CN107946228A - A kind of vacuum WAND - Google Patents

A kind of vacuum WAND Download PDF

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Publication number
CN107946228A
CN107946228A CN201711184472.7A CN201711184472A CN107946228A CN 107946228 A CN107946228 A CN 107946228A CN 201711184472 A CN201711184472 A CN 201711184472A CN 107946228 A CN107946228 A CN 107946228A
Authority
CN
China
Prior art keywords
vacuum
cups
switch
penholder
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711184472.7A
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Chinese (zh)
Inventor
夏久龙
王向阳
刘磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CETC 55 Research Institute
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CETC 55 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CETC 55 Research Institute filed Critical CETC 55 Research Institute
Priority to CN201711184472.7A priority Critical patent/CN107946228A/en
Publication of CN107946228A publication Critical patent/CN107946228A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The present invention is a kind of vacuum WAND, its structure includes vacuum cups, vacuum cups Multi-angle adjusting mechanism and vacuum detecting system, and the vacuum cups Multi-angle adjusting mechanism includes A vacuum metals tubule, B vacuum metals tubule, rubber hose, fixed metal tube, screw, rotary rail;Vacuum detecting system includes vacuum indicator light, micro power and vacuum sensing sensor, and vacuum indicator light, micro power and vacuum sensing sensor are connected in series.Advantage:1st, vacuum cups Multi-angle adjusting mechanism can adjust rotation and fix, and meet various equipment and the needs of manually carrying.2. the vacuum detecting system of vacuum WAND, can avoid because wafer scrap caused by vacuum blockage or switching damage.

Description

A kind of vacuum WAND
Technical field
The present invention relates to a kind of vacuum WAND, belongs to chip aspiration technique field.
Background technology
In semiconductor manufacturing industry, manufacturing process have to it is antifouling dust-proof, but processing and product circulation when can inevitably contact Or manual handling chip, particularly in some compound manufacturing process, since the degree of automation is relatively low, manual contact chip Probability can greatly increase.Since the cost of GaAs, gallium nitride is much higher relative to silicon chip, so not only to ensure antifouling It is dust-proof, it is often more important that to ensure the safety of chip.
The content of the invention
The present invention proposes a kind of vacuum WAND, it is desirable to provide a kind of vacuum cups adjusts rotation and fixes while prevent The vacuum WAND of wafer breakage.
Technical scheme:
A kind of vacuum WAND, its structure include vacuum cups 9 and vacuum cups Multi-angle adjusting mechanism, and the vacuum cups is polygonal Spend adjusting mechanism include A vacuum metals tubule 10, B vacuum metals tubule 18, rubber hose 11, fixed metal tube 12, screw 13, Rotary rail 14;Wherein, vacuum cups 9 is connected with the A ends of A vacuum metals tubule 10, and the B ends of A vacuum metals tubule 10 pass through Rubber hose 11 is connected with the A ends of B vacuum metals tubule 18, and the A ends of fixed metal tube 12 are connected with A vacuum metals tubule 10, B End is equipped with screw 13, and the B ends of fixed metal tube 12 can adjust angle along guide rail 14 and be fixed by screw 13, guide rail 14 and B Vacuum metal tubule 18 connects;The B ends of the B vacuum metals tubule 18 are equipped with internal thread link connector 15.
Beneficial effects of the present invention:
1st, vacuum cups Multi-angle adjusting mechanism can adjust rotation and fix, and meet various equipment and the needs of manually carrying.
2. the vacuum detecting system of vacuum WAND, can avoid because chip report caused by vacuum blockage or switching damage It is useless.
Brief description of the drawings
Fig. 1 is a kind of fragmentary front view of vacuum WAND.
Fig. 2 is a kind of Multi-angle adjusting mechanism of vacuum WAND.
Fig. 3 is a kind of vacuum detecting system schematic of vacuum WAND.
1 is vacuum switch in figure;2 be vacuum indicator light;3 be vacuum switch fore vacuum pipeline;4 be branch line;5 are Vacuum detecting system;6 be vacuum switch rear end vacuum line;7 be vacuum hose;8 be vacuum cups connection screw thread;9 be vacuum Suction nozzle;10 be vacuum metal tubule;11 be rubber hose connection;12 be fixed metal tube;13 be lock screw;14 be that rotation is led Rail;15 be internal thread link connector;16 be micro power;17 be vacuum transducer;18 be vacuum metal tubule.
Embodiment
A kind of vacuum WAND, its structure include vacuum cups 9 and vacuum cups Multi-angle adjusting mechanism, the vacuum cups Multi-angle adjusting mechanism includes A vacuum metals tubule 10, B vacuum metals tubule 18, rubber hose 11, fixed metal tube 12, spiral shell Silk 13, rotary rail 14;Wherein, vacuum cups 9 is connected with the A ends of A vacuum metals tubule 10, the B ends of A vacuum metals tubule 10 It is connected by rubber hose 11 with the A ends of B vacuum metals tubule 18, the A ends of fixed metal tube 12 connect with A vacuum metals tubule 10 Connect, B ends are equipped with screw 13, and the B ends of fixed metal tube 12 can adjust angle along guide rail 14 and be fixed by screw 13, guide rail 14 It is connected with B vacuum metals tubule 18;The B ends of the B vacuum metals tubule 18 are equipped with internal thread link connector 15.
The guide rail 14 has two, and the screw 13 has two.
It is true that the vacuum WAND further includes penholder, vacuum switch 1, vacuum switch fore vacuum pipeline 3, vacuum switch rear end Blank pipe road 6;Wherein, vacuum switch 1 is arranged in the middle part of penholder shaft, and the front end of vacuum switch 1 is true for vacuum switch front end in penholder Blank pipe road 3, the rear end of vacuum switch 1 are vacuum switch rear end vacuum line 6,3 end of vacuum switch fore vacuum pipeline of penholder Equipped with vacuum cups connection screw thread 8, vacuum cups connection screw thread 8 links connector 15 with the internal thread and is connected through a screw thread, pen 6 end of the vacuum switch rear end vacuum line connection vacuum hose of bar.
Branch line 4 and vacuum detecting system are further included, the vacuum detecting system includes vacuum indicator light 2, micro electric Source 16 and vacuum sensing sensor 17, vacuum indicator light 2, micro power 16 and vacuum sensing sensor 17 are connected in series;Wherein, Branch line 4 is located in penholder, connection vacuum switch fore vacuum pipeline 3 and vacuum detecting system.
The micro power 16 is external power supply.
Technical scheme is further illustrated below in conjunction with the accompanying drawings.
Compare attached drawing 1, a kind of vacuum WAND, including penholder, vacuum switch 1, vacuum indicator light 2, vacuum switch front end are true Blank pipe road 3, branch line 4, vacuum detecting system 5, vacuum switch rear end vacuum line 6, vacuum hose 7 are connected with vacuum cups Screw thread 8;Wherein, vacuum switch 1 is arranged in the middle part of penholder shaft, and the front end of vacuum switch 1 is vacuum switch fore vacuum in penholder Pipeline 3, the rear end of vacuum switch 1 is vacuum switch rear end vacuum line 6, and 3 end of vacuum switch fore vacuum pipeline of penholder is set There is vacuum cups connection screw thread 8, vacuum cups connection screw thread 8 links connector 15 with the internal thread and is connected through a screw thread, penholder 6 end of vacuum switch rear end vacuum line connection vacuum hose 7, branch line 4 be located in penholder, and it is true to connect vacuum switch front end Blank pipe road 3 and vacuum detecting are 5.
Compare attached drawing 2, a kind of vacuum WAND, including vacuum cups 9 and vacuum cups Multi-angle adjusting mechanism, vacuum cups Multi-angle adjusting mechanism includes A vacuum metals tubule 10, B vacuum metals tubule 18, rubber hose 11, fixed metal tube 12, spiral shell Silk 13, rotary rail 14;Wherein, vacuum cups 9 is connected with the A ends of A vacuum metals tubule 10, the B ends of A vacuum metals tubule 10 It is connected by rubber hose 11 with the A ends of B vacuum metals tubule 18, the A ends of fixed metal tube 12 connect with A vacuum metals tubule 10 Connect, B ends are equipped with screw 13, and the B ends of fixed metal tube 12 can adjust angle along guide rail 14 and be fixed by screw 13, guide rail 14 It is connected with B vacuum metals tubule 18;The B ends of the B vacuum metals tubule 18 are equipped with internal thread link connector 15;Guide rail 14 has Two, screw 13 has two.
Attached drawing 3 is compareed, vacuum detecting system includes vacuum indicator light 2, micro power 16 and vacuum sensing sensor 17, Vacuum indicator light 2, micro power 16 and vacuum sensing sensor 17 are connected in series.Micro power 16 can also be external power supply.
Embodiment 1
The presetting preset value of vacuum transducer in vacuum detecting system 5, when the vacuum WAND trip switch 1 installed is held After chip, a voltage is exported after the vacuum values in vacuum switch fore vacuum pipeline 3 reach the preset value, vacuum is attached to and opens The vacuum indicator light 2 closed on fore vacuum pipeline 3 can light.Whether operator can judge chip according to vacuum indicator light 2 Safely and whether vacuum WAND is faulty.
13 screws are unclamped, required angle in practical operation, fastening screw 13 are adjusted along guide rail 14.Can level can band The vacuum cups of angle can meet most equipment and carry demand.
Micro power(Can also be external)16 improve power supply to indicator light and vacuum transducer 17, when the vacuum detected Equivalent to the conducting wire of conducting, indicator light 2 brightens vacuum transducer when reaching setting value.
Vacuum cups connection screw thread 8 links connector 15 with the internal thread in Fig. 2 and is connected through a screw thread.

Claims (5)

1. a kind of vacuum WAND, it is characterised in that its structure includes vacuum cups and vacuum cups Multi-angle adjusting mechanism, described Vacuum cups Multi-angle adjusting mechanism includes A vacuum metals tubule, B vacuum metals tubule, rubber hose, fixed metal tube, spiral shell Silk, rotary rail;Wherein, vacuum cups is connected with the A ends of A vacuum metal tubules, and the B ends of A vacuum metal tubules pass through rubber Hose is connected with the A ends of B vacuum metal tubules, and the A ends of fixed metal tube are connected with A vacuum metal tubules, the B of fixed metal tube End is equipped with screw, and the B ends of fixed metal tube can adjust angle and be screwed along guide rail, and guide rail and B vacuum metals are thin Pipe connects;The B ends of the B vacuum metals tubule are equipped with internal thread link connector.
A kind of 2. vacuum WAND according to claim 1, it is characterised in that:The guide rail has two, and the screw has two It is a.
A kind of 3. vacuum WAND according to claim 1, it is characterised in that:The vacuum WAND further includes penholder, vacuum Switch, vacuum switch fore vacuum pipeline, vacuum switch rear end vacuum line;Wherein, vacuum switch is arranged in the middle part of penholder shaft, The front end of vacuum switch is vacuum switch fore vacuum pipeline in penholder, and the rear end of vacuum switch is vacuum switch rear end vacuum tube Road, the vacuum switch fore vacuum pipeline end of penholder are equipped with vacuum cups connection screw thread, vacuum cups connection screw thread with it is described interior Screw thread link connector is connected through a screw thread, the vacuum switch rear end vacuum tube terminal connection vacuum hose of penholder.
A kind of 4. vacuum WAND according to claim 1, it is characterised in that:Further include branch line and vacuum detecting system System, the vacuum detecting system include vacuum indicator light, micro power and vacuum sensing sensor, vacuum indicator light, micro electric Source and vacuum sensing sensor are connected in series;Wherein, vacuum indicator light is arranged on the vacuum switch fore vacuum pipeline 3 of penholder shaft Section, branch line are located in penholder, branch line connection vacuum switch fore vacuum pipeline and vacuum detecting system.
A kind of 5. vacuum WAND according to claim 4, it is characterised in that:The micro power is external power supply.
CN201711184472.7A 2017-11-23 2017-11-23 A kind of vacuum WAND Pending CN107946228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711184472.7A CN107946228A (en) 2017-11-23 2017-11-23 A kind of vacuum WAND

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711184472.7A CN107946228A (en) 2017-11-23 2017-11-23 A kind of vacuum WAND

Publications (1)

Publication Number Publication Date
CN107946228A true CN107946228A (en) 2018-04-20

Family

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Family Applications (1)

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CN201711184472.7A Pending CN107946228A (en) 2017-11-23 2017-11-23 A kind of vacuum WAND

Country Status (1)

Country Link
CN (1) CN107946228A (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383751U (en) * 1999-01-22 2000-03-01 United Microelectronics Corp Vacuum suction pen with adjustable vacuum display
TW459330B (en) * 2000-12-04 2001-10-11 United Microelectronics Corp Connection-operated varying-angle suction pen
JP2002346963A (en) * 2001-05-29 2002-12-04 Seiko Epson Corp Vacuum tweezers with terminal input pen function, electro-optical device manufacturing method, electro- optical device and electronic appliance
TW518307B (en) * 2000-10-04 2003-01-21 United Microelectronics Corp Multi-angle bent sucking pen
KR20070016789A (en) * 2005-08-05 2007-02-08 삼성전자주식회사 Apparatus for transferring wafer
CN201233467Y (en) * 2008-06-04 2009-05-06 安润科技股份有限公司 Reflection mechanism having non-directional adjustment
GB201011148D0 (en) * 2010-07-02 2010-08-18 Lai Peng C Shooting angle adjuster
CN202601707U (en) * 2012-05-15 2012-12-12 浙江宝利特新能源股份有限公司 Vacuum suction pen
CN202839575U (en) * 2012-09-11 2013-03-27 彩虹集团公司 Vacuum nozzle self-adaptive to any angle for crystalline silicon cell
CN205140320U (en) * 2015-11-27 2016-04-06 林建伟 Air pressure experiences pipe
CN205469575U (en) * 2016-03-15 2016-08-17 天津市菲佳自行车工贸有限公司 Can regulate and control bicycle frame
CN105895571A (en) * 2016-01-22 2016-08-24 苏州能讯高能半导体有限公司 Vacuum sucking pen
JP2016162914A (en) * 2015-03-03 2016-09-05 株式会社ディスコ Vacuum tweezer
CN207966951U (en) * 2017-11-23 2018-10-12 中国电子科技集团公司第五十五研究所 A kind of vacuum WAND

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383751U (en) * 1999-01-22 2000-03-01 United Microelectronics Corp Vacuum suction pen with adjustable vacuum display
TW518307B (en) * 2000-10-04 2003-01-21 United Microelectronics Corp Multi-angle bent sucking pen
TW459330B (en) * 2000-12-04 2001-10-11 United Microelectronics Corp Connection-operated varying-angle suction pen
JP2002346963A (en) * 2001-05-29 2002-12-04 Seiko Epson Corp Vacuum tweezers with terminal input pen function, electro-optical device manufacturing method, electro- optical device and electronic appliance
KR20070016789A (en) * 2005-08-05 2007-02-08 삼성전자주식회사 Apparatus for transferring wafer
CN201233467Y (en) * 2008-06-04 2009-05-06 安润科技股份有限公司 Reflection mechanism having non-directional adjustment
GB201011148D0 (en) * 2010-07-02 2010-08-18 Lai Peng C Shooting angle adjuster
CN202601707U (en) * 2012-05-15 2012-12-12 浙江宝利特新能源股份有限公司 Vacuum suction pen
CN202839575U (en) * 2012-09-11 2013-03-27 彩虹集团公司 Vacuum nozzle self-adaptive to any angle for crystalline silicon cell
JP2016162914A (en) * 2015-03-03 2016-09-05 株式会社ディスコ Vacuum tweezer
CN205140320U (en) * 2015-11-27 2016-04-06 林建伟 Air pressure experiences pipe
CN105895571A (en) * 2016-01-22 2016-08-24 苏州能讯高能半导体有限公司 Vacuum sucking pen
CN205469575U (en) * 2016-03-15 2016-08-17 天津市菲佳自行车工贸有限公司 Can regulate and control bicycle frame
CN207966951U (en) * 2017-11-23 2018-10-12 中国电子科技集团公司第五十五研究所 A kind of vacuum WAND

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
TAKAHIRO YAMASHITA ET.AL: "Ultra-thin Piezoelectric Strain Sensor Array Integrated on Flexible Printed Circuit for Structural Health Monitoring", IEEE SENSORS. PROCEEDINGS, 31 December 2016 (2016-12-31), pages 1 - 3 *
郭东等: "自动排片机在IC芯片分选中的应用研究", 电子工业专用设备, 30 April 2011 (2011-04-30), pages 21 - 24 *

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