembled with a circuit board is small, the assembly difficulty is reduced, and the product yield is improved.

On the basis, as shown in fig. 1, the flip chip film 2 is disposed on the non-light-emitting side, i.e., the backlight side 1b, of the light-emitting substrate 1.

The chip on film 2 is electrically connected to the signal line set 11.

The chip on film 2 is configured to supply a light emission control signal to the light emitting unit 12 through the signal line group 11, so that light emission control of the light emitting unit 12 can be achieved.

Illustratively, the chip on film 2 includes a plurality of output channels, each of which is electrically connected to one of the light emitting units 12 through the signal line group 11 in a one-to-one correspondence, and the output channels in the chip on film 2 continuously output the light emitting control signals to the light emitting units 12 corresponding thereto within the refresh time of one frame of the display device.

Illustratively, the chip on film 2 is electrically connected to the signal lines D in the signal line group 11, so as to transmit the light emitting control signal to the light emitting unit 12 through the signal lines D, thereby implementing the light emitting control of the light emitting elements G in the light emitting unit 12.

Illustratively, one end of the signal line D in the signal line group 11 is electrically connected to the light emitting element G in the light emitting unit 12, and the other end is disposed as a pin on the backlight side 1b of the light emitting substrate 1 and on the binding side S of the light emitting substrate 1. The output channel in the chip on film 2 is bound and connected with the pin of the signal line D in the signal line group 11.

As shown in fig. 1, the back plate 3 is disposed on the non-light-emitting side of the light-emitting substrate 1, i.e. the backlight side 1b, and the chip on film 2 is disposed between the light-emitting substrate 1 and the back plate 3.

The back plate 3 is configured to serve as a protective case that protects the components such as the light-emitting substrate 1 from being knocked and damaged by an external structure; meanwhile, as a supporting structure, the backlight module 10 is prevented from being deformed to cause poor display of the display device, and the strength of the display device is improved.

As shown in fig. 1, the back plate 3 is provided with a groove J, and a notch of the groove J is disposed toward the light emitting substrate 1. At least part of the flip chip film 2 is disposed in the groove J.

It should be noted that the chip on film 2 is a structure that a flexible film with signal traces is used as a carrier for packaging the driving chip, and the driving chip is combined with the flexible circuit board. Therefore, referring to fig. 2, the thickness (i.e. the dimension along the thickness direction Z of the light-emitting substrate 1) of the chip on film 2 at different positions is different, for example, the thickness of the portion of the chip on film 2 where the driving chip is packaged is larger.

Exemplarily, the part of the flip chip 2, in which the driving chip is packaged, is arranged in the groove J, so that the driving chip can be effectively protected from being collided and damaged by the outside in the assembling process of the display device.

Illustratively, as shown in fig. 1, the depth d1 of the groove J (i.e., the dimension in the thickness direction Z of the light-emitting substrate 1) is greater than or equal to the maximum thickness d2 of the portion of the flip-chip package 2 in which the driver chip is packaged (i.e., the dimension in the thickness direction Z of the light-emitting substrate 1).

The groove J is formed in the back plate 3, and at least part of the chip on film 2 is arranged in the groove J, for example, the part of the chip on film 2, which is packaged with the driving chip, is arranged in the groove J, so that a placing space can be provided for the chip on film 2, especially the part of the chip on film 2, which is packaged with the driving chip, and important components (such as the driving chip) in the chip on film 2 can be protected from being damaged in the subsequent assembly process of the display device.

In an exemplary embodiment, as shown in fig. 1, the chip on film 2 includes a flexible film 22 and a driving chip 21.

The chip on film 2 is a structure in which the flexible film 22 provided with signal traces is used as a carrier for packaging the driving chip 21, and the driving chip 21 is combined with the flexible film 22. The structure of the flip chip film 2 in the drawings of the present disclosure is only schematically shown, and the actual structure of the flip chip film 2 is not limited.

The flexible film 22 is electrically connected to the signal line group 11.

Illustratively, the flexible film 22 includes a plurality of output channels therein.

Illustratively, the flexible film 22 may be electrically connected to the signal line D in the signal line group, for example, one end of the output channel in the flexible film 22 may be exposed and may be bound to the pin of the signal line D.

The driving chip 21 is electrically connected to the flexible film 22, for example, the other end of the output channel in the flexible film 22 is electrically connected to the driving chip 21. The light emission control signal in the driving chip 21 is transmitted to the signal line group 11 and finally to the light emitting unit 12 through the flexible film 22, so that the light emission control of the light emitting element G is realized.

Illustratively, the driving chip 21 may be a light emission control chip, and the driving chip 21 may be configured to transmit a light emission control signal to the signal line group 11 and finally to the light emitting unit 12, thereby implementing light emission control of the light emitting elements G in the light emitting unit 12.

As shown in fig. 1, the driving chip 21 is disposed in the groove J.

Illustratively, as shown in fig. 1, the volume of the groove J may be greater than or equal to the volume of the driving chip 21.

It should be noted that the "driving chip 21 is disposed in the groove J" is understood that the portion of the flip-chip film 2 where the driving chip 21 is disposed in the groove J, that is, in addition to the driving chip 21 being disposed in the groove J, the portion of the flexible film 22 for packaging the driving chip 21 is also disposed in the groove J accordingly.

By arranging the driving chip 21 in the groove J, the driving chip 21 is prevented from being damaged by the outside in the subsequent assembling process of the display device.

Fig. 3 shows a rear view of the backlight assembly 10. In some embodiments, as shown in fig. 3, the groove J is in a strip shape, and a length direction of the groove J is the same as an extending direction of a side edge of the binding side S (shown in fig. 1 and 2) of the light emitting substrate 1 (see the first direction X in fig. 5).

The binding side S of the light-emitting substrate 1 is the side where the light-emitting substrate 1 and the flip-chip film 2 are bound and electrically connected.

Exemplarily, as shown in fig. 3, the groove J is provided at a side of the rear plate 3 corresponding to the binding side S of the light emitting substrate 1.

Fig. 4 shows a structure diagram of the light-emitting substrate 1 with the flip-chip film 2 disposed on the backlight side 1b. In some embodiments, as shown in fig. 4, the backlight module 10 includes a plurality of chip on films 2, and the plurality of chip on films 2 are sequentially arranged along the first direction X.

Illustratively, each of the flip-chip films 2 includes at least one driving chip 21. Illustratively, as shown in fig. 4, each of the flip-chip films 2 includes two driving chips 21.

Illustratively, as shown in fig. 4, each of the flip-chip films 2 is bonded to the light-emitting substrate 1 at the bonding side S of the light-emitting substrate 1.

Illustratively, the plurality of chip on films 2 may be an integral structure. For example, the flexible film material is disposed between two adjacent flip chips 2, but no trace is disposed in the flexible film material between two adjacent flip chips 2.

In some embodiments, as shown in fig. 5 and 7, the side wall Jb of the groove J is a step structure along the thickness direction Z of the light-emitting substrate 1 and directed from the notch of the groove J to the bottom surface Ja, and the side wall Jb of the groove J includes a first sub-wall surface J11, a step surface J12, and a second sub-wall surface J21 connected in sequence.

The "bottom surface Ja" refers to a surface of the groove J which is substantially parallel to the light-emitting substrate 1 and farthest from the light-emitting substrate 1.

Note that the above-mentioned "side wall Jb" includes, in the groove J, all the side faces substantially perpendicular to the light-emitting substrate 1 and the portion connecting the two side faces, that is, referring to fig. 7, the side wall Jb includes a first sub-wall face J11, a step face J12, and a second sub-wall face J21 which are connected in this order.

As shown in fig. 5 and 7, the first sub-wall surface J11 and the second sub-wall surface J21 each intersect the step surface J12. Illustratively, the first sub-wall surface J11 and the second sub-wall surface J21 are both perpendicular to the step surface J12.

As shown in fig. 5 and 7, the groove J includes a first sub-groove J1 and a second sub-groove J2, the first sub-groove J1 includes a first sub-wall surface J11 and a step surface J12, and the second sub-groove J2 includes a second sub-wall surface J21 and a bottom surface Ja of the groove J.

Illustratively, the first and second sub-grooves J1 and J2 are integrally formed.

The driving chip 21 is disposed in the second sub-groove J2, and at least a portion of the flexible film 22 is disposed in the first sub-groove J1.

Including first sub-recess J1 and second sub-recess J2 through setting up recess J, and make driver chip 21 locate in the second sub-recess J2, at least part of flexible film 22 is located in first sub-recess J1, namely, shape through design recess J and cover brilliant film 2's appearance phase-match, make cover brilliant film 2 be equipped with driver chip 21's part, and driver chip 21 can lay in recess J flatly on every side, the position that folding or fold appears when reducing cover brilliant film 2 and placing in recess J, thereby reduce cover brilliant film 2 and take place damaged risk, improve backlight unit 10's life.

Illustratively, as shown in fig. 5 and 7, the maximum depth d1 (dimension in the thickness direction Z of the light-emitting substrate 1) of the groove J may be 0.8mm to 1.2mm, for example, 1mm. For example, the depth d3 of the first groove J1 is approximately 0.4mm to 0.6mm, for example, 0.5mm, and the depth d4 of the second groove J1 is approximately 0.4mm to 0.6mm, for example, 0.5mm.

In an exemplary embodiment, as shown in fig. 5 and 6, the groove J includes a plurality of second sub-grooves J2, and the plurality of second sub-grooves J2 are aligned in the first direction X.

The first direction X is parallel to the extending direction of the binding side S of the light-emitting substrate 1.

As shown in fig. 6, the backlight module 10 includes a plurality of flip-chip films 2, and the plurality of flip-chip films 2 are sequentially arranged along a first direction X.

Each of the chip on films 2 includes at least one driving chip 21. Illustratively, as shown in fig. 6, each of the flip-chip films 2 includes a driving chip 21.

As shown in fig. 6, all the driver chips 21 belonging to the same chip on film 2 are disposed in the same second sub-recess J2.

Illustratively, each of the flip-chip films 2 includes two driver chips 21, and the two driver chips 21 are spaced in the same second sub-groove J2.

Alternatively, the plurality of flip-chip films 2 may be an integral structure.

Through setting up a plurality of second sub-recess J2 along first direction X range, and make driver chip 21 locate in the second sub-recess J2, can include under the condition of a plurality of cover brilliant films 2 at backlight unit 10, make a plurality of cover brilliant films 2 and recess J's shape phase-match, thereby make a plurality of driver chip 21 all can set up in recess J, and can make cover brilliant film 2 lay in recess J flatly, the position that folding or fold appears when reducing cover brilliant film 2 and placing in recess J, thereby reduce cover brilliant film 2 and take place damaged risk, improve backlight unit 10's life.

In an exemplary embodiment, as shown in fig. 7, the groove J further includes a plurality of first sub-grooves J1, and the first sub-grooves J1 and the second sub-grooves J2 are alternately arranged in the first direction X.

Illustratively, at least one first sub-groove J1 is disposed between two adjacent second sub-grooves J2 along the first direction X.

As shown in fig. 8, along the first direction X, two side edges of the flexible film 22 of each chip on film 2 respectively exceed two side edges of the driving chip 21 of the chip on film 2, and two side edges of the flexible film 22 are respectively located in two first sub-grooves J1 at two sides of the second sub-groove J2 where the driving chip 21 is located.

Through setting up first sub-recess J1 and the second sub-recess J2 that sets up along first direction X alternate arrangement, and make driver chip 21 locate in the second sub-recess J2, can include under the condition of a plurality of cover brilliant films 2 at backlight unit 10, make a plurality of cover brilliant films 2 and recess J's shape phase-match, thereby make a plurality of driver chip 21 all can set up in recess J, and can make cover brilliant film 2 lay in recess J flatly, reduce the position that folding or fold appear when cover brilliant film 2 places in recess J, thereby reduce cover brilliant film 2 and take place damaged risk, improve backlight unit 10's life.

In some embodiments, as shown in fig. 5 and 7, the back plate 3 further includes a back plate body 31, the back plate body 31 is disposed around the groove J (as shown in fig. 5), and the top Jb1 of the sidewall Jb of the groove J is connected with the back plate body 31. The bottom face Ja of the groove J is farther from the light-emitting substrate 1 with respect to the back plate main body 31 in the thickness direction Z of the light-emitting substrate 1.

That is, the groove J projects toward a direction away from the light-emitting substrate 1 with respect to the back plate main body 31.

Illustratively, the groove J and the back plate body 31 are integrally provided.

Through set up recess J on backplate 3, and the bottom surface Ja that sets up recess J is farther away from luminescent substrate 1 for backplate main part 31, thereby can be providing for driver chip 21 and place the space, when protection driver chip 21 avoids the damage, recess J can also regard as the strengthening rib that extends along first direction X of backplate 3, can strengthen backplate 3's intensity, thereby avoid backlight unit 10 to take place deformation, especially can avoid backlight unit 10 to take place to buckle on the direction Y along perpendicular to first direction X, thereby improve display device's product yield, extension display device's life.

In some embodiments, as shown in fig. 9, the backlight module 10 further includes a heat dissipation layer 4 disposed between the bottom surface Ja of the groove J and the driving chip 21, and the heat dissipation layer 4 is connected to the bottom surface Ja of the groove J.

Exemplarily, the heat dissipation layer 4 is bonded to the bottom surface Ja of the groove J by an adhesive, that is, the adhesive is disposed on a side of the heat dissipation layer 4 close to the bottom surface Ja, so that the heat dissipation layer 4 is fixed while the driving chip 21 is prevented from contacting the adhesive, and thus the heat dissipation layer 4 and the driving chip 21 are prevented from being badly heat-conducted and affecting the heat dissipation effect.

Through setting up heat dissipation layer 4, can dispel the heat to driver chip 21, avoid driver chip 21 and other structures to be damaged in the large amount of heats that driver chip 21 produced in the operation to improve backlight unit 10's life.

In some embodiments, as shown in fig. 4 and 11, the backlight module 10 further includes a second flexible printed circuit 5, and one end of the second flexible printed circuit 5 is electrically connected to the light emitting substrate 1.

In an exemplary embodiment, the second flexible wiring board 5 may be configured to transmit a power supply signal (e.g., a positive electrode voltage) to the light emitting elements G in the light emitting unit 12.

Exemplarily, the second flexible wiring board 5 may be electrically connected with the light emitting unit 12 in the light emitting substrate 1.

For example, the signal line group 11 further includes a power trace, and the second flexible printed circuit 5 and the light emitting unit 12 are electrically connected through the power trace.

Specifically, one end of the power supply line is electrically connected to the positive electrode of the light emitting element G in the light emitting unit 12, and the other end of the power supply line is disposed on the backlight side 1b of the light emitting substrate 1 as a pin and is bound and connected to the line in the second flexible printed circuit 5, so that a power supply signal can be transmitted to the light emitting element G in the light emitting unit 12, and the light emission of the light emitting element G is realized.

In an exemplary embodiment, the second flexible wiring board 5 may also be configured to transmit a control signal to the chip on film 2.

Exemplarily, the second flexible circuit board 5 and the chip on film 2 may be electrically connected through a control signal line located in the light emitting substrate 1, and the second flexible circuit board 5 transmits a control signal to the chip on film 2 through the control signal line, so as to control the driving chip 21 in the chip on film 2.

In an exemplary embodiment, the other end of the second flexible wiring board 5 may be electrically connected to an external structure (e.g., a circuit board or a timing controller), so that a power signal and/or a control signal transmitted from the external structure is transmitted to the light emitting substrate 1 through the second flexible wiring board 5, thereby achieving light emission of the light emitting elements G in the light emitting units 12 in the light emitting substrate 1.

As shown in fig. 3 and 10, the back plate 3 is provided with a first opening K1.

Illustratively, as shown in fig. 10 and 11, one side of the rear plate 3 is bent toward a direction close to the light emitting substrate 1. On one hand, each film layer structure of the backlight module 10 can be fixed in the frame of the back plate 3, on the other hand, the side strength of the back plate 3 can be enhanced, and the defects of sinking or cracking and the like of the side of the backlight module 10 are avoided.

As shown in fig. 11, the other end of the second flexible printed circuit board 5 passes through the first opening K1 and extends to a side of the back plate 3 away from the light-emitting substrate 1.

Illustratively, the second flexible circuit board 5 extends to a side of the back plate 3 away from the light-emitting substrate 1, and then is electrically connected with an external structure, such as a circuit board, so as to transmit an electrical signal in the external structure to the light-emitting substrate 1 through the second flexible circuit board 5.

Illustratively, 39 pins may be included in the second flexible wiring board 5.

In the related art, the number of pins electrically connected with an external structure, such as a circuit board, required by the backlight module adopting the passive driving mode is large, for example, the number of the pins is 300, at least three second flexible circuit boards are required to realize the electrical connection between the light-emitting substrate and the circuit board, and accordingly, at least three first openings are required to be arranged on the back plate in the related art, so that the structural strength of the back plate is reduced.

In the embodiment provided by the present disclosure, the number of pins electrically connected to an external structure, such as a circuit board, required by the signal line group 11 in the light-emitting substrate 1 is small, so that one second flexible circuit board 5 can electrically connect the light-emitting substrate 1 to the external structure, such as the circuit board, and therefore, only one first opening K1 needs to be designed in the back plate 3, thereby effectively improving the structural strength of the back plate 3, and further improving the structural strength of the backlight module 10.

In an exemplary embodiment, as shown in fig. 11, the first opening K1 is located at a side of the groove J near the binding side S side of the light emitting substrate 1. That is, the second flexible printed circuit 5 is bound to the light-emitting substrate 1 at the binding side S of the light-emitting substrate 1, and all binding processes (for example, binding the chip on film 2 to the light-emitting substrate 1 and binding the second flexible printed circuit 5 to the light-emitting substrate 1) in the backlight module 10 are completed at the binding side S, so that the process difficulty can be reduced, and the preparation efficiency of the backlight module 10 can be improved.

In some embodiments, as shown in fig. 12, the backlight module 10 further includes a first fixing adhesive layer 6 disposed between the light-emitting substrate 1 and the back plate 3.

The first adhesive layer 6 is disposed to avoid the groove J and the flip chip film 2.

Exemplarily, as shown in fig. 12, the second opening K2 is formed in the first fixing adhesive layer 6, so that the material of the first fixing adhesive layer 6 can avoid the groove J and the chip on film 2, and the material of the first fixing adhesive layer 6 can be prevented from damaging the chip on film 2 or affecting the heat dissipation between the driver chip 21 and the flexible film 22 in the chip on film 2.

Illustratively, the first fixing glue layer 6 is also disposed so as to avoid the second flexible wiring board 5 (see fig. 17).

Through the arrangement of the first fixing adhesive layer 6, the light-emitting substrate 1 and the back plate 3 can be fixed, so that each part in the backlight module 10 is prevented from loosening, and the assembly of the backlight module 10 is completed.

In some embodiments, as shown in fig. 13, the backlight module 10 further includes an optical adjustment film 7 and a glue frame 8.

The optical adjustment film 7 is provided on the light exit side 1a of the light emitting substrate 1. The optical adjustment film 7 is configured to adjust light emitted from the light-emitting substrate 1.

Illustratively, the optical conditioning film 7 may include one or more of at least one of a light uniformizing film, a complex prism, a color conversion film, and a brightness enhancement film. The dodging film is configured to scatter light emitted by the light-emitting substrate 1, so that light emitted to the outside is more uniform, and the display effect is improved; the composite prism is used for condensing light to avoid light scattering; the color conversion film may color-modulate light emitted from the light-emitting substrate 1, for example, convert blue light into white light; the brightness enhancement film can improve the brightness of light, thereby improving the display effect.

Through setting up optics adjusting film 7, can improve the quality of the light that backlight unit 10 sent to promote display device's display effect.

The rubber frame 8 is provided around the optical adjustment film 7. Illustratively, four side surfaces of the optical conditioning film 7 are each abutted with the rubber frame 8. Illustratively, the glue frame is of annular design.

The rubber frame 8 is configured to support and protect each optical adjustment film 7 inside the backlight module 10. The rubber frame 8 mainly plays a bearing role (bearing the optical adjusting films 7), and in addition, all the optical adjusting films 7 are fixed together to avoid loosening; on the other hand, an external structure (e.g., a display panel) and the backlight module 10 may be combined to obtain a display module.

As shown in fig. 13, the bezel 8 is provided on the light exit side 1a of the light emitting substrate 1. Illustratively, as shown in fig. 13, the side surface of the light-emitting substrate 1 where the bonding side S is located is flush with the side surface of the glue frame 8 away from the optical adjustment film 7.

In the related art, the bezel is provided on the side surface where the binding side of the light emitting substrate is located, thereby surrounding the light emitting substrate and the optical adjustment film at the same time.

However, in the backlight module 10 provided in the embodiment of the disclosure, after the active driving method is adopted, the binding side S of the light-emitting substrate 1 needs to be bound (including binding the chip on film 2 and the light-emitting substrate 1, and binding the second flexible printed circuit board 2 and the light-emitting substrate 1). The backlight module 10 provided by the embodiment of the present disclosure locates the light-emitting side 1a of the light-emitting substrate 1 through the glue frame 8, and controls the side of the light-emitting substrate 1 where the binding side S is located, and the side away from the optical adjustment film 7 with the glue frame 8 is flush, thereby extending the width (along the dimension in the Y direction) of the light-emitting substrate 1, increasing the design space of the surface of the light-emitting substrate 1 at the backlight side 1b, and reserving the design space for binding the light-emitting substrate 1 with the flexible film 11 and the second flexible circuit board 5.

In some embodiments, as shown in fig. 13, the backlight module 10 further includes a second fixing adhesive layer 9 disposed between the light-emitting substrate 1 and the adhesive frame 8.

The second fixing glue layer 9 is configured to fix the glue frame 8 on the light emitting substrate 1, so as to fix the optical adjustment film 7 on the light emitting side 1a of the light emitting substrate 1, and further fix the light emitting substrate 1 and an external structure (e.g., a display panel), so as to realize the alignment of the backlight module 10 and the external structure (e.g., the display panel), thereby obtaining the display module.

Exemplarily, as shown in fig. 13, a portion of the second fixing adhesive layer 9 is disposed between the optical adjustment film 7 and the light emitting substrate 1, so that the optical adjustment film 7 is more firmly disposed on the light emitting side 1a of the light emitting substrate 1.

Exemplarily, as shown in fig. 13, one side of the back plate 3 is bent toward the light-emitting substrate 1 and sequentially passes through the side surfaces of the light-emitting substrate 1 and the second fixing adhesive layer 9, and finally extends to the adhesive frame 8, so that the strength of the side of the back plate 3 can be further enhanced, and the strength of the side of the backlight module 10 can be improved.

As shown in fig. 14, some embodiments of the present disclosure also provide a display module 100.

As shown in fig. 15, the display module 100 includes the display panel 20 and the backlight module 10 in the above embodiments.

The display panel 20 is disposed on the light emitting side 1a of the backlight module 10. Exemplarily, as shown in fig. 15, the display module 100 further includes a foam adhesive 20', and the foam adhesive 20' is configured to fix the adhesive frame 8 and the display panel 20, so as to realize the combination of the display panel 20 and the backlight module 10, thereby obtaining the display module 100.

Illustratively, the Display panel 20 may be a Liquid Crystal Display (LCD) panel.

Illustratively, the display panel 20 may include an array substrate, a cell-to-cell substrate, and a liquid crystal layer disposed between the array substrate and the cell-to-cell substrate. The opposite-box substrate is far away from the backlight module 10 relative to the array substrate.

Illustratively, the color filter layer may be included in the opposite-case substrate of the display panel 20. The color filter layer at least includes a red photoresist unit, a green photoresist unit, and a blue photoresist unit, and the red photoresist unit, the green photoresist unit, and the blue photoresist unit are configured to control the color of the light emitted from the display panel 20.

Illustratively, the display panel 20 further includes a black matrix pattern in the opposite-to-box substrate for spacing the red, green, and blue light blocking units.

The display panel 20 further includes a first polarizer disposed on a side of the opposing substrate away from the backlight module 10, and a second polarizer disposed on a side of the array substrate close to the backlight module 10.

The advantages of the display module 100 in the above embodiments of the disclosure are the same as those of the backlight module 10, and are not repeated herein.

In some embodiments, as shown in fig. 16, the display module 100 further includes a circuit board 30.

The circuit board 30 is disposed on a side of the backlight module 10 away from the display panel 20, and the circuit board 30 is disposed on a side of the groove J of the back plate 1 of the backlight module 10.

Illustratively, as shown in fig. 16, the circuit board 30 is provided on a side of the groove J near the binding side S of the light emitting substrate 1.

By arranging the circuit board 30 at one side of the groove J, when the circuit board 30 is assembled, the edge of the groove J in the backlight module 10 can be used as a boundary line to limit the arrangement position of the circuit board 30, so that a laser etching process for manufacturing a reference line can be saved, and the assembly process is simplified.

For example, in the display module 100 provided by the embodiment of the present disclosure, the thickness of the groove J may be substantially equal to the thickness of the circuit board 30, and the circuit board 30 is disposed on a side of the groove J close to the binding side S of the light emitting substrate 1.

The thickness through designing recess J can be roughly equal with the thickness of circuit board 30, and locate recess J with circuit board 30 and be close to the one side that emitting substrate 1 bound side S, can avoid recess J 'S design to increase display module assembly 100' S whole thickness, is favorable to realizing the frivolous design of the display device who adopts the active drive mode.

Illustratively, the size of the circuit board 30 along the first direction X, i.e., the length of the circuit board 30, may be 260mm to 300mm, e.g., 280mm, and the size along the direction Y perpendicular to the first direction X, i.e., the width of the circuit board 30, may be 10mm to 14mm, e.g., 12mm. Compared with the size of the circuit board 30 in the related art (for example, the length is 280mm, and the width is 30 mm), the circuit board 30 provided in the embodiment of the disclosure occupies a smaller design space, and can reserve more design space for the display device.

In some embodiments, as shown in fig. 14 and 16, the display module 100 further includes a third flexible printed circuit 40, and the display panel 20 is electrically connected to the circuit board 30 through the third flexible printed circuit 40.

Illustratively, as shown in fig. 16, one end of the third flexible printed circuit 40 is led out from the display panel 20, bent to pass through the side surface of the binding side S, and finally extended to the circuit board 30, and then electrically connected to the circuit board 30.

The circuit board 30 is configured to supply its required electrical signals to the display panel 20. For example, an electric field is applied to the liquid crystal layer in the display panel 20 to control the liquid crystal, so as to control the light emitted from the display panel 20.

In some embodiments, as shown in fig. 14 and 17, the display module 100 further includes a connector 50, and the connector 50 is disposed on a side of the circuit board 30 away from the backlight module 10.

Illustratively, the connector 50 is provided with sockets, and the number of the sockets is the same as the number of pins of the second flexible wiring board 5, for example, 39 sockets each.

As shown in fig. 17, the second flexible wiring board 5 is plugged with the connector 50.

The circuit board 30 is electrically connected to the second flexible circuit board 5 of the backlight module 10, and the circuit board 30 is further configured to transmit a power signal (e.g., a positive voltage) and/or a control signal to the second flexible circuit board 5, transmit the power signal to the light-emitting unit 12 in the light-emitting substrate 1 through the second flexible circuit board 5, and transmit the control signal to the chip on film 2, thereby implementing light-emitting control of the light-emitting element G in the light-emitting unit 12 in the light-emitting substrate 1.

As shown in fig. 18, some embodiments of the present disclosure further provide a display device 1000, where the display device 1000 includes the display module 100 in the above embodiments.

The beneficial effects that the display device 1000 in the embodiment of the present disclosure can achieve are the same as the beneficial effects that the display module 100 can achieve, and are not described herein again.

Fig. 18 is a top view of a display device 1000 provided by some embodiments of the present disclosure. The display device 1000 may be any device that displays images, whether in motion (e.g., video) or stationary (e.g., still images), and whether textual or textual. More particularly, it is contemplated that embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal Digital Assistants (PDAs), virtual Reality (VR) devices

(Virtual Reality, abbreviated VR) displays, hand-held or portable computers, global Positioning System (abbreviated GPS) receivers/navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), navigators, cockpit controls and/or displays, displays of camera views (e.g., of a rear-view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images for a piece of jewelry), and the like.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art will appreciate that changes or substitutions within the technical scope of the present disclosure are included in the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (17)

1. A backlight module, comprising:

a light emitting substrate including a signal line group and a plurality of light emitting cells electrically connected to the signal line group;

the chip on film is arranged on the non-light-emitting side of the light-emitting substrate and is electrically connected with the signal line group;

the back plate is arranged on the non-light-emitting side of the light-emitting substrate, and the chip on film is positioned between the back plate and the light-emitting substrate; the back plate is provided with a groove, the notch of the groove faces the light-emitting substrate, and at least part of the chip on film is arranged in the groove.

2. The backlight module as claimed in claim 1, wherein the flip-chip film comprises:

the flexible film is electrically connected with the signal line group;

the driving chip is electrically connected with the flexible film; the driving chip is arranged in the groove.

3. The backlight module according to claim 2, wherein the side wall of the recess has a step structure, and is oriented from the notch of the recess to the bottom surface along the thickness direction of the light-emitting substrate, and the side wall of the recess includes a first sub-wall, a step surface and a second sub-wall connected in sequence, and the first sub-wall and the second sub-wall are intersected with the step surface;

the groove comprises a first sub-groove and a second sub-groove, the first sub-groove comprises the first sub-wall surface and the step surface, and the second sub-groove comprises the second sub-wall surface and the bottom surface of the groove;

the driving chip is arranged in the second sub-groove, and at least part of the flexible film is arranged in the first sub-groove.

4. A backlight module according to claim 3, wherein the grooves comprise a plurality of the second sub-grooves, and the plurality of the second sub-grooves are arranged along a first direction; the first direction is parallel to the extending direction of the binding side edge of the light-emitting substrate;

the backlight module comprises a plurality of chip on films, and the chip on films are sequentially arranged along the first direction;

each chip on film comprises at least one driving chip, and all the driving chips belonging to the same chip on film are arranged in the same second sub-groove.

5. The backlight module according to claim 4, wherein the grooves comprise a plurality of the first sub-grooves, and the first sub-grooves and the second sub-grooves are alternately arranged along the first direction;

along the first direction, two side edges of the flexible film of each chip on film exceed two side edges of the driving chip of the chip on film respectively, the two side edges of the flexible film are located in two first sub-grooves on two sides of the second sub-groove where the driving chip is located respectively.

6. The backlight module of claim 2, further comprising:

the heat dissipation layer is arranged between the bottom surface of the groove and the driving chip and connected with the bottom surface of the groove.

7. The backlight module according to claim 1, wherein the back plate further comprises a back plate main body, the back plate main body is disposed around the groove, and the top of the sidewall of the groove is connected with the back plate main body;

in the thickness direction of the light emitting substrate, the bottom surface of the groove is farther away from the light emitting substrate relative to the back plate main body.

8. The backlight module according to any one of claims 1-7, further comprising:

one end of the second flexible circuit board is electrically connected with the light-emitting substrate;

the backboard is provided with a first opening, and the other end of the second flexible circuit board penetrates through the first opening and extends to one side of the backboard far away from the light-emitting substrate.

9. A backlight module according to claim 8, wherein the first opening is located at a side of the recess near a bound side edge of the light-emitting substrate.

10. The backlight module according to any one of claims 1-7, further comprising:

the first fixing adhesive layer is arranged between the light-emitting substrate and the back plate; the first fixing adhesive layer is arranged to avoid the groove and the chip on film.

11. The backlight module according to any one of claims 1-7, further comprising:

the optical adjusting film is arranged on the light-emitting side of the light-emitting substrate;

and the rubber frame surrounds the optical adjusting film, and is arranged on the light-emitting side of the light-emitting substrate.

12. The backlight module according to claim 11, further comprising:

and the second fixed glue layer is arranged between the light-emitting substrate and the glue frame.

13. A display module, comprising:

a backlight module according to any one of claims 1 to 12;

and the display panel is arranged on the light emitting side of the backlight module.

14. The display module according to claim 13, further comprising:

the circuit board is arranged on one side of the backlight module, which is far away from the display panel, and is arranged on one side of the groove of the back plate of the backlight module; the circuit board is electrically connected with the second flexible circuit board of the backlight module.

15. The display module of claim 14, further comprising:

and the display panel is electrically connected with the circuit board through the third flexible circuit board.

16. The display module according to claim 14 or 15, further comprising:

the connector is arranged on one side of the circuit board, which is far away from the backlight module; the second flexible circuit board is connected with the connector in an inserting mode.

17. A display device comprising the display module according to any one of claims 13 to 16.

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