CN115972096A - Method for controlling removal amount distribution of double-sided polishing equipment - Google Patents
Method for controlling removal amount distribution of double-sided polishing equipment Download PDFInfo
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- CN115972096A CN115972096A CN202211532859.8A CN202211532859A CN115972096A CN 115972096 A CN115972096 A CN 115972096A CN 202211532859 A CN202211532859 A CN 202211532859A CN 115972096 A CN115972096 A CN 115972096A
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Abstract
The invention relates to a method for controlling removal amount distribution of double-sided polishing equipment, which comprises the following steps: s1: a preparation process: recording specified removal amount distribution or setting uniform removal on double-sided polishing equipment, and setting processing time; s2: loading the element to start processing, and fitting pressure distribution on the element according to pressure information of each point of the polishing working surface collected by the pressure sensor; s3: calculating correct track concentration distribution according to the setting of the S1; s4: adjusting the swing speeds of the upper polishing disc in the X direction and the Y direction through an adjusting device according to the calculated track concentration distribution, so that the track concentration of the surface of the element accords with the calculation result; s5: and repeating S2-S4 according to the set interval time until the machining time is finished, and finishing the polishing process. The automatic grinding and feeding device can automatically adjust the grinding and feeding speed according to the acquired pressure data in the machining process, and effectively solves the problem that the removal amount of each position of an element cannot be accurately regulated and controlled.
Description
Technical Field
The invention relates to the field of optical element polishing, in particular to a method for controlling removal amount distribution of double-sided polishing equipment.
Background
In the field of plane optical element polishing, double-sided polishing is a commonly used polishing method, can polish the full aperture of an element, has high efficiency, is difficult to realize targeted removal of high points of the element, and has very limited planeness indexes.
At present, when optical elements are subjected to double-side polishing, pressure is generally applied to the elements by an upper polishing disc, and parameters such as rotating speed of the upper polishing disc and rotating speed of the lower polishing disc, feeding speed of the elements and the like are adjusted to realize different removal processes.
Therefore, the problem that the removal amount of each position of an element cannot be accurately regulated and controlled in the double-sided polishing process of the optical element by the conventional double-sided polishing equipment is to be solved.
Disclosure of Invention
The invention aims to provide a control method for removal amount distribution of double-sided polishing equipment, which utilizes a distributed pressure sensor to collect the pressure distribution condition of the surface of an element, calculates the motion track concentration distribution of the element by combining preset target removal amount distribution, generates a processing program with each point feeding speed, can realize accurate control on the removal amount under the condition of any polishing disk and element surface type, can be adjusted on line along with the tiny change of the element surface type in the processing process, can greatly improve the polishing processing efficiency of optical elements, accurately remove high points and improve the flatness precision of the double-sided polishing equipment.
The technical scheme for realizing the purpose of the invention is as follows: the invention comprises the following steps:
s1: a preparation process: recording specified removal amount distribution or setting uniform removal on double-sided polishing equipment, and setting processing time; the upper polishing disc of the double-sided polishing equipment is provided with a pressure sensor for collecting pressure information of each point on a polishing working surface; the upper polishing pad of the upper polishing disk is positioned between the pressure sensor and the element;
s2: loading the element for processing, and fitting the pressure distribution on the element according to the pressure information of each point of the polishing working surface collected by the pressure sensor;
s3: calculating correct track concentration distribution according to the setting of the S1;
s4: adjusting the swing speeds of the upper polishing disc in the X direction and the Y direction through an adjusting device according to the calculated track concentration distribution, so that the track concentration of the surface of the element accords with the calculation result;
s5: repeating S2-S4 according to the set interval time until the processing time is finished, and finishing the polishing process;
wherein the specified removal amount distribution in step S1 is obtained by subtracting the measured surface type of the element from the target surface type; wherein the uniform removal in step S1 is a setting such that the removal amount of each point on the element is uniform.
In the step S5, the interval time is adjusted according to the variation of the surface type of the element and the height of the polishing pad during the processing, and when the removal efficiency is high due to factors such as high pressure and high concentration of the polishing solution, the interval time of the adjustment period needs to be shortened, and when the removal efficiency is low, the interval time of the adjustment period can be prolonged.
Further, the pressure sensor in S2 is a thin film pressure sensor; the pressure sensors are distributed on the mounting seat of the upper polishing disk, which is used for mounting the upper polishing pad, and are positioned between the mounting seat and the upper polishing pad.
Furthermore, a plurality of piezoresistor groups for detecting pressure are distributed on the pressure sensor; each piezoresistor group comprises a plurality of piezoresistors which are uniformly distributed along the circumference of the rotating axis of the upper polishing disk; all the piezoresistor groups are coaxially arranged; the piezoresistors on two adjacent piezoresistor groups are staggered with each other. Wherein two adjacent piezoresistors in each piezoresistor group are spaced apart by an angle of 30 °. The piezoresistors on two adjacent piezoresistor groups are staggered by an angle of 15 degrees.
Further, in the step S2, fitting operation is performed according to the results collected by the piezoresistors on the pressure sensor, so as to obtain the pressure distribution of the entire element surface.
Further, if the setting of step S1 in step S3 is a uniform distribution, the calculated trace concentration distribution is a result of reversing the pressure distribution; if the setting of S1 is the specified removal amount distribution, the calculated trace density distribution is the difference between the specified removal amount and the pressure distribution.
Further, the adjusting device is an XY two-axis sliding table capable of adjusting in the X direction and the Y direction; the driving device for driving the upper polishing disc is fixedly arranged on the XY two-axis sliding table and swings in the X direction and the Y direction under the driving of the XY two-axis sliding table; the track concentration for realizing the track contact ratio in the X direction can be controlled by adjusting the swing speed of the upper polishing disc in the X direction; the track concentration for realizing track contact ratio in the Y direction can be controlled by adjusting the swing speed of the upper polishing disc in the Y direction; wherein the higher the moving speed, the lower the trace density.
Further, the interval time in the above step S5 is not less than the time required for a single adjustment cycle.
The invention has the positive effects that: the invention is used for solving the problem that the removal amount of each position of an optical element cannot be accurately regulated and controlled in the double-sided polishing process of the optical element by the conventional double-sided polishing equipment. By designing a set of removal amount on-line control system, the pressure distribution between the polishing upper disc and the optical element, which is acquired by a distributed pressure sensor, is utilized, the track concentration distribution is calculated according to the set removal amount distribution, the swing speeds in the X and Y directions are adjusted, the accurate control of the removal amount is realized, the pressure between the polishing upper disc and the element can be detected on line under the conditions of no interruption and influence on processing, the track concentration distribution is adjusted in real time to keep stable removal amount distribution, the problem that the removal amount cannot be controlled by double-sided polishing is solved, a large amount of process development time can be saved, and the processing accuracy of double-sided polishing is improved to a new height.
Drawings
In order that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings
FIG. 1 is a diagram of the process steps of the present invention;
FIG. 2 is a schematic view of the construction of the upper polishing pad of the present invention;
FIG. 3 is a schematic illustration of the polishing of the present invention;
FIG. 4 is a distribution diagram of a pressure sensor according to the present invention;
FIG. 5 is a graph showing the pressure distribution applied to the upper polishing pad in accordance with the preferred embodiment of the present invention;
FIG. 6 is a graph showing a pressure profile imparted by the upper polishing pad in practice of an embodiment of the present invention;
FIG. 7 is a graph showing the pressure profile applied to an original by an upper polishing pad at one point in time in accordance with an embodiment of the present invention;
FIG. 8 is a graph of a trace concentration distribution calculated from uniform removal, in accordance with an embodiment of the present invention;
FIG. 9 is a schematic diagram illustrating an embodiment of the present invention for adjusting the swing speed of the upper polishing pad;
FIG. 10 shows the swing speed at each point in the machining program during a single conditioning cycle of the present invention.
Detailed Description
(example 1)
Referring to fig. 1, the present invention comprises the steps of:
s1: a preparation process: the uniform removal was set on the double-side polishing apparatus (so the route of the method proceeds according to the uniform processing in fig. 1), the processing time period of 2h was set, the conditioning cycle was set to be performed every 15min (steps S2 to S4 are one conditioning cycle), and the down pressure of the upper polishing disk 1 was set to 200N.
Wherein, the upper polishing disk 1 of the double-sided polishing equipment is provided with a pressure sensor 2 used for collecting pressure information of each point on the polishing working surface; the upper polishing pad 3 of the upper polishing disc 1 is located between the pressure sensor 2 and the element 4; the pressure sensor 2 is a film pressure sensor; the pressure sensors 2 are distributed on a mounting seat 5 of the upper polishing disk 1 for mounting the upper polishing pad 3 and are positioned between the mounting seat 5 and the upper polishing pad. The electric signal of the pressure sensor 2 is transmitted to the data processing unit of the double-side polishing equipment by a wireless transmission module (WLAN, bluetooth, NB-loT, etc.) in the integrated circuit.
A plurality of piezoresistor groups for detecting pressure are distributed on the pressure sensor 2; each piezoresistor group comprises a plurality of piezoresistors 21 which are uniformly distributed along the circumference of the rotating axis of the upper polishing disk 1; each piezoresistor group is coaxially arranged; the piezoresistors 21 on two adjacent piezoresistor groups are staggered with each other. Wherein two adjacent piezoresistors 21 in each piezoresistor group are spaced apart by an angle of 30 °. The piezoresistors 21 on two adjacent piezoresistor groups are staggered by an angle of 15 degrees.
Since the double-side polishing apparatus is an existing apparatus, only the modified parts will be described, and other parts of the apparatus for realizing double-side polishing can refer to the prior art. And the modified portions may refer to fig. 2 to 4.
S2: loading the element 4 for processing, and fitting the pressure distribution on the element 4 according to the pressure information of each point of the polishing working surface collected by the pressure sensor 2; that is, the fitting operation is performed on the results collected by the piezoresistors on the pressure sensor, so as to obtain the pressure distribution of the whole element surface, as shown in fig. 7, where the pressure at point a is 193n and the pressure at point b is 181N.
S3: the pressure profile is converted to a concentration profile and reversed to obtain a trace concentration profile, see fig. 8.
S4: adjusting the swing speeds of the upper polishing disc in the X and Y directions through an adjusting device 6 according to the calculated track concentration distribution, so that the track concentration of the element surface conforms to the calculation result; this corresponds to converting the track density distribution into the swing velocity of each point, see fig. 9 and 10. As shown in FIG. 9, the swing speed of the section S1 is 1mm/S, the swing speed of the section S2 is 0.8mm/S, the swing speed of the section S3 is 0.5mm/S, and the swing speed of the section S4 is 0.2mm/S. As shown in fig. 10, the swing speeds of the point C in the X direction and the Y direction are (-1.6 mm/s,1.7 mm/s); the swing speeds of the point D in the X direction and the Y direction were (0.4 mm/s ).
Wherein the adjusting device 6 is an XY two-axis sliding table which can adjust in the X direction and the Y direction; a driving device for driving the upper polishing disk 1 is fixedly arranged on the XY two-axis sliding table and swings in the X direction and the Y direction under the driving of the XY two-axis sliding table; the track concentration for realizing track contact ratio in the X direction can be controlled by adjusting the swing speed of the upper polishing disc 1 in the X direction; the track concentration for realizing track contact ratio in the Y direction can be controlled by adjusting the swing speed of the upper polishing disc 1 in the Y direction; wherein the higher the moving speed, the lower the trace density, the adjusting device 6 can be seen in fig. 2.
S5: and repeating the steps S2-S4 every 15min until the machining time is finished, and finishing the polishing process.
In the step S5, the interval time is adjusted according to the variation of the surface type of the element and the height of the polishing pad during the processing, and when the removal efficiency is high due to factors such as high pressure and high concentration of the polishing solution, the interval time of the adjustment period needs to be shortened, and when the removal efficiency is low, the interval time of the adjustment period is prolonged.
(example 2)
In the invention, a mode of specifying the removal amount distribution is adopted in the step S1, and the specified removal amount distribution is obtained by subtracting the surface type measured by the element from the target surface type. Referring to fig. 5 and 6, fig. 5 is subtracted from fig. 6. The other steps are the same as in example 1. The specific process route was carried out according to the removal profile specified in FIG. 1.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A control method of removal amount distribution of double-sided polishing equipment; the method is characterized by comprising the following steps:
s1: a preparation process: recording specified removal amount distribution or setting uniform removal on double-sided polishing equipment, and setting processing time; the upper polishing disc of the double-sided polishing equipment is provided with a pressure sensor for collecting pressure information of each point on a polishing working surface; the upper polishing pad of the upper polishing disk is positioned between the pressure sensor and the element;
s2: loading the element to start processing, and fitting pressure distribution on the element according to pressure information of each point of the polishing working surface collected by the pressure sensor;
s3: calculating correct track concentration distribution according to the setting of the S1;
s4: adjusting the swing speeds of the upper polishing disc in the X direction and the Y direction through an adjusting device according to the calculated track concentration distribution, so that the track concentration of the surface of the element accords with the calculation result;
s5: repeating S2-S4 according to the set interval time until the processing time is finished, and finishing the polishing process;
wherein, the specified removal amount distribution in the step S1 is obtained by subtracting the measured surface type of the element from the target surface type; wherein the uniform removal in step S1 is a setting such that the removal amount of each point on the element is uniform.
2. A method of controlling a removal amount distribution of a double-side polishing apparatus according to claim 1, wherein: the pressure sensor in the S2 is a film pressure sensor; the pressure sensors are distributed on the mounting seat of the upper polishing disc, which is used for mounting the upper polishing pad, and are positioned between the mounting seat and the upper polishing pad.
3. The method of controlling a removal amount distribution of a double-side polishing apparatus according to claim 2, characterized in that: a plurality of piezoresistor groups for detecting pressure are distributed on the pressure sensor; each piezoresistor group comprises a plurality of piezoresistors which are uniformly distributed along the circumference of the rotating axis of the upper polishing disk; each piezoresistor group is coaxially arranged; the piezoresistors on two adjacent piezoresistor groups are staggered with each other.
4. A control method of a removal amount distribution of a double-side polishing apparatus according to claim 3, characterized in that: in the step S2, fitting operation is performed according to the results collected by the piezoresistors on the pressure sensor, so as to obtain the pressure distribution of the whole element surface.
5. The method of controlling a removal amount distribution of a double-side polishing apparatus according to claim 1, characterized in that: if the setting of the step S1 in the step S3 is uniform distribution, the calculated track concentration distribution is a result of the pressure distribution reversal; if the setting of S1 is the specified removal amount distribution, the calculated trace density distribution is the difference between the specified removal amount and the pressure distribution.
6. A method of controlling a removal amount distribution of a double-side polishing apparatus according to claim 1, wherein: the adjusting device is an XY two-axis sliding table capable of adjusting in the X direction and the Y direction; the driving device for driving the upper polishing disc is fixedly arranged on the XY two-axis sliding table and swings in the X direction and the Y direction under the driving of the XY two-axis sliding table;
the track concentration for realizing track contact ratio in the X direction can be controlled by adjusting the swing speed of the upper polishing disc in the X direction; the track concentration for realizing track contact ratio in the Y direction can be controlled by adjusting the swing speed of the upper polishing disc in the Y direction; wherein the greater the moving speed, the smaller the trace density.
7. The method of controlling a removal amount distribution of a double-side polishing apparatus according to claim 1, characterized in that: the interval time in step S5 is not less than the time required for a single adjustment cycle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211532859.8A CN115972096A (en) | 2022-12-01 | 2022-12-01 | Method for controlling removal amount distribution of double-sided polishing equipment |
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| CN202211532859.8A CN115972096A (en) | 2022-12-01 | 2022-12-01 | Method for controlling removal amount distribution of double-sided polishing equipment |
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| CN115972096A true CN115972096A (en) | 2023-04-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116494120A (en) * | 2023-06-29 | 2023-07-28 | 苏州博宏源机械制造有限公司 | Large disc detection method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116494120A (en) * | 2023-06-29 | 2023-07-28 | 苏州博宏源机械制造有限公司 | Large disc detection method |
| CN116494120B (en) * | 2023-06-29 | 2023-09-19 | 苏州博宏源机械制造有限公司 | Large disc detection method |
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