CN107916041A - Graphene heat dissipation copper foil coating, preparation method and application - Google Patents
Graphene heat dissipation copper foil coating, preparation method and application Download PDFInfo
- Publication number
- CN107916041A CN107916041A CN201711341700.7A CN201711341700A CN107916041A CN 107916041 A CN107916041 A CN 107916041A CN 201711341700 A CN201711341700 A CN 201711341700A CN 107916041 A CN107916041 A CN 107916041A
- Authority
- CN
- China
- Prior art keywords
- weight
- parts
- graphene
- copper foil
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention provides a kind of graphene heat dissipation copper foil coating, it includes graphene slurry, bn slurry, binding agent, diluent.Wherein graphene slurry is mixed including graphene powder, surface conditioning agent, solvent.Bn slurry includes boron nitride powder, surface conditioning agent, solvent and mixes.Above-mentioned coating organically combines graphene slurry and bn slurry with copper foil, and the raising of heat conduction, heat dissipation performance to radiating insulating copper foil has very big addition.The present invention also provides the preparation method and copper foil of a kind of graphene heat dissipation copper foil coating.
Description
Technical field
The present invention relates to heat sink material field, more particularly to a kind of graphene heat dissipation copper foil coating, preparation method and should
With.
Background technology
With the rapid development of electronic technology, electronic product is sent out towards directions such as miniaturization, high power, Highgrade integrations
Exhibition, causes the caloric value established practice modelling of electronic unit to increase rapidly, resulting result be exactly electronic chip temperature or
Junction temperature raises rapidly, the security that the conducting effect of heat directly influences the stability of electronic product performance, uses.Many institute's weeks
Know, substantial amounts of heat be able to can produce during the use of electronic product, if encapsulating material does not have excellent heat conductivility, produce
Heat can not disperse, it will cause the life and reliability of electronic product to reduce rapidly.Electronic product temperature often rises 2 DEG C,
Its reliability decrease about 10%, so high-thermal conductivity electronic packaging material is the key of electronics industry development.How by electronics member device
Part produce waste heat quickly conduct and be diffused into surrounding environment or cooling system in, be Most electronic product development should
One of bottleneck.
The content of the invention
The purpose of the technical program embodiment is that providing the good graphene heat dissipation copper foil of thermal diffusivity, thermal conductivity applies
Material, preparation method and application.
The present invention provides a kind of graphene heat dissipation copper foil coating, it is prepared by the raw material including following parts by weight：
5 ~ 30 parts by weight of graphene slurry；
25 ~ 70 parts by weight of bn slurry；
5 ~ 10 parts by weight of binding agent；
1 ~ 60 parts by weight of diluent；
Wherein, the graphene slurry includes following raw material：5 ~ 50 parts by weight of graphene powder, surface conditioning agent 1 ~
10 parts by weight, 40 ~ 94 parts by weight of solvent；
The bn slurry includes 10 ~ 30 parts by weight of boron nitride powder, 1 ~ 10 parts by weight of surface conditioning agent, and solvent 60 ~
89 parts by weight；
It is one or more kinds of that the surface conditioning agent includes acid amides, polyethers；
Solvent is propylene glycol methyl ether acetate, nylon acid methyl esters, toluene, butyl acrylate are one or more kinds of；
The binding agent is acrylic resin, epoxy resin, the one or more of organic siliconresin；
The diluent for ethylene glycol, 2-Butoxyethyl acetate or butyl acetate, one kind in propylene glycol methyl ether acetate or
More than one.
Preferably, including 8 ~ 25 parts by weight of graphene slurry；28 ~ 65 parts by weight of bn slurry；Binding agent 5
~ 10 parts by weight；1 ~ 50 parts by weight of diluent.
Preferably, including 10 ~ 20 parts by weight of graphene slurry；30 ~ 60 parts by weight of bn slurry；Binding agent 7
~ 9 parts by weight；1 ~ 35 parts by weight of diluent.
Preferably, the binding agent is low hydroxyl value acrylic resin and aminoepoxy resin.
Preferably, the diluent is butyl acetate or propylene glycol methyl ether acetate.
The present invention also provides a kind of preparation method of the heat dissipation copper foil coating of graphene, comprise the following steps successively：Choosing
Take the ratio of graphene heat dissipation copper foil coating as the aforementioned；
1-60 parts by weight diluent, the mixing of 1-10 parts by weight surface conditioning agent, then add 30-80 parts by weight of graphite alkene powders
It is mixed and stirred for, obtains mixture, then the mixture is sanded or ball milling, obtains graphene slurry；
1-60 parts by weight diluent, the mixing of 1-10 parts by weight surface conditioning agent are taken, 20-70 parts by weight boron nitride is then added and carries out
Stirred after mixing, obtain mixture, then the mixture is sanded or ball milling, obtain bn slurry；
Graphene slurry and bn slurry are mixed and stirred for, binding agent is then added and obtains the heat dissipation copper foil painting of graphene
Material.
Preferably, mixing is stirred using the sand mill with cold water cooling system.
The present invention also provides a kind of preparation method of the heat dissipation copper foil of graphene, its spy radiates foregoing graphene
Copper foil is uniformly coated on the first surface of copper foil with coating, is placed in toasting 30-60 min at 110 DEG C -130 DEG C；
The preceding graphene heat dissipation copper foil is uniformly coated in the second surface opposite with first surface of copper foil with coating
On, it is placed in toasting 30-60 min at 110 DEG C -130 DEG C；
First surface and second surface are coated with and baked copper foil extrusion forming obtains copper foil.
Preferably, the copper foil for being coated with graphene heat dissipation copper foil coating toasts 50 minutes at 120 DEG C.
Preferably, first surface and second surface are coated with and baked copper foil is extruded by stack.
Mixing of the graphene heat dissipation copper foil of the present invention with coating using graphite slurry and bn slurry, wherein, graphite
Alkene slurry is by a kind of homogeneous system of graphene high degree of dispersion, it can guarantee that the monolithic of graphene disperses, without reuniting, to make stone
Black alkene can preferably incorporate in other application system and retain the high heat conduction advantage of graphene in itself.Boron nitride be by nitrogen-atoms and
The crystal that boron atom is formed.Boron carbide has：Friction coefficient very low and high temperature stability is fine, resistance to heat shocks is fine, intensity
It is high, thermal conductivity factor is high, the coefficient of expansion is relatively low, resistivity is big, it is corrosion-resistant, can microwave or the advantages that saturating infrared ray thoroughly.Boron nitride is starched
Material can guarantee that material while with high heat conduction heat-sinking capability with good insulation performance.By graphene slurry and boron nitride
Slurry is organically combined with copper foil, and the raising of heat conduction, heat dissipation performance to radiating insulating copper foil has very big addition.
Embodiment
The technical solution in the technical program embodiment will be clearly and completely described below, it is clear that described
Embodiment is only the technical program part of the embodiment, instead of all the embodiments.Based on the implementation in the technical program
Example, those of ordinary skill in the art's all other embodiments obtained without creative efforts, belongs to
The scope of protection of the invention.
Raw material of the present invention is commercially available convenient source.Source for raw material and model below.
Binding agent：Low hydroxyl value acrylic resin MR-767 contains 60% Wei Lina Chemical Co., Ltd.s admittedly；
Curing agent:Aminoepoxy resin MR-818 contains 60% Wei Lina Chemical Co., Ltd.s admittedly；
Graphene：Guo Chuanjiawei graphenes Science and Technology Ltd. of Shenzhen；
Boron nitride：43.6% Fuhua industrial chemicals of 20um Boron contents sells Co., Ltd；
Diluent：The prosperous suitable Chemical Co., Ltd. of 99.9% technical grade of butyl acetate；
Solvent：99.9% Jin Teng Yilong Industry Co., Ltd. of technical grade Shenzhen of propylene glycol methyl ether acetate；
Surface active agent：BYK-101 Germany Bi Ke chemistry.
Graphene powder, it is heat conduction, heat accumulation, heat dissipation that it, which is acted on, and average grain diameter is 0.05 μm -50 μm, preferably 1 μm -
35μm.Its pattern of the graphene powder can be spherical, spherical, stick, sheet and irregular shape.The Graphene powder
Body can be reduced graphene, graphene oxide, graphene microchip.Can be a kind of, and two or three graphene is mixed
Compound.
Its effect of boron nitride powder is heat conduction, insulation.Particle diameter is 0.05-100 μm, which is hexagonal boron nitride, excellent
It is 5-20 μm to select particle diameter.
Surface conditioning agent, mainly plays surface conditioning agent, it is therefore an objective to carries out lipophile processing to graphene powder, carries
The surface wettability of high graphene powder, can be such that graphene powder evenly disperses in diluent.The embodiment of the present invention
Long chain is selected, the one or more in polyethers.
The purpose of binding agent is to make graphene powder and copper foil organic structure, in the present embodiment, acrylic resin, asphalt mixtures modified by epoxy resin
The one or more of fat, organic siliconresin.
Diluent the purpose is to which graphene powder is effectively uniformly dispersed, in the present embodiment using ethylene glycol, ethylene glycol fourth
One or more in ether acetate or butyl acetate.
Solvent is propylene glycol methyl ether acetate, nylon acid methyl esters, toluene, butyl acrylate are one or more kinds of.
Embodiment 1：A kind of graphene heat dissipation copper foil coating, raw materials used dosage are as follows：
10 parts by weight of graphene slurry, graphene slurry include 25 parts by weight of graphene powder, surface conditioning agent（BYK 101）
6 parts by weight, solvent（Propylene glycol methyl ether acetate）60 parts；
30 parts by weight of bn slurry, including 20 parts by weight of boron nitride powder, 6 parts by weight of surface conditioning agent, solvent（Propane diols
Methyl ether acetate）80 parts；
Binding agent is low hydroxyl value acrylic resin MR-767 and its curing agent aminoepoxy resin MR-818,10 parts by weight；
Diluent（Propylene glycol methyl ether acetate）50 parts by weight.
Preparation method is as follows：1-60 parts by weight diluent, the mixing of 1-10 parts by weight surface conditioning agent are taken, is then added
30-80 parts by weight of graphite alkene powders are mixed and stirred for, and obtain mixture, then the mixture is sanded or ball milling, are obtained
Graphene slurry；1-60 parts by weight diluent, the mixing of 1-10 parts by weight surface conditioning agent are taken, then adds 20-70 parts by weight nitrogen
Change after boron is mixed and stir, obtain mixture, then the mixture is sanded or ball milling, obtain bn slurry；
Graphene slurry and bn slurry are mixed and stirred for, binding agent is then added and obtains the heat dissipation copper foil painting of graphene
Material.
Preferable preparation method is as follows：
40 parts by weight diluent, the mixing of 10 parts by weight surface conditioning agents are taken, then adds the progress of 50 parts by weight of graphite alkene powders
It is mixed and stirred for, obtains mixture, then the mixture is sanded or ball milling, obtains graphene slurry.
60 parts by weight diluent, the mixing of 10 parts by weight surface conditioning agents are taken, 30 parts by weight boron nitride is then added and is mixed
Stirred after conjunction, obtain mixture, then the mixture is sanded or ball milling, obtain bn slurry.
Graphene slurry and bn slurry are mixed and stirred for, binding agent is then added and obtains the heat dissipation copper foil use of graphene
Coating.
Embodiment 2：A kind of graphene heat dissipation copper foil coating, raw materials used dosage are as follows：
15 parts by weight of graphene slurry, graphene slurry include 50 parts by weight of graphene powder, surface conditioning agent (BYK 101)
5 parts by weight；
45 parts by weight of bn slurry, including 10 parts by weight of boron nitride powder, 5 parts by weight of surface conditioning agent；
Binding agent（For low hydroxyl value acrylic resin and its curing agent aminoepoxy resin）5 parts by weight；
Diluent is 35 parts by weight of butyl acetate.
Preparation method of the preparation method with embodiment 1.
Embodiment 3：A kind of graphene heat dissipation copper foil coating, raw materials used dosage are as follows：
20 parts by weight of graphene slurry, graphene slurry include 10 parts by weight of graphene powder, surface conditioning agent（BYK 101）
1 parts by weight；
60 parts by weight of bn slurry, including 30 parts by weight of boron nitride powder, 9 parts by weight of surface conditioning agent；
Binding agent（For acrylic resin）10 parts by weight；
Diluent（For ethylene glycol）10 parts by weight.
Preparation method of the preparation method with embodiment 1.
Comparative example 1：40 parts by weight of graphene slurry, wherein, graphene slurry includes 10 parts by weight of graphene powder, table
1 parts by weight of surface treatment agent；
Binding agent（For acrylic resin）10 parts by weight；
Diluent（Butyl acetate）50 parts by weight.
Comparative example 2：40 parts by weight of bn slurry, including 30 parts by weight of boron nitride powder, 9 weight of surface conditioning agent
Part；
Binding agent（For acrylic resin）10 parts by weight；
Diluent（Butyl acetate）50 parts by weight.
Table 1 below is for each embodiment with comparative example in plane thermal conductivity, axial thermal conductivity coefficient, heat emissivity coefficient and electricity
Resistance rate performance parameter list.
The radiating insulating copper foil performance parameter table of 1 embodiment of table and comparative example：
1 data of summary analysis, the comprehensive performance of embodiment 3 is optimal, while coating heat transfer coefficient is ensured, the hot spoke of coating
Penetrate that coefficient is also preferable, and there is good insulation performance.Embodiment 1 and 2 axial thermal conductivity system of embodiment are bad, the reason is that graphene
The content of boron nitride is relatively low caused.After adding graphene in coating, the heat emissivity coefficient of coating is significantly increased, and adds boron nitride
After spherical slurry, coating axial thermal conductivity coefficient has been lifted.
The present invention also provides a kind of preparation method of the heat dissipation copper foil of graphene, it comprises the following steps：
There is provided copper foil, there is provided ink alkene heat dissipation copper foil coating described above.
By above-mentioned coating, uniformly the first surface coated in copper foil is formed in first coating, is placed in 110 DEG C -130
30-60 min are toasted at DEG C.
Above-mentioned graphene heat dissipation copper foil is uniformly coated in second table opposite with first surface of copper foil with coating
On face, it is placed in toasting 30-60 min at 110 DEG C -130 DEG C.
First surface and second surface are coated with and baked copper foil extrusion forming obtains copper foil.
Preferably, the copper foil for being coated with graphene heat dissipation copper foil coating toasts 50 minutes at 120 DEG C.
Preferably, first surface and second surface are coated with and baked copper foil is extruded by stack.
Copper foil is made using above-mentioned preparation method, after adding graphene and the spherical slurry of boron nitride, the heat radiation system of coating
Number is significantly increased, and coating axial thermal conductivity coefficient greatly promotes.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, those of ordinary skill in the art are when understanding：It still can be with
Modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；And
These modifications are replaced, and the essence of appropriate technical solution is departed from the spirit and model of various embodiments of the present invention technical solution
Enclose.
Claims (10)
- The copper foil coating 1. a kind of graphene radiates, it is characterised in that it is prepared by the raw material including following parts by weight：5 ~ 30 parts by weight of graphene slurry；25 ~ 70 parts by weight of bn slurry；5 ~ 10 parts by weight of binding agent；1 ~ 60 parts by weight of diluent；Wherein, the graphene slurry includes following raw material：5 ~ 50 parts by weight of graphene powder, surface conditioning agent 1 ~ 10 parts by weight, 40 ~ 94 parts by weight of solvent；The bn slurry includes 10 ~ 30 parts by weight of boron nitride powder, 1 ~ 10 parts by weight of surface conditioning agent, and solvent 60 ~ 89 parts by weight；It is one or more kinds of that the surface conditioning agent includes acid amides, polyethers；Solvent is propylene glycol methyl ether acetate, nylon acid methyl esters, toluene, butyl acrylate are one or more kinds of；The binding agent is acrylic resin, epoxy resin, the one or more of organic siliconresin；The diluent for ethylene glycol, 2-Butoxyethyl acetate or butyl acetate, one kind in propylene glycol methyl ether acetate or More than one.
- The copper foil coating 2. graphene as claimed in claim 1 radiates, it is characterised in that including being prepared by following raw material Into,8 ~ 25 parts by weight of graphene slurry；28 ~ 65 parts by weight of bn slurry；5 ~ 10 parts by weight of binding agent；1 ~ 50 parts by weight of diluent.
- The copper foil coating 3. graphene as claimed in claim 2 radiates, it is characterised in that including being prepared by following raw material Into,10 ~ 20 parts by weight of graphene slurry；30 ~ 60 parts by weight of bn slurry；7 ~ 9 parts by weight of binding agent；1 ~ 35 parts by weight of diluent.
- The copper foil coating 4. graphene as claimed in claim 1 radiates, it is characterised in that the binding agent is low hydroxyl value propylene Acid resin and aminoepoxy resin.
- The copper foil coating 5. graphene as claimed in claim 1 radiates, it is characterised in that the diluent is butyl acetate, Or propylene glycol methyl ether acetate.
- 6. the preparation method of the heat dissipation copper foil coating of a kind of graphene, it is characterised in that comprise the following steps successively：Choose the ratio of the graphene heat dissipation copper foil coating such as any one of claim 1-5；1-60 parts by weight diluent, the mixing of 1-10 parts by weight surface conditioning agent are taken, then adds 30-80 parts by weight of graphite alkene Powder is mixed and stirred for, and obtains mixture, then the mixture is sanded or ball milling, obtains graphene slurry；Take 1-60 parts by weight diluent, 1-10 parts by weight surface conditioning agent mixing, then add 20-70 parts by weight boron nitride into Stirred after row mixing, obtain mixture, then the mixture is sanded or ball milling, obtain bn slurry；Graphene slurry and bn slurry are mixed and stirred for, binding agent is then added and obtains the heat dissipation copper foil painting of graphene Material.
- 7. the preparation method of the heat dissipation copper foil coating of graphene as claimed in claim 6, it is characterised in that cold using having The sand mill of water cooling system is stirred mixing.
- 8. the preparation method of the heat dissipation copper foil of a kind of graphene, it is characterised in that dissipate the graphene as prepared by claim 6 Hot copper foil is uniformly coated on the first surface of copper foil with coating, is placed in toasting 30-60 min at 110 DEG C -130 DEG C；Graphene heat dissipation copper foil as prepared by claim 6 is uniformly opposite with first surface coated in copper foil with coating Second surface on, be placed in toasting 30-60 min at 110 DEG C -130 DEG C；First surface and second surface are coated with and baked copper foil extrusion forming obtains copper foil.
- 9. the preparation method of the heat dissipation copper foil of graphene as claimed in claim 8, it is characterised in that be coated with graphene and dissipate The copper foil of hot copper foil coating toasts 50 minutes at 120 DEG C.
- 10. the preparation method of the heat dissipation copper foil of graphene as claimed in claim 8, it is characterised in that by first surface and the Two surfaces are coated with and baked copper foil is extruded by stack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711341700.7A CN107916041A (en) | 2017-12-14 | 2017-12-14 | Graphene heat dissipation copper foil coating, preparation method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711341700.7A CN107916041A (en) | 2017-12-14 | 2017-12-14 | Graphene heat dissipation copper foil coating, preparation method and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107916041A true CN107916041A (en) | 2018-04-17 |
Family
ID=61893395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711341700.7A Pending CN107916041A (en) | 2017-12-14 | 2017-12-14 | Graphene heat dissipation copper foil coating, preparation method and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107916041A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108753087A (en) * | 2018-05-29 | 2018-11-06 | 厦门海莱照明有限公司 | A kind of copper foil graphene acrylic resin high-heat-conductive composite material and preparation method thereof |
| CN109608986A (en) * | 2018-12-10 | 2019-04-12 | 中昊北方涂料工业研究设计院有限公司 | A kind of heat exchanger graphene high thermal conductivity anticorrosive paint and preparation method thereof |
| CN111774572A (en) * | 2020-07-15 | 2020-10-16 | 何林 | High-heat-dissipation copper foil for electronic equipment and preparation method thereof |
| CN116093610A (en) * | 2023-01-19 | 2023-05-09 | 荣耀终端有限公司 | Manufacturing method of antenna structure, antenna structure and electronic equipment |
| CN117551380A (en) * | 2023-10-24 | 2024-02-13 | 国电投重庆能源研究院有限公司 | Epoxy resin coating, and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103214772A (en) * | 2012-01-18 | 2013-07-24 | 广西格润科技有限公司 | Novel heat-dissipation material and preparation method thereof |
| CN105514066A (en) * | 2016-01-19 | 2016-04-20 | 合肥微晶材料科技有限公司 | Composite graphene infrared radiation and heat conduction film and manufacturing method thereof |
| CN106167693A (en) * | 2016-06-21 | 2016-11-30 | 成都市科愿科技有限公司 | A kind of preparation method of Graphene basement membrane product |
| CN107418382A (en) * | 2017-08-25 | 2017-12-01 | 深圳市烯世传奇科技有限公司 | A kind of heat radiation coating based on graphene and preparation method thereof |
-
2017
- 2017-12-14 CN CN201711341700.7A patent/CN107916041A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103214772A (en) * | 2012-01-18 | 2013-07-24 | 广西格润科技有限公司 | Novel heat-dissipation material and preparation method thereof |
| CN105514066A (en) * | 2016-01-19 | 2016-04-20 | 合肥微晶材料科技有限公司 | Composite graphene infrared radiation and heat conduction film and manufacturing method thereof |
| CN106167693A (en) * | 2016-06-21 | 2016-11-30 | 成都市科愿科技有限公司 | A kind of preparation method of Graphene basement membrane product |
| CN107418382A (en) * | 2017-08-25 | 2017-12-01 | 深圳市烯世传奇科技有限公司 | A kind of heat radiation coating based on graphene and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 顾国芳等: "《新型装修材料及其应用（第二版）》", 30 June 1996, 中国建筑工业出版社 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108753087A (en) * | 2018-05-29 | 2018-11-06 | 厦门海莱照明有限公司 | A kind of copper foil graphene acrylic resin high-heat-conductive composite material and preparation method thereof |
| CN109608986A (en) * | 2018-12-10 | 2019-04-12 | 中昊北方涂料工业研究设计院有限公司 | A kind of heat exchanger graphene high thermal conductivity anticorrosive paint and preparation method thereof |
| CN111774572A (en) * | 2020-07-15 | 2020-10-16 | 何林 | High-heat-dissipation copper foil for electronic equipment and preparation method thereof |
| CN116093610A (en) * | 2023-01-19 | 2023-05-09 | 荣耀终端有限公司 | Manufacturing method of antenna structure, antenna structure and electronic equipment |
| CN116093610B (en) * | 2023-01-19 | 2024-03-29 | 荣耀终端有限公司 | Manufacturing method of antenna structure, antenna structure and electronic equipment |
| CN117551380A (en) * | 2023-10-24 | 2024-02-13 | 国电投重庆能源研究院有限公司 | Epoxy resin coating, and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107916041A (en) | Graphene heat dissipation copper foil coating, preparation method and application | |
| CN105273540B (en) | A kind of graphene heat radiation coating and its preparation method and application | |
| CN105514066B (en) | A kind of compound infrared radiation heat-conducting film of graphene and preparation method thereof | |
| CN109988484A (en) | A kind of graphene water-based cooling coating and preparation method thereof | |
| CN107903751B (en) | Graphene heat dissipation coating and preparation method thereof | |
| CN107164647B (en) | High thermal conductivity rigidity graphene/copper nanocomposite cooling fin and preparation method thereof | |
| CN105602485B (en) | A kind of insulating heat-conductive adhesive of high infrared radiance and preparation method thereof | |
| JP3290127B2 (en) | Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition | |
| CN108003725A (en) | Heat radiation coating, radiator coating and the preparation method of graphene | |
| CN105754348A (en) | Low-filling high-heat-conductivity organic-inorganic compound | |
| JP6465368B2 (en) | Heat dissipation material using mixed graphite and method for producing the same | |
| CN106634474B (en) | Heat-dissipation powder paint and preparation method thereof | |
| CN103555262B (en) | A kind of heat conduction hot melt adhesive and preparation method thereof | |
| JP2018026527A5 (en) | ||
| CN106009530A (en) | Boron nitride-silver hybrid particle/epoxy resin composite material and preparation method thereof | |
| CN106752516A (en) | A kind of heat radiation coating of electronic device and preparation method thereof | |
| Chung et al. | Thermal conductivity of epoxy resin composites filled with combustion‐synthesized AlN powder | |
| CN108893636A (en) | A kind of preparation method of high thermal conductivity isotropic graphite ball reinforced aluminum matrix composites | |
| KR20180065966A (en) | Heat radiation material using graphite mixture and method for manufacturing same | |
| CN107746655A (en) | A kind of polyaniline epoxy organosilicon graphene radiating static conductive coating | |
| CN108148558A (en) | A kind of thermally conductive gel of graphene-containing and its preparation method and application | |
| JP3794996B2 (en) | Thermally conductive resin composition and phase change type heat radiation member | |
| WO2019235234A1 (en) | Method for producing glass-coated aluminum nitride particles, and method for producing heat-dissipating resin composition containing said glass-coated aluminum nitride particles | |
| CN107502205A (en) | A kind of graphene heat conduction and heat radiation copper foil slurry, heat conduction copper foil and preparation method thereof | |
| CN106832222A (en) | Epoxy resin composition and thermal interface material comprising same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180417 |