CN107931762A - A kind of method that electrical discharge machining prepares copper anti-tartar micro-nano compound structure layer - Google Patents

A kind of method that electrical discharge machining prepares copper anti-tartar micro-nano compound structure layer Download PDF

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Publication number
CN107931762A
CN107931762A CN201711095529.6A CN201711095529A CN107931762A CN 107931762 A CN107931762 A CN 107931762A CN 201711095529 A CN201711095529 A CN 201711095529A CN 107931762 A CN107931762 A CN 107931762A
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copper
tartar
micro
discharge machining
electrical discharge
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CN201711095529.6A
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CN107931762B (en
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何照荣
揭晓华
连玮琦
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Guangdong University of Technology
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Guangdong University of Technology
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/008Surface roughening or texturing

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention discloses a kind of method that electrical discharge machining prepares copper anti-tartar micro-nano compound structure layer, is that copper billet is installed on edm forming machine clamp, it is ensured that copper billet comes into full contact with fixture;Adjust electric spark processing liquid nozzle spray direction and be directed toward copper block surface, and 2 °~15 ° angular ranges are formed with copper block surface, electrical discharge machining parameter is set;Electric spark shaping mill processing copper block surface is opened, working depth is 1~2mm, and copper block surface is uniformly distributed macroscopic galvanic corrosion feature structure, obtains copper anti-tartar micro-nano compound structure layer.The present invention is simple and convenient, and copper anti-tartar micro-nano compound structure layer only needs time processing process to prepare completion, and electric spark processing liquid is recyclable to be continuing with, and reduces pollution of the processing-waste to environment, reduces extra expenses caused by liquid waste processing.

Description

A kind of method that electrical discharge machining prepares copper anti-tartar micro-nano compound structure layer
Technical field
The present invention relates to material surface engineering field, more particularly to a kind of electrical discharge machining prepares copper anti-tartar micro-nano composite junction The method of structure layer.
Background technology
Copper-based material is as heat-transfer surface material, and heat transferring medium is generally tap water or industrial water, easily on heat-transfer surface Produce incrustation scale so that the heat exchange efficiency of heat-transfer surface reduces, and the chemical composition of incrustation scale can corrode adhering zone, shortens heat exchange and sets Standby service life.
In recent years, researcher develops various anti-tartar coatings and its technology of preparing according to the characteristics of incrustation scale, and system is ground Study carefully anti-tartar mechanism, it is found that low-surface-energy can influence adhewsive action of the incrustation scale in heat exchange surface, reduce dirt in heat exchange surface Adhesion amount, realizes surface anti-tartar.The technology of preparing of common surface anti-tartar coating mainly includes chemical vapor deposition, chemistry The methods of plating, electrochemical deposition, self-assembling technique, sol-gal process, ion implantation, be chemically in these methods Main, prepare one or more layers film by chemical reaction has low-surface-energy in heat exchange surface, the film, reduces dirt and is changing The attachment in hot face.But anti-tartar coating prepared by chemical method is influenced by preparation method, its shortcoming is also apparent from:Firstly, since change Hot interface is heat exchange effect concentrated area, and the vibrated and hot-fluid exchange that coating produces in by boiling heat transfer process are influenced, Coating and basal body binding force are greatly lowered, and directly affect its service life, and the coating after coming off is mixed in heat transferring medium Pollute the harm with secondary dirt deposition;Secondly, anti-tartar coating composition have impact on heat transfer effect, and part anti-tartar coating is with height Molecular material is not so good as metal material and part nonmetallic materials heat conduction as wherein one of constituent element, the heat conductivility of high molecular material Effect so that the heat-transfer effect of the type anti-tartar coating reduces, although cannot expire with preferable anti-fouling performance heat transfer efficiency Sufficient operating mode needs.Meanwhile chemical method prepares surface anti-tartar coating and is also influenced be subject to preparative-scale, environmental pollution, corresponding system Standby cost is higher, and large-scale industrial production is restricted.Therefore, in order to which simple, green, environmentally friendly prepares anti-tartar coating, prolong The service life of long anti-tartar coating, and heat transfer property is taken into account, it is of great significance.
The content of the invention
It is an object of the invention to overcome shortcoming existing in the prior art, there is provided a kind of heat transfer efficiency is high, it is environmental-friendly, The method that cost is low, the simple electrical discharge machining of technique prepares copper anti-tartar micro-nano compound structure layer.
The purpose of the present invention is achieved through the following technical solutions:
A kind of method that electrical discharge machining prepares copper anti-tartar micro-nano compound structure layer, comprises the following steps:Copper billet is installed On edm forming machine clamp, it is ensured that copper billet comes into full contact with fixture;Electric spark processing liquid nozzle spray direction is adjusted to be directed toward Copper block surface, and 2 °~15 ° angular ranges are formed with copper block surface, electrical discharge machining parameter is set;Open electric spark shaping mill Copper block surface is processed, working depth is 1~2mm, and copper block surface is uniformly distributed macroscopic galvanic corrosion feature structure, obtains copper and resist Dirty micro-nano compound structure layer.
It is 10~20mm that the copper billet, which cuts into length, and width is 10~20mm, the highly fritter for 3~10mm.
The electric spark processing liquid is the electric spark processing liquid of market conventional sales, its physical and chemical index is:Flash-point (closes Mouthful) 80 DEG C of >, dynamic viscosity (40 DEG C) 1.3~2.2mm of scope2·s-1, < -15 DEG C of pour point, acid value 0.01~ 0.06mgKOH·g-1, 85 DEG C of Saybolt color >+30, aniline point >, aromatic hydrocarbons (FIA analyses) < 0.5%, no antioxidant.Electrical fire Spent processing solution can also be deionized water.
The galvanic corrosion feature structure be electrical discharge machining after the completion of, in the case where macroscopic view visually observes, be processed specimen surface It is uniform-distribution with direction-free unevenness and hard chimb.
The micro-nano compound structure layer is made of typical electrical discharge machining microscopic appearance feature, including nano aperture, micro- Rice hole, reflow zone, bead and crack due to thermal stress, are with low-surface-energy (1.553~6.025mJm-2) hydrophobic surface.
The electrical discharge machining parameter is:Electric current is 15~20A, pulsewidth is 80~100 μ s, duty cycle 80%, Gap voltage is 40V, working depth is 1~3mm.
Before processing, copper billet is subjected to surface processing early period:Using the surface of the sand paper polishing copper billet of 200~600 mesh, remove Surface impurity and oxide layer;Then it is cleaned by ultrasonic 5~10 minutes with acetone, absolute ethyl alcohol and deionized water respectively, cleans surface Remaining abrasive dust, then dry up copper block surface.
After completion of processing, copper block surface is cleaned:Copper billet is removed from fixture, be respectively put into acetone, absolute ethyl alcohol, go from It is cleaned by ultrasonic 5~10 minutes in sub- water, the electric spark processing liquid and processing for removing remnants are considered to be worth doing.
The principle of the present invention is:The high temperature that discharge band is come in edm process will melt copper-based coating metal, and The electric arc produced between electrode will impact Copper substrate surface, so that it is micro- that a series of typical electrical discharge machinings are formed on Copper substrate surface Shape characteristic is seen, is made of nano aperture, micron hole, reflow zone, bead and crack due to thermal stress etc., i.e. micro-nano compound structure layer. The structure sheaf is the hydrophobic surface with low-surface-energy, its hydrophobic performance can effectively obstruct infiltration and the dirt crystalline substance of soiling media The attachment of body and grow up.Meanwhile matrix skin microstructure is the remelting tissue that re-forms after high-temperature digestion, its consistency compared with Height, has good corrosion resistance, avoids corrosion failure of the soiling media to basal body structure, and then protect lower-surface-free-energy surface Hydrophobic performance.Under the corrosion resistance synergy of the anti-dirt adhewsive action of low-surface-energy and fine and close seasoning metal tissue, effectively Improve Copper substrate surface anti-fouling performance.
The present invention has the following advantages that compared with prior art and effect:
(1) spark erosion machining of the invention is simple and convenient, and copper anti-tartar micro-nano compound structure layer only needs time processing process Completion can be prepared.
(2) without various chemical reagent, electric spark processing liquid is recyclable to be continuing with the present invention, reduces processing-waste to ring The pollution in border, reduces extra expenses caused by liquid waste processing.
(3) electric spark processing liquid of the invention can use deionized water, realize environmental protection production.
(4) spark erosion machining of the invention can coordinate digital control system, realize that the copper for preparing large area or complex profile resists Dirty micro-nano compound structure layer.
Brief description of the drawings
Fig. 1 is the scanning electron microscope (SEM) photograph of the copper anti-tartar micro-nano compound structure layer of embodiment 1.
Fig. 2 is the Contact-angle measurement result of copper anti-tartar micro-nano compound structure layer of the present invention.
Fig. 3 is the polarization curve of copper anti-tartar micro-nano compound structure layer and smooth surface copper billet of the present invention.
Fig. 4 is the impedance spectra of copper anti-tartar micro-nano compound structure layer and smooth surface copper billet of the present invention, and it is light to scheme medium and small frame The enlarged drawing of sliding surface copper billet impedance spectra.
Fig. 5 is smooth surface copper billet in CaCl2+NaOH(0.1mol·L-1) when immersion 72 is small in solution after surface smut Adhere to scanning electron microscope (SEM) photograph.
Fig. 6 is the copper anti-tartar micro-nano compound structure layer of embodiment 1 in CaCl2+NaOH(0.1mol·L-1) soak in solution 72 it is small when after surface smut attachment scanning electron microscope (SEM) photograph.
Fig. 7 is smooth copper block surface and copper anti-tartar micro-nano compound structure layer of the present invention in CaCl2+NaOH(0.1mol·L-1) Surface smut adhesion amount weightening curve during when immersion 72 is small in solution.
Embodiment
Further detailed description is done to the present invention with reference to embodiment, but the implementation of the present invention is not limited to this.
Embodiment 1
First, cut copper billet sample, size is 10mm × 10mm × 3mm, by the copper block surface of well cutting respectively with 200, 400th, 600 mesh sand paper are polished, and remove the impurity and oxide skin on surface, then respectively with acetone, absolute ethyl alcohol and deionized water ultrasound Cleaning 5 minutes, washes the remaining abrasive dust on surface, then dries up copper billet with air duct;Secondly, by copper billet be installed on electric spark into On type machine clamp, it is ensured that copper billet installation is correct, electrically conductive no short-circuit conditions, and adjustment electric spark processing liquid injection direction is directed toward copper billet Surface, and the angle that injection direction forms 10 ° or so with copper block surface is adjusted, setting electrical discharge machining parameter is:Electric current 20A, 100 μ s of pulsewidth, duty cycle 80%, gap voltage 40V, working depth 1mm, then start to process;When electrical discharge machining to setting During depth, processing sample surface is all uniformly distributed macroscopic galvanic corrosion feature structure, then electrical discharge machining finishes, by copper billet Remove, be respectively put into acetone, absolute ethyl alcohol and deionized water to be cleaned by ultrasonic to take out for 5 minutes and dry.Copper anti-tartar micro-nano composite junction Structure layer contact angle is 139 ± 1.5 °.
Embodiment 2
First, cut copper billet sample, size is 10mm × 10mm × 3mm, by the copper block surface of well cutting respectively with 200, 400th, 600 mesh sand paper are polished, and remove the magazine and oxide skin on surface, then respectively with acetone, absolute ethyl alcohol and deionized water ultrasound Cleaning 5 minutes, washes the remaining abrasive dust on surface, then dries up copper billet with air duct;Secondly, by copper billet be installed on electric spark into On type machine clamp, it is ensured that copper billet installation is correct, electrically conductive no short-circuit conditions, and adjustment electric spark processing liquid injection direction is directed toward copper billet Surface, and the angle that injection direction forms 10 ° or so with copper block surface is adjusted, setting electrical discharge machining parameter is:Electric current 15A, 80 μ s of pulsewidth, duty cycle 80%, gap voltage 40V, working depth 1mm, then start to process;When electrical discharge machining is deep to setting When spending, processing sample surface is all uniformly distributed macroscopic galvanic corrosion feature structure, then electrical discharge machining finishes, and copper billet is taken Under, it is respectively put into acetone, absolute ethyl alcohol and deionized water to be cleaned by ultrasonic to take out for 5 minutes and dries.Copper anti-tartar micro-nano compound structure Layer contact angle is 133 ± 6.4 °.
Embodiment 3
First, cut copper billet sample, size is 10mm × 10mm × 3mm, by the copper block surface of well cutting respectively with 200, 400th, 600 mesh sand paper are polished, and remove the magazine and oxide skin on surface, then respectively with acetone, absolute ethyl alcohol and deionized water ultrasound Cleaning 10 minutes, washes the remaining abrasive dust on surface, then dries up copper billet with air duct;Secondly, copper billet is installed on electricity On spark forming machine clamp, it is ensured that copper billet installation is correct, electrically conductive no short-circuit conditions, and adjustment electric spark processing liquid injection direction refers to To copper block surface, and the angle that injection direction forms 10 ° or so with copper block surface is adjusted, setting electrical discharge machining parameter is:Electricity 18A, 100 μ s of pulsewidth, duty cycle 80%, gap voltage 40V, working depth 2mm are flowed, then starts to process;Work as electrical discharge machining To when setting depth, processing sample surface is all uniformly distributed macroscopic galvanic corrosion feature structure, then electrical discharge machining finishes, Copper billet is removed, is respectively put into acetone, absolute ethyl alcohol and deionized water to be cleaned by ultrasonic to take out for 10 minutes and dries.Copper anti-tartar micro-nano Composite construction layer contact angle is 129 ± 2.0 °.
Test case
Using smooth surface copper billet as comparative example, the copper anti-tartar micro-nano compound structure layer copper that is prepared with the embodiment of the present invention Block carries out performance comparative analysis.
As seen from Figure 1, after electrical discharge machining, there are obvious galvanic corrosion feature structure, including galvanic corrosion to cheat, again on copper surface Melting zone, bead and crack due to thermal stress, wherein galvanic corrosion hole range scale are nanoscale to micron order.These galvanic corrosion feature structures are uniform Ground is distributed in copper surface, forms micro-nano compound structure layer.The structure sheaf is the hydrophobic surface of low-surface-energy.
The result is shown in Fig. 2, contact angle knot for Contact-angle measurement of the copper anti-tartar micro-nano compound structure layer of embodiment 1 to deionized water Fruit is 139 ± 1.5 °, surface energy 2.629mJm-2
As seen from Figure 3, polarization of the polarization curve of the copper anti-tartar micro-nano compound structure layer of embodiment 1 than smooth surface copper billet Curve is deviated to positive direction, corrosion potential 0.001V;The polarization curve ratio of the copper anti-tartar micro-nano compound structure layer of embodiment 2 The polarization curve of smooth surface copper billet is deviated to positive direction, and corrosion potential is -0.022V;The copper anti-tartar micro-nano of embodiment 3 is answered The polarization curve for closing structure sheaf is deviated than the polarization curve of smooth surface copper billet to positive direction, corrosion potential 0.007V.
From fig. 4, it can be seen that the polarization resistance value of the copper anti-tartar micro-nano compound structure layer of embodiment 1, embodiment 2, embodiment 3 is equal Much larger than the polarization resistance value of smooth surface copper billet.As it can be seen that copper anti-tartar micro-nano compound structure layer prepared by the present invention is corrosion-resistant Performance is better than smooth surface copper billet.
The copper anti-tartar micro-nano compound structure layer and smooth surface copper billet of embodiment 1,2,3 are immersed in different beakers respectively CaCl2+NaOH(0.1mol·L-1) in solution, take out sample drying at the same time every 8 hours, then weighed with electronic balance The CaCO of sample surfaces3Dirt adhesion amount data, when duration of experiment is 72 small, and draw dirt adhesion amount with time surface Trend curve, see Fig. 7.As seen from Figure 7, the copper anti-tartar micro-nano compound structure layer of embodiment 1 and smooth surface copper billet are soaking In time, CaCO3Adhesion amount of the dirt on surface all increases with the increase of time, but the dirt adhesion amount of embodiment 1 compares light Sliding surface copper billet is small, and its fluctuating range is less than the fluctuating range of smooth surface copper billet, illustrates the copper anti-tartar micro-nano of embodiment 1 Composite construction layer is than smooth surface copper billet anti-tartar.The overall trend of the surface smut adhesion amount of embodiment 2 is the increase with the time And increase, but incrementss are less than smooth surface copper billet, and the fluctuation of dirt adhesion amount overall variation trend is smaller, illustrates embodiment 2 Copper anti-tartar composite construction layer than smooth surface copper billet anti-tartar.The surface smut adhesion amount of embodiment 3 increases and changes with the time It is smaller, and dirt adhesion amount overall variation trend tends to be straight, dirt adhesion amount is much smaller than smooth surface copper billet, illustrates embodiment 3 copper anti-tartar composite construction layer is than smooth surface copper billet anti-tartar.
After experiment, electron microscopic observation is scanned to the surface smut of embodiment 1 and smooth surface copper billet respectively, it is tied Fruit sees Fig. 5 and Fig. 6 respectively.By Fig. 5 and Fig. 6 as it can be seen that after dirty solution when 72 is small soaks, the attachment of smooth surface copper billet CaCO3Amount of crystals far more than embodiment 1, and in Fig. 61 surface attachment of embodiment CaCO3Average crystal size is smaller.As it can be seen that The scanning electron microscope result of Fig. 5 and Fig. 6 further proves that the anti-fouling performance of the copper anti-tartar micro-nano compound structure layer of embodiment 1 is good, excellent In smooth surface copper billet.

Claims (8)

1. a kind of method that electrical discharge machining prepares copper anti-tartar micro-nano compound structure layer, it is characterised in that comprise the following steps:Will Copper billet is installed on edm forming machine clamp, it is ensured that copper billet comes into full contact with fixture;Adjust the injection of electrical discharge machining nozzle for liquid Copper block surface is directed toward in direction, and forms 2 °~15 ° angular ranges with copper block surface, sets electrical discharge machining parameter;Open electrical fire Flower forming machine processing copper block surface, working depth is 1~2mm, and copper block surface is uniformly distributed macroscopic galvanic corrosion feature structure, Obtain copper anti-tartar micro-nano compound structure layer.
2. the method that electrical discharge machining according to claim 1 prepares copper anti-tartar micro-nano compound structure layer, it is characterised in that: The physical and chemical index of the electric spark processing liquid is:Flash-point (is remained silent) 80 DEG C of >, and dynamic viscosity (40 DEG C) scope 1.3~ 2.2mm2·s-1, < -15 DEG C of pour point, 0.01~0.06mgKOHg of acid value-1, Saybolt color >+30, aniline point > 85 DEG C, aromatic hydrocarbons (FIA analyses) < 0.5%, no antioxidant.
3. the method that electrical discharge machining according to claim 1 prepares copper anti-tartar micro-nano compound structure layer, it is characterised in that: Electric spark processing liquid is deionized water.
4. the method that electrical discharge machining according to claim 1 prepares copper anti-tartar micro-nano compound structure layer, it is characterised in that: The galvanic corrosion feature structure is after the completion of electrical discharge machining, in the case where macroscopic view visually observes, processed specimen surface is uniformly distributed Direction-free unevenness and hard chimb.
5. the method that electrical discharge machining according to claim 1 prepares copper anti-tartar micro-nano compound structure layer, it is characterised in that: The micro-nano compound structure layer is made of typical electrical discharge machining microscopic appearance feature, including nano aperture, micron hole, remelting Area, bead and crack due to thermal stress, are with low-surface-energy (1.553~6.025mJm-2) hydrophobic surface.
6. the method that electrical discharge machining according to claim 1 prepares copper anti-tartar micro-nano compound structure layer, it is characterised in that: The electrical discharge machining parameter is:Electric current is 15~20A, pulsewidth is 80~100 μ s, duty cycle 80%, gap voltage are 40V, working depth are 1~2mm.
7. the method that electrical discharge machining according to claim 1 prepares copper anti-tartar micro-nano compound structure layer, it is characterised in that: Before processing, copper billet is subjected to surface processing early period:Using the surface of the sand paper polishing copper billet of 200~600 mesh, surface impurity is removed And oxide layer;Then it is cleaned by ultrasonic 5~10 minutes with acetone, absolute ethyl alcohol and deionized water respectively, cleans the mill of remained on surface Bits, then dry up copper block surface.
8. the method that electrical discharge machining according to claim 1 prepares copper anti-tartar micro-nano compound structure layer, it is characterised in that: After completion of processing, copper block surface is cleaned:Copper billet is removed from fixture, is respectively put into acetone, absolute ethyl alcohol, deionized water and surpasses Sound cleans 5~10 minutes, and the electric spark processing liquid and processing for removing remnants are considered to be worth doing.
CN201711095529.6A 2017-11-09 2017-11-09 Method for preparing copper anti-scaling micro-nano composite structure layer by electric spark machining Expired - Fee Related CN107931762B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109396579A (en) * 2018-11-14 2019-03-01 广东石油化工学院 A kind of FeAl intermetallic compound anti-tartar coating and preparation method

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US5648122A (en) * 1994-09-28 1997-07-15 Ford Motor Company Using electrical discharge surface preparation for thermal coatings
US5818006A (en) * 1995-12-07 1998-10-06 Ford Global Technologies, Inc. Surface preparation electrical discharge apparatus and method
CN103317198A (en) * 2013-05-27 2013-09-25 长春理工大学 One-step preparation method of metal material surface with super-hydrophobic micro-nano structure
CN106270853A (en) * 2016-09-21 2017-01-04 河南理工大学 A kind of processing method of micro structure array

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648122A (en) * 1994-09-28 1997-07-15 Ford Motor Company Using electrical discharge surface preparation for thermal coatings
US5818006A (en) * 1995-12-07 1998-10-06 Ford Global Technologies, Inc. Surface preparation electrical discharge apparatus and method
CN103317198A (en) * 2013-05-27 2013-09-25 长春理工大学 One-step preparation method of metal material surface with super-hydrophobic micro-nano structure
CN106270853A (en) * 2016-09-21 2017-01-04 河南理工大学 A kind of processing method of micro structure array

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109396579A (en) * 2018-11-14 2019-03-01 广东石油化工学院 A kind of FeAl intermetallic compound anti-tartar coating and preparation method

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