CN107919290A - A kind of Double-lead-frame fixing means - Google Patents
A kind of Double-lead-frame fixing means Download PDFInfo
- Publication number
- CN107919290A CN107919290A CN201710991069.9A CN201710991069A CN107919290A CN 107919290 A CN107919290 A CN 107919290A CN 201710991069 A CN201710991069 A CN 201710991069A CN 107919290 A CN107919290 A CN 107919290A
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- CN
- China
- Prior art keywords
- lead
- groove
- frame
- double
- fixing means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 45
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000000748 compression moulding Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 230000013011 mating Effects 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000006071 cream Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000012237 artificial material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 208000031232 peroneal neuropathy Diseases 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49534—Multi-layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention discloses a kind of Double-lead-frame fixing means, includes the following steps：Step S100, two lead frames that can be superimposed with each other are provided, the superposed surfaces of a lead frame open up groove wherein；Step S200, connecting material is placed in groove；Step S300, two lead frames are overlapped；Step S400, the fixed part of two lead frames of connection is formed after the connecting material in groove cures.By setting groove on the lead frames and connecting material being placed in groove, the connecting material in two lead frame solidify afterwards grooves can overlapped, to form fixed part, fixed part will closely connect two lead frames, prevent two lead frame deformation separation, be effectively improved the yield of product.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of Double-lead-frame fixing means.
Background technology
Chip carrier of the lead frame as integrated circuit, is that one kind realizes that chip internal circuits draw by means of bonding gold wire
The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead
Act on, be required for using lead frame in most semiconductor integrated blocks, lead frame is important in electronics and information industry
Basic material.
At present, in order to improve production efficiency, the mode often combined using two panels lead frame produces semiconductor package.
Before being separated into single product after lead frame injection, material all in one piece three times about occurs, artificial material all in one piece, electricity after being respectively molded
Artificial material all in one piece during plating and the material all in one piece being separated into before single product, multiple material all in one piece can become the two panels lead frame of overlapping
Shape separates, and especially corner location, the two panels lead frame of overlapping can cause the interior foot on lead frame to separate after deformation
Resinite, foot drops there is a phenomenon where in, causes product bad.
The content of the invention
It is an object of the invention to：A kind of Double-lead-frame fixing means is provided, after it can strengthen Double-lead-frame injection
Intensity, prevent Double-lead-frame from deforming, product yield is high.
In order to achieve the above object, the present invention uses following technical scheme：
A kind of Double-lead-frame fixing means is provided, is included the following steps：
Step S100, two lead frames that can be superimposed with each other are provided, wherein the superposed surfaces of a lead frame
Open up groove；
Step S200, connecting material is placed in the groove；
Step S300, two lead frames are overlapped；
Step S400, the connecting material in described groove forms the fixed part of two lead frames of connection after curing
Point.
As a kind of preferred solution of Double-lead-frame fixing means, in the step S100, draw described in another
Processing and the mating protrusion of the groove in the superposed surfaces of wire frame.
It is less than the depth of the groove as height raised described in a kind of preferred solution of Double-lead-frame fixing means.
As raised bending and molding or punch forming described in a kind of preferred solution of Double-lead-frame fixing means.
A kind of preferred solution as Double-lead-frame fixing means at least the lead frame superposed surfaces corner
Position sets the groove.
As Double-lead-frame fixing means a kind of preferred solution the lead frame superposed surfaces corner location
And medium position is respectively provided with the groove.
It is as step S200 described in a kind of preferred solution of Double-lead-frame fixing means：To offering the groove
The superposed surfaces printing of the lead frame coats the connecting material, makes the full connecting material of filling in the groove.
It is welding material as connecting material described in a kind of preferred solution of Double-lead-frame fixing means.
It is curable adhesives as connecting material described in a kind of preferred solution of Double-lead-frame fixing means.
A kind of preferred solution as Double-lead-frame fixing means groove described in etch-forming on the lead frame；
Or,
The groove described in compression molding on the lead frame.
Beneficial effects of the present invention are：, can by setting groove on the lead frames and connecting material being placed in groove
To overlap the connecting material in two lead frame solidify afterwards grooves, to form fixed part, fixed part will closely connect
Two lead frames are connect, prevent two lead frame deformation separation, are effectively improved the yield of product.
Brief description of the drawings
The present invention is described in further detail below according to drawings and examples.
Fig. 1 is the structure diagram of the first lead frame described in one embodiment of the invention.
Fig. 2 is the Section A-A figure of Fig. 1.
Fig. 3 is the structure diagram of the second lead frame described in one embodiment of the invention.
Fig. 4 is that the first lead frame described in one embodiment of the invention coats the structure diagram after connecting material.
Fig. 5 is the section B-B figure of Fig. 4.
Fig. 6 is the first lead frame described in one embodiment of the invention and the structural representation after the second lead frame overlapping
Figure.
Fig. 7 is the C-C sectional views of Fig. 6.
Fig. 8 is the structure diagram of the second lead frame described in another embodiment of the present invention.
Fig. 9 is the D-D sectional views of Fig. 8.
Figure 10 is that the structure after the first lead frame described in another embodiment of the present invention is overlapped with the second lead frame is shown
It is intended to.
Figure 11 is the E-E sectional views of Figure 10.
In figure：
1st, the first lead frame；11st, groove；2nd, the second lead frame；21st, it is raised；3rd, connecting material.
Embodiment
For make present invention solves the technical problem that, the technical solution that uses and the technique effect that reaches it is clearer, below
The technical solution of the embodiment of the present invention will be described in further detail with reference to attached drawing, it is clear that described embodiment is only
It is part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art exist
All other embodiments obtained under the premise of creative work are not made, belong to the scope of protection of the invention.
In the description of the present invention, unless otherwise clearly defined and limited, term " connected ", " connection ", " fixation " are answered
It is interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can mechanically connect,
Can be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, can be the company inside two elements
Logical or two elements interaction relationship.For the ordinary skill in the art, can be understood with concrete condition above-mentioned
The concrete meaning of term in the present invention.
As shown in Fig. 1 to 7, in this present embodiment, Double-lead-frame fixing means of the invention, includes the following steps：
Step S100, two lead frames that can be superimposed with each other are provided, the superposed surfaces of a lead frame open up wherein
Groove 11；
Step S200, connecting material 3 is placed in groove 11；
Step S300, two lead frames are overlapped；
Step S400, the fixed part of two lead frames of connection is formed after the connecting material 3 in groove 11 cures.
By setting groove 11 on the lead frames and connecting material 3 being placed in groove 11, can draw overlapping two
Connecting material 3 in wire frame solidify afterwards groove 11, to form fixed part, fixed part will closely connect two lead frames
Frame, prevents two lead frame deformation separation, is effectively improved the yield of product.
In a preferred embodiment of the invention, as shown in Fig. 8 to 11, in the step s 100, in another lead
Processing and the mating protrusion 21 of groove 11 in the superposed surfaces of frame.By setting protrusion 21, two lead frames can be made
Overlapping rear projection 21 is inserted into groove 11, strengthens bonding strength.
In the present embodiment, the height of protrusion 21 is less than the depth of groove 11.The height of protrusion 21 will be set less than groove
11 depth, it is close in order to be overlapped between two lead frames.
Specifically, raised 21 bending and moldings or punch forming.Bending and molding or stamping forming raised 21 structural strength are more
It is high, it is not easy to fall off, and difficulty of processing can also be reduced.
It is at least recessed in the corner location setting of the superposed surfaces of lead frame in another preferred embodiment of the present invention
Groove 11.The corner location of lead frame easily deforms, therefore groove 11 is opened up in this position, fills connecting material 3, can be with
Effectively prevent the lead frame after overlapping from deforming.
Specifically, the corner location and medium position in the superposed surfaces of lead frame are respectively provided with groove 11.Lead frame
Area is larger, is respectively provided with groove 11 in corner location and medium position, can further lift bonding strength.
In another preferred embodiment of the present invention, step S200 is：Lead frame to offering groove 11
Superposed surfaces are printed or coating connecting material 3, make the full connecting material 3 of filling in groove 11.
Connecting material 3 is installed by the way of printing or coating, difficulty of processing, improving production efficiency can be reduced.
In the present embodiment, connecting material 3 is welding material.Preferably, welding material is tin cream.
In other embodiments, connecting material 3 is curable adhesives.It is solid after adhesives and welding after curing
The tin cream of change can strengthen the being completely embedded property of the lead frame after overlapping.
In another preferred embodiment of the present invention, etch-forming groove 11 on the lead frames；Or, in lead frame
Compression molding groove 11 on frame.Etching or compression molding groove 11, can reduce groove 11 opens up difficulty.
Preferably, lead frame etch-forming groove 11 before product is installed.The etching of groove 11 is arranged on lead frame
It is that product is immersed in the etching solution of etched recesses 11 in order to prevent before frame installation product, ensures that product is not damaged.
In the specific embodiment of the present invention, as shown in Fig. 1 to 7, the Double-lead-frame fixation side of the present embodiment
Method includes the following steps：
Step S110, the first lead frame 1 and the second lead frame 2 are provided, the four of the superposed surfaces of the first lead frame 1
Seven grooves 11 of Angle Position and middle part compression molding；
Step S120, connecting material 3 is coated in the superposed surfaces of the first lead frame 1, connecting material 3 is tin cream, makes tin
Cream is full of groove 11；
Step S130, the first lead frame 1 and the second lead frame 2 are overlapped；
Step S140, in side heating of first lead frame 1 away from the second lead frame 2, tin cream is made to be formed by curing company
Connect the fixed part of the first lead frame 1 and the second lead frame 2.
In the present embodiment, the depth of groove 11 is the half of the thickness of the first lead frame 1.
Certainly, the depth of groove 11 is not limited to the half of the thickness of the first lead frame 1, is also less than the first lead
The half of the thickness of frame 1.
In another specific embodiment of the present invention, as shown in Fig. 1,2,4,5 and 8 to 11, pair of the present embodiment
Lead frame fixing means includes the following steps：
Step S210, the first lead frame 1 and the second lead frame 2 are provided, the four of the superposed surfaces of the first lead frame 1
Seven grooves 11 of Angle Position and middle part etch-forming, this groove 11 is etched before the first lead frame 1 installs product；
Step S220, in 2 upper mold swaging of the second lead frame into the protrusion 21 for protruding from its superposed surfaces, the position of protrusion 21
It is corresponding with the position of groove 11 and quantity with quantity；
Step S230, connecting material 3 is coated in the superposed surfaces of the first lead frame 1, connecting material 3 is glued for curable
Material is connect, adhesives is full of groove 11；
Step S240, the first lead frame 1 and the second lead frame 2 are overlapped, and protrusion 21 is inserted into groove 11；
Step S250, adhesives is formed by curing the fixed part of the first lead frame 1 of connection and the second lead frame 2.
In the description of this specification, the description of reference term " embodiment " etc. means to combine the tool of embodiment description
Body characteristics, structure, material or feature are contained at least one embodiment of the present invention.In the present specification, to above-mentioned art
The schematic representation of language is not necessarily referring to identical embodiment.Moreover, particular features, structures, materials, or characteristics described
It can be combined in an appropriate manner in any one or more embodiments.
Above in association with the specific embodiment technical principle that the invention has been described.These descriptions are intended merely to explain the present invention's
Principle, and limiting the scope of the invention cannot be construed in any way.Based on explanation herein, the technology of this area
Personnel would not require any inventive effort the other embodiments that can associate the present invention, these modes are fallen within
Within protection scope of the present invention.
Claims (10)
1. a kind of Double-lead-frame fixing means, it is characterised in that include the following steps：
Step S100, two lead frames that can be superimposed with each other are provided, the superposed surfaces of a lead frame open up wherein
Groove；
Step S200, connecting material is placed in the groove；
Step S300, two lead frames are overlapped；
Step S400, the connecting material in described groove forms the fixed part of two lead frames of connection after curing.
2. Double-lead-frame fixing means according to claim 1, it is characterised in that in the step S100, another
Processing and the mating protrusion of the groove in the superposed surfaces of one lead frame.
3. Double-lead-frame fixing means according to claim 2, it is characterised in that the raised height is less than described
The depth of groove.
4. Double-lead-frame fixing means according to claim 2, it is characterised in that the protrusion bending and molding or punching press
Shaping.
5. Double-lead-frame fixing means according to claim 1, it is characterised in that at least in the folded of the lead frame
The corner location in conjunction face sets the groove.
6. Double-lead-frame fixing means according to claim 5, it is characterised in that in the superposed surfaces of the lead frame
Corner location and medium position be respectively provided with the groove.
7. Double-lead-frame fixing means according to any one of claims 1 to 6, it is characterised in that the step S200
For：The superposed surfaces of the lead frame to offering the groove print or coat the connecting material, make in the groove
The full connecting material of filling.
8. Double-lead-frame fixing means according to any one of claims 1 to 6, it is characterised in that the connecting material
For welding material.
9. Double-lead-frame fixing means according to any one of claims 1 to 6, it is characterised in that the connecting material
For curable adhesives.
10. Double-lead-frame fixing means according to any one of claims 1 to 6, it is characterised in that in the lead frame
Groove described in etch-forming on frame；Or,
The groove described in compression molding on the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710991069.9A CN107919290A (en) | 2017-10-23 | 2017-10-23 | A kind of Double-lead-frame fixing means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710991069.9A CN107919290A (en) | 2017-10-23 | 2017-10-23 | A kind of Double-lead-frame fixing means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107919290A true CN107919290A (en) | 2018-04-17 |
Family
ID=61895732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710991069.9A Pending CN107919290A (en) | 2017-10-23 | 2017-10-23 | A kind of Double-lead-frame fixing means |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107919290A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111090058A (en) * | 2019-11-22 | 2020-05-01 | 珠海格力电器股份有限公司 | Frame, preparation method thereof and high-temperature reverse bias test |
| CN111261597A (en) * | 2018-11-29 | 2020-06-09 | 株式会社Vctech | Semiconductor element package with high voltage-resistant insulation structure |
| CN112786558A (en) * | 2019-11-05 | 2021-05-11 | 珠海格力电器股份有限公司 | Semiconductor device and reliability verification method thereof |
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| CN201788965U (en) * | 2010-07-29 | 2011-04-06 | 一诠精密电子工业(中国)有限公司 | Stacking structure for material strip of lead frame |
| CN102903692A (en) * | 2011-07-26 | 2013-01-30 | 万国半导体股份有限公司 | Stacked power semiconductor device with double-layer lead frame and production method thereof |
| CN203367269U (en) * | 2013-06-05 | 2013-12-25 | 吉林华微斯帕克电气有限公司 | Lead frame |
| WO2017079516A1 (en) * | 2015-11-04 | 2017-05-11 | Texas Instruments Incorporated | Semiconductor systems having premolded dual leadframes |
| CN106981449A (en) * | 2016-09-22 | 2017-07-25 | 唐虞企业股份有限公司 | Circuit pin positioning structure, stacked package circuit pin forming method and manufacturing method of welded circuit assembly |
-
2017
- 2017-10-23 CN CN201710991069.9A patent/CN107919290A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201788965U (en) * | 2010-07-29 | 2011-04-06 | 一诠精密电子工业(中国)有限公司 | Stacking structure for material strip of lead frame |
| CN102903692A (en) * | 2011-07-26 | 2013-01-30 | 万国半导体股份有限公司 | Stacked power semiconductor device with double-layer lead frame and production method thereof |
| CN203367269U (en) * | 2013-06-05 | 2013-12-25 | 吉林华微斯帕克电气有限公司 | Lead frame |
| WO2017079516A1 (en) * | 2015-11-04 | 2017-05-11 | Texas Instruments Incorporated | Semiconductor systems having premolded dual leadframes |
| CN106981449A (en) * | 2016-09-22 | 2017-07-25 | 唐虞企业股份有限公司 | Circuit pin positioning structure, stacked package circuit pin forming method and manufacturing method of welded circuit assembly |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111261597A (en) * | 2018-11-29 | 2020-06-09 | 株式会社Vctech | Semiconductor element package with high voltage-resistant insulation structure |
| CN111261597B (en) * | 2018-11-29 | 2023-10-31 | 株式会社Vctech | Semiconductor element package with high withstand voltage insulating structure |
| CN112786558A (en) * | 2019-11-05 | 2021-05-11 | 珠海格力电器股份有限公司 | Semiconductor device and reliability verification method thereof |
| CN112786558B (en) * | 2019-11-05 | 2023-02-28 | 珠海格力电器股份有限公司 | Semiconductor device and reliability verification method thereof |
| CN111090058A (en) * | 2019-11-22 | 2020-05-01 | 珠海格力电器股份有限公司 | Frame, preparation method thereof and high-temperature reverse bias test |
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180417 |
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| RJ01 | Rejection of invention patent application after publication |