CN107946225A - A kind of silicon chip aligning gear - Google Patents
A kind of silicon chip aligning gear Download PDFInfo
- Publication number
- CN107946225A CN107946225A CN201711384048.7A CN201711384048A CN107946225A CN 107946225 A CN107946225 A CN 107946225A CN 201711384048 A CN201711384048 A CN 201711384048A CN 107946225 A CN107946225 A CN 107946225A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- angle
- inclination
- suction mechanism
- side plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Registering Or Overturning Sheets (AREA)
Abstract
The invention discloses a kind of silicon chip aligning gear, including carrier device base, transport block is provided with the top of the carrier device base, silicon chip is provided between the delivery side plate, the bottom of the silicon chip is connected to inside the card slot at the top of transport block, the side of the silicon chip is stuck between delivery side plate, the silicon chip is tilted and is connected to inside the card slot at the top of transport block, angle of inclination is identical with the angle of inclination for delivering side plate, the side of the silicon chip is provided with sheet suction mechanism, the suction disc of the sheet suction mechanism tilts installation, angle of inclination is identical with the angle of inclination of silicon chip, the sheet suction mechanism is provided with suction nozzle in face of the one side of silicon chip, the one side that the sheet suction mechanism facing away from silicon chip is provided with attachment device.This silicon chip aligning gear, sheet suction mechanism because its own it is close with the angle that silicon chip is inclined to angle, contacted between sheet suction mechanism and silicon chip for face, so as to reduce fragment rate, the present apparatus is simple in structure, efficiently solves the problems, such as that fragment rate is done.
Description
Technical field
The present invention relates to silicon chip aligning gear technical field, is specially a kind of silicon chip aligning gear.
Background technology
Relation of the general device silicon chip during the motion between bogey is not known, and is waved it and is added broken
Piece rate.
The content of the invention
It is an object of the invention to provide a kind of silicon chip aligning gear, have the advantages that fragment rate is low, solve existing skill
The problem of in art.
To achieve the above object, the present invention provides following technical solution：A kind of silicon chip aligning gear, including toter bottom
Seat, is provided with transport block at the top of the carrier device base, the transport block carrier device base top slide, it is described
The side of transport block is provided with delivery side plate, and the delivery side plate is tiltedly mounted on the top both sides of carrier device base, described
Delivery side plate is symmetrically mounted on the top both sides of carrier device base in pairs, and silicon chip is provided between the delivery side plate, described
The bottom of silicon chip is connected to inside the card slot at the top of transport block, and the side of the silicon chip is stuck between delivery side plate, the silicon chip
Inclination is connected to inside the card slot at the top of transport block, and angle of inclination is identical with the angle of inclination for delivering side plate, and the one of the silicon chip
Side is provided with sheet suction mechanism, and the suction disc of the sheet suction mechanism tilts installation, and angle of inclination is identical with the angle of inclination of silicon chip, described
Sheet suction mechanism is provided with suction nozzle in face of the one side of silicon chip, and the one side that the sheet suction mechanism facing away from silicon chip is provided with attachment device.
Preferably, card slot is provided with the top of the transport block, the size of card slot is identical with the size of silicon chip bottom.
Preferably, the attachment device is connected with vacuum machine.
Preferably, the delivery side plate is fixedly mounted on the top both sides of carrier device base.
Preferably, the angle of inclination of the suction nozzle and the angle of inclination of silicon chip are identical.
Compared with prior art, beneficial effects of the present invention are as follows：
This silicon chip aligning gear, silicon chip are tilted and are connected to inside the card slot at the top of transport block, and angle of inclination is inclined with delivery side plate
Rake angle is identical, and the side of silicon chip is provided with sheet suction mechanism, and the suction disc of sheet suction mechanism tilts installation, and angle of inclination and silicon chip incline
Rake angle is identical, and sheet suction mechanism is provided with suction nozzle, the angle of inclination of suction nozzle and the angle of inclination phase of silicon chip in face of the one side of silicon chip
Together, sheet suction mechanism because its own it is close with the angle that silicon chip is inclined to angle, be face between sheet suction mechanism and silicon chip
Contact, so as to reduce fragment rate, the present apparatus is simple in structure, efficiently solves the problems, such as that fragment rate is done.
Brief description of the drawings
Fig. 1 is the overall structure operating diagram of the present invention；
Fig. 2 is that the toter of the present invention and silicon chip install side view；
Fig. 3 is that the toter of the present invention and silicon chip install front view；
Fig. 4 is the sheet suction mechanism structure diagram of the present invention.
In figure：1 carrier device base, 11 transport blocks, 2 delivery side plates, 3 silicon chips, 4 sheet suction mechanisms, 41 suction nozzles, 42 connection dresses
Put.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
- 4 are please referred to Fig.1, a kind of silicon chip aligning gear, including carrier device base 1, the top of carrier device base 1 are set
Transport block 11 is equipped with, the top of transport block 11 is provided with card slot, and the size of card slot is identical with the size of 3 bottom of silicon chip, transport block
Card slot on 11 is stuck in the both sides of 3 bottom of silicon chip, and silicon chip 3 is clamped from both sides, does not influence picking and placeing for silicon chip 3, and transport block 11 is being transported
The top slide of device pedestal 1 is carried, top movements of the silicon chip 3 in carrier device base 1 is transported, realizes the delivery of silicon chip 3,
The side of transport block 11 is provided with delivery side plate 2, and delivery side plate 2 is tiltedly mounted on the top both sides of carrier device base 1, delivery
Side plate 2 is symmetrically mounted on the top both sides of carrier device base 1 in pairs, and delivery side plate 2 is fixedly mounted on carrier device base 1
Top both sides, are not moved with the movement of transport block 11, and delivery side plate 2 is clipped in the both sides of silicon chip 3, effectively maintains silicon chip 3
Angle of inclination, delivers and is provided with silicon chip 3 between side plate 2, the bottom of silicon chip 3 is connected to inside the card slot at the top of transport block 11, silicon
The side of piece 3 is stuck between delivery side plate 2, and silicon chip 3, which tilts, to be connected to inside the card slot at the top of transport block 11, angle of inclination and fortune
The angle of inclination of load side plate 2 is identical, and the side of silicon chip 3 is provided with sheet suction mechanism 4, and the suction disc of sheet suction mechanism 4 tilts installation, tilts
Angle is identical with the angle of inclination of silicon chip 3, and sheet suction mechanism 4 is provided with suction nozzle 41, the inclination angle of suction nozzle 41 in face of the one side of silicon chip 3
Degree is identical with the angle of inclination of silicon chip 3, and the one side that sheet suction mechanism 4 facing away from silicon chip 3 is provided with attachment device 42, attachment device 42
Be connected with vacuum machine, sheet suction mechanism 4 because its own it is close with the angle that silicon chip 3 is inclined to angle, sheet suction mechanism 4 with
Contacted between silicon chip 3 for face, so as to reduce fragment rate, this silicon chip aligning gear, silicon chip 3, which tilts, is connected to the top of transport block 11
Card slot inside, angle of inclination with deliver side plate 2 angle of inclination it is identical, the side of silicon chip 3 is provided with sheet suction mechanism 4, suction piece
The suction disc of mechanism 4 tilts installation, and angle of inclination is identical with the angle of inclination of silicon chip 3, and sheet suction mechanism 4 is pacified in face of the one side of silicon chip 3
Equipped with suction nozzle 41, the angle of inclination of suction nozzle 41 is identical with the angle of inclination of silicon chip 3, and sheet suction mechanism 4 is because its own institute's band angle
It is close with the angle that silicon chip 3 is inclined to, so being contacted between sheet suction mechanism 4 and silicon chip 3 for face, so as to reduce fragment rate, this dress
Put simple in structure, efficiently solve the problems, such as that fragment rate is done.
In summary：This silicon chip aligning gear, silicon chip 3, which tilts, to be connected to inside the card slot at the top of transport block 11, inclination angle
Degree is identical with the angle of inclination for delivering side plate 2, and the side of silicon chip 3 is provided with sheet suction mechanism 4, and the suction disc of sheet suction mechanism 4 tilts peace
Dress, angle of inclination is identical with the angle of inclination of silicon chip 3, and sheet suction mechanism 4 is provided with suction nozzle 41, suction nozzle 41 in face of the one side of silicon chip 3
Angle of inclination it is identical with the angle of inclination of silicon chip 3, sheet suction mechanism 4 because its own institute with angle and silicon chip 3 deviation angle
Close, so being contacted between sheet suction mechanism 4 and silicon chip 3 for face, so as to reduce fragment rate, the present apparatus is simple in structure, effectively solution
Fragment rate of having determined does to obtain problem.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of changes, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of silicon chip aligning gear, including carrier device base（1）, it is characterised in that：The carrier device base（1）Top
Portion is provided with transport block（11）, the transport block（11）In carrier device base（1）Top slide, the transport block（11）'s
Side is provided with delivery side plate（2）, the delivery side plate（2）It is tiltedly mounted on carrier device base（1）Top both sides, it is described
Deliver side plate（2）It is symmetrically mounted on carrier device base in pairs（1）Top both sides, the delivery side plate（2）Between be provided with
Silicon chip（3）, the silicon chip（3）Bottom be connected to transport block（11）Inside the card slot at top, the silicon chip（3）Side be stuck in
Deliver side plate（2）Between, the silicon chip（3）Inclination is connected to transport block（11）Inside the card slot at top, angle of inclination and delivery
Side plate（2）Angle of inclination it is identical, the silicon chip（3）Side be provided with sheet suction mechanism（4）, the sheet suction mechanism（4）Suction
Plate tilts installation, angle of inclination and silicon chip（3）Angle of inclination it is identical, the sheet suction mechanism（4）In face of silicon chip（3）One side peace
Equipped with suction nozzle（41）, the sheet suction mechanism（4）It facing away from silicon chip（3）One side attachment device is installed（42）.
A kind of 2. silicon chip aligning gear according to claim 1, it is characterised in that：The transport block（11）Top set
There are card slot, the size and silicon chip of card slot（3）The size of bottom is identical.
A kind of 3. silicon chip aligning gear according to claim 1, it is characterised in that：The attachment device（42）With vacuum machine
Connection.
A kind of 4. silicon chip aligning gear according to claim 1, it is characterised in that：The delivery side plate（2）It is fixedly mounted
In carrier device base（1）Top both sides.
A kind of 5. silicon chip aligning gear according to claim 1, it is characterised in that：The suction nozzle（41）Angle of inclination with
Silicon chip（3）Angle of inclination it is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711384048.7A CN107946225A (en) | 2017-12-20 | 2017-12-20 | A kind of silicon chip aligning gear |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711384048.7A CN107946225A (en) | 2017-12-20 | 2017-12-20 | A kind of silicon chip aligning gear |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107946225A true CN107946225A (en) | 2018-04-20 |
Family
ID=61941966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711384048.7A Withdrawn CN107946225A (en) | 2017-12-20 | 2017-12-20 | A kind of silicon chip aligning gear |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107946225A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000177842A (en) * | 1998-12-10 | 2000-06-27 | Mitsubishi Heavy Ind Ltd | Carrying device and vacuum processing device |
| CN102623372A (en) * | 2012-03-27 | 2012-08-01 | 江西赛维Ldk太阳能高科技有限公司 | Automatic wafer-separating device for wet silicon wafers |
| CN203491239U (en) * | 2013-10-12 | 2014-03-19 | 英利能源（中国）有限公司 | Device for transferring silicon chips between chip boxes |
| CN106680289A (en) * | 2017-01-25 | 2017-05-17 | 江苏东旭亿泰智能装备有限公司 | Macroscopic inspection system for glass substrate |
| CN206209292U (en) * | 2016-11-29 | 2017-05-31 | 张家港晋宇达电子科技有限公司 | A kind of silicon wafer conveying device of litho machine |
| CN207558772U (en) * | 2017-12-20 | 2018-06-29 | 无锡优耐特能源科技有限公司 | A kind of silicon chip aligning gear |
-
2017
- 2017-12-20 CN CN201711384048.7A patent/CN107946225A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000177842A (en) * | 1998-12-10 | 2000-06-27 | Mitsubishi Heavy Ind Ltd | Carrying device and vacuum processing device |
| CN102623372A (en) * | 2012-03-27 | 2012-08-01 | 江西赛维Ldk太阳能高科技有限公司 | Automatic wafer-separating device for wet silicon wafers |
| CN203491239U (en) * | 2013-10-12 | 2014-03-19 | 英利能源（中国）有限公司 | Device for transferring silicon chips between chip boxes |
| CN206209292U (en) * | 2016-11-29 | 2017-05-31 | 张家港晋宇达电子科技有限公司 | A kind of silicon wafer conveying device of litho machine |
| CN106680289A (en) * | 2017-01-25 | 2017-05-17 | 江苏东旭亿泰智能装备有限公司 | Macroscopic inspection system for glass substrate |
| CN207558772U (en) * | 2017-12-20 | 2018-06-29 | 无锡优耐特能源科技有限公司 | A kind of silicon chip aligning gear |
Non-Patent Citations (1)
| Title |
|---|
| 郭志球;柳锡运;沈辉;刘正义;: "各向同性腐蚀法制备多晶硅绒面", 材料科学与工程学报 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207566401U (en) | A kind of arrangement conveying device of button | |
| CN207558772U (en) | A kind of silicon chip aligning gear | |
| CN107946225A (en) | A kind of silicon chip aligning gear | |
| CN105148510B (en) | A kind of mahjong machine send board apparatus | |
| CN106185326A (en) | A kind of stable type song screen carrying mechanism | |
| CN207658642U (en) | A kind of automatic arraying device having a workpiece | |
| CN109333844A (en) | A kind of silicon wafer sliver apparatus and wafer dicing system of processing | |
| CN205521843U (en) | Bag sealer beat formula truing mechanism | |
| CN210236234U (en) | Quick workpiece feeding system | |
| CN105540213B (en) | A kind of cylinder feeder and bottle transport system | |
| CN207827293U (en) | A kind of arranging-in-row device having a workpiece | |
| CN207671227U (en) | A kind of conveying mechanism for magnetic shoe overturning | |
| CN207551200U (en) | A kind of capacitor stapling picks guide pin delivery track | |
| CN208932554U (en) | A kind of conveying device of grain | |
| CN209275490U (en) | A kind of precision element feeding device | |
| CN208800690U (en) | A kind of pipe cutting machine automatic charging machine | |
| CN208147881U (en) | One kind can positioning type mechanical arm | |
| CN106182061A (en) | One yeast inoculation screen catching robot | |
| CN208146191U (en) | Feeding conveying device for Vertical Mill technique production ferronickel ground-slag | |
| CN104828600A (en) | PCB conveying and fixing device for component inserter and fully-automatic component inserter | |
| CN207387332U (en) | A kind of burnishing device for changing polishing angle | |
| CN220695815U (en) | Mahjong machine | |
| CN205467762U (en) | Leather bonder | |
| CN112349636A (en) | High-precision large-board-level micro-assembly equipment | |
| CN209379202U (en) | A kind of conveyer concentration equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180420 |