CN107883964B - Device for detecting motion trail of single point on workpiece ring in ring polishing processing and method for detecting motion trail by using device - Google Patents
Device for detecting motion trail of single point on workpiece ring in ring polishing processing and method for detecting motion trail by using device Download PDFInfo
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- CN107883964B CN107883964B CN201711115936.9A CN201711115936A CN107883964B CN 107883964 B CN107883964 B CN 107883964B CN 201711115936 A CN201711115936 A CN 201711115936A CN 107883964 B CN107883964 B CN 107883964B
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Abstract
A single-point motion trail detection device on a workpiece ring in ring polishing processing and a method for detecting by using the device relate to a motion trail detection device on a workpiece ring in ring polishing processing and a method thereof. The invention aims to solve the problems of complex detection process and low detection precision of a single-point motion rail on a workpiece ring in the existing ring polishing processing. The device consists of a workpiece ring, a laser displacement sensor, a photoelectric position sensor and a fixing plate; the workpiece ring and the fixing plate are arranged in parallel, the laser displacement sensor is arranged in a blind hole in the upper surface of the workpiece ring, and the photoelectric position sensor is arranged on the lower surface of the fixing plate in an annular array mode. The method comprises the following steps: in the rotation process of the workpiece ring, a photoelectric position sensor records plane coordinate data x and y, and a laser displacement sensor records vertical height change z; and drawing x and y into a plane motion trail graph, and drawing x, y and z into a three-dimensional motion trail graph. The method has simple and convenient detection process and higher precision, and can improve the precision of the element surface shape evolution prediction.
Description
Technical Field
The invention relates to a device and a method for detecting a single-point motion track on a workpiece ring.
Background
The ring polishing process is widely used for final precision polishing of planar optical elements because it can effectively suppress medium-high frequency errors of workpieces and has high cost performance relative to small tool polishing.
In actual machining, the motion of the polishing disk is evaluated by detecting the average rotating speed, but the motion of the workpiece is influenced by factors such as machine tool vibration, and the self-rotation motion track of the workpiece is not a regular circular track. That is, the actual motion trajectory of the workpiece ring does not rotate around the circumference of the center of the workpiece ring, i.e., the motion of a single point on the workpiece ring has not only a deviation in the radial direction of the polishing disk but also a run-out in the direction perpendicular to the polishing disk. At present, the prediction of the surface shape evolution trend of the workpiece surface is realized by a preston equation, specifically, the geometric model reconstruction of the contact pair of the workpiece and the polishing disk is carried out, and then the contact interface stress distribution of the workpiece and the polishing disk is obtained by adopting a finite element method based on contact mechanics; then obtaining the respective movement speeds of the workpiece and the polishing disc by utilizing coordinate transformation; and finally, discretizing the surface of the workpiece to obtain the accumulated material removal amount of the single points on the surface of the workpiece, and further completing the surface shape evolution trend prediction of the surface of the workpiece ring. Therefore, the existing motion model ignores the deviation of a single point on the workpiece ring along the radial direction of the polishing disk and ignores the jumping along the direction vertical to the polishing disk; and further, errors exist in the motion representation of the polishing disk, and large errors are introduced to the calculation of the nonuniform distribution of the removal rate of the workpiece material.
Meanwhile, the prediction of the surface shape evolution trend of the workpiece ring in the ring polishing process is seriously judged by the experience of a technician, so that the surface shape precision of the workpiece ring is determined, the method has the problem of low detection precision, and the improvement of the processing efficiency is also restricted; large errors may also be introduced into the calculation of the non-uniform distribution of the removal rate of the workpiece material.
Disclosure of Invention
The invention provides a single-point motion track detection device on a workpiece ring in ring polishing processing and a detection method by using the device, aiming at solving the problems of low detection precision and large error in the motion error detection of the workpiece ring in the existing ring polishing processing.
A single-point motion track detection device on a workpiece ring in ring polishing processing is composed of the workpiece ring, 1 laser displacement sensor, a plurality of photoelectric position sensors and a fixing plate;
the workpiece ring and the fixing plate are arranged in parallel, the workpiece ring is arranged below the fixing plate, a blind hole is formed in the upper surface of the workpiece ring, the laser displacement sensor is arranged in the blind hole and is perpendicular to the upper surface of the workpiece ring, and the sensing end of the laser displacement sensor faces the fixing plate; the photoelectric position sensors are arranged on the lower surface of the fixing plate in an annular array mode, sensing ends of the photoelectric position sensors are arranged towards the workpiece ring, and the center of the annular array of the photoelectric position sensors corresponds to the center of the workpiece ring; the center of the sensing end of the photoelectric position sensor corresponds to the center of the sensing end of the laser displacement sensor;
the parallelism between the upper surface of the workpiece ring and the lower surface of the fixing plate is less than 5 mu m;
the vertical distance between the upper surface of the workpiece ring and the lower surface of the fixing plate is 300-400 mm;
the flatness of the lower surface of the fixing plate is less than 5 mu m;
the positioning precision of the photoelectric position sensor in the range of 3mm multiplied by 3mm is less than 3 mu m;
the perpendicularity between the laser displacement sensor and the workpiece ring is less than 5 mu m;
the photoelectric position sensor is adsorbed on the lower surface of the fixing plate through a vacuum chuck;
the detection precision of the laser displacement sensor is less than 3 mu m;
the method for detecting the single-point motion trail by using the single-point motion trail detection device on the workpiece ring in the ring polishing processing comprises the following steps:
firstly, adjusting the parallelism between the upper surface of the workpiece ring and the lower surface of the fixed plate to be less than 5 mu m;
adjusting the horizontal position of the laser displacement sensor to enable the center of the sensing end of the photoelectric position sensor to vertically correspond to the center of the sensing end of the laser displacement sensor;
starting the workpiece ring, recording plane coordinate data x and y of a central point of the position where the laser displacement sensor is located by using the photoelectric position sensor in the process that the laser displacement sensor rotates along with the workpiece ring, and recording vertical height change z of the central point of the position where the laser displacement sensor is located by using the laser displacement sensor;
drawing the plane coordinate data x and y recorded by the photoelectric position sensor and the laser displacement sensor into a plane motion track diagram of the central point of the position where the laser displacement sensor is located, and drawing the plane coordinate data x and y and the vertical height change z recorded by the photoelectric position sensor and the laser displacement sensor into a three-dimensional motion track diagram of the central point of the position where the laser displacement sensor is located; namely, the detection of the motion trail of the single point on the workpiece ring in the ring polishing processing is completed;
the working principle and the beneficial effects of the invention are as follows:
1. according to the invention, a laser displacement sensor is embedded in a workpiece ring, an annular array of photoelectric position sensors are arranged above the workpiece ring, the photoelectric position sensors are used for recording the plane motion information of the workpiece ring, the laser displacement sensors can acquire the vertical displacement information of the workpiece ring, and the three-dimensional motion track of a single point on the workpiece ring can be obtained after data processing;
2. aiming at solving the problems of low detection precision and large error in the motion error detection of a workpiece ring in the existing ring polishing processing, the laser displacement sensor is embedded in the workpiece ring, the annular array photoelectric position sensor is arranged above the workpiece ring, the motion track of a single point on the ring polishing workpiece ring can be automatically detected in the motion process of the workpiece ring, the detection process is simple and convenient, and the precision is high.
Description of the drawings:
FIG. 1 is a schematic view of the apparatus of the present invention;
FIG. 2 is a back view of the fixing plate 4 of the device of FIG. 1;
FIG. 3 is a planar motion trace diagram of the center point of the laser displacement sensor 2 tested in example 1;
fig. 4 is a three-dimensional motion trajectory diagram of the central point of the position where the laser displacement sensor 2 is located, which is tested in embodiment 1.
The specific implementation mode is as follows:
the technical scheme of the invention is not limited to the specific embodiments listed below, and any reasonable combination of the specific embodiments is included.
The first embodiment is as follows: the embodiment is described with reference to fig. 1 and 2, and the single-point motion trajectory detection device on the workpiece ring in the ring polishing process of the embodiment is composed of a workpiece ring 1, 1 laser displacement sensor 2, a plurality of photoelectric position sensors 3 and a fixing plate 4;
the workpiece ring 1 and the fixing plate 4 are arranged in parallel, the workpiece ring 1 is arranged below the fixing plate 4, a blind hole 11 is formed in the upper surface of the workpiece ring 1, the laser displacement sensor 2 is arranged inside the blind hole 11, the laser displacement sensor 2 is perpendicular to the upper surface of the workpiece ring 1, and the sensing end of the laser displacement sensor 2 faces the fixing plate 4; the photoelectric position sensors 3 are arranged on the lower surface of the fixing plate 4 in an annular array mode, the sensing ends of the photoelectric position sensors 3 are arranged towards the workpiece ring 1, and the center of the annular array of the photoelectric position sensors 3 corresponds to the center of the workpiece ring 1; the center of the sensing end of the photoelectric position sensor 3 is arranged corresponding to the center of the sensing end of the laser displacement sensor 2.
The working principle and the beneficial effects of the embodiment are as follows:
1. according to the embodiment, the laser displacement sensor 2 is embedded in the workpiece ring, the photoelectric position sensor 3 in an annular array is arranged above the workpiece ring, the photoelectric position sensor 3 is used for recording the plane motion information of the workpiece ring, the laser displacement sensor 2 can acquire the vertical displacement information of the workpiece ring, and the three-dimensional motion track of a single point on the workpiece ring can be obtained after data processing;
2. aiming at solving the problems of complex detection process and low detection precision of a single-point motion track on a workpiece ring in the existing ring polishing processing, the laser displacement sensor 2 is embedded into the workpiece ring, the photoelectric position sensor 3 in the annular array is arranged above the workpiece ring, the single-point motion track on the ring polishing workpiece ring can be automatically detected in the motion process of the workpiece ring, the detection process is simple and convenient, the precision is high, the three-dimensional motion track of the single point on the workpiece ring can be obtained through the device of the embodiment, and then the motion model and the contact are guided to be corrected, so that the precision of element surface shape evolution prediction is improved.
The second embodiment is as follows: the first difference between the present embodiment and the specific embodiment is: the parallelism between the upper surface of the workpiece ring 1 and the lower surface of the fixed plate 4 is less than 5 mu m. Other steps and parameters are the same as in the first embodiment.
The third concrete implementation mode: the present embodiment differs from the first or second embodiment in that: the vertical distance between the upper surface of the workpiece ring 1 and the lower surface of the fixing plate 4 is 300-400 mm. Other steps and parameters are the same as in the first or second embodiment.
The fourth concrete implementation mode: the difference between this embodiment mode and one of the first to third embodiment modes is: the flatness of the lower surface of the fixing plate 4 is less than 5 mu m. Other steps and parameters are the same as in one of the first to third embodiments.
The fifth concrete implementation mode: the difference between this embodiment and one of the first to fourth embodiments is: the positioning accuracy of the photoelectric position sensor 3 in the range of 3mm multiplied by 3mm is less than 3 mu m. Other steps and parameters are the same as in one of the first to fourth embodiments.
The sixth specific implementation mode: the difference between this embodiment and one of the first to fifth embodiments is: the verticality of the laser displacement sensor 2 and the workpiece ring 1 is less than 5 mu m. Other steps and parameters are the same as in one of the first to fifth embodiments.
The seventh embodiment: the difference between this embodiment and one of the first to sixth embodiments is: the photoelectric position sensor 3 is attached to the lower surface of the fixing plate 4 by a vacuum chuck. Other steps and parameters are the same as in one of the first to sixth embodiments.
The specific implementation mode is eight: the present embodiment differs from one of the first to seventh embodiments in that: the detection precision of the laser displacement sensor 2 is less than 3 mu m. Other steps and parameters are the same as in one of the first to seventh embodiments.
The specific implementation method nine: the method for detecting the single-point motion trail by using the single-point motion trail detection device on the workpiece ring in the ring polishing processing is carried out according to the following steps:
firstly, adjusting the parallelism between the upper surface of the workpiece ring 1 and the lower surface of the fixed plate 4 to be less than 5 mu m;
adjusting the horizontal position of the laser displacement sensor 2 to enable the center of the sensing end of the photoelectric position sensor 3 to vertically correspond to the center of the sensing end of the laser displacement sensor 2;
starting the workpiece ring 1, recording plane coordinate data x and y of a central point of the position where the laser displacement sensor 2 is located by using the photoelectric position sensor 3 and recording vertical height change z of the central point of the position where the laser displacement sensor 2 is located by using the laser displacement sensor 2 in the process that the laser displacement sensor 2 rotates along with the workpiece ring 1;
drawing the plane coordinate data x and y recorded by the photoelectric position sensor 3 and the laser displacement sensor 2 into a plane motion trail diagram of the central point of the position where the laser displacement sensor 2 is located, and drawing the plane coordinate data x and y and the vertical height change z recorded by the photoelectric position sensor 3 and the laser displacement sensor 2 into a three-dimensional motion trail diagram of the central point of the position where the laser displacement sensor 2 is located; and then the single-point motion track detection on the workpiece ring in the ring polishing processing is completed.
The working principle and the beneficial effects of the embodiment are as follows:
1. according to the embodiment, the laser displacement sensor 2 is embedded in the workpiece ring, the photoelectric position sensor 3 in an annular array is arranged above the workpiece ring, the photoelectric position sensor 3 is used for recording the plane motion information of the workpiece ring, the laser displacement sensor 2 can acquire the vertical displacement information of the workpiece ring, and the three-dimensional motion track of a single point on the workpiece ring can be obtained after data processing;
2. aiming at solving the problems of complex detection process and low detection precision of a single-point motion track on a workpiece ring in the existing ring polishing processing, the laser displacement sensor 2 is embedded in the workpiece ring, the photoelectric position sensor 3 in the annular array is arranged above the workpiece ring, the single-point motion track on the ring polishing workpiece ring can be automatically detected in the motion process of the workpiece ring, the detection process is simple and convenient, the precision is high, the three-dimensional motion track of the single point on the workpiece ring can be obtained through the method of the embodiment, and then the motion model and the contact are guided to be corrected, so that the precision of element surface shape evolution prediction is improved.
The following examples were used to demonstrate the beneficial effects of the present invention:
example 1:
in the embodiment, a workpiece ring with the diameter of 1650mm is selected for verification;
the single-point motion track detection device on the workpiece ring in the ring polishing processing of the embodiment is composed of a workpiece ring 1, 1 laser displacement sensor 2, a plurality of photoelectric position sensors 3 and a fixing plate 4;
the workpiece ring 1 and the fixing plate 4 are arranged in parallel, the workpiece ring 1 is arranged below the fixing plate 4, a blind hole 11 is formed in the upper surface of the workpiece ring 1, the laser displacement sensor 2 is arranged inside the blind hole 11, the laser displacement sensor 2 is perpendicular to the upper surface of the workpiece ring 1, and the sensing end of the laser displacement sensor 2 faces the fixing plate 4; the photoelectric position sensors 3 are arranged on the lower surface of the fixing plate 4 in an annular array mode, the sensing ends of the photoelectric position sensors 3 are arranged towards the workpiece ring 1, and the center of the annular array of the photoelectric position sensors 3 corresponds to the center of the workpiece ring 1; the center of the sensing end of the photoelectric position sensor 3 corresponds to the center of the sensing end of the laser displacement sensor 2;
the parallelism between the upper surface of the workpiece ring 1 and the lower surface of the fixed plate 4 is less than 5 mu m;
the vertical distance between the upper surface of the workpiece ring 1 and the lower surface of the fixing plate 4 is 300 mm;
the flatness of the lower surface of the fixed plate 4 is less than 5 mu m;
the positioning precision of the photoelectric position sensor 3 in the range of 3mm multiplied by 3mm is less than 3 mu m;
the verticality between the laser displacement sensor 2 and the workpiece ring 1 is less than 5 mu m;
the photoelectric position sensor 3 is adsorbed on the lower surface of the fixing plate 4 through a vacuum chuck;
the detection precision of the laser displacement sensor 2 is less than 3 mu m;
the method for detecting the single-point motion trail by using the single-point motion trail detection device on the workpiece ring in the ring polishing processing comprises the following steps:
firstly, adjusting the parallelism between the upper surface of the workpiece ring 1 and the lower surface of the fixed plate 4 to be less than 5 mu m;
adjusting the horizontal position of the laser displacement sensor 2 to enable the center of the sensing end of the photoelectric position sensor 3 to vertically correspond to the center of the sensing end of the laser displacement sensor 2;
starting the workpiece ring 1, recording plane coordinate data x and y of a central point of the position where the laser displacement sensor 2 is located by using the photoelectric position sensor 3 and recording vertical height change z of the central point of the position where the laser displacement sensor 2 is located by using the laser displacement sensor 2 in the process that the laser displacement sensor 2 rotates along with the workpiece ring 1;
drawing the plane coordinate data x and y recorded by the photoelectric position sensor 3 and the laser displacement sensor 2 into a plane motion trail diagram of the central point of the position where the laser displacement sensor 2 is located, and drawing the plane coordinate data x and y and the vertical height change z recorded by the photoelectric position sensor 3 and the laser displacement sensor 2 into a three-dimensional motion trail diagram of the central point of the position where the laser displacement sensor 2 is located; namely, the detection of the motion trail of the single point on the workpiece ring in the ring polishing processing is completed;
the plane coordinate data x and y and the vertical height change z of a single point on the workpiece ring with the diameter of 1650mm obtained in the embodiment are shown in table 1; the plane coordinate data x and y in table 1 are plotted as a plane motion trail graph, as shown in fig. 3, and the plane coordinate data x and y and the vertical height change z are plotted as a three-dimensional motion trail graph, as shown in fig. 4, that is, the detection of the present embodiment is completed. As can be seen from fig. 3 and 4, the error of the roundness of the plane of the workpiece ring is 132.924mm, and the error of the movement of the height is 4.833mm, which indicates that the error of the radial movement of the workpiece ring is large, and the control of the amount of radial movement of the workpiece should be increased. Meanwhile, the radial motion error affects the actual motion trajectory of the workpiece, and the influence of radial motion should be added to the motion model.
TABLE 1
Claims (9)
1. The utility model provides a single point motion trail detection device on work piece ring in processing is thrown to ring which characterized in that: the device consists of a workpiece ring (1), 1 laser displacement sensor (2), a plurality of photoelectric position sensors (3) and a fixing plate (4);
the workpiece ring (1) and the fixing plate (4) are arranged in parallel, the workpiece ring (1) is arranged below the fixing plate (4), a blind hole (11) is formed in the upper surface of the workpiece ring (1), the laser displacement sensor (2) is arranged in the blind hole (11), the laser displacement sensor (2) is perpendicular to the upper surface of the workpiece ring (1), and the sensing end of the laser displacement sensor (2) faces the fixing plate (4); the photoelectric position sensors (3) are arranged on the lower surface of the fixing plate (4) in an annular array mode, the sensing ends of the photoelectric position sensors (3) are arranged towards the workpiece ring (1), and the centers of the annular arrays of the photoelectric position sensors (3) correspond to the center of the workpiece ring (1); the center of the sensing end of the photoelectric position sensor (3) is arranged corresponding to the center of the sensing end of the laser displacement sensor (2).
2. The device for detecting the single-point motion trajectory on the workpiece ring in the ring polishing process according to claim 1, characterized in that: the parallelism between the upper surface of the workpiece ring (1) and the lower surface of the fixing plate (4) is less than 5 mu m.
3. The device for detecting the single-point motion trajectory on the workpiece ring in the ring polishing process according to claim 1, characterized in that: the vertical distance between the upper surface of the workpiece ring (1) and the lower surface of the fixing plate (4) is 300-400 mm.
4. The device for detecting the single-point motion trajectory on the workpiece ring in the ring polishing process according to claim 1, characterized in that: the flatness of the lower surface of the fixing plate (4) is less than 5 mu m.
5. The device for detecting the single-point motion trajectory on the workpiece ring in the ring polishing process according to claim 1, characterized in that: the positioning accuracy of the photoelectric position sensor (3) in the range of 3mm multiplied by 3mm is less than 3 mu m.
6. The device for detecting the single-point motion trajectory on the workpiece ring in the ring polishing process according to claim 1, characterized in that: the verticality between the laser displacement sensor (2) and the workpiece ring (1) is less than 5 mu m.
7. The device for detecting the single-point motion trajectory on the workpiece ring in the ring polishing process according to claim 1, characterized in that: the photoelectric position sensor (3) is adsorbed on the lower surface of the fixing plate (4) through a vacuum chuck.
8. The device for detecting the single-point motion trajectory on the workpiece ring in the ring polishing process according to claim 1, characterized in that: the detection precision of the laser displacement sensor (2) is less than 3 mu m.
9. A method for detecting a single point motion trajectory by using the single point motion trajectory detection device on the workpiece ring in ring polishing processing according to claim 1, characterized in that: the method comprises the following steps:
firstly, adjusting the parallelism between the upper surface of the workpiece ring (1) and the lower surface of the fixed plate (4) to be less than 5 mu m;
adjusting the horizontal position of the laser displacement sensor (2) to enable the center of the sensing end of the photoelectric position sensor (3) to vertically correspond to the center of the sensing end of the laser displacement sensor (2);
thirdly, starting the workpiece ring (1), recording plane coordinate data x and y of a central point of the position where the laser displacement sensor (2) is located by using the photoelectric position sensor (3) and recording vertical height change z of the central point of the position where the laser displacement sensor (2) is located by using the laser displacement sensor (2) in the process that the laser displacement sensor (2) rotates along with the workpiece ring (1);
drawing the plane coordinate data x and y recorded by the photoelectric position sensor (3) into a plane motion track diagram of the central point of the position where the laser displacement sensor (2) is located, and drawing the plane coordinate data x and y and the vertical height change z recorded by the photoelectric position sensor (3) and the laser displacement sensor (2) into a three-dimensional motion track diagram of the central point of the position where the laser displacement sensor (2) is located; and then the single-point motion track detection on the workpiece ring in the ring polishing processing is completed.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110986865B (en) * | 2019-12-25 | 2022-03-22 | 苏州伟信奥图智能科技有限公司 | Ring defect detection method |
| CN114061920A (en) * | 2020-08-07 | 2022-02-18 | 北京小米移动软件有限公司 | Folding track detection device, folding track detection method and folding detection system |
| CN112097641B (en) * | 2020-08-28 | 2023-05-23 | 天津津航技术物理研究所 | Positioning accuracy measuring device and measuring method for push-out type photoelectric equipment |
| CN116652419B (en) * | 2023-06-13 | 2024-01-05 | 大辽激光科技(宁波)有限公司 | Blind hole machining method based on visual image |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103144036A (en) * | 2012-12-31 | 2013-06-12 | 南京理工大学 | Grinding amount on-line monitoring device at ring-polishing stage and grinding amount on-line monitoring method |
| CN103868480A (en) * | 2012-12-10 | 2014-06-18 | 苏州星诺奇传动科技有限公司 | Radial and end face runout measurement device |
| CN203773802U (en) * | 2014-03-21 | 2014-08-13 | 金陵科技学院 | Novel LED motion locus plotter based on photoelectric induction |
| CN103978430A (en) * | 2014-05-21 | 2014-08-13 | 成都精密光学工程研究中心 | Method for detecting polishing disk surface shape during full-caliber plane polishing |
| CN104034284A (en) * | 2014-06-30 | 2014-09-10 | 中国科学院上海光学精密机械研究所 | Polishing rubber disc face shape detection device for large annular polishing machine |
| CN104197874A (en) * | 2014-07-04 | 2014-12-10 | 丽水学院 | In-place measuring method for runout of high precision gyrorotor |
| CN105043737A (en) * | 2015-07-21 | 2015-11-11 | 河南科技大学 | Bearing retainer trajectory measurement method based on error separation technology |
| CN105203065A (en) * | 2015-09-14 | 2015-12-30 | 成都精密光学工程研究中心 | Ring throwing machine plastic disc face shape detection method |
| CN105690258A (en) * | 2016-03-08 | 2016-06-22 | 华侨大学 | In-situ measurement method and device for radial run-out of grinding wheel |
| CN106949852A (en) * | 2017-04-10 | 2017-07-14 | 哈尔滨工业大学 | Ring throws the detection means and detection method of processing correction-plate surface shape error |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140120802A1 (en) * | 2012-10-31 | 2014-05-01 | Wayne O. Duescher | Abrasive platen wafer surface optical monitoring system |
-
2017
- 2017-11-13 CN CN201711115936.9A patent/CN107883964B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103868480A (en) * | 2012-12-10 | 2014-06-18 | 苏州星诺奇传动科技有限公司 | Radial and end face runout measurement device |
| CN103144036A (en) * | 2012-12-31 | 2013-06-12 | 南京理工大学 | Grinding amount on-line monitoring device at ring-polishing stage and grinding amount on-line monitoring method |
| CN203773802U (en) * | 2014-03-21 | 2014-08-13 | 金陵科技学院 | Novel LED motion locus plotter based on photoelectric induction |
| CN103978430A (en) * | 2014-05-21 | 2014-08-13 | 成都精密光学工程研究中心 | Method for detecting polishing disk surface shape during full-caliber plane polishing |
| CN104034284A (en) * | 2014-06-30 | 2014-09-10 | 中国科学院上海光学精密机械研究所 | Polishing rubber disc face shape detection device for large annular polishing machine |
| CN104197874A (en) * | 2014-07-04 | 2014-12-10 | 丽水学院 | In-place measuring method for runout of high precision gyrorotor |
| CN105043737A (en) * | 2015-07-21 | 2015-11-11 | 河南科技大学 | Bearing retainer trajectory measurement method based on error separation technology |
| CN105203065A (en) * | 2015-09-14 | 2015-12-30 | 成都精密光学工程研究中心 | Ring throwing machine plastic disc face shape detection method |
| CN105690258A (en) * | 2016-03-08 | 2016-06-22 | 华侨大学 | In-situ measurement method and device for radial run-out of grinding wheel |
| CN106949852A (en) * | 2017-04-10 | 2017-07-14 | 哈尔滨工业大学 | Ring throws the detection means and detection method of processing correction-plate surface shape error |
Non-Patent Citations (1)
| Title |
|---|
| 大口径光学元件超精密环抛技术研究;曹冲;《中国优秀博硕士学位论文全文数据库(硕士) 工程科技Ⅱ辑》;20050315(第1期);第C030-26页 * |
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| CN107883964A (en) | 2018-04-06 |
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