CN107911999B - Modularized liquid cooling server case - Google Patents
Modularized liquid cooling server case Download PDFInfo
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- CN107911999B CN107911999B CN201711193709.8A CN201711193709A CN107911999B CN 107911999 B CN107911999 B CN 107911999B CN 201711193709 A CN201711193709 A CN 201711193709A CN 107911999 B CN107911999 B CN 107911999B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
Abstract
The invention relates to a modularized liquid cooling server chassis, comprising: a box body; one or more liquid cooling modules, wherein each liquid cooling module comprises: the liquid cooling module is inserted with a single server during operation and is filled with cooling liquid; a connector for connecting the liquid cooling module to an external power supply; and an auxiliary portion including a liquid-filled region and a liquid-filled tube. By using the modularized liquid cooling server chassis provided by the invention, if a single server is required to be maintained, the server can be taken out for independent maintenance or replacement without influencing the operation of other servers by only powering off the working server, closing the air outlet valve and the liquid inlet valve and pulling out the liquid cooling module. In addition, each liquid cooling module is provided with an independent condenser, so that the number of the liquid cooling modules can be flexibly selected according to requirements without fixing specifications.
Description
Technical Field
The invention relates to the field of servers, in particular to a modularized liquid cooling server chassis.
Background
With the rise of big data, cloud computing and AI (Artificial intelligence), the computing requirements of data centers and servers are higher and higher, and the computing architecture mainly based on the CPU chip is also more and more difficult to satisfy the analysis processing of big data and the model training of Artificial intelligence. Then, heterogeneous computing systems represented by a GPU (graphics Processing Unit), an FPGA (Field Programmable Gate Array), an ASIC (application specific Integrated Circuit), and the like have great development potential, and power density is continuously increased, a single chip can reach 300W or even more than 500W, and single cabinet density can reach 40 kW or even 60 kW. The traditional data center cooling technology adopts a machine room precision air conditioner, and exchanges heat with a radiator of a server computing chip through cold air, so that the heat exchange thermal resistance is high and the heat flow density is low due to poor heat exchange characteristics of air, and the heat dissipation requirements of novel high-density heterogeneous computing and super computing of a data center cannot be met; in addition, the energy cost is continuously increased, people pay attention to green environment protection, and the energy-saving requirements of servers and data centers are more and more strong. On the premise of ensuring the safety and high-performance operation of the equipment, how to improve the energy utilization Efficiency of the data center and reduce the PUE (Power Usage Efficiency) has become one of the targets pursued by the data center infrastructure.
In traditional data center, refrigerating unit provides the refrigerated water and carries out continuously cooling to the IT equipment to the air conditioner terminal, and the proportion that refrigerating unit energy consumption accounts for data center energy consumption is about 40%, and the energy consumes seriously, though can realize natural cooling (free cooling) energy saving and consumption reduction with the part through selecting suitable low temperature environment through heat exchanger bypass refrigerating unit, nevertheless need extra investment, area, and receive the restriction of region environment and the highest air inlet temperature of server, the effect is limited.
The liquid cooling technology of directly adopting liquid to cool the server can realize higher heat exchange efficiency, thereby cooling the server chip, completely removing the refrigerating unit, running higher temperature of the server chip, being not limited by regions, and having PUE up to 1.02 or even lower. In consideration of inherent factors such as water leakage risk, multiple fault points, difficult maintenance and the like of a cold plate type liquid cooling system of a water inlet server, the immersed liquid cooling is the best cooling mode for realizing high density and energy conservation on the premise of reliability.
The existing immersion type liquid cooling scheme is to directly immerse a server chip and other devices in non-conductive liquid for heat exchange, wherein the heat exchange can be performed by cooling single-phase high-boiling-point fluorinated liquid or mineral oil, and cooling two-phase low-boiling-point fluorinated liquid.
The heat exchange of the single-phase immersion cooling adopts a convection mode, so that the flow field is uneven, the heat exchange efficiency is low (compared with two-phase immersion cooling), a heat dissipation bottleneck exists, dragging loss exists during the maintenance of IT equipment (namely, the surface of the IT equipment is stained with liquid and is not easy to fall off quickly), the complete drying needs several hours, and the normal maintenance of a server is influenced;
the two-phase immersion liquid cooling system is cooled by efficient and uniform phase change, and is free from dragging loss (liquid on the surface of IT equipment can be quickly volatilized) during maintenance, convenient to maintain and the like, and has a better prospect;
however, in the existing two-phase immersion liquid cooling scheme, a plurality of IT servers are placed in a large box body 'pool', a large amount of liquid needs to be filled to fill structural gaps in the box body, so that the filling amount of the liquid is large, the non-conductive fluorinated liquid is very expensive, the initial investment of immersion liquid cooling equipment is greatly improved, the initial investment is obviously higher than that of the traditional air cooling server, and the return on investment is not high; meanwhile, the huge box body causes great evaporation dissipation on the surface of the fluorinated liquid; moreover, when a single IT server is serviced, other servers may be shut down, otherwise a greater amount of vapor may be dissipated, which can significantly increase maintenance costs and labor requirements, making such immersion liquid cooling impractical for large-scale applications.
Disclosure of Invention
In view of the above, embodiments of the present invention provide a modular liquid-cooled server chassis to solve or alleviate the technical problems in the prior art, and at least provide a useful choice.
The technical scheme of the embodiment of the invention is realized as follows:
according to an embodiment of the present invention, there is provided a modular liquid-cooled server chassis including:
a box body;
one or more liquid cooling modules, wherein each liquid cooling module comprises: the liquid cooling module comprises a shell, a liquid inlet valve and a condenser, wherein the liquid inlet valve is opened when the liquid cooling module works, the condenser is used for cooling gas in the liquid cooling module, and a single server is inserted into the liquid cooling module when the liquid cooling module works and is filled with cooling liquid; and
a connector for connecting the liquid cooling module to an external power supply; and
an auxiliary portion comprising a liquid-filled zone and a liquid-filled tube, wherein,
the liquid filling area is filled with cooling liquid; and
the liquid charging pipe is connected to the liquid inlet valve and is used for conveying the liquid from the liquid charging area to the liquid cooling module.
In some embodiments, each liquid cooling module further comprises a maintenance end cap that is closed when the liquid cooling module is in operation.
In some embodiments, each liquid cooling module further comprises a cooling valve, and the chassis further comprises a first cooling tube and a second cooling tube; wherein the content of the first and second substances,
the cooling valve is connected with the condenser;
the first cooling tube is connected to each cooling valve and is used for conveying the coolant in the condenser of the liquid cooling module to the outside of the chassis; and
the second cooling water pipe is connected to each cooling valve and serves to deliver the coolant from the outside to the condenser.
In some embodiments, the chassis further comprises a power and control system comprising a power source and a controller; wherein the content of the first and second substances,
the power supply is connected to the connector and used for supplying power to other components in the case through the connector; and
the controller is used for controlling other components in the chassis.
In some embodiments, each liquid cooling module further comprises a pressure relief valve for venting gas in the liquid cooling module to the outside.
In some embodiments, the cabinet further comprises an air outlet pipe, and a steam treatment area connected with the air outlet pipe; wherein the outlet duct is connected to each pressure relief valve and receives gas discharged from the pressure relief valves.
In some embodiments, the tank further comprises a charge valve connected to the charge zone through which coolant can be added to the charge zone.
In some embodiments, each liquid-cooled module further comprises a first sensor connected to the controller and configured to monitor a level of cooling liquid in the liquid-cooled module; wherein the content of the first and second substances,
when the liquid level of cooling liquid in the liquid cooling module is higher than a first threshold value, the first sensor generates a first signal and sends the first signal to the controller, and the controller controls the liquid inlet valve to be closed after receiving the first signal; and the number of the first and second electrodes,
when the liquid level of cooling liquid in the liquid cooling module is lower than a second threshold value, the first sensor generates a second signal and sends the second signal to the controller, and the controller controls the liquid inlet valve to be opened after receiving the second signal.
In some embodiments, each liquid-cooled module further comprises a second sensor connected to the controller for monitoring the gas pressure in the liquid-cooled module; wherein the content of the first and second substances,
when the gas pressure is larger than a third threshold value, the second sensor generates a third signal and sends the third signal to the controller, and the controller controls the pressure release valve to open to release the pressure after receiving the third signal.
In some embodiments, the liquid-filled zone further comprises a third sensor connected to the controller and configured to monitor the level of the cooling liquid in the liquid-filled zone; wherein the content of the first and second substances,
when the liquid level of the cooling liquid in the liquid filling area is lower than a fourth threshold value, the third sensor generates a fourth signal and sends the fourth signal to the controller, and the controller sends an alarm signal after receiving the fourth signal to prompt that liquid filling is needed.
In some embodiments, the first cooling tube and the second cooling tube are connected to an external heat exchange device.
In some embodiments, the heat exchange device is a dry chiller, a cooling tower, or a building chilled water system.
In some embodiments, the coolant is cooling water.
In some embodiments, the connector is a quick-plug device.
In some embodiments, the cooling liquid is a fluorinated liquid.
Due to the adoption of the technical scheme, the embodiment of the invention has the following advantages: by using the modularized liquid cooling server chassis provided by the invention, if a single server is required to be maintained, the server in operation can be taken out for independent maintenance or replacement without influencing the operation of other servers only by powering off the server in operation, closing the air outlet valve and the liquid inlet valve and pulling out the liquid cooling module. In addition, each liquid cooling module is provided with an independent condenser, so that the number of the liquid cooling modules can be flexibly selected according to requirements without fixing specifications.
The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and following detailed description.
Drawings
In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are therefore not to be considered limiting of its scope.
Fig. 1 is a schematic cross-sectional view of a modular liquid-cooled server chassis according to a first embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a liquid cooling module according to a first embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a modular liquid-cooled server chassis according to a second embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a liquid cooling module according to a second embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of a modular liquid-cooled server chassis according to a third embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of a liquid cooling module according to a third embodiment of the present invention.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "square," and "over" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Fig. 1 is a schematic cross-sectional view of a modular liquid-cooled server chassis according to an embodiment of the present invention, and as shown in fig. 1, the modular liquid-cooled server chassis 100 includes:
a tank 110, one or more liquid cooling modules 120, connectors 130, and auxiliary portions.
The case 110 accommodates all components of the cabinet therein, and an upper portion or a side portion thereof may be provided with a cover (not shown) so that an operator can open the cover to check the components in the case 110 and replace the components.
One or more liquid cooling modules 120 are disposed inside the tank 110. Fig. 2 shows a single liquid cooling module comprising a housing 121, a liquid inlet valve 122, and a condenser 123, and a single server S immersed in a cooling liquid L.
When the liquid-cooled module 120 is in operation, the individual servers S are completely immersed in the cooling liquid L and the inlet valve 122 is opened. Typically, the cooling fluid is a low boiling point, electrically non-conductive liquid. In particular, the cooling liquid may be a fluorinated liquid. The fluorinated liquid has stable performance, does not react with active materials such as metal, plastic and elastomer, has excellent non-conducting and insulating properties at high temperature or low temperature, and can be widely used for cooling electronic equipment. The specific kind of the fluorination liquid in the present invention is not particularly limited.
The connector 130 is used to connect the liquid cooling module to an external power source. The specific type of connector 130 is not limiting in the present invention. Preferably, the connector 130 may be a quick-connect device, such as a power strip, to enable quick insertion and removal of the liquid-cooled module.
The auxiliary portion includes a liquid-filled region 141 and a liquid-filled tube 142.
The liquid filling region 141 is filled with a cooling liquid; the liquid charging pipe 142 is connected to the liquid inlet valve 122 of each liquid cooling module 120 for delivering the cooling liquid in the liquid charging area 141 to the liquid cooling module 120.
The intake valve 122 is hidden from view by the charge tube 142, and is shown in phantom in FIG. 1 for ease of illustration.
When the enclosure 100 is in operation, the liquid-cooled modules 120 are plugged into the connectors 130 and the inlet valves 122 are opened. The connector 130 is connected to an external power source to supply power to the liquid cooling module 120 and the server S. As the server S operates, the temperature of its internal chip gradually rises to reach the boiling point of the coolant L. At this time, the coolant is vaporized, and the heat of the chip and other parts of the server is taken away by latent heat. And the vaporized coolant bubbles float from the coolant and are emitted to the gas area at the upper part of the liquid cooling module, and then the condenser 123 cools the coolant gas into the coolant. The re-condensed cooling liquid drops into the cooling liquid below, and the circulation of the cooling liquid is completed.
The condenser 123 contains a coolant. In particular, the coolant may be cooling water. The condenser 123 may be any type of condenser, such as a condensation tray, and the invention is not particularly limited herein.
Fig. 1 shows 10 liquid cooling modules. It is understood that other numbers of liquid cooling modules may be disposed in the tank 110, and the size of the tank 110 may vary. In particular, different size boxes can be provided according to different use environments, different numbers of liquid cooling modules are contained in the boxes, and connectors with adjustable socket numbers are used. For example, a large data center may use a very large number of servers, thereby providing a larger enclosure containing tens or even hundreds of liquid cooling modules. For the common users, a small-sized case containing a small number of liquid cooling modules can be provided. Because each liquid cooling module comprises a condenser, the modularized liquid cooling server case provided by the invention is very flexible, and the number of the liquid cooling modules can be flexibly adjusted according to requirements without fixing specifications.
In the invention, because the condenser is arranged in each liquid cooling module, the cooling liquid can complete circulation in the liquid cooling module, thereby improving the utilization rate of the cooling liquid.
If a single server needs to be serviced, it can be shut down while the liquid cooling module 120 in which it is located is disconnected from the connector 130, and the liquid cooling module 120 can be removed from the cabinet 110 by closing the inlet valve 122 of the liquid cooling module 120. At this time, other servers still run normally and are not affected. After the liquid cooling module 120 is removed, the server S may be removed from the cooling liquid for maintenance or replacement.
When the server S is reinstalled, the server after maintenance or replacement may be reinstalled in the liquid cooling module 120, the inlet valve 122 of the liquid cooling module 120 may be connected to the chassis, and the valve may be opened. At this time, according to the principle of liquid level pressure balance, the cooling liquid in the liquid filling region 141 enters the liquid cooling module 120 through the liquid inlet valve 122 via the liquid filling pipe 142. After the height of the cooling liquid meets the server requirement, the liquid cooling module 120 can be connected to the connector 130 to supply power again, so that the liquid cooling module can work normally.
Thus, with the modular liquid cooled server chassis according to the present invention, individual servers can be maintained and replaced without affecting other servers.
Fig. 3 is a schematic cross-sectional view of a modular liquid-cooled server enclosure 200 according to a second embodiment of the invention, and the parts of the enclosure 200 that are the same as those of the enclosure 100 are not described again, and only the differences will be described in detail.
In the enclosure 200, as shown in fig. 4, each liquid cooling module 220 further includes a service end cap 224, the service end cap 224 being closed when the liquid cooling module 220 is in operation. Thus, if the server needs to be maintained, the cooling liquid is basically not lost when the cover of the case is opened to take out the liquid cooling module.
As shown in fig. 3 and 4, each liquid cooling module 220 may further include a cooling valve 225, and the auxiliary portion of the enclosure 200 may further include a first cooling water pipe 243 and a second cooling water pipe 244. The first and second cooling pipes 243 and 244 are connected to each of the cooling valves 225 and the external heat exchange devices, and the first cooling pipe 243 serves to transfer hot coolant from the condenser 223 to the external heat exchange devices, and the second cooling pipe 244 serves to transfer new coolant from the external heat exchange devices to the condenser 223, thereby completing the replacement of the coolant.
In the present invention, the heat exchange device is disposed outside the chassis 200, but it is understood that the chassis 200 itself may also contain the heat exchange device. Furthermore, the heat exchange device may be of any type, such as a dry chiller, a cooling tower or a building chilled water system.
In addition, the chassis 200 also includes a power and control system 250. As shown in fig. 3, the power and control system 250 includes a power source 251 and a controller 252. A power supply 251 is coupled to connector 230 to provide power to the components of chassis 200. The controller is connected to the components of the chassis to control the components, for example, to control the opening and closing of the valves of the liquid cooling module 220, and to power off and power back up the liquid cooling module 220, so that the operation of the chassis 200 is more convenient.
Preferably, as shown in fig. 3, the box body 210 may further include a liquid filling valve 211 connected to the liquid filling area 241, and the liquid filling valve 211 may be used to replenish the liquid filling area 241 with the cooling liquid, so that it is possible to avoid opening the cabinet to add the cooling liquid, which is convenient for the user.
In addition, sometimes the steam generated by the server is too much to be cooled in a timely manner. At this time, the pressure in the liquid cooling module 220 will increase, thereby affecting the cooling effect and possibly even damaging the condenser 223. To this end, as shown in fig. 4, each liquid cooling module preferably includes a pressure relief valve 226. Through this relief valve 226, can carry out the pressure release to liquid cooling module 220, avoided the problem that leads to because the pressure is too high.
The gas vented as a result of the pressure relief may be vented to the external environment, but preferably the gas vented from the pressure relief valves may be received by a gas outlet pipe (not shown) connected to each pressure relief valve. Accordingly, the auxiliary section further includes a steaming region 245 connected to the outlet duct, and collecting gas discharged from the outlet duct. At ambient temperature, the gas in the vapor treatment zone 245 condenses into a liquid that drips into the liquid filled zone 241. The liquid-cooled module 220 can then be filled with liquid via the liquid fill tube 242, which improves the usage of the cooling liquid. It will be appreciated that the steaming region 245 may also be provided with a condensing device to cool the coolant gas, and the present invention is not particularly limited thereto.
Fig. 5 illustrates a schematic cross-sectional view of a modular liquid-cooled server chassis 300 in accordance with a third embodiment of the invention. The chassis 300 differs from the chassis 200 shown in fig. 2 in that sensors may be included in the liquid cooling module 320 and the liquid fill zone 341 of the chassis 300. Otherwise, the rest of the chassis 300 is the same as the chassis 200, and thus, will not be described again.
It will be appreciated that one or more sensors may be provided in one or both of the two components described above, as the invention is not limited in this regard. For illustrative purposes, two sensors (shown in fig. 6) are disposed in the liquid cooling module 320 within the housing 300, and one sensor, respectively designated as a first sensor 327, a second sensor 328, and a third sensor 3411, is disposed in the liquid-filled region 341.
The first, second, and third sensors 327, 328, and 3411, respectively, are connected to the controller 352, which may be any type of sensor, such as a contact depth sensor, a pressure sensor, etc., and it is understood that these sensors may also be non-contact sensors disposed on the walls of the chassis, such as laser sensors, infrared sensors, etc.
First and second sensors 327 and 328 are provided in each liquid cooling module 320 for monitoring the level of cooling liquid in the liquid cooling module 320 and the pressure of gas in the liquid cooling module 320, respectively. After the server is serviced and reinserted into the liquid cooling module 320, the liquid cooling module 320 is refilled with cooling liquid. When the first sensor 327 detects that the liquid level of the cooling liquid in the liquid cooling module 320 exceeds a first threshold, a first signal is generated to notify the controller 352, and the controller 352 controls the liquid inlet valve 323 to be closed according to the first signal, so as to stop the entry of the cooling liquid. And, if the first sensor 325 detects that the liquid level in the liquid cooling module 320 is lower than the second threshold, it sends a second signal to notify the controller 352, and the controller 352 will control the liquid inlet valve to open according to the signal to replenish the liquid cooling module with the cooling liquid. In this way, the liquid level of the cooling liquid in the liquid cooling module can be kept within a stable range. The first and second thresholds are set according to the amount of cooling fluid required to cool the servers.
The second sensor 328 is used to monitor the pressure of the gas within the liquid cooling module 320. When the gas pressure exceeds the third threshold, the second sensor 328 sends a third signal to the controller 352, and the controller controls the pressure release valve 326 to open according to the signal to release the pressure of the liquid cooling module 320.
A third sensor 3411 is disposed in the freeboard zone 341 for monitoring the level of cooling fluid within the freeboard zone 341. When the liquid level decreases below the fourth threshold, a fourth signal is sent to notify the controller 352, the controller 352 sends an alarm signal according to the signal and prompts that the coolant needs to be filled, and then the coolant can be filled through the liquid filling port 311, so that the problem caused by insufficient coolant is avoided.
The third threshold and the fourth threshold may be set according to actual needs, and the present invention is not limited in this respect.
In particular, a sensor may also be provided within the steaming region 345 to monitor the gas pressure within the steaming region 346, and a pressure relief valve may also be provided within the steaming region 345. If the gas pressure exceeds the fifth threshold, a signal is sent to the controller 352, and the controller 352 controls the pressure relief valve to release the pressure according to the signal, so as to discharge the gas in the steam processing region 345 to the outside or to an external air bag. If the air bag is discharged to the outside, the gas in the air bag can be cooled to be the cooling liquid at normal temperature and is filled into the liquid filling area 341 through the liquid filling port 311 for reuse, so that the utilization efficiency of the cooling liquid is improved. It will be appreciated that the bladder may also be contained within the housing. In this case, the airbag may be connected to a cooling device, or a cooling device may be provided inside the airbag, and after the gas in the airbag is cooled to a cooling liquid, the airbag may be connected to a liquid filling area through a pipe provided separately for reuse. The fifth threshold value is determined according to actual needs.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various changes or substitutions within the technical scope of the present invention, and these should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (14)
1. A modular liquid cooled server chassis comprising:
a box body;
a plurality of liquid cooling modules, wherein each liquid cooling module includes: the liquid cooling module comprises a shell, a liquid inlet valve and a condenser, wherein the liquid inlet valve is opened when the liquid cooling module works, the condenser is used for cooling gas in the liquid cooling module, and a single server is inserted into the liquid cooling module when the liquid cooling module works and is filled with cooling liquid; and
a connector for connecting the liquid cooling module to an external power supply; and
an auxiliary portion comprising a liquid-filled zone and a liquid-filled tube, wherein,
the liquid filling area is filled with cooling liquid; and
the liquid charging pipe is connected to the liquid inlet valve and is used for conveying the liquid from the liquid charging area to the liquid cooling module;
each liquid cooling module further comprises a cooling valve, and the chassis further comprises a first cooling pipe and a second cooling pipe; wherein the content of the first and second substances,
the cooling valve is connected with the condenser;
the first cooling tube is connected to each cooling valve and is used for conveying the coolant in the condenser of the liquid cooling module to the outside of the chassis; and
the second cooling water pipe is connected to each cooling valve and serves to deliver the coolant from the outside to the condenser.
2. The server chassis of claim 1, wherein each liquid cooled module further comprises a maintenance end cap, the maintenance end cap being closed when the liquid cooled module is in operation.
3. The server chassis of claim 1, wherein the chassis further comprises a power and control system comprising a power supply and a controller; wherein the content of the first and second substances,
the power supply is connected to the connector and used for supplying power to other components in the case through the connector; and
the controller is used for controlling other components in the chassis.
4. The server chassis of claim 3, wherein each liquid-cooled module further comprises a pressure relief valve for venting gas in the liquid-cooled module to the outside.
5. The server chassis of claim 4, wherein the chassis further comprises an air outlet duct, and a steam treatment zone connected to the air outlet duct; wherein the outlet duct is connected to each pressure relief valve and receives gas discharged from the pressure relief valves.
6. The server chassis of claim 3, wherein the box further comprises a charge valve coupled to the charge zone through which coolant can be added to the charge zone.
7. The server chassis of claim 3, further comprising a first sensor in each liquid-cooled module connected to the controller and configured to monitor a level of cooling liquid in the liquid-cooled module; wherein the content of the first and second substances,
when the liquid level of cooling liquid in the liquid cooling module is higher than a first threshold value, the first sensor generates a first signal and sends the first signal to the controller, and the controller controls the liquid inlet valve to be closed after receiving the first signal; and the number of the first and second electrodes,
when the liquid level of cooling liquid in the liquid cooling module is lower than a second threshold value, the first sensor generates a second signal and sends the second signal to the controller, and the controller controls the liquid inlet valve to be opened after receiving the second signal.
8. The server chassis of claim 4, further comprising a second sensor within each liquid-cooled module connected to the controller for monitoring a gas pressure in the liquid-cooled module; wherein the content of the first and second substances,
when the gas pressure is larger than a third threshold value, the second sensor generates a third signal and sends the third signal to the controller, and the controller controls the pressure release valve to open to release the pressure after receiving the third signal.
9. The server chassis of claim 3, further comprising a third sensor within the plenum, coupled to the controller, for monitoring a level of cooling fluid in the plenum; wherein the content of the first and second substances,
when the liquid level of the cooling liquid in the liquid filling area is lower than a fourth threshold value, the third sensor generates a fourth signal and sends the fourth signal to the controller, and the controller sends an alarm signal after receiving the fourth signal to prompt that liquid filling is needed.
10. The server chassis of claim 1, wherein the first cooling tube and the second cooling tube are connected to external heat exchange equipment.
11. The server chassis of claim 10, wherein the heat exchanging device is a chiller, a cooling tower, or a building chilled water system.
12. The server chassis of claim 1, wherein the coolant is cooling water.
13. The server chassis of claim 1, wherein the connector is a quick-connect device.
14. The server chassis of claim 1, wherein the cooling fluid is a fluorinated fluid.
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| CN201711193709.8A CN107911999B (en) | 2017-11-24 | 2017-11-24 | Modularized liquid cooling server case |
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| CN107911999B true CN107911999B (en) | 2020-03-03 |
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| CN108966603A (en) * | 2018-08-15 | 2018-12-07 | 南京佳力图机房环境技术股份有限公司 | A kind of cooling immersion liquid cooling combination unit of server |
| CN108882654B (en) * | 2018-08-29 | 2021-05-18 | 乌鲁木齐金风天翼风电有限公司 | Phase change cooling system, cooling system and converter cabinet cooling system |
| CN111857281A (en) * | 2020-08-07 | 2020-10-30 | 深圳比特微电子科技有限公司 | Electronic equipment and liquid cooling device for same |
| CN112181106A (en) * | 2020-09-02 | 2021-01-05 | 宁畅信息产业(北京)有限公司 | Server and driving method thereof |
| CN114518791A (en) * | 2020-11-19 | 2022-05-20 | 英业达科技有限公司 | Cooling system of server |
| CN114995612A (en) * | 2022-06-28 | 2022-09-02 | 西安易朴通讯技术有限公司 | Liquid cooling module and assembly structure of liquid cooling module |
| CN115052465A (en) * | 2022-06-30 | 2022-09-13 | 西安易朴通讯技术有限公司 | Liquid cooling device |
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| US7885070B2 (en) * | 2008-10-23 | 2011-02-08 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
| US8959941B2 (en) * | 2011-07-21 | 2015-02-24 | International Business Machines Corporation | Data center cooling with an air-side economizer and liquid-cooled electronics rack(s) |
| CN103298312B (en) * | 2012-02-23 | 2016-09-07 | 华为技术有限公司 | A kind of biphase submergence heat abstractor, communication equipment and manufacture method thereof |
| US9049800B2 (en) * | 2013-02-01 | 2015-06-02 | Dell Products L.P. | Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet |
| US9328964B2 (en) * | 2013-02-01 | 2016-05-03 | Dell Products, L.P. | Partitioned, rotating condenser units to enable servicing of submerged it equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system |
| US9195282B2 (en) * | 2013-02-01 | 2015-11-24 | Dell Products, L.P. | Vertically-oriented immersion server with vapor bubble deflector |
| CN206479925U (en) * | 2017-01-18 | 2017-09-08 | 阿里巴巴集团控股有限公司 | Cooling device, chip and server |
| CN107015613A (en) * | 2017-03-15 | 2017-08-04 | 北京百度网讯科技有限公司 | Server cooling system and server |
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