CN107922794A

CN107922794A - Bonding sheet

Info

Publication number: CN107922794A
Application number: CN201680050607.8A
Authority: CN
Inventors: 高野健; 菊池和浩; 杉野贵志
Original assignee: Lintec Corp
Current assignee: Lintec Corp
Priority date: 2015-09-01
Filing date: 2016-09-01
Publication date: 2018-04-17
Also published as: JPWO2017038918A1; TW201723120A; KR102541672B1; KR20180048658A; JP6713471B2; TWI738662B; WO2017038918A1

Abstract

The present invention provides a kind of bonding sheet, it is the bonding sheet used when the semiconductor element on to bonding sheet seals, the bonding sheet (10) possesses base material (11) and adhesive phase (12), and the value tried to achieve in the chip pull test that described adhesive layer (12) carries out silicon under 100 DEG C of gaseous environment is more than 3.0N/ chip.

Description

Bonding sheet

Technical field

The present invention relates to bonding sheet.

Background technology

In recent years, in mounting technique, chip size packages (Chip Size Package；CSP) technology attracts attention. In the art, for wafer-level packaging (Wafer Level Package；WLP) for representative without using substrate and only with It is especially noticeable in miniaturization and highly integrated aspect for the encapsulation that the form of chip carries out.

In the manufacture method of such WLP, needed for the chip being fixed on substrate to be fixed on other support in the past On body.Thus, for example, recorded in patent document 1 to being carried out without using metal ieadf iotaame without substrate semiconductor chip The adhesive tape pasted and used during resin seal.Recorded in patent document 1 in base of the glass transition temperature more than 180 DEG C The elasticity modulus that the one or two sides of material layer is arranged at 180 DEG C is 1.0 × 10⁵The adhesive glue that the adhesive phase of more than Pa forms Band.

Prior art literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 2012-062372 publications

The content of the invention

The subject that the invention solves

But for the adhesive tape as described in patent document 1, not necessarily can be in sealing semiconductor member Semiconductor element movement is substantially prevented from during part.

Half can be prevented when being sealed it is an object of the invention to provide a kind of semiconductor element on to bonding sheet Conductor element is mobile and bonding sheet that position is deviateed.

The method for solving problem

A mode according to the present invention can provide a kind of bonding sheet, it is the semiconductor element progress on to bonding sheet The bonding sheet used during sealing, the bonding sheet possess base material and adhesive phase, the described adhesive under 100 DEG C of gaseous environment The value tried to achieve in the chip pull test that layer carries out silicon is more than 3.0N/ chip.

For the bonding sheet of one embodiment of the present invention, storage modulus of the preferably described base material at 100 DEG C for 1 × 10⁷More than Pa.

For the bonding sheet of one embodiment of the present invention, preferably described adhesive layer contains acrylic adhesives group Compound or silicone adhesive category composition.

For the bonding sheet of one embodiment of the present invention, preferably described acrylic pressure-sensitive adhesive compositions are included with third Acrylic copolymer of the olefin(e) acid 2- ethylhexyls as principal monomer.

For the bonding sheet of one embodiment of the present invention, preferably described silicone adhesive category composition includes addition Aggretion type organic siliconresin.

According to the present invention it is possible to providing can prevent semiconductor element from moving in the semiconductor element of seal bond on piece And the bonding sheet that position is deviateed.

Brief description of the drawings

Fig. 1 is the diagrammatic cross-section of the bonding sheet of embodiments of the present invention.

Fig. 2A be to used a part of manufacturing process of the semiconductor device of the bonding sheet of embodiments of the present invention into The figure of row explanation.

Fig. 2 B be to used a part of manufacturing process of the semiconductor device of the bonding sheet of embodiments of the present invention into The figure of row explanation.

Fig. 2 C be to used a part of manufacturing process of the semiconductor device of the bonding sheet of embodiments of the present invention into The figure of row explanation.

Fig. 2 D be to used a part of manufacturing process of the semiconductor device of the bonding sheet of embodiments of the present invention into The figure of row explanation.

Fig. 2 E be to used a part of manufacturing process of the semiconductor device of the bonding sheet of embodiments of the present invention into The figure of row explanation.

Fig. 3 A are the schematic diagrames for illustrating the method for chip pull test.

Fig. 3 B are the schematic diagrames for illustrating the method for chip pull test.

Fig. 3 C are the schematic diagrames for illustrating the method for chip pull test.

Fig. 3 D are the schematic diagrames for illustrating the method for chip pull test.

Fig. 3 E are the schematic diagrames for illustrating the method for chip pull test.

Fig. 3 F are the schematic diagrames for illustrating the method for chip pull test.

Fig. 3 G are the schematic diagrames for illustrating the method for chip pull test.

Fig. 3 H are the schematic diagrames for illustrating the method for chip pull test.

Symbol description

10 ... bonding sheets

11 ... base materials

12 ... adhesive phases

Embodiment

(embodiment)

(bonding sheet)

Fig. 1 shows the diagrammatic cross-section of the bonding sheet 10 of present embodiment.

Bonding sheet 10 has base material 11 and adhesive phase 12.As shown in Figure 1,12 superimposed layer of adhesive phase has stripping film RL.

Base material 11 has the first base material face 11a and the second substrate surface 11b of side opposite with the first base material face 11a.Bonding sheet 10 shape can be the arbitrary shape such as sheet, banding, label-like.

(base material)

Base material 11 is the component for supporting adhesive phase 12.

As base material 11, sheet material such as synthetic resin film etc. can be used.As synthetic resin film, example can be enumerated Such as：Polyethylene film, polypropylene screen, polybutene film, polybutadiene film, polymethylpentene film, polychloroethylene film, vinyl chloride copolymer Film, polyethylene terephthalate film, poly (ethylene naphthalate) film, polybutylene terephthalate (PBT) film, polyurethane Film, vinyl-vinyl acetate copolymer film, ionomer resin film, ethene-(methyl) acrylic copolymer film, ethene-(methyl) The films such as acrylate copolymer film, polystyrene film, polycarbonate membrane and polyimide film.In addition, as base material 11, can To enumerate their cross linking membrane and stack membrane etc..

Base material 11 preferably comprises polyester resin, is more preferably made of the material using polyester resin as principal component. In this specification, the material using polyester resin as principal component refers to that the quality of polyester resin is being formed the material of base material Shared ratio is more than 50 mass % in gross mass.As polyester resin, for example, it is preferable to for selected from poly terephthalic acid second Terephthalate resin, polybutylene terephthalate (PBT) resin, polyethylene naphthalate resin, polybutylene naphthalate Any resin in the copolymer resins of resin and these resins, more preferably pet resin.

As base material 11, it is preferably polyethylene terephthalate film and polyethylene naphthalate, is more preferably Polyethylene terephthalate film.As the oligomer contained in polyester film, come from polyester formative monomer, dimer, Trimer etc..

From the viewpoint of dimensional stability during processing, the lower limit of storage modulus of the base material 11 at 100 DEG C is preferably 1 ×10⁷More than Pa, more preferably 1 × 10⁸More than Pa.From the viewpoint of flexibility (adaptability) of operation, energy storage of the base material 11 at 100 DEG C The upper limit of modulus is preferably 1 × 10¹²Below Pa.It should be noted that in the present specification, storage modulus is to use Dynamic Viscoelastic The value that property measurement device is measured by torsional shear method under frequency 1Hz.Base material to be determined is cut to wide 5mm, long 20mm, Measured using determination of viscoelasticity device (TA Instruments companies manufacture, DMAQ800), using frequency 11Hz, stretch mode Energy storage viscoplasticity at 100 DEG C.

For the 11a of the first base material face, in order to improve the adaptation with adhesive phase 12, it is possible to implement primary coat processing, At least any of surface treatment in sided corona treatment and corona treatment etc..The first base material face 11a of base material 11 can be applied Cloth adhesive and implement adhesion process.As the adhesive used in the adhesion process of base material, can enumerate for example：Acrylic acid The adhesives such as class, rubber, organic silicon and carbamates.

The thickness of base material 11 is preferably more than 10 μm and less than 500 μm, more preferably more than 15 μm and less than 300 μm, into One step is preferably more than 20 μm and less than 250 μm.

(adhesive phase)

In the present embodiment, in 100 DEG C of gaseous environment adhesive phase 12 to being tried to achieve in the chip pull test of silicon Value need to be more than 3.0N/ chips.Value as tried to achieve in fruit chip pull test is more than 3.0N/ chips, then to bonding When the semiconductor element of on piece is sealed, it can prevent that semiconductor element is mobile and position deviation (below, is otherwise referred to as core Piece deviates).Its reason is still not clear, but can be speculated as following mechanism.That is, it could be speculated that chip offset is not semiconductor element Slid laterally on adhesive phase 12, but semiconductor element is peeled off from adhesive phase 12, is glued together again after movement.Cause This, the value tried to achieve in chip pull test is bigger, represents that semiconductor element is more difficult to peel off from adhesive phase 12.Therefore, push away There are dependency relation between the value and chip offset tried to achieve in survey chip pull test.

In addition, from the viewpoint of deviateing from the position for being more reliably prevented from semiconductor element, asked in the chip pull test The value obtained is preferably more than 4.0N/ chips, more preferably more than 5.0N/ chips and below 15N/ chips.In chip pull test When the value tried to achieve is less than 3.0N/ chips, it may occur however that chip offset, when more than 15N/ chips, peels off from bonding sheet and partly lead The circuit face of semiconductor element may be destroyed during volume elements part.

Adhesive phase 12 can be by below to the value tried to achieve in the chip pull test of silicon in 100 DEG C of gaseous environment Method described in the embodiment of narration measures.

It should be noted that as the method for adjusting the value tried to achieve in the chip pull test, following side can be enumerated Method.For example, asked by changing the composition of the adhesive composition used in adhesive phase 12 to adjust in the chip pull test The value obtained.

The adhesive phase 12 of present embodiment contains adhesive composition.As the bonding contained in the adhesive composition Agent, is not particularly limited, and various adhesives can be applied to adhesive phase 12.As the bonding contained in adhesive phase 12 Agent, can enumerate for example：Rubber, acrylic compounds, organic silicon, polyesters and carbamates.It is it should be noted that viscous Purposes can be contemplated in the species of mixture and the species of adherend that is stuck etc. selects.Adhesive phase 12 preferably comprises propylene Acrylic binder composition or silicone adhesive category composition.

Acrylic pressure-sensitive adhesive compositions

In the case where adhesive phase 12 contains acrylic pressure-sensitive adhesive compositions, acrylic pressure-sensitive adhesive compositions are preferred Contain the acrylic copolymer using 2-EHA as principal monomer.

In addition, in the case where adhesive phase 12 contains acrylic pressure-sensitive adhesive compositions, preferably comprise acrylic compounds and be total to Polymers and bonding agent.Acrylic copolymer is preferably the copolymer using 2-EHA as principal monomer.It is viscous Close auxiliary agent and preferably comprise the rubber type of material with reactive group as principal component.

In the present specification, refer to using 2-EHA as principal monomer, from 2-EHA The quality ratio shared in the gross mass of acrylic copolymer of copolymer component be more than 50 mass %.In this implementation In mode, in acrylic copolymer the ratio of the copolymer component from 2-EHA be preferably 50 mass % with Upper and below 95 mass %, more preferably more than 60 mass % and below 95 mass %, more preferably more than 80 mass % It is still more preferably more than 85 mass % and below 93 mass % and 95 below mass %.If come from acrylic acid 2- ethyls The ratio of the copolymer component of own ester is more than 60 mass %, then bonding force will not be excessive after heating, and bonding sheet is easier from quilt Peeled off on bur, if more than 80 mass %, then be easier to peel off.If the copolymer from 2-EHA The ratio of component is below 95 mass %, then can prevent initial stage closing force deficiency and cause heating when base material deform, by Bonding sheet is set to be peeled off from adherend in its deformation.

The species and quantity of copolymer component in acrylic copolymer in addition to 2-EHA are without spy Do not limit.For example, as the second copolymer component, it is however preferred to have reactive functional groups contain monomer.As second The reactive functional groups of copolymer component, after use in the case of the crosslinking agent of face narration, are preferably capable and the crosslinking agent The functional group of reaction.The reactive functional groups are preferably to be selected from carboxyl, hydroxyl, amino, substituted-amino and epoxy group At least any of substituent at least any of substituent, more preferably carboxyl and hydroxyl, more preferably carboxyl.

As the monomer (carboxyl group-containing monomer) with carboxyl, can enumerate for example：Acrylic acid, methacrylic acid, crotonic acid, The ethylenically unsaturated carboxylic acids such as maleic acid, itaconic acid and citraconic acid.In carboxyl group-containing monomer, examined from the viewpoint of reactivity and copolymerizable Consider, be preferably acrylic acid.Carboxyl group-containing monomer may be used alone or in combination of two or more kinds.

As the monomer (hydroxyl monomer) with hydroxyl, can enumerate for example：(methyl) acrylic acid 2- hydroxy methacrylates, (methyl) acrylic acid 2- hydroxy propyl esters, (methyl) acrylic acid 3- hydroxy propyl esters, (methyl) acrylic acid 2- hydroxybutyls, (methyl) third (methyl) hydroxyalkyl acrylates such as olefin(e) acid 3- hydroxybutyls and (methyl) acrylic acid 4- hydroxybutyls etc..In hydroxyl monomer In, it is preferably (methyl) acrylic acid 2- hydroxy methacrylates from the viewpoint of the reactivity and copolymerizable of hydroxyl.Hydroxyl monomer can To be used alone, two or more use can also be combined.It should be noted that " (methyl) acrylic acid " in this specification is table Show the form of presentation used when both " acrylic acid " and " methacrylic acid ", other similar terms are similarly.

As the acrylate with epoxy group, can enumerate for example：Glycidyl acrylate and methacrylic acid contracting Water glyceride etc..

As other copolymer components in acrylic copolymer, the carbon number that can enumerate alkyl is 2~20 (methyl) alkyl acrylate.As (methyl) alkyl acrylate, can enumerate for example：(methyl) ethyl acrylate, (first Base) propyl acrylate, (methyl) n-butyl acrylate, (methyl) acrylic acid n-pentyl ester, (methyl) the just own ester of acrylic acid, methyl-prop Olefin(e) acid 2- ethylhexyls, (methyl) Isooctyl acrylate monomer, the positive last of the ten Heavenly stems ester of (methyl) acrylic acid, (methyl) acrylic acid dodecyl Ester, (methyl) myristyl ester, (methyl) acrylic acid palm ester, (methyl) stearyl acrylate etc..At these (methyl) In alkyl acrylate, from the viewpoint of adhesiveness is further improved, optimizing alkyl carbon number is 2~4 (methyl) third Olefin(e) acid ester, more preferably (methyl) n-butyl acrylate.(methyl) alkyl acrylate can be used alone, and can combine 2 kinds It is used above.

As other copolymer components in acrylic copolymer, it can enumerate for example to come to be selected from and contain alkoxy It is (methyl) acrylate of alkyl, (methyl) acrylate with cycloaliphatic ring, (methyl) acrylate with aromatic rings, non- In the acrylamide of bridging property, (methyl) acrylate with tertiary amino of non-crosslinked property, vinyl acetate and styrene The copolymer component of at least any of monomer.

As (methyl) acrylate containing alkoxyalkyl, can enumerate for example：(methyl) methoxyethyl first Ester, (methyl) methoxyethyl acrylate, (methyl) ethioxy methyl esters and (methyl) ethoxyethyl acrylate.

As (methyl) acrylate with cycloaliphatic ring, for example, (methyl) cyclohexyl acrylate.

As (methyl) acrylate with aromatic rings, for example, (methyl) phenyl acrylate.

As the acrylamide of non-crosslinked property, for example, acrylamide and Methacrylamide.

As (methyl) acrylate with tertiary amino of non-crosslinked property, can enumerate for example：(methyl) acrylic acid (N, N- dimethylaminos) ethyl ester and (methyl) acrylic acid (N, N- dimethylamino) propyl ester.

As other copolymer components in acrylic copolymer, from improve the polarity of adhesive, improve adaptation and From the viewpoint of bonding force, further preferably come from the copolymer component of the monomer with the ring comprising nitrogen-atoms.

As the monomer with the ring comprising nitrogen-atoms, can enumerate：N-vinyl-2-pyrrolidone, N- ethylene methacrylics Base pyrrolidones, N- vinylpiperidones, N- vinyl piperazine, N- vinylpyrazines, N- vinyl pyrroles, N- vinyl miaows Azoles, N- polyvinyl morpholinones, N- caprolactams and N- (methyl) acryloyl morpholine etc..Wherein, it is preferably N- (methyl) third Dimethomorph.

These monomers may be used alone or in combination of two or more kinds.

In the present embodiment, it is preferably carboxyl group-containing monomer or hydroxyl monomer as the second copolymer component, more preferably For acrylic acid.Comprising the copolymer component for coming from 2-EHA and come from acrylic acid in acrylic copolymer Copolymer component in the case of, come from the quality of copolymer component of acrylic acid in the gross mass of acrylic copolymer Shared ratio is preferably below 1 mass %, is more preferably more than 0.1 mass % and below 0.5 mass %.If acrylic acid Ratio is below 1 mass %, then when containing crosslinking agent in adhesive composition, can prevent the crosslinking of acrylic copolymer Too fast progress.

Acrylic copolymer can come from the copolymer component containing monomer containing two or more.For example, propylene Acid copolymer can be 3 membered copolymers.In the case where acrylic copolymer is 3 yuan of based copolymer, preferably by acrylic acid 2- ethylhexyls, carboxyl group-containing monomer and acrylic copolymer obtained from hydroxyl monomer copolymerization, the carboxyl group-containing monomer are preferred For acrylic acid, hydroxyl monomer is preferably acrylic acid 2- hydroxy methacrylates.It is preferred that come from acrylic acid 2- in acrylic copolymer The ratio of the copolymer component of ethylhexyl is more than 80 mass % and below 95 mass %, come from the copolymer of acrylic acid into The mass ratio divided is below 1 mass %, and remainder is the copolymer component for coming from acrylic acid 2- hydroxy methacrylates.

The weight average molecular weight (Mw) of acrylic copolymer is preferably more than 300,000 and less than 2,000,000, and more preferably 600,000 Above and less than 1,500,000, more preferably more than 800,000 and less than 1,200,000.If the Weight-average molecular of acrylic copolymer It is more than 300,000 to measure Mw, then can not peeled off in adherend residual adhesive residue.If acrylic copolymer The weight average molecular weight Mw of thing is less than 2,000,000, then can reliably be pasted on adherend.

The weight average molecular weight Mw of acrylic copolymer is by gel permeation chromatography (Gel Permeation Chromatography；GPC) method measures and is scaled the value of standard styrene.

Acrylic copolymer can be manufactured using above-mentioned various starting monomers according to conventionally known method.

The copolymerized form of acrylic copolymer is not particularly limited, and can be block copolymer, random copolymer or connects Any of graft copolymer.

In the present embodiment, the containing ratio of the acrylic copolymer in adhesive composition be preferably 40 mass % with Upper and below 90 mass %, more preferably more than 50 mass % and below 90 mass %.

In the present embodiment, bonding agent preferably comprises the rubber type of material with reactive group as principal component. When adhesive composition includes reactive bonding auxiliary agent, residue glue can be reduced.Bonding agent in adhesive composition Containing ratio is preferably more than 3 mass % and below 50 mass %, more preferably more than 5 mass % and below 30 mass %.Bonding When the containing ratio of bonding agent in agent composition is below 3 mass %, there is the hidden danger for producing residue glue, more than 50 mass % When, there are the hidden danger that bonding force reduces.

In the present specification, refer to that there is reactivity as principal component comprising the rubber type of material with reactive group The quality of the rubber type of material of group ratio shared in the gross mass of bonding agent is more than 50 mass %.In present embodiment In, the ratio of the rubber type of material with reactive group is preferably greater than 50 mass % in bonding agent, more preferably 80 matter Measure more than %.Bonding agent is preferably substantially made of the rubber type of material with reactive group.

As reactive group, hydroxyl, isocyanate group, amino, Oxyranyle, anhydride group, alcoxyl are preferably selected from One or more of base, acryloyl group and methylacryloyl functional group, is preferably hydroxyl.Reaction possessed by rubber type of material Property group can be a kind, or two or more.Rubber type of material with hydroxyl can be further with above-mentioned reaction Property group.In addition, in 1 molecule for forming rubber type of material, the quantity of reactive group can be 1, or 2 More than.

As rubber type of material, it is not particularly limited, is preferably the hydrogen of polybutadiene resinoid and polybutadiene resinoid The hydride of compound, more preferably polybutadiene resinoid.

As polybutadiene resinoid, the resin with Isosorbide-5-Nitrae-repetitive unit can be enumerated, with 1,2- repetitive units Resin and the resin with both 1,4- repetitive units and 1,2- repetitive units.The polybutadiene tree of present embodiment The hydride of fat also includes the hydride of the resin with these repetitive units.

The hydride of polybutadiene resinoid and polybutadiene resinoid preferably has reactive group respectively in two ends. The reactive group of two ends may be the same or different.The reactive group of two ends is preferably selected from hydroxyl, isocyanic acid One or more of ester group, amino, Oxyranyle, anhydride group, alkoxy, acryloyl group and methylacryloyl functional group, Preferably hydroxyl.In the hydride of polybutadiene resinoid and polybutadiene resinoid, more preferably two ends are hydroxyl.

The adhesive composition of present embodiment is further preferably included except being combined with the acrylic copolymer above described And beyond bonding agent, cross-linking agent obtained from the composition crosslinking of crosslinking agent is also coordinated.In addition, adhesive composition is consolidated Body component is preferably substantially as mentioned earlier by foregoing acrylic copolymer, bonding agent and cross-linking agents Obtained from cross-linking agent form.It is mentioned here substantially to refer to, except be inevitably mixed into the trace impurity of adhesive with Outside, the solid constituent of adhesive composition is only made of the cross-linking agent.

In the present embodiment, as crosslinking agent, can enumerate for example：Isocyanates crosslinking agent, epoxies crosslinking agent, Aziridines crosslinking agent, metal-chelating species crosslinking agent, amine cross-linking agent and amino resins class crosslinking agent etc..These crosslinking agents can To be used alone, two or more use can also be combined.

In the present embodiment, from the viewpoint of the heat resistance and bonding force for improving adhesive composition, in these friendships Join in agent, the crosslinking agent (isocyanates crosslinking agent) preferably using the compound with isocyanate group as principal component.As Isocyanates crosslinking agent, can enumerate for example：2,4 toluene diisocyanate, 2,6- toluene di-isocyanate(TDI)s, 1,3- benzene two Methyl diisocyanate, 1,4- xylylene diisocyanates, diphenyl-methane -4,4 '-diisocyanate, diphenyl-methane -2,4 ' - Diisocyanate, 3- Dimethyl diphenylmethanes diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, Dicyclohexyl methyl hydride -4,4 '-diisocyanate, dicyclohexyl methyl hydride -2,4 '-diisocyanate and lysine isocyanates etc. Polyisocyanate compound.

In addition, polyisocyanate compound can be above-claimed cpd trimethylolpropane adduct type modifier, with Biuret form modifier or the cyamelide ester type modifier containing triple polyisocyanate annulus obtained from water reaction.

In the present specification, the crosslinking agent using the compound with isocyanate group as principal component refers to, has isocyanide The quality of the compound of perester radical ratio shared in the gross mass for forming crosslinker component is more than 50 mass %.

In the present embodiment, relative to 100 mass parts of acrylic copolymer, crosslinking agent contains in adhesive composition Amount is preferably more than 0.1 mass parts and 20 is below mass part, and more preferably more than 1 mass parts and 15 is below mass part, further Preferably more than 5 mass parts and 10 is below mass part.If the content of crosslinking agent in adhesive composition is in such scope, The cementability of the layer (adhesive phase) comprising adhesive composition and adherend (such as base material) can be then improved, so as to Shorten and be used to make the adhesion characteristic stabilized curing time after bonding sheet is manufactured.

In the present embodiment, from the viewpoint of the heat resistance of adhesive composition, isocyanates crosslinking agent is into one Step is preferably the compound (cyamelide ester type modifier) with triple polyisocyanate annulus.It is total to preferably with respect to acrylic compounds The hydroxyl equivalent of polymers more than 0.7 equivalent and below 1.5 equivalents to coordinate the compound with triple polyisocyanate annulus.If The use level of compound with triple polyisocyanate annulus is more than 0.7 equivalent, then bonding force will not be excessive after heating, easily stripping From bonding sheet, it is possible to reduce residue glue.If the use level of the compound with triple polyisocyanate annulus is below 1.5 equivalents, It can prevent that initial bond power is too low or prevent stickup property from reducing.

In the case that adhesive composition in the present embodiment contains crosslinking agent, preferably adhesive composition also contains Crosslinking accelerator.Crosslinking accelerator preferably suitably selects to use according to species of crosslinking agent etc..For example, in adhesive composition In the case of containing polyisocyanate compound as crosslinking agent, preferably further containing organometallics such as organo-tin compounds The crosslinking accelerator of compound class.

Silicone adhesive category composition

In the case where adhesive phase 12 contains silicone adhesive category composition, preferred silicone adhesive category composition Contain addition polymerization type organic siliconresin.In the present specification, the organic silicon containing addition polymerization type organic siliconresin is glued Mixture composite is known as addition reaction-type silicone adhesive category composition.

Addition reaction-type silicone adhesive category composition contains host agent and crosslinking agent.Addition reaction-type organic silicon bonds Agent composition has the following advantages：Can only it be used by the one-step solidification of low temperature, without 2 curings at high temperature.And Existing peroxide curing type silicone class adhesive needs 2 curings at a high temperature of more than 150 DEG C.

Therefore, bonding can be manufactured at a lower temperature by using addition reaction-type silicone adhesive category composition Piece, energy saving is excellent, and the relatively low base material 11 of heat resistance can also be used to manufacture bonding sheet 10.In addition, unlike peroxide Curing type silicone class adhesive produces accessory substance when curing like that, therefore also there is no the problems such as foul smell and corrosion.

Addition reaction-type silicone adhesive category composition generally comprises：By organic siliconresin component and organic silicon rubber into Point the mixture host agent, the crosslinking agent containing hydrosilyl (SiH yls) and the curing that uses as needed that are formed urge Agent.

Organic siliconresin component is by carrying out dehydrating condensation after by organochlorosilane and organoalkoxysilane hydrolysis The organopolysiloxane of net structure obtained from reaction.

Organic silicon rubber component is the diorganopolysiloxanecompositions for having linear chain structure.

It is methyl, ethyl, third in the case of organic siliconresin component and organic silicon rubber component as organic group Base, butyl, phenyl etc..The a part of of above-mentioned organic group can be substituted by vinyl, hexenyl, pi-allyl, fourth Alkenyl, pentenyl, octenyl, (methyl) acryloyl group, (methyl) acryloyl methyl, (methyl) acryloyl propyl group and cyclohexene Unsaturated group as base.It is preferred that the organic group with vinyl being industrially readily available.It is organic in addition reaction-type In silicon class adhesive composition, it is crosslinked by the addition reaction of unsaturated group and hydrosilyl, shape is webbed Structure, shows adhesiveness.

Be 100 relative to organic group, the quantity of unsaturated group as vinyl be usually more than 0.05 and Less than 3.0, be preferably more than 0.1 and less than 2.5.By by relative to the unsaturated group of organic group 100 Quantity is set to more than 0.05, can prevent from reducing with the reactivity of hydrosilyl and be difficult to cure, it is appropriate to assign Bonding force.By the way that the quantity of the unsaturated group relative to organic group 100 is set to less than 3.0, can prevent from bonding The crosslink density of agent increases, bonding force and cohesiveness increase and cause harmful effect to being attached face.

As such organopolysiloxane noted earlier, specifically, there is what Shin-Etsu Chemial Co., Ltd manufactured KS-3703 (relative to methyl 100, the quantity of vinyl is 0.6), Dow Corning Toray Co., Ltd. (Dow Corning Toray Co., Ltd) manufacture BY23-753 (relative to methyl 100, the quantity of vinyl is 0.1) and BY24-162 (relative to methyl 100, the quantity of vinyl is 1.4) etc..Alternatively, it is also possible to be manufactured using Dow Corning Toray Co., Ltd. SD4560PSA, SD4570PSA, SD4580PSA, SD4584PSA, SD4585PSA, SD4587L and SD4592PSA etc..

As previously described, the organopolysiloxane as organic siliconresin component is usually mixed with organic silicon rubber component and made With as organic silicon rubber component, the KS-3800 of Shin-Etsu Chemial Co., Ltd's manufacture can be enumerated (relative to methyl 100 A, the quantity of vinyl is 7.6), the BY24-162 of Dow Corning Toray Co., Ltd.'s manufacture is (relative to methyl 100, ethene The quantity of base is 1.4), BY24-843 (not having unsaturated group) and SD-7292 (relative to methyl 100, vinyl Quantity is 5.0) etc..

The specific example of such addition reaction-type organosilicon noted earlier is recorded in such as Japanese Unexamined Patent Publication 10-219229 In number publication.

Crosslinking agent coordinates in the following way：Relative to the vinyl of organic siliconresin component and organic silicon rubber component this The unsaturated group of sample 1 so that the hydrogen atom being bonded on the silicon atoms is usually more than 0.5 and less than 10, is preferably 1 It is a more than and less than 2.5.By making the hydrogen atom of bonding on the silicon atoms be more than 0.5, can prevent as vinyl The reaction of unsaturated group and hydrosilyl not exclusively carries out and causes to cure bad.By making bonding on the silicon atoms Hydrogen atom is less than 10, can prevent crosslinking agent unreacted and left behind, so as to cause harmful effect to being attached face.

Addition reaction-type silicone adhesive category composition preferably containing foregoing addition reaction-type organosilicon into While dividing (host agent being made of organic siliconresin component and organic silicon rubber component) and crosslinking agent, also containing curing catalysis Agent.

The curing catalysts be in order to promote unsaturated group in organic siliconresin component and organic silicon rubber component with The silyl hydrideization of Si-H bases in crosslinking agent is reacted and used.

As curing catalysts, platinum group catalyst, i.e. chloroplatinic acid, the alcoholic solution of chloroplatinic acid, chloroplatinic acid and alcohol can be enumerated The reactant of solution, the reactant of chloroplatinic acid and olefin(e) compound, chloroplatinic acid are anti-with the silicone compounds containing vinyl Answer thing, platinum-alkene complex, platinum-silicone complex containing vinyl and platinum-phosphorus complex etc..Above-mentioned curing catalysis The specific example of agent is recorded in such as Japanese Unexamined Patent Publication 2006-28311 publications and Japanese Unexamined Patent Publication 10-147758 publications.

More specifically, as commercially available product, SRX-212 and SHIN-ETSU HANTOTAI that Dow Corning Toray Co., Ltd. manufactures can be enumerated Learn PL-50T of Industrial Co., Ltd's manufacture etc..

Relative to the total amount of organic siliconresin component and organic silicon rubber component, in terms of platinum component, curing catalysts are matched somebody with somebody Resultant is usually more than 5 mass ppm and below 2000 mass ppm, is preferably more than 10 mass ppm and below 500 mass ppm. By being set to more than 5 mass ppm, it can prevent curability from reducing and reducing crosslink density, you can to prevent bonding force and cohesion Power (retentivity) reduces, and by being set to below 2000 mass ppm, adhesive phase can be kept while cost increase is prevented Stability, and the curing catalysts that can prevent from being excessively used cause harmful effect to being attached face.

In addition reaction-type silicone adhesive category composition, by coordinating foregoing each component, even in normal Also bonding force is shown under temperature, from the aspect of the stability of bonding force, preferably by addition reaction-type silicone adhesive category group Compound is coated on base material 11 or stripping film described below, after base material 11 is bonded with stripping film, is heated or irradiates work Property energy line promotes organic siliconresin component and cross-linking reaction of the organic silicon rubber component under the action of crosslinking agent.

Heating-up temperature during using heating to promote cross-linking reaction is usually more than 60 DEG C and less than 140 DEG C, is preferably 80 More than DEG C and less than 130 DEG C.By being heated more than 60 DEG C, can prevent organic siliconresin component and organic silicon rubber into The crosslinking divided is insufficient and causes bonding force insufficient, by being heated below 140 DEG C, can prevent substrate sheets from producing heat and receiving Contracting fold, occur deterioration, change colour.

Irradiation active energy ray in the case of promoting cross-linking reaction, in electromagnetic wave or charged particle beam, can utilize Active energy ray with the quantum of energy, i.e. ultraviolet isoreactivity light or electron beam etc. can be utilized.Irradiating electron beam is crosslinked In the case of, it is not necessary to Photoepolymerizationinitiater initiater, but in the case of irradiation ultraviolet isoreactivity light progress is crosslinked, preferably there are light Polymerization initiator.

Photoepolymerizationinitiater initiater during as irradiation ultraviolet, is not particularly limited, can be from conventional commonly used in ultraviolet Arbitrary Photoepolymerizationinitiater initiater is suitably selected to use in the Photoepolymerizationinitiater initiater of line gel-type resin.Trigger as the photopolymerization Agent, for example,：Benzoin class, benzophenone, acetophenones, Alpha-hydroxy ketone, alpha-amido ketone, α-diones, α-diketone dialkyl acetal (α-diketone dialkyl acetal) class, Anthraquinones, thioxanthene ketone class, other compounds etc..

These Photoepolymerizationinitiater initiaters may be used singly or in combination of two or more use.In addition, relative to as master 100 mass parts of total amount of above-mentioned addition reaction-type silicone ingredients and crosslinking agent that agent uses, the usage amount of Photoepolymerizationinitiater initiater Usually more than 0.01 mass parts and it is 30 below mass part, preferably more than 0.05 mass parts and 20 scopes choosings below mass part It is fixed.

It is crosslinked by heating or irradiating active energy ray, the bonding sheet with stable bonding force can be obtained.

The accelerating potential for irradiating electron beam when being crosslinked as the electron beam of one of active energy ray is usually 130kV Above and below 300kV, be preferably more than 150kV and below 250kV., can be to prevent by irradiating the accelerating potential of more than 130kV Only the crosslinking deficiency of organic siliconresin component and organic silicon rubber component and cause the insufficient situation of bonding force, by with The accelerating potential irradiating electron beam of below 300kV, can prevent adhesive phase and substrate sheets from deteriorating, changing colour.Electron beam current Preferred scope is more than 1mA and below 100mA.

The dosage of the electron beam of irradiation be preferably more than 1Mrad and below 70Mrad, more preferably more than 2Mrad and Below 20Mrad.By that with the dose irradiation electron beam of more than 1Mrad, can prevent adhesive phase and substrate sheets from deteriorating, discoloration, from And it can prevent the insufficient situation of the adhesiveness produced by crosslinking deficiency.By with the dose irradiation electronics of below 70Mrad Beam, the cohesiveness for can prevent adhesive phase deterioration, changing colour and producing decline, so as to prevent substrate sheets deterioration, shrink.

Exposure during as irradiation ultraviolet, can suitably select, light quantity 100mJ/cm²Above and 500mJ/cm²With Under, illumination 10mW/cm²Above and 500mW/cm²Below.

Hinder to react due to oxygen in order to prevent, preferably heated under nitrogen atmosphere and the irradiation of active energy ray.

The thickness of adhesive phase 12 can suitably be determined according to the purposes of bonding sheet 10.In the present embodiment, adhesive phase 12 thickness is preferably more than 5 μm and less than 60 μm, more preferably more than 10 μm and less than 50 μm.If the thickness of adhesive phase 12 Spend it is thin, worry adhesive phase 12 can not follow semiconductor chip circuit face bumps and produce gap.Such as layer insulation Material and sealing resin etc. enter its gap, and the wiring connecting electrode in chip circuit face is lined with and may be blocked.It is if viscous The thickness of mixture layer 12 is more than 5 μm, then adhesive phase 12 easily follows the bumps in chip circuit face, so as to prevent gap Generation.In addition, if the thickness of adhesive phase 12 is blocked up, semiconductor chip is sunk in adhesive phase, semiconductor chip portion Divide and be possible to produce difference of height with the resin portion of sealing semiconductor chips.If difference of height as producing, when connecting up again Wiring is possible to that broken string can be produced.If the thickness of adhesive phase 12 is less than 60 μm, difference of height is not likely to produce.

In the present embodiment, within the scope of the effect of the invention, can contain in adhesive composition other Component.As the other components that can contain in adhesive composition, for example,：Organic solvent, fire retardant, thickening Agent, ultra-violet absorber, light stabilizer, antioxidant, antistatic agent, preservative, mould inhibitor, plasticizer, defoamer, colouring agent, Filler and Wetting-transition agent etc..

Dimethyl siloxane and dimethyl diphenyl can also be contained in addition reaction-type silicone adhesive category composition Non-reacted polysiloxane is as additive as siloxanes.

As the more specifically example of the adhesive composition of present embodiment, for example following such bonding can be enumerated The example of agent composition, but the present invention is not limited to such example.

As an example of the adhesive composition of present embodiment, following adhesive composition can be enumerated, it contains Have acrylic copolymer, bonding agent and a crosslinking agent, the acrylic copolymer be at least by 2-EHA, Acrylic copolymer obtained from carboxyl group-containing monomer and hydroxyl monomer copolymerization, the bonding agent, which includes, has reactive base For the rubber type of material of group as principal component, the crosslinking agent is isocyanates crosslinking agent.

As an example of the adhesive composition of present embodiment, following adhesive composition can be enumerated, it contains Have acrylic copolymer, bonding agent and a crosslinking agent, the acrylic copolymer be at least by 2-EHA, Acrylic copolymer obtained from carboxyl group-containing monomer and hydroxyl monomer copolymerization, the bonding agent hydrogenate for two terminal hydroxyls Polybutadiene, the crosslinking agent are isocyanates crosslinking agent.

As an example of the adhesive composition of present embodiment, following adhesive composition can be enumerated, it contains Have acrylic copolymer, bonding agent and a crosslinking agent, the acrylic copolymer be at least by 2-EHA, Acrylic copolymer obtained from acrylic acid and the copolymerization of acrylic acid 2- hydroxy methacrylates, the bonding agent, which includes, has reactivity For the rubber type of material of group as principal component, the crosslinking agent is isocyanates crosslinking agent.

As an example of the adhesive composition of present embodiment, following adhesive composition can be enumerated, it contains Have acrylic copolymer, bonding agent and a crosslinking agent, the acrylic copolymer be at least by 2-EHA, Acrylic copolymer obtained from acrylic acid and the copolymerization of acrylic acid 2- hydroxy methacrylates, the bonding agent is two terminal hydroxyl hydrogen Change polybutadiene, the crosslinking agent is isocyanates crosslinking agent.

In these examples of the adhesive composition of present embodiment, preferably come from aforesaid propylene acid copolymer The ratio of the copolymer component of 2-EHA is more than 80 mass % and below 95 mass %, comes from list containing carboxyl The mass ratio of the copolymer component of body is below 1 mass %, and remainder is other copolymer components, as other copolymers Component, preferably comprises the copolymer component for coming from hydroxyl monomer.

(stripping film)

As stripping film RL, it is not particularly limited.For example, from the viewpoint of handling easiness, stripping film RL preferably has Standby peeling base and the peeling agent layer for being coated with remover in peeling base and being formed.In addition, stripping film RL can shelled only Possess peeling agent layer from the single side of base material, can also possess peeling agent layer on the two sides of peeling base., can be with as peeling base Enumerate for example：Paper base material, laminated paper and plastic foil obtained from the thermoplastic resin such as laminated polyethylene on the paper base material Deng.As paper base material, can enumerate：Glassine paper, coated paper and cast-coated paper (cast coated paper) etc..As plastic foil, It can enumerate：The polyester such as polyethylene terephthalate, polybutylene terephthalate (PBT) and polyethylene naphthalate Polyolefin film such as film and polypropylene and polyethylene etc..As remover, can enumerate for example：Olefine kind resin, rubber bullet Property body (for example, butadiene type resin, isoprene resinoid etc.), chain alkyl resinoid, alkyd based resin, fluorine-containing resinoid And organic silicon resin.

The thickness of stripping film RL is not particularly limited.The thickness of stripping film RL is usually more than 20 μm and less than 200 μm, excellent Elect more than 25 μm and less than 150 μm as.

The thickness of peeling agent layer is not particularly limited.The situation of peeling agent layer is formed containing the solution of remover in coating Under, the thickness of peeling agent layer is preferably more than 0.01 μm and less than 2.0 μm, more preferably more than 0.03 μm and less than 1.0 μm.

In the case where using plastic foil as peeling base, the thickness of the plastic foil be preferably more than 3 μm and 50 μm with Under, more preferably more than 5 μm and less than 40 μm.

The bonding sheet 10 of present embodiment preferably shows following bonding force after the heating.First, paste bonding sheet 10 In adherend (copper foil or polyimide film), heated under conditions of 100 DEG C and 30 minutes, further when 190 DEG C and 1 are small Condition heating after, preferably adhesive phase 12 at room temperature the bonding force to copper foil and adhesive phase 12 at room temperature to polyamides The bonding force of imines film is respectively more than 0.7N/25mm and below 2.0N/25mm.If the bonding after such heating is carried out Power is more than 0.7N/25mm, then is also possible to prevent bonding sheet 10 in the case where making base material or adherend deformation because of heating Peeled off from adherend.In addition, if the bonding force after heating is below 2.0N/25mm, then peeling force will not be excessive, is easy to Bonding sheet 10 is peeled off from adherend.

It should be noted that in the present specification, room temperature refers to the temperature of more than 22 DEG C and less than 24 DEG C.In this specification In, bonding force is the value measured by 180 ° of stripping methods under 300mm/ points of draw speed, bonding sheet width 25mm.

(manufacture method of bonding sheet)

The manufacture method of bonding sheet 10 is not particularly limited.

For example, bonding sheet 10 can be manufactured by following process.First, applied on the first base material face 11a of base material 11 Cloth adhesive, forms film.Then, make the dried coating film, form adhesive phase 12.Then, with the side of coating and bonding oxidant layer 12 Formula pastes stripping film RL.

In addition, other manufacture methods as bonding sheet 10, can manufacture by following process.First, in stripping film The upper coating adhesive compositions of RL, form film.Then, make dried coating film, form adhesive phase 12, then make the first of base material 11 Substrate surface 11a fits in the adhesive phase 12.

In the case where coating adhesive composition forms adhesive phase 12, preferably with organic solvent diluting adhesive group Compound, prepares coating liquid and uses.As organic solvent, can enumerate for example：Toluene, ethyl acetate and methyl ethyl ketone etc..Coating The method of coating liquid is not particularly limited.As coating method, can enumerate for example：Spin-coating method, spraying process, stick coating method, scraper Rubbing method, roller knife rubbing method, rolling method, scraper plate rubbing method, die coating method and gravure coating process etc..

Organic solvent and low boiling point component residue in adhesive phase 12 in order to prevent, and coating liquid preferably is being coated on base material After 11 or stripping film RL, heating film makes its drying.In addition, in the case of coordinating crosslinking agent in adhesive composition, in order to Cross-linking reaction is carried out and is improved cohesiveness, preferably heat film.

(use of bonding sheet)

Bonding sheet 10 is used when being sealed to semiconductor element.Bonding sheet 10 preferably draws to not being equipped on made of metal Wire frame and the semiconductor element in the state of being pasted onto on bonding sheet 10 use when being sealed.Specifically, bonding sheet 10 is simultaneously The non-semiconductor element to being equipped on metal ieadf iotaame uses when sealing, and it is preferred that to being pasted onto adhesive phase 12 On the semiconductor element of state use when being sealed.Semiconductor element is sealed as without using metal ieadf iotaame The mode of dress, can enumerate face Board level packaging (Panel Scale Package；) and wafer-level packaging (Wafer Level PSP Package；WLP).

Bonding sheet 10 is preferred for following technique, which has following process：Make the frame structure for foring multiple opening portions Part is pasted on the process of bonding sheet 10, the adhesive phase 12 for making semiconductor chip be pasted onto the opening portion for being exposed to the frame component Process, coat with sealing resin the process of the semiconductor chip and make the process of the sealing resin heat cure.

(manufacture method of semiconductor device)

The method that semiconductor device is manufactured to the bonding sheet 10 using present embodiment illustrates.

Fig. 2A~Fig. 2 E show the schematic diagram of the manufacture method of the semiconductor device for illustrating present embodiment.

Implement following process in the manufacture method of the semiconductor device of present embodiment：Make formed with multiple opening portions 21 Frame component 20, which is pasted on the process (bonding sheet adhering processes) of bonding sheet 10, is pasted on semiconductor chip CP utilizes frame component 20 Opening portion 21 and process (bonding (bonding) process) on the adhesive phase 12 that exposes, coated with sealing resin 30 and partly led The process (sealing process) of body chip CP, the process (heat curing processes) for making 30 heat cure of sealing resin and after heat cure The process (stripping process) that bonding sheet is peeled off.As needed, can also implement to make stiffener 40 after heat curing processes The process (stiffener adhering processes) being pasted on the seal 50 sealed using sealing resin 30.

Hereinafter, each operation is illustrated.

Bonding sheet adhering processes

Fig. 2A is illustrated that the schematic diagram of the process of the adhesive phase 12 for making frame component 20 be pasted on bonding sheet 10.

Frame component 20 in present embodiment is formed as clathrate, and has multiple opening portions 21.Frame component 20 preferably by Material with heat resistance is formed.As the material of frame component 20, for example,：The metal such as copper and stainless steel, Yi Jiju Heat-resistant resin such as imide resin and glass epoxy resin etc..

Opening portion 21 is the hole for the surface back side for penetrating through frame component 20.For the shape of opening portion 21, as long as energy Enough shapes being accommodated in semiconductor chip CP in frame, are not particularly limited.As long as the hole depth of opening portion 21 also can Semiconductor chip CP is stored, is not particularly limited.

Bond process

Fig. 2 B are illustrated that the schematic diagram of the process for illustrating to make semiconductor chip CP be pasted on adhesive phase 12.

After bonding sheet 10 is pasted on frame component 20, in each opening portion 21, adhesive phase 12 corresponds to opening portion 21 Shape and expose.Semiconductor chip CP is set to be pasted on the adhesive phase 12 of each opening portion 21.When pasting semiconductor chip CP, So that its circuit face is covered by adhesive phase 12.

For manufacture for semiconductor chip CP, manufactured by implementing for example following process：To formed with electricity The back of the body grinder sequence and the cutting action by semiconductor wafer singualtion that the back side of the semiconductor wafer on road is ground.Cutting Cut in process, semiconductor wafer is pasted on the adhesive layer of cutting sheet, use the disconnecting devices such as slicer (dicing saw) By semiconductor wafer singualtion, semiconductor chip CP (semiconductor element) is thus obtained.

Cutter device is not particularly limited, and can use known cutter device.In addition, do not have for the condition of cutting yet It is particularly limited to.It should be noted that it can also be cut using laser cutting method or stealthy patterning method etc. instead of using cutter The method cut.

After cutting action, it is possible to implement cutting sheet is stretched, so as to expand the interval between multiple semiconductor chip CP Spread sheet process.By implementing spread sheet process, semiconductor chip CP can be picked up using conveyers such as opening folders.In addition, By implementing spread sheet process, bonding force of the cutting sheet to adhesive layer can be reduced, make semiconductor chip CP become to easily pick up.

In the case of coordinating energy line polymerizable compound in the adhesive composite or adhesive layer of cutting sheet, from The substrate side of cutting sheet cures energy line polymerizable compound adhesive layer irradiation energy line.Make energy line polymerism After compound cures, the cohesiveness of adhesive layer improves, and can make the bonding force of adhesive layer reduce.As energy line, Ke Yiju Go out such as ultraviolet (UV) and electron beam (EB), preferably ultraviolet.The irradiation of energy line can paste semiconductor wafer it Afterwards, any stage before the stripping (pickup) of semiconductor chip carries out.For example, energy can be irradiated before being cut or after cutting Measure line, can also after spread sheet process irradiation energy line.

Sealing process and heat curing processes

Fig. 2 C are illustrated that close for illustrating to carry out the semiconductor chip CP and frame component 20 that are pasted onto on bonding sheet 10 The schematic diagram of the process of envelope.

The material of sealing resin 30 is heat-curing resin, and for example, epoxy resin etc..As sealing resin It can contain in 30 epoxy resin used such as phenolic resin, elastomer, inorganic filling material and curing accelerator.

The method that semiconductor chip CP and frame component 20 are coated with sealing resin 30 is not particularly limited.

In the present embodiment, enumerate exemplified by the mode for the sealing resin 30 for having used sheet to illustrate.Place piece The sealing resin 30 of shape simultaneously makes it cover semiconductor chip CP and frame component 20, sealing resin 30 is heating and curing and is formed sealing Resin bed 30A.So, semiconductor chip CP and frame component 20 are embedded in sealing resin layer 30A.Use the close of sheet In the case of sealing resin 30, preferably sealed by double of conductor chip CP of vacuum layer platen press and frame component 20.It is true by this Dead level platen press, can prevent from producing gap between semiconductor chip CP and frame component 20.Heating using vacuum layer platen press is consolidated The temperature conditionss scope of change is, for example, more than 80 DEG C and less than 120 DEG C.

In sealing process, the sealing resin 30 of sheet can be used by the resin sheet branch of polyethylene terephthalate etc. Support the laminated sheet formed.In this case, after placing laminated sheet in the way of covering semiconductor chip CP and frame component 20, will set Fat piece is peeled off from sealing resin 30, sealing resin 30 is heating and curing.As such laminated sheet, for example,：ABF Film (manufacture of Ajinomoto Fine-Techno companies).

As the method sealed to semiconductor chip CP and frame component 20, shifting formwork method (トラ Application ス Off ァ can be used ーモー Le De method).In this case, for example semiconductor core on bonding sheet 10 is pasted onto in the mould inside storage of sealing device Piece CP and frame component 20.The resin material of inside injection mobility to the mould, cures resin material.The situation of shifting formwork method Under, heating and pressure are not particularly limited.As an example of the usual conditions in shifting formwork method, be by more than 150 DEG C of temperature, The pressure of more than 4MPa and below 15MPa are kept for more than 30 seconds and less than 300 seconds.Then, pressurization is released, from sealing device Take out and stand in an oven, holding more than 150 DEG C temperature 2 it is small when more than and 15 it is small when below.So, by semiconductor Chip CP and frame component 20 are sealed.

In the case of using the sealing resin 30 of sheet in above-mentioned sealing process, 30 thermosetting of sealing resin can be made Implement the first heating suppression process before the process (heat curing processes) of change.In the first heating suppression process, from two sides plate Shape component clamps the semiconductor chip CP covered by sealing resin 30 and the bonding sheet 10 with framed component 20, in given temperature Suppressed under conditions of degree, time and pressure.By implementing the first heating suppression process, sealing resin 30 is easily filled into In the gap of semiconductor chip CP and frame component 20.In addition, by implementing to heat suppression process, can also be to by sealing resin 30 The bumps of the sealing resin layer 30A of composition are planarized.As tabular component, such as the metal of stainless steel etc. can be used Plate.

If bonding sheet 10 is peeled off after heat curing processes, can obtain the semiconductor core sealed by sealing resin 30 Piece CP and frame component 20.Hereinafter, it is sometimes referred to as seal 50.

Stiffener adhering processes

Fig. 2 D are illustrated that the schematic diagram of the process for illustrating to make stiffener 40 be pasted on seal 50.

After bonding sheet 10 is peeled off, the circuit face of the semiconductor chip CP to exposing implements to be formed again the cloth again of wiring layer Line procedures and the process that projection (バ Application プ pays け) is set.In order to improve such cabling processes again and set in the process of projection Seal 50 operability, the process that can implement to make stiffener 40 be pasted on seal 50 as needed (strengthens structure Part adhering processes).In the case of implementing stiffener adhering processes, preferably implement before bonding sheet 10 is peeled off.Such as Fig. 2 D institutes Show, seal 50 is supported with the state clamped by bonding sheet 10 and stiffener 40.

In the present embodiment, stiffener 40 possesses the reinforcing plate 41 of heat resistance and the adhesive linkage 42 of heat resistance.

As reinforcing plate 41, can enumerate for example：Include the heat-resistant resin such as polyimide resin and glass epoxy resin Tabular component.

Adhesive linkage 42 makes reinforcing plate 41 be bonded with seal 50., can be according to reinforcing plate 41 and sealing as adhesive linkage 42 The material of resin bed 30A suitably selects.For example, glass is included comprising epoxylite and reinforcing plate 41 in sealing resin layer 30A In the case of epoxy resin, as adhesive linkage 42, the glass fabric of thermoplastic resin is preferably comprised, as in adhesive linkage 42 Contained thermoplastic resin, preferably bismaleimide-triazine resin (BT resins).

In stiffener adhering processes, the second following heating suppression process is preferable to carry out：In the sealing of seal 50 Adhesive linkage 42 is sandwiched between resin bed 30A and reinforcing plate 41, then tabular component is used respectively from 41 side of reinforcing plate and 10 side of bonding sheet Clamping, is suppressed under conditions of given temperature, time and pressure.By the second heating suppression process, by seal 50 Pre-fixed with stiffener 40., preferably will be close after fixation in order to cure adhesive linkage 42 after the second heating suppression process Envelope body 50 and stiffener 40 are heated under conditions of given temperature and time.The condition being heating and curing can be according to bonding The material of layer 42 is suitably set, and is, for example, 185 DEG C, 80 minutes and 2.4MPa of condition.In the second heating suppression process, make For tabular component, such as the metallic plate of stainless steel etc. can be used.

Stripping process

Fig. 2 E are illustrated that the schematic diagram of the process for illustrating to peel off bonding sheet 10.

In the present embodiment, the base material 11 of bonding sheet 10 can it is curved in the case of, can make bonding sheet 10 bend and Easily peeled off from frame component 20, semiconductor chip CP and sealing resin layer 30A.Peel angle θ is not particularly limited, preferably Bonding sheet 10 is peeled off with more than 90 degree of peel angle θ.If peel angle θ is more than 90 degree, will easily can glue Piece 10 is closed to peel off from frame component 20, semiconductor chip CP and sealing resin layer 30A.Peel angle θ be preferably more than 90 degree and Below 180 degree, it is more preferably below more than 135 degree and 180 degree.Make the bending of bonding sheet 10 in this way while being shelled From, the load to frame component 20, semiconductor chip CP and sealing resin layer 30A application can be reduced to peel off, so as to To suppress the damage of the semiconductor chip CP and sealing resin layer 30A that are produced by the stripping of bonding sheet 10.Bonding sheet 10 is shelled From rear, process for implementing above-mentioned cabling processes again and setting projection etc..After the stripping of bonding sheet 10, implement cabling processes again and set Before process for putting projection etc., above-mentioned stiffener adhering processes can also be implemented as needed.

In the case of pasting stiffener 40, after cabling processes again and the process for setting projection etc. are implemented, not The stage of the support of stiffener 40 is needed to peel off stiffener 40 from seal 50.

Then, seal 50 is subjected to singualtion (singualtion operation) in the form of semiconductor chip CP units.Make sealing The method of 50 singualtion of body is not particularly limited.For example, can be by with above describing when being cut to semiconductor wafer The same method of used method carries out singualtion.Make the process of 50 singualtion of seal can also be pasted by seal 50 Implement in the state of cutting sheet etc..By carrying out singualtion to seal 50, partly leading for semiconductor chip CP units can be manufactured Body encapsulates, which is mounted in installation procedure and is installed in printed circuit board etc..

According to the present embodiment, it can prevent semiconductor chip CP movements, position from deviateing in sealing process.In this implementation In mode, adhesive phase 12 in 100 DEG C of gaseous environment to the value tried to achieve in the chip pull test of silicon for 3.0N/ chips with On, semiconductor chip CP is more difficult to be peeled off from adhesive phase 12.Therefore, in sealing process, semiconductor chip CP can be prevented Peeled off from adhesive phase 12, can prevent semiconductor chip CP movements, position from deviateing.

(deformation of embodiment)

The present invention is not limited to the above embodiment, deformation and improvement in the range of it can realize the object of the invention Etc. being also included in the present invention.It should be noted that in the following description, if with the component illustrated by the above embodiment Etc. identical, identical symbol is just assigned, and its explanation is omitted or simplified.

In the above-described embodiment, enumerate and be used as example in a manner of being stripped piece RL claddings using the adhesive phase 12 of bonding sheet 10 Son is illustrated, but the present invention is not limited to such mode.

In addition, bonding sheet 10 can be provided with the state of monolithic, can also provided with the state of multiple 10 laminations of bonding sheet. In this case, for example, adhesive phase 12 can also be treated that the base material 11 of other bonding sheets of lamination covers.

In addition, bonding sheet 10 can for strip piece, can also be provided with the state being rolled into a roll.It is rolled into web-like Bonding sheet 10 is cut into the rear use such as desired size after being extracted out from volume.

In the above-described embodiment, the situation for enumerating thermosetting resin as the material of sealing resin 30 carries out as an example Explanation, but the present invention is not limited to such mode.For example, sealing resin 30 can also be cured with ultraviolet Isoenergetical line Energy ray-curable resin.

In the above-described embodiment, in the explanation of the manufacture method of semiconductor device, enumerating is pasted on frame component 20 The mode of bonding sheet 10 is illustrated as an example, but the present invention is not limited to such mode.Bonding sheet 10 can also be Manufacture without using frame component 20 and used in the manufacturing method for semiconductor device of semiconductor element.

Embodiment

Hereinafter, enumerate embodiment the present invention will be described in more detail.The present invention and from any of these embodiments Limit.

(evaluation method)

The evaluation of bonding sheet is carried out according to method as shown below.

[chip pull test]

Determine value of the adhesive phase to being tried to achieve in the chip pull test of silicon in 100 DEG C of gaseous environment.It is specific and Speech, is determined according to following step (a)~(h).

(a) semiconductor chip (silicon) of measure object has been made under the following conditions.

Back grinding tape：E-8180HR (Lindeke Co., Ltd's manufacture), dicing tape：D-174A (Lin get Ke plants of formula meetings Society manufactures)

Cutter device：" DFD651 " of DISCO companies manufacture

Standard cleavage conditions：Blade=27HECC, 35,000rpm, cut mode A, 50mm/ second

Chip thickness：200 μm of (#2000), chip sizes：6.4mm × 6.4mm (6.435mm intervals)

(b) as shown in Figure 3B, the sticking two-faced adhesive tape band DF (TL- in entire surface of the lining shown in Fig. 3 A with bakelite plate BB 6177-12-LN TEST, Lindeke Co., Ltd's manufacture), then peel off the stripping film of two-sided tape DF.

(c) using the adhesive phase 12 made in embodiment and comparative example as sample film, as shown in Figure 3 C, in two-sided tape The upper adhesive layers 12 of DF, have then peeled off the stripping film of adhesive phase 12.

(d) as shown in Figure 3D, semiconductor chip CP (8) is arranged on adhesive phase 12 with 2.5cm intervals with tweezers, So that circuit face CPA connects with adhesive phase 12.At this time, semiconductor chip CP is provided with, so that semiconductor core smooth vertical Adhesive phase 12 is not touched in the angle of piece CP.

(e) vacuum lamination has been carried out to the sample made in above-mentioned (d) under the following conditions using vacuum laminator.Need Illustrate, when carrying out vacuum lamination, as shown in FIGURE 3 E, in 2 stripping film LF (thickness of configuration up and down：38 μm), carry out Vacuum lamination.

Vacuum laminator：NISSINBO companies manufacture

Temperature：100℃

Pressure：100Pa, vacuum：Do not set and (aspirate with all strength), compacting：Do not set (pressure difference with atmospheric pressure)

Laminate speed：Fast mode

Program：Vacuum suction is carried out 40 seconds after 60 seconds with high-speed layer pressure

It is laminated after design temperature is when 1 is small, is temporarily dallied before actual sample lamination.

(f) sample of vacuum lamination in above-mentioned (e) is placed in tensile testing machine (Nordson Advanced " Dage4000 " of Technology companies manufacture), it is preheated to 100 DEG C.

(g) as shown in Figure 3 G, being pasted with two-sided tape DF2 as illustrated in Figure 3 F, (Lindeke Co., Ltd manufactures " A208 ") stress part PB be placed on semiconductor chip CP, press with finger 5 seconds.After 1 minute, in following conditions Under carry out chip pull test as shown in figure 3h, displacement and the power of force cell are measured, using the peak value of power as being applied to 1 Power (unit on chip (semiconductor chip CP)：N/ chips).

The temperature of gaseous environment：100℃

Test speed：200 μm/second

(h) then, after semiconductor chip CP is removed from stress part PB, to other semiconductors as above-mentioned (g) Chip CP carries out chip pull test, until the quantity of valid data reaches 6, obtains the power for being applied to 1 chip.Then, Using the average value of obtained valid data as the value (unit tried to achieve in chip pull test：N/ chips).

[chip offset evaluation]

It is spaced in necessary on the adhesive surface of bonding sheet according to the adhesive surface of bonding sheet and the circuit face of semiconductor chip The mode to connect sets 8000 semiconductor chips (silicon mirror chip, chip sizes：2.3mm × 1.7mm, chip thickness： 0.2mm).Then, sealing is passed through using heating in vacuum pressurization laminating machine (" 7024HP5 " that ROHM and HAAS companies manufacture) Resin (ABF films, the GX T-31 of the manufacture of Ajinomoto Fine-Techno companies) carries out the semiconductor chip on bonding sheet Sealing.Air-proof condition is as described below.

Preheating temperature：Workbench and membrane are 100 DEG C

Vacuum suction：60 seconds

Dynamic compacting pattern：30 seconds

Static pressing die formula：10 seconds

Then, the semiconductor chip on the bonding sheet after naked eyes and the embedment of micro- sem observation is passed through, it is thus identified that whether there is and partly lead Deviate the position of body chip.The situation that no position of semiconductor chip deviates is determined as " A ", there will be position of semiconductor chip The situation of deviation is determined as " B ".It should be noted that it is being embedded to front and rear semiconductor chip and is being moved more than 20 μm of situation Under, it is determined as " existence position deviation ".

(embodiment 1)

(1) making of adhesive composition

Coordinate following material (polymer, bonding agent, crosslinking agent and retarder thinner), be fully stirred, be prepared for The coating of embodiment 1 is with binder solution (adhesive composition).

Polymer：Acrylate copolymer, 40 mass parts (solid constituent)

Acrylate copolymer is by 92.8 mass % of 2-EHA, 7.0 matter of acrylic acid 2- hydroxy methacrylates Measure % and 0.2 mass % of acrylic acid copolymerization and prepare.

Bonding agent：(Tso Tat Co., Ltd., Japan manufactures two terminal hydroxyl hydrogenated butadiene polymers；GI-1000), 5 mass Part (solid constituent)

Bonding agent：(Japan Oil Co manufactures polyethers amine derivative；DT-203), 1.5 mass parts (solid constituent)

Crosslinking agent：Aliphatic category isocyanates (hexamethylene diisocyanate with hexamethylene diisocyanate Cyamelide ester type modifier) (Nippon Polyurethane Industry Co., Ltd. manufacture；Coronate HX), 3.5 mass parts (Gu Body component)

Retarder thinner：Using methyl ethyl ketone, coating is adjusted to 30 mass % with the solid component concentration of adhesive liquid.

(2) making of adhesive phase

The coating of preparation is coated on by there is provided organic with binder solution using Comma Coater (registration mark) (Lindeke Co., Ltd manufactures stripping film made of 38 μm of transparent polyethylene terephthalate films of silicon class peel ply；SP- PET382150) stripping aspect side so that dried thickness is 50 μm, carries out 90 DEG C and 90 seconds of heating, then into The heating that 115 DEG C and 90 seconds of row, makes dried coating film.

(3) making of bonding sheet

After the dried coating film for making coating binder solution, adhesive phase and base material are bonded, obtained the viscous of embodiment 1 Close piece.It should be noted that as base material, transparent polyethylene terephthalate film (Teijin DuPont Films are used Company manufactures；Storage modulus 3.1 × 10 when PET50KFL12D, 50 μm, 100 DEG C of thickness⁹Pa), adhesive phase is fitted in into base The easy bonding plane of material.

(embodiment 2)

In addition to the bonding agent contained in adhesive phase is with 1 difference of embodiment, reality has been made similarly to Example 1 Apply the bonding sheet of example 2.

For two terminal hydroxyl hydrogenated butadiene polymers, (Tso Tat Co., Ltd., Japan manufactures the bonding agent used in embodiment 2； GI-1000), 5 mass parts (solid constituent).

(embodiment 3)

Silicone adhesive category has been used in embodiment 3.

In embodiment 3, coordinate：

18 mass parts (solid constituent) of silicone adhesive category A (SD4580PSA),

40 mass parts (solid constituent) of silicone adhesive category B (SD4587L),

0.3 mass parts (solid constituent) of catalyst A (NC-25CAT),

0.65 mass parts (solid constituent) of catalyst B (CAT-SRX-212) and

5 mass parts (solid constituent) of subbing (BY24-712),

It is sufficiently stirred, is prepared for coating binder solution (adhesive composition).In the adhesive composition of embodiment 3 The material used is the manufacture of Dow Corning Toray companies.

The coating binder solution of coating Examples 3 on base material, and it is dry so that and dried thickness is 20 μm, Adhesive phase is made.Drying condition is set to 100 DEG C and 1 minute.Base material uses polyimide film used by embodiment 3 (Du Pont-Toray companies manufacture；Storage modulus 3.1 × 10 when KAPTON 100H, 25 μm, 100 DEG C of thickness⁹Pa〕.Will be The adhesive phase made on the surface of stripping film is bonded with base material, has obtained the bonding sheet of embodiment 3.

(embodiment 4)

In addition to the polymer contained in adhesive phase is with 2 difference of embodiment, implementation has been made similarly to Example 2 The bonding sheet of example 4.

The polymer used in embodiment 4 is to make 80.8 mass % of 2-EHA, acrylic acid 2- hydroxy methacrylates 7 What 12 mass % of quality %, 4- acryloyl morpholine and 0.2 mass % of acrylic acid was copolymerized and prepared.

(comparative example 1)

In addition to the bonding agent contained in adhesive phase is with 1 difference of embodiment, ratio has been made similarly to Example 1 Compared with the bonding sheet of example 1.

The bonding agent used in comparative example 1 is tributyl 2-acetylcitrate (Taoka Chemical Industries Co. Ltd.'s manufacture), 5 Mass parts (solid constituent).

By the bonding sheet evaluation result is shown in table 1 of embodiment 1~4 and comparative example 1.In addition, by embodiment 1~4 and compare Table 1 is shown in compared with the adhesive used in example 1.

[table 1]

Result as shown in Table 1 is it has been confirmed that try the chip pulling force of silicon in gaseous environment of the adhesive phase in 100 DEG C The value tried to achieve is tested as (embodiment 1~4) in the case of more than 3.0N/ chips, can prevent chip offset.

Claims

1. a kind of bonding sheet, it is the bonding sheet used when the semiconductor element on to bonding sheet seals,

The bonding sheet possesses base material and adhesive phase, and described adhesive layer draws the chip of silicon under 100 DEG C of gaseous environment The value tried to achieve in power experiment is more than 3.0N/ chip.

2. bonding sheet according to claim 1, wherein, storage modulus of the base material at 100 DEG C is 1 × 10⁷Pa with On.

3. bonding sheet according to claim 1 or 2, wherein, described adhesive layer contains acrylic pressure-sensitive adhesive compositions Or silicone adhesive category composition.

4. bonding sheet according to claim 3, wherein, the acrylic pressure-sensitive adhesive compositions are included with acrylic acid 2- second Acrylic copolymer of the own ester of base as principal monomer.

5. bonding sheet according to claim 3, wherein, the silicone adhesive category composition, which includes addition polymerization type, to be had Machine silicones.