CN107883210A - A kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp - Google Patents
A kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp Download PDFInfo
- Publication number
- CN107883210A CN107883210A CN201711366546.9A CN201711366546A CN107883210A CN 107883210 A CN107883210 A CN 107883210A CN 201711366546 A CN201711366546 A CN 201711366546A CN 107883210 A CN107883210 A CN 107883210A
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- thermal conductive
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- power
- light fixture
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- 239000007788 liquid Substances 0.000 title claims abstract description 28
- 238000001816 cooling Methods 0.000 title claims abstract description 21
- 238000012546 transfer Methods 0.000 title claims abstract description 21
- 239000012530 fluid Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 26
- 239000013078 crystal Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000499 gel Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000003921 oil Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 210000004209 hair Anatomy 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 6
- 229910017083 AlN Inorganic materials 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- 238000005057 refrigeration Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp.It includes LED illuminating sources, the cold heat transfer system of liquid, water cooling system and driving power；The cold heat transfer system of liquid includes thermal conductive cavity, catheter and pump；The both ends open of thermal conductive cavity is connected with catheter, and conductive fluid is filled in thermal conductive cavity and catheter, sets pump to drive on catheter；Water cooling system includes radiating row and fan；Fan is fixed on radiating row；LED illuminating sources are arranged in thermal conductive cavity, and are located opening above LED illuminating sources on thermal conductive cavity and passed through lens seals；The two poles of the earth of driving power are connected by the power line through heat conduction cavity wall with LED illuminating sources, and power line seals through at heat conduction cavity wall；Connection radiating row on catheter.Heat conduction of the present invention and radiating effect are obvious, and volume and weight is reduced.
Description
Technical field
The present invention relates to a kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp, belong to high-power LED lamp technology neck
Domain.
Background technology
It is increasing to great power LED demand now with the extensive use of LED lamp, and more next is required to LED power
It is higher.High-power LED lamp can produce substantial amounts of heat, so in the market great power LED is but generally large volume, big radiator,
Also big weight, all effectively it can not conduct heat and radiate, cause this to user in the actual use of high-power LED lamp and installation side
Face brings very big inconvenience.LED electro-optical efficiency is about 20%, and about 80% electric energy is converted to heat and distributed, therefore
Heat flow density at its chip is high, and chip light emitting produces substantial amounts of heat after being powered；Blue light be converted into by fluorescent material it is white
Substantial amounts of heat is generated in the process of light, the heat part of chip can be conducted by substrate, but luminous fluorescent transition material produces
Raw heat, which can not be exported effectively, easily causes temperature too high.Fluorescent material temperature rises the junction temperature rise meeting that can influence LED chip
Luminous efficiency decline, the lost of life, luminescent spectrum is caused to produce drift, serious can also burn chip, so chip and fluorescence
The heat conduction and radiating of material are that key problems-solving is needed in high-power LED illumination.Current existing various LEDs frequently with
Substrate or heat pipe for thermal conductivity, natural air convection current is passively radiated or other heat conduction and heat radiation modes, causes great power LED with these modes
Light fixture is bulky, and weight is overweight, inconvenient for use.
Therefore it provides a kind of heat conduction and the preferable high-power LED lamp of radiating effect, just turn into those skilled in the art urgently
Need to solve the problems, such as.
The content of the invention
It is an object of the invention to provide a kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp, present invention liquid are cold fast
Speed conducts heat supporting air-cooled forced heat radiation to solve asking for the quick conductive of high-power LED chip and fluorescent material and quick heat radiating
Topic, the present invention can actively guide heat caused by chip and fluorescent material, and heat conduction and radiating effect are obvious, and the cold heat conduction of liquid adds wind
The aluminium of the cold passive heat conduction and heat radiation for eliminating conventional lamp that radiates, volume and weight is reduced, and is solved well
Super-high-power LED heat conduction and heat dissipation problem.
A kind of cold heat transfer of liquid provided by the invention and wind-cooling heat dissipating high-power LED lamp, it includes LED illuminating sources, liquid
Cold heat transfer system, water cooling system and driving power；
The cold heat transfer system of liquid includes thermal conductive cavity, catheter and pump；The both ends open of the thermal conductive cavity and the drain
Pipe is connected, and conductive fluid is filled in the thermal conductive cavity and the catheter, sets the pump to drive on the catheter；
The water cooling system includes radiating row and fan；The fan is fixed on the radiating row；
The LED illuminating sources are arranged in the thermal conductive cavity, and on the LED illuminating sources on the thermal conductive cavity
Opening passes through lens seals at side；
The two poles of the earth of the driving power pass through the power line through the heat conduction cavity wall and the LED illuminating sources phase
Connection, and the power line seals through at the heat conduction cavity wall；
The radiating row is connected on the catheter.
In the present invention, the thermal conductive cavity, the radiating row, the pump, the catheter connect into confined space.
In above-mentioned light fixture, the LED illuminating sources include fluorescent material layer, chip and the light set gradually from top to bottom
Source substrate；Circuit is arranged in the one side of the light source substrate and crystal bonding area is set, along the die bond area edge box dam glue；Institute
Chip is stated to be arranged on the crystal bonding area；
The two poles of the earth of the driving power through the power line of the heat conduction cavity wall with the light source substrate by being connected
Connect.
In above-mentioned light fixture, the coated on one side heat-conducting glue of the crystal bonding area is not provided with the light source substrate.
In above-mentioned light fixture, set in the thermal conductive cavity and be coated with heat-conducting glue in the one side cavity wall of the LED illuminating sources.
In above-mentioned light fixture, the conductive fluid is added by the liquid injection port set on the thermal conductive cavity.
In above-mentioned light fixture, the fan is screwed on the radiating row.
In above-mentioned light fixture, it is connected to by pump described in pumping source line in the driving power.
In above-mentioned light fixture, it is connected to by fan described in fan power supply line in the driving power.
In above-mentioned light fixture, the light source substrate is in aluminium nitride substrate, aluminum oxide substrate, aluminium base and copper base
It is at least one；
The chip is flip LED chips；
The material of the fluorescent material layer is phosphor gel and/or fluorescent crystal, and the phosphor gel is that silica gel mixing is glimmering
Light powder or epoxy resin mixed fluorescent powder, the fluorescent crystal are glass fluorescent crystal or transparent fluorescent ceramic；
The thickness of the fluorescence coating is 0.1~0.8mm；
The thickness of the light source substrate is 0.5~3mm.
In above-mentioned light fixture, the conductive fluid is selected from least one of water, oil and solution；
In the present invention, the conductive fluid is at least one of water commonly used in the art, oil and solution；
The water concretely ultra-pure water, deionized water or distilled water；Oily concretely silicone oil, kerosene or the lubrication
Oil；The solution concretely glucose solution, alcohol.
The present invention has advantages below：
1) light source substrate front, luminescence chip, fluorescent material pyrotoxin, which are all placed in conductive fluid, reduces heat transfer level, greatly
Width reduces thermal resistance, ensures that heat exports in time, light source works long hours unattenuated；
2) pump is started working after being powered, and conductive fluid flows rapidly, quickly take away heat of light source, it is ensured that light-source temperature not heap
Product, ensure light source light extraction efficiency and life-span；
3) heat is transmitted to rapidly on radiating row by conductive fluid by catheter, and the rapid refrigeration radiating venting of fan removes heat conduction
Liquid temperature degree；Heat conduction and heat radiation is rapid, and heat dissipating mass can be reduced with power, effectively reduces whole lamp volume and weight, can make lightweight
LED high-power illumination light fixtures
4) heat conduction and heat radiation is rapid, and heat dissipating mass can be reduced with power, effectively reduces whole lamp volume and weight, can make light weight
Change LED high-power illumination light fixtures；
5) present invention has good heat conduction and heat radiation ability, can realize large-power lamp, light source works in small area light source
The features such as low light efficiency of temperature is good, production technology is advanced and production efficiency is high.
Brief description of the drawings
Fig. 1 is the cold heat transfer of liquid of the present invention and wind-cooling heat dissipating high-powered LED lamp structure schematic diagram.
Each mark is as follows in Fig. 1：
1 lens；2 chips and fluorescent material layer；3 thermal conductive cavities；4 conductive fluids；5 driving powers；6 radiating rows；7 fans；8 pumps；9
Heat conducting pipe；10 box dam glue；11 light source substrates；12 light source power connecting lines；13 liquid injection ports；14 pumping source lines；15 fan power supply lines；
16 conductive fluid loop directions are illustrated.
Embodiment
Experimental method used in following embodiments is conventional method unless otherwise specified.
Material used, reagent etc., unless otherwise specified, are commercially obtained in following embodiments.
The present invention is further described below in conjunction with the accompanying drawings, but the invention is not limited in following examples.
The cold heat transfer of embodiment 1, a kind of liquid and wind-cooling heat dissipating high-power LED lamp
As shown in figure 1, for the cold heat transfer of liquid of the present invention and the structural representation of wind-cooling heat dissipating high-power LED lamp, it includes
The cold heat transfer system of LED illuminating sources, liquid, water cooling system and driving power 5.
LED illuminating sources include the chip and fluorescent material layer 2 and light source substrate 11 set gradually from top to bottom；Light source
Circuit is arranged in the one side of substrate 11 and crystal bonding area is set, another side coating heat-conducting glue, along die bond area edge box dam glue 10；
Chip is arranged on crystal bonding area.
The cold heat transfer system of liquid includes thermal conductive cavity 3, catheter 9 and pump 8；The both ends open of thermal conductive cavity 3 is connected with catheter 9
It is logical, conductive fluid 4 is filled in thermal conductive cavity 3 and catheter 9, liquid injection port can be set on thermal conductive cavity in order to facilitate the addition of conductive fluid 4
13, set pump 8 to drive on catheter 9, pump 8 is connected in driving power 5 by pumping source line 14.
Water cooling system includes radiating row 6 and fan 7；Fan 7 is screwed on radiating row 6, and fan 7 passes through
Fan power supply line 15 is connected in driving power 5.
LED illuminating sources are arranged in thermal conductive cavity 3, and place's opening passes through thoroughly above LED illuminating sources on thermal conductive cavity 3
Mirror 1 seals；Set in thermal conductive cavity 3 and be coated with heat-conducting glue in the one side cavity wall of LED illuminating sources.
The two poles of the earth of driving power 5 by power line through the wall of thermal conductive cavity 3 (specifically also known as light source power connecting line) 12 with
Light source substrate 11 is connected, and power line 12 seals through at the wall of thermal conductive cavity 3；
Connection radiating row 6 on catheter 9.
The cold heat transfer of embodiment 2, a kind of liquid and the preparation of wind-cooling heat dissipating high-power LED lamp
What is prepared comprises the following steps that：
1) corresponding circuit line and crystal bonding area, aluminium nitride substrate are set by silk-screen printing in the one side of aluminium nitride substrate
Another side by silk-screen mode print it is cellular can layer；
2) flip LED chips are fixed on the crystal bonding area of aluminum nitride ceramic substrate by die bond mode using bonder；
3) aluminium nitride substrate of solid good flip-chip carries out eutectic welding by eutectic furnace, completes eutectic technology and forms indigo plant
Radiant；
4) blue light source along crystal bonding area box dam glue and forms barrier wall structure by point gum machine, baking, 150 DEG C of temperature,
Time 1h, cooling；
5) by fluorescent crystal (glass fluorescent crystal or transparent fluorescent ceramic) by bonder be mounted on flip-chip just on
The baking of Fang Binghou rows is fixed, 165 DEG C of baking temperature, time 2h；
6) electricity consumption Lip river iron welds baked two electric power connection lines of light source；
7) by the light source back coated heat-conducting glue of the good connecting line of bonding wire, thermal conductive cavity inner bottom part coating heat-conducting glue, heat conduction is passed through
Light source is fixed on thermal conductive cavity bottom by glue；
8) light source power wire is passed through into line mouth, and sealed up line mouth is crossed；
9) by through the light source conductor of line mouth be welded on driving power both positive and negative polarity；
10) glass lens is connected at the top of thermal conductive cavity through seal and sealed；
11) two catheters are picked out from two interfaces of thermal conductive cavity, a root port is connected to radiating row above and seals and consolidate
Fixed, another is connected on pump and seals fixation；
12) it will radiate to arrange by catheter and connect, seal and fix with pump, and connect thermal conductive cavity, radiating row, pump, catheter
It is connected into confined space；
13) fan is screwed on radiating row；
14) pump will be connect and fan power supply line is connected in driving power；
15) conductive fluid from liquid injection port filling heat-conductive intracavitary and is sealed, that is, obtains the cold heat transfer of liquid and wind-cooling heat dissipating is high-power
LED lamp.
Claims (10)
1. a kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp, it includes LED illuminating sources, the cold heat transfer system of liquid, air-cooled
Cooling system and driving power；
The cold heat transfer system of liquid includes thermal conductive cavity, catheter and pump；The both ends open of the thermal conductive cavity and the catheter phase
Connect, conductive fluid is filled in the thermal conductive cavity and the catheter, set the pump to drive on the catheter；
The water cooling system includes radiating row and fan；The fan is fixed on the radiating row；
The LED illuminating sources are arranged in the thermal conductive cavity, and are located on the thermal conductive cavity above the LED illuminating sources
Opening passes through lens seals；
The two poles of the earth of the driving power are connected by the power line through the heat conduction cavity wall with the LED illuminating sources
Connect, and the power line seals through at the heat conduction cavity wall；
The radiating row is connected on the catheter.
2. light fixture according to claim 1, it is characterised in that：The LED illuminating sources include setting gradually from top to bottom
Fluorescent material layer, chip and light source substrate；Circuit is arranged in the one side of the light source substrate and crystal bonding area is set, along described
Die bond area edge box dam glue；The chip is arranged on the crystal bonding area；
The two poles of the earth of the driving power through the power line of the heat conduction cavity wall with the light source substrate by being connected.
3. light fixture according to claim 1 or 2, it is characterised in that：The die bond is not provided with the light source substrate
The coated on one side heat-conducting glue in area.
4. according to the light fixture any one of claim 1-3, it is characterised in that：In the thermal conductive cavity, the LED hairs are set
Heat-conducting glue is coated with the one side cavity wall of radiant.
5. according to the light fixture any one of claim 1-4, it is characterised in that：The conductive fluid passes through on the thermal conductive cavity
The liquid injection port of setting adds.
6. according to the light fixture any one of claim 1-5, it is characterised in that：The fan is screwed in described
On radiating row.
7. according to the light fixture any one of claim 1-6, it is characterised in that：Institute is connected to by pump described in pumping source line
State in driving power.
8. according to the light fixture any one of claim 1-7, it is characterised in that：Connected by fan described in fan power supply line
In in the driving power.
9. according to the light fixture any one of claim 1-8, it is characterised in that：The light source substrate is selected from aluminum-nitride-based
At least one of plate, aluminum oxide substrate, aluminium base and copper base；
The chip is flip LED chips；
The material of the fluorescent material layer is phosphor gel and/or fluorescent crystal, and the phosphor gel is silica gel mixed fluorescent powder
Or epoxy resin mixed fluorescent powder, the fluorescent crystal are glass fluorescent crystal or transparent fluorescent ceramic；
The thickness of the fluorescence coating is 0.1~0.8mm；
The thickness of the light source substrate is 0.5~3mm.
10. according to the light fixture any one of claim 1-9, it is characterised in that：The conductive fluid is selected from water, oil and solution
At least one of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711366546.9A CN107883210A (en) | 2017-12-18 | 2017-12-18 | A kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711366546.9A CN107883210A (en) | 2017-12-18 | 2017-12-18 | A kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107883210A true CN107883210A (en) | 2018-04-06 |
Family
ID=61771901
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|---|---|---|---|
| CN201711366546.9A Pending CN107883210A (en) | 2017-12-18 | 2017-12-18 | A kind of cold heat transfer of liquid and wind-cooling heat dissipating high-power LED lamp |
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| CN204227377U (en) * | 2014-10-09 | 2015-03-25 | 汪绍芬 | A kind of great power LED liquid cooling module lamp |
| CN106151982A (en) * | 2016-08-12 | 2016-11-23 | 华南理工大学 | A kind of great power LED liquid cooling heat radiation system |
| CN106287329A (en) * | 2015-06-04 | 2017-01-04 | 国立中央大学 | Liquid-cooled high-power LED spotlight |
| CN107084376A (en) * | 2017-06-29 | 2017-08-22 | 湖南明和光电设备有限公司 | A kind of cold combination cooling system of liquid cold wind |
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2017
- 2017-12-18 CN CN201711366546.9A patent/CN107883210A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103175035A (en) * | 2013-03-19 | 2013-06-26 | 潘明明 | Light-emitting diode (LED) road lamp with built-in water-cooled radiator |
| CN203099766U (en) * | 2013-03-19 | 2013-07-31 | 潘明明 | Water-cooled LED lamp |
| CN103953907A (en) * | 2014-05-19 | 2014-07-30 | 北京格林美芯科技发展有限公司 | LED (light emitting diode) liquid-cooling heat dissipation system and big-power LED spotlight |
| CN204227377U (en) * | 2014-10-09 | 2015-03-25 | 汪绍芬 | A kind of great power LED liquid cooling module lamp |
| CN106287329A (en) * | 2015-06-04 | 2017-01-04 | 国立中央大学 | Liquid-cooled high-power LED spotlight |
| CN106151982A (en) * | 2016-08-12 | 2016-11-23 | 华南理工大学 | A kind of great power LED liquid cooling heat radiation system |
| CN107084376A (en) * | 2017-06-29 | 2017-08-22 | 湖南明和光电设备有限公司 | A kind of cold combination cooling system of liquid cold wind |
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Application publication date: 20180406 |