CN203607385U - Manual wafer picker suitable for large-diameter wafer processing - Google Patents
Manual wafer picker suitable for large-diameter wafer processing Download PDFInfo
- Publication number
- CN203607385U CN203607385U CN201320733794.3U CN201320733794U CN203607385U CN 203607385 U CN203607385 U CN 203607385U CN 201320733794 U CN201320733794 U CN 201320733794U CN 203607385 U CN203607385 U CN 203607385U
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- CN
- China
- Prior art keywords
- wafer
- main body
- manual
- applicable
- taking device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 48
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 abstract 3
- 238000007599 discharging Methods 0.000 abstract 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a manual wafer picker suitable for large-diameter wafer processing. The manual wafer picker comprises a cylinder shape main body, wherein a lower end of the main body is equipped with a central absorption disc, and an upper end of the main body is equipped with a handle; the main body is also provided with a pressure discharging hole and a vacuum pipe connection port; three telescoping pipes are mounted at a middle part of the main body, and tail ends of the three telescoping pipes are respectively equipped with an auxiliary absorption discs. In the manual wafer picker, four absorption discs are contacted with the wafer to absorb the wafer, so that the wafer is prevented from deformation, a break rate of the wafer is reduced, and wafer lose is reduced. The manual wafer picker which is applicable for wafers with different diameters through simple adjustment, is convenient and practical.
Description
Technical field
The utility model relates to a kind of manually picture-taking device, relates in particular to a kind of manual picture-taking device that is applicable to diameter wafers processing.
Background technology
In wafer fabrication processes, carry out attrition process in order to obtain flat surface, after processing, take out wafer from mill and be mostly manual operation, after holding wafer, takes out a hand-held picture-taking device.Traditional picture-taking device is generally for the design of small size wafer, and in the time drawing diameter wafers, wafer meeting unbalance stress, deformation occurs.In addition, because wafer is fragile material, while adopting traditional picture-taking device to draw diameter wafers, the broken situation of as easy as rolling off a log appearance, has a strong impact on processed finished products rate.
Utility model content
The purpose of this utility model is to provide a kind of manual picture-taking device that is applicable to diameter wafers processing, to reduce wafer fragmentation, reduces wafer loss, simultaneously through the simple wafer that goes for different-diameter of adjusting.
For achieving the above object, the utility model is by the following technical solutions:
A kind of manual picture-taking device that is applicable to diameter wafers processing, comprise tubular body, the lower end of this main body is provided with center sucker, upper end is provided with handle, in this main body, be also provided with relief hole and vacuum tube interface, this main body middle part is provided with three telescoping tubes, and the end of these three telescoping tubes is installed respectively an assisted sucking disc.
Described center sucker and three assisted sucking discs are at grade.
Described relief hole is positioned at handle below.
Between described telescoping tube and main body for being threaded.
Picture-taking device of the present utility model, by regulating telescoping tube length to go for 8～12 inches of different-diameter wafers.
The utility model has the advantage of:
The utility model contacts with wafer by four suckers, and while drawing wafer, wafer can not produce deformation, has reduced wafer reduction ratios, has reduced wafer loss; Go for the wafer of different-diameter by simple adjustment, convenient and practical.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 1, the manual picture-taking device that is applicable to diameter wafers processing of the present utility model comprises tubular body 1, the lower end of main body 1 is provided with center sucker 2, upper end is provided with handle 3, in main body, 1 is also provided with relief hole 4 and vacuum tube interface 5, and relief hole 4 is positioned at the below of handle 3, and vacuum tube interface 5 is for connecting vacuum tube 6, the middle part of main body 1 is provided with three telescoping tubes 7, and the end of these three telescoping tubes is installed respectively an assisted sucking disc 8.Center sucker 2 and three assisted sucking discs 8 are connected with main body 1 and telescoping tube 7 respectively, and internal pipeline communicates, and are finally communicated with vacuum tube 6.
In the utility model, three telescoping tubes 7 are symmetrically distributed in main body 1 around, and three assisted sucking discs 8 are in the same plane with center sucker 2.Between three telescoping tubes and main body, can adopt and be threaded.By regulating telescoping tube length to adjust the position of assisted sucking disc, can adapt to for example diameter of different-diameter is the needs of 8～12 inches of wafers.Three telescoping tubes can be fixed by holding screw in place.
The main body of the manual picture-taking device of the utility model can adopt the hard material such as engineering plastics or stainless steel such as polypropylene (PP plastics), polyvinyl chloride (PVC plastics).Sucker can adopt the flexible materials such as acrylonitrile-butadiene rubber, modified polyvinyl chloride (Modifying Character for PVC Plastic) or silica gel.
The utility model in use, is held handle, and picture-taking device is placed on wafer, and finger is blocked relief hole, and under the state vacuumizing, the inner negative pressure that forms of picture-taking device holds wafer.While placing wafer, finger is decontroled relief hole, and wafer comes off naturally.It is smooth undeformed that whole process wafer keeps, and can effectively reduce wafer distortion fragmentation, reduces wafer loss.
Claims (5)
1. one kind is applicable to the manual picture-taking device of diameter wafers processing, it is characterized in that, comprise tubular body, the lower end of this main body is provided with center sucker, upper end is provided with handle, in this main body, be also provided with relief hole and vacuum tube interface, this main body middle part is provided with three telescoping tubes, and the end of these three telescoping tubes is installed respectively an assisted sucking disc.
2. the manual picture-taking device that is applicable to diameter wafers processing according to claim 1, is characterized in that, described center sucker and three assisted sucking discs are at grade.
3. the manual picture-taking device that is applicable to diameter wafers processing according to claim 1 and 2, is characterized in that, described relief hole is positioned at handle below.
4. the manual picture-taking device that is applicable to diameter wafers processing according to claim 1 and 2, is characterized in that, between described telescoping tube and main body for being threaded.
5. the manual picture-taking device that is applicable to diameter wafers processing according to claim 1 and 2, is characterized in that, by regulating telescoping tube length to be applicable to 8～12 inches of different-diameter wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320733794.3U CN203607385U (en) | 2013-11-19 | 2013-11-19 | Manual wafer picker suitable for large-diameter wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320733794.3U CN203607385U (en) | 2013-11-19 | 2013-11-19 | Manual wafer picker suitable for large-diameter wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203607385U true CN203607385U (en) | 2014-05-21 |
Family
ID=50720049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320733794.3U Expired - Lifetime CN203607385U (en) | 2013-11-19 | 2013-11-19 | Manual wafer picker suitable for large-diameter wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203607385U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109665318A (en) * | 2019-02-26 | 2019-04-23 | 深圳市诚亿自动化科技有限公司 | A kind of multi-direction material taking arm mechanism |
| CN110228626A (en) * | 2019-05-29 | 2019-09-13 | 湖北中烟工业有限责任公司 | A kind of plume cigarette taking out device |
-
2013
- 2013-11-19 CN CN201320733794.3U patent/CN203607385U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109665318A (en) * | 2019-02-26 | 2019-04-23 | 深圳市诚亿自动化科技有限公司 | A kind of multi-direction material taking arm mechanism |
| CN110228626A (en) * | 2019-05-29 | 2019-09-13 | 湖北中烟工业有限责任公司 | A kind of plume cigarette taking out device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GRINM ADVANCED MATERIALS CO., LTD. Free format text: FORMER NAME: GRINM SEMICONDUCTOR MATERIALS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee after: GRINM ADVANCED MATERIALS CO.,LTD. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD. Effective date: 20150611 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150611 Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road Patentee after: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee before: GRINM ADVANCED MATERIALS CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee after: Youyan semiconductor silicon materials Co.,Ltd. Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140521 |
|
| CX01 | Expiry of patent term |