CN107889356A - Soft or hard composite circuit board - Google Patents
Soft or hard composite circuit board Download PDFInfo
- Publication number
- CN107889356A CN107889356A CN201610852493.0A CN201610852493A CN107889356A CN 107889356 A CN107889356 A CN 107889356A CN 201610852493 A CN201610852493 A CN 201610852493A CN 107889356 A CN107889356 A CN 107889356A
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- layer
- coating
- wiring board
- binder course
- soft
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of soft or hard composite circuit board, including FPC, and it includes core layer, the first coating, the second coating, the first binder course, the second binder course, the first dielectric layer, the second dielectric layer, the first superimposed layer and the second superimposed layer.Core layer includes the first core line layer and the second core line layer.First coating covering part the first core line layer, second coating covering part the second core line layer.First the first coating of binder course covering part, second the second coating of binder course covering part.First dielectric layer covering part the first core line layer and the coating of part first, second dielectric layer covering part the second core line layer and the coating of part second.First superimposed layer is configured on the first binder course and the first dielectric layer, and the second superimposed layer is configured on the second binder course and the second dielectric layer.This programme can improve reliability of the multilayer soft board in thermal shock inspection, be not exposed between layers of copper and layers of copper can not opposite face design limitation.
Description
Technical field
It can improve thermal shock the invention relates to a kind of soft or hard composite circuit board, and in particular to one kind
The soft or hard composite circuit board of (thermal shock) reliability.
Background technology
According to the pliability of insulating barrier, wiring board can be divided into rigid wiring board and FPC.When electronic component welds
When being connected to FPC, FPC can not provide enough structural strengths.On the other hand, in the feelings of welding electronic part
Under condition, though rigid wiring board provides preferable structural strength, pliability is bad, thus limits answering for rigid wiring board
With.
Soft or hard composite circuit board is a kind of wiring board formed as combined by FPC and rigid wiring board, and its is simultaneous
Have the pliability of FPC and the structural strength of rigid wiring board.Soft or hard composite circuit board is made by existing method
When, for the characteristic of soft board bent area, it is bonded whole plate face usually using board (bonding sheet).However, more
After secondary pressing, the process conditions of HTHP may cause soft board to be layered between board, or carry out thermal shock inspection
When there is reliability abnormal risk.In addition, in the design of multilayer soft board, if making the layers of copper of soft board layer be set with layers of copper with opposite face
Meter, may result in short circuit, therefore, suffered from folded structure between layers of copper and layers of copper can not opposite face design limitation, Jin Erzeng
The cost payout of soft board material is added.
Based on above-mentioned, how to solve reliability risk problem of the multilayer soft board in thermal shock inspection, while improve layers of copper
Between layers of copper can not opposite face design limitation, desire most ardently the target reached for those skilled in the art.
The content of the invention
The present invention provides a kind of soft or hard composite circuit board, can improve reliability of the multilayer soft board in thermal shock inspection,
And make on folded structure not by between layers of copper and layers of copper can not opposite face design limited.
A kind of soft or hard composite circuit board of offer of the present invention, including FPC.FPC includes core layer, the
One coating, the second coating, the first binder course, the second binder course, the first insulating barrier, the second insulating barrier, the first superimposed layer and
Second superimposed layer.Core layer, including the core dielectric layer with first surface and second surface, the first core line layer and second
Core line layer, the first core line layer and the second core line layer are respectively on first surface and second surface.First covers
Cap rock covering part the first core line layer, second coating covering part the second core line layer.First binder course covering part
Divide the first coating, second the second coating of binder course covering part.First insulating barrier covering part the first core line layer and
The coating of part first, the thickness of the first insulating barrier is equivalent to the first coating and the thickness of the first binder course.Second insulating barrier
Covering part the second core line layer and the coating of part second, the thickness of the second insulating barrier is equivalent to the second coating and second
The thickness of binder course.First superimposed layer includes the first soft board layer and first line layer, is configured at the first binder course and the first insulation
On layer.Second superimposed layer includes the second soft board layer and the second line layer, is configured on the second binder course and the second insulating barrier.
In one embodiment of this invention, the first coating from bottom to top sequentially includes the first adhesion coating and the first polyamides is sub-
Amine layer, the second coating from bottom to top sequentially include the second adhesion coating and the second polyimide layer.
In one embodiment of this invention, the material of the first binder course and the second binder course includes pure glue material.
In one embodiment of this invention, soft or hard composite circuit board also includes the first rigid wiring board and the second rigid circuit
Plate.First rigid wiring board has the first opening, is configured on the first superimposed layer.Second rigid wiring board has the second opening,
It is configured on the second superimposed layer.The first dielectric layer and the 3rd covering are configured between first rigid wiring board and the first superimposed layer
Layer, and the first opening coating of expose portion the 3rd.The second dielectric is configured between second rigid wiring board and the second superimposed layer
Layer and the 4th coating, and the second opening coating of expose portion the 4th.
In one embodiment of this invention, it is exhausted to include multiple first conductive layers, multiple first hardboards for the first rigid wiring board
Edge layer and multiple first conductive through holes, the first conductive through hole runs through the first conductive layer and the first hardboard insulating barrier, so that first leads
It is electrically connected between electric layer.Second rigid wiring board includes multiple second conductive layers, multiple second hardboard insulating barriers and multiple the
Two conductive through holes, the second conductive through hole run through the second conductive layer and the second hardboard insulating barrier, so that between the second conductive layer electrically
Connection.
In one embodiment of this invention, soft or hard composite circuit board also includes the first welding resisting layer and the second welding resisting layer.First
Welding resisting layer is configured on the first rigid wiring board, the second welding resisting layer, is configured on the second rigid wiring board.
In one embodiment of this invention, soft or hard composite circuit board also includes the 3rd conductive through hole.3rd conductive through hole passes through
FPC, the first rigid wiring board, the second rigid wiring board, the first dielectric layer and the second dielectric layer are worn, to be electrically connected with
FPC, the first rigid wiring board and the second rigid wiring board.
A kind of soft or hard composite circuit board of offer of the present invention, including FPC, the first rigid wiring board and second are hard
Property wiring board.FPC includes core layer, the first coating, the second coating, the first binder course, the second binder course, the
One insulating barrier, the second insulating barrier, the first superimposed layer and the second superimposed layer.Core layer, including with first surface and second surface
Core dielectric layer, the first core line layer and the second core line layer, the first core line layer and the second core line layer point
Wei Yu not be on first surface and second surface.First coating covering part the first core line layer, the second coating covering part
Divide the second core line layer.First the first coating of binder course covering part, second the second coating of binder course covering part.The
One insulating barrier covering part the first core line layer and the coating of part first, the thickness of the first insulating barrier is equivalent to the first covering
The thickness of layer and the first binder course.Second insulating barrier covering part the second core line layer and the coating of part second, second is exhausted
The thickness of edge layer is equivalent to the second coating and the thickness of the second binder course.First superimposed layer includes the first soft board layer and First Line
Road floor, it is configured on the first binder course and the first insulating barrier.Second superimposed layer includes the second soft board layer and the second line layer, configuration
In on the second binder course and the second insulating barrier.First rigid wiring board has the first opening, is configured on the first superimposed layer.Second
Rigid wiring board has the second opening, is configured on the second superimposed layer.Configured between first rigid wiring board and the first superimposed layer
There are the first dielectric layer and the 3rd coating, and the first opening coating of expose portion the 3rd.Second rigid wiring board and second folded
Add and the second dielectric layer and the 4th coating are configured between layer, and the second opening coating of expose portion the 4th.
In one embodiment of this invention, the first coating from bottom to top sequentially includes the first adhesion coating and the first polyamides is sub-
Amine layer, the second coating from bottom to top sequentially include the second adhesion coating and the second polyimide layer.
In one embodiment of this invention, the material of the first binder course and the second binder course includes pure glue material.
In one embodiment of this invention, it is exhausted to include multiple first conductive layers, multiple first hardboards for the first rigid wiring board
Edge layer and multiple first conductive through holes, the first conductive through hole runs through the first conductive layer and the first hardboard insulating barrier, so that first leads
It is electrically connected between electric layer.Second rigid wiring board includes multiple second conductive layers, multiple second hardboard insulating barriers and multiple the
Two conductive through holes, the second conductive through hole run through the second conductive layer and the second hardboard insulating barrier, so that between the second conductive layer electrically
Connection.
In one embodiment of this invention, soft or hard composite circuit board also includes the first welding resisting layer and the second welding resisting layer.First
Welding resisting layer is configured on the first rigid wiring board, the second welding resisting layer, is configured on the second rigid wiring board.
In one embodiment of this invention, soft or hard composite circuit board also includes the 3rd conductive through hole.3rd conductive through hole passes through
FPC, the first rigid wiring board, the second rigid wiring board, the first dielectric layer and the second dielectric layer are worn, to be electrically connected with
FPC, the first rigid wiring board and the second rigid wiring board.
Based on above-mentioned, the present invention proposes a kind of soft or hard composite circuit board, in the FPC of soft or hard composite circuit board,
Soft board is pressed together using complete binder course different from prior art, but uses coating local complexity line layer,
Binder course is locally bonded with coating again, exposes part of covering layer.Meanwhile between soft board beyond binder course and coating
Region, configure polypropylene insulation layer.That is, in the soft or hard composite circuit board of the present invention, polypropylene material is used between soft board,
Soft board bent area is then to be combined using the coating being locally bonded with binder course, therefore, it is possible to improve multilayer soft board in thermal shock
Reliability in inspection, and make on folded structure not by between layers of copper and layers of copper can not opposite face design limited, even if layers of copper and copper
Interlayer opposite face designs, and is not easy to cause short circuit problem, and then reduce the cost payout of soft board material.
For features described above of the invention and advantage can be become apparent, special embodiment below, and it is detailed to coordinate accompanying drawing to make
Carefully it is described as follows.
Brief description of the drawings
Figure 1A to Fig. 1 F shows for the Making programme section according to the soft or hard composite circuit board shown by embodiments of the invention
It is intended to.
Drawing reference numeral explanation：
10：Soft or hard composite circuit board；
100：FPC；
102：Core layer；
102A：First surface；
102B：Second surface；
104：Core dielectric layer；
106：First core line layer；
108：Second core line layer；
110：First coating；
112：First adhesion coating；
114：First polyimide layer；
120：Second coating；
122：Second adhesion coating；
124：Second polyimide layer；
130：First binder course；
140：Second binder course；
150：First insulating barrier；
160：Second insulating barrier；
170：First superimposed layer；
172：First soft board layer；
174：First line layer；
180：Second superimposed layer；
182：Second soft board layer；
184：Second line layer；
210：3rd coating；
212：3rd adhesion coating；
214：3rd polyimide layer；
220：4th coating；
222：4th adhesion coating；
224：4th polyimide layer；
230：First dielectric layer；
240：Second dielectric layer；
300：First rigid wiring board；
310：First conductive layer；
320：First hardboard insulating barrier；
330：First hardboard dielectric layer；
340、342：First conductive through hole；
400：Second rigid wiring board；
410：Second conductive layer；
420：Second hardboard insulating barrier；
430：Second hardboard dielectric layer；
440、442：Second conductive through hole；
510：First welding resisting layer；
520：Second welding resisting layer；
610：3rd conductive through hole；
H1：First opening；
H2：Second opening.
Embodiment
Figure 1A to Fig. 1 F shows for the Making programme section according to the soft or hard composite circuit board shown by embodiments of the invention
It is intended to.
First, it refer to Figure 1A, there is provided core layer 102, wherein core layer 102 include having first surface 102A and second
Surface 102B core dielectric layer 104, the first core line layer 106 and the second core line layer 108.First core line layer
106 and second core line layer 108 respectively positioned at 102B on first surface 102A and second surface.More specifically, the first core
The core line layer 108 of heart line layer 106 and second is, for example, layers of copper or copper alloy layer.
Then, Figure 1B is refer to, forms the first coating 110 and the second coating 120.The covering part of first coating 110
Divide the first core line layer 106, the second core of the covering part line layer 108 of the second coating 120.More specifically, first covers
Cap rock 110 from bottom to top sequentially may include the first adhesion coating 112 and the first polyimide layer 114, the second coating 120 by lower and
On sequentially may include the second adhesion coating 122 and the second polyimide layer 124.In the present embodiment, using such as cutting die or cut
The mode of cutting carries out pre-treatment, with the first coating 110 and the second coating 120 of size needed for obtaining, the first coating 110 and
The size of second coating 120 can be adjusted with practical operation demand, and the size of the first coating 110 be, for example, equivalent to
The size of second coating 120.
Then, Fig. 1 C are refer to, form the first binder course 130 and the second binder course 140.The covering part of first binder course 130
Divide the first coating 110, the second coating of covering part 120 of the second binder course 140.More specifically, the first binder course 130 and
The material of second binder course 140 may include pure glue material.As shown in Figure 1B and Fig. 1 C, used different from prior art complete
Binder course presses together soft board, and the present embodiment is using the first coating 110 and the second coating 120 difference local complexity
First core line layer 106 and the second core line layer 108.Then, it is the first binder course 130 and the first coating 110 is local
Fitting, and the second binder course 140 is bonded with the part of the second coating 120, to expose the first coating of part 110 and second
Coating 120.
In the present embodiment, pre-treatment is carried out using such as cutting die or cutting mode, to obtain the first of required size
The size of the binder course 140 of binder course 130 and second, the first binder course 130 and the second binder course 140 can be entered with practical operation demand
Row adjustment, wherein the width of the first binder course 130 and the second binder course 140 is respectively smaller than the first coating 110 and the second covering
The width of layer 120, and the size of the first binder course 130 is, for example, the size equivalent to the second binder course 140.
Afterwards, Fig. 1 D are refer to, form the first insulating barrier 150 and the second insulating barrier 160.The covering part of first insulating barrier 150
Divide the first core line layer 106 and the first coating of part 110, and the thickness of the first insulating barrier 150 is, for example, equivalent to first
The thickness of the binder course 130 of coating 110 and first.The second core of the covering part line layer 108 of second insulating barrier 160 and part
Two coatings 120, and the thickness of the second insulating barrier 160 is, for example, the thickness equivalent to the second coating 120 and the second binder course 140
Degree.More specifically, the material of the first insulating barrier 150 and the second insulating barrier 160 is, for example, polypropylene.In the present embodiment, may be used
Using such as cutting die or the progress pre-treatment of short side formula is dragged for, to obtain the first insulating barrier 150 and the second insulating barrier with opening
160。
Next, continue referring to Fig. 1 D, in forming the first superimposed layer on the first binder course 130 and the first insulating barrier 150
170, and in forming the second superimposed layer 180 on the second binder course 140 and the second insulating barrier 160.First superimposed layer 170 may include
One soft board layer 172 and first line layer 174, the second superimposed layer 180 may include the second soft board layer 182 and the second line layer 184.More
Specifically, the line layer 184 of first line layer 174 and second is, for example, layers of copper.Thus, you can complete FPC
100 making.
Afterwards, Fig. 1 E are refer to, form the 3rd coating 210 and the 4th coating 220.The covering part of 3rd coating 210
Divide the first superimposed layer 170, the second superimposed layer of covering part 180 of the 4th coating 220.More specifically, the 3rd coating 210 by
It sequentially may include the 3rd adhesion coating 212 and the 3rd polyimide layer 214 on down, the 4th coating 220 from bottom to top sequentially may be used
Including the 4th adhesion coating 222 and the 4th polyimide layer 224.
In the present embodiment, pre-treatment is carried out using such as cutting die or cutting mode, to obtain the 3rd of required size the
The size of the coating 220 of coating 210 and the 4th, the 3rd coating 210 and the 4th coating 220 can be entered with practical operation demand
Row adjustment.More specifically, the size of the 3rd coating 210 is, for example, the size equivalent to the 4th coating 220, and the 3rd covers
The size of the coating 220 of cap rock 210 and the 4th is, for example, the size equivalent to the first coating 110 and the second coating 120.
Next, Fig. 1 F are refer to, pressing FPC 100, the first rigid 300 and second rigid circuit of wiring board
Plate 400, so that the 3rd coating 210 and the first dielectric layer 230 are connected to 100 and first rigid wiring board 300 of FPC
Between, the 4th coating 220 and the second dielectric layer 240 are connected between 100 and second rigid wiring board 400 of FPC.
The material of first dielectric layer 230 and the second dielectric layer 240 is, for example, polypropylene.In the present embodiment, the first rigid wiring board 300
With the first opening H1 with the coating 210 of expose portion the 3rd, the second rigid wiring board 400 has the second opening H2 with exposed portion
Divide the 4th coating 220.
More specifically, the first rigid wiring board 300 may include multiple first conductive layers 310, the insulation of multiple first hardboards
The 320, first hardboard dielectric layer 330 of layer and multiple first conductive through holes 340,342.First conductive layer 310 and the insulation of the first hardboard
320 stacking alternating with each other of layer, the first conductive through hole 340,342 run through the first conductive layer 310 and the first hardboard insulating barrier 320, with
Make to be electrically connected between the first conductive layer 310.Second rigid wiring board 400 may include multiple second conductive layers 410, multiple second
Hardboard insulating barrier 420, the second hardboard dielectric layer 430 and multiple second conductive through holes 440,442.Second conductive layer 410 and second
420 stacking alternating with each other of hardboard insulating barrier, the second conductive through hole 440,442 insulate through the second conductive layer 410 and the second hardboard
Layer 420, so as to be electrically connected between the second conductive layer 410.In the present embodiment, the first hardboard insulating barrier 320 and the second hardboard
The material of insulating barrier 420 is, for example, polypropylene.
Meanwhile it can also be formed through FPC 100, the first rigid wiring board 300, the second rigid wiring board 400,
3rd conductive through hole 610 of one dielectric layer 230 and the second dielectric layer 240, to be electrically connected with the hardness of FPC 100, first
300 and second rigid wiring board 400 of wiring board.
For example, laser processing procedure can be used in the first conductive layer 310, the first hardboard insulating barrier 320, the second conductive layer
410 and second perforate is formed in hardboard insulating barrier 420, conductive material is then inserted in perforate to form the first conductive through hole
340th, 342 and second conductive through hole 440,442.Similarly, laser processing procedure can be used in FPC 100, the first hard rays
Perforate is formed in road plate 300, the second rigid wiring board 400, the first dielectric layer 230 and the second dielectric layer 240, then then at perforate
In insert conductive material to form the 3rd conductive through hole 610.
Then, Fig. 1 F are continued referring to, are formed respectively on the first rigid 300 and second rigid wiring board 400 of wiring board
First welding resisting layer 510 and the second welding resisting layer 520.The function of first welding resisting layer 510 and the second welding resisting layer 520 is, for example, to protect first
Line construction (such as the first conductive layer 310 and the second conductive layer 410) on rigid 300 and second rigid wiring board 400 of wiring board
It is unaffected when welding, and line construction can be avoided to produce oxidative phenomena.Thus, you can complete soft or hard composite circuit board
10 making.
The soft or hard composite circuit board of the present invention is explained by taking Fig. 1 F as an example below.It refer to Fig. 1 F, soft or hard composite line
Plate 10 may include FPC 100, the first rigid wiring board 300, the second rigid wiring board 400, the first welding resisting layer 510 and
Two welding resisting layers 520.The first rigid wiring board 300 with the first opening H1 and the second rigid wiring board with the second opening H2
400 are respectively arranged on the first superimposed layer 170 and the second superimposed layer 180 of FPC 100.Also, the first rigid circuit
The 3rd coating 210 and the first dielectric layer 230, the second rigid wiring board 400 are configured between the superimposed layer 170 of plate 300 and first
The 4th coating 220 and the second dielectric layer 240 are configured between the second superimposed layer 180.
As shown in fig. 1F, FPC 100 may include core layer 102, the first coating 110, the second coating 120,
First binder course 130, the second binder course 140, the first insulating barrier 150, the second insulating barrier 160, the first superimposed layer 170 and second are folded
Add layer 180, wherein core layer 102 may include core dielectric layer 104, the first core line layer 106 and the second core line layer
108。
More specifically, the first core of the covering part line layer 106 of the first coating 110, the covering part of the second coating 120
Divide the second core line layer 108.Also, the first coating of covering part 110 of the first binder course 130, the second binder course 140 cover
The second coating of part 120.Soft board is pressed together using complete binder course different from prior art, the present invention is to use
First coating 110 and the second coating 120 difference the first core of local complexity line layer 106 and the second core line layer 108,
The first binder course 130 and the second binder course 140 are bonded with the first coating 110 and the part of the second coating 120 respectively again.Together
When, the thickness of the first insulating barrier 150 is, for example, equivalent to the first coating 110 and the thickness of the first binder course 130, the second insulation
The thickness of layer 160 is, for example, equivalent to the second coating 120 and the thickness of the second binder course 140.
In summary, the present invention proposes a kind of soft or hard composite circuit board, and polypropylene material is used between soft board as insulation
Layer, soft board bent area is then to be combined using the coating being locally bonded with binder course, and the thickness of insulating barrier is equivalent to coating
And the thickness of binder course.Consequently, it is possible to soft board can be avoided to be layered under the process conditions of HTHP between board, and
And improve reliability of the multilayer soft board in thermal shock inspection.Make simultaneously on folded structure not by can not opposite face between layers of copper and layers of copper
The limitation of design, even if opposite face designs between layers of copper and layers of copper, be not easy to cause short circuit problem, so reduce soft board material into
This expenditure.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, either which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (7)
1. a kind of soft or hard composite circuit board, including：
FPC, the FPC include：
Core layer, including the core dielectric layer with first surface and second surface, the first core line layer and the second core-wire
Road floor, the first core line layer and the second core line layer are located at the first surface and the second surface respectively
On；
First coating, the first core line layer described in covering part；
Second coating, the second core line layer described in covering part；
First binder course, the first coating described in covering part；
Second binder course, the second coating described in covering part；
First insulating barrier, the first core line layer and part first coating, first insulating barrier described in covering part
Thickness equivalent to first coating and the thickness of first binder course；
Second insulating barrier, the second core line layer and part second coating, second insulating barrier described in covering part
Thickness equivalent to second coating and the thickness of second binder course；
First superimposed layer, including the first soft board layer and first line layer, it is configured at first binder course and first insulation
On layer；And
Second superimposed layer, including the second soft board layer and the second line layer, it is configured at second binder course and second insulation
On layer.
2. soft or hard composite circuit board according to claim 1, wherein first coating from bottom to top sequentially includes the
One adhesion coating and the first polyimide layer, second coating from bottom to top sequentially includes the second adhesion coating and the second polyamides is sub-
Amine layer.
3. soft or hard composite circuit board according to claim 1, wherein first binder course and second binder course
Material includes pure glue material.
4. soft or hard composite circuit board according to claim 1, in addition to：
First rigid wiring board, there is the first opening, be configured on first superimposed layer；And
Second rigid wiring board, there is the second opening, be configured on second superimposed layer,
The first dielectric layer and the 3rd coating are configured between wherein described first rigid wiring board and first superimposed layer, and
3rd coating described in the first opening expose portion, and
The second dielectric layer and the 4th coating are configured between the second rigid wiring board and second superimposed layer, and it is described
4th coating described in second opening expose portion.
5. soft or hard composite circuit board according to claim 4, wherein
It is logical that the first rigid wiring board includes multiple first conductive layers, multiple first hardboard insulating barriers and multiple first conductions
Hole, first conductive through hole runs through first conductive layer and the first hardboard insulating barrier, so that first conductive layer
Between be electrically connected with, and
It is logical that the second rigid wiring board includes multiple second conductive layers, multiple second hardboard insulating barriers and multiple second conductions
Hole, second conductive through hole runs through second conductive layer and the second hardboard insulating barrier, so that second conductive layer
Between be electrically connected with.
6. the soft or hard composite circuit board according to claim 4 or 5, in addition to：
First welding resisting layer, it is configured on the described first rigid wiring board；And
Second welding resisting layer, it is configured on the described second rigid wiring board.
7. the soft or hard composite circuit board according to claim 4 or 5, in addition to the 3rd conductive through hole, the described 3rd is conductive logical
The FPC, the first rigid wiring board, the second rigid wiring board, first dielectric layer and institute are run through in hole
The second dielectric layer is stated, to be electrically connected with the FPC, the first rigid wiring board and the second rigid wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610852493.0A CN107889356B (en) | 2016-09-27 | 2016-09-27 | Soft and hard composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610852493.0A CN107889356B (en) | 2016-09-27 | 2016-09-27 | Soft and hard composite circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN107889356A true CN107889356A (en) | 2018-04-06 |
| CN107889356B CN107889356B (en) | 2020-09-01 |
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| CN201610852493.0A Active CN107889356B (en) | 2016-09-27 | 2016-09-27 | Soft and hard composite circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112087863A (en) * | 2019-06-13 | 2020-12-15 | 李蕙如 | Soft and hard composite board and its making method |
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| JP2004031682A (en) * | 2002-06-26 | 2004-01-29 | Sony Corp | Method of manufacturing printed wiring board |
| CN101640972A (en) * | 2008-07-28 | 2010-02-03 | 欣兴电子股份有限公司 | Circuit board structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112087863A (en) * | 2019-06-13 | 2020-12-15 | 李蕙如 | Soft and hard composite board and its making method |
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| CN107889356B (en) | 2020-09-01 |
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