CN107880479A - Electronic Packaging insulating materials and preparation method thereof - Google Patents
Electronic Packaging insulating materials and preparation method thereof Download PDFInfo
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- CN107880479A CN107880479A CN201711112868.0A CN201711112868A CN107880479A CN 107880479 A CN107880479 A CN 107880479A CN 201711112868 A CN201711112868 A CN 201711112868A CN 107880479 A CN107880479 A CN 107880479A
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- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
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Abstract
The invention discloses Electronic Packaging insulating materials and preparation method thereof, the Electronic Packaging insulating materials is prepared by following components：Furfural acetone formaldehyde resin, epoxyoleic acid butyl ester, XNBR, ceramic powder, adjacent chlorine para-aminophenol, ceteth, silicone oil, the carboxylate of piperazine 2, portland cement, PE waxes, 3 methyl tetrahydrochysene phthalate anhydrides.The advantages of packaging insulating material provided by the invention has ceramic material and resin material concurrently, high heat conductance and thermal coefficient of expansion are shown, meets very much requirement of the electronic applications to encapsulating material；The preparation technology of the packaging insulating material is simple simultaneously and preparation temperature is relatively low, and integral manufacturing cost is relatively low, can be widely popularized use.
Description
Technical field
The invention belongs to insulating materials technical field, and in particular to Electronic Packaging insulating materials and preparation method thereof.
Background technology
Electronic package material is to be used to carry electronic component and its phase interconnection line, a machinery is supported, sealed environment is protected,
The matrix material of the effects such as signal transmission, radiating and shielding, make electronic equipment from external environment interference, protection electronics set
The ability that life-span that is standby, improving electronic equipment and enhancing electronic device environment adapt to.
Electronic package material mainly includes ceramic base encapsulating material, plastics base encapsulating material and Metal Substrate encapsulating material.Its
Although middle ceramic base encapsulating material is steady with high intensity, high heat conductance, heat endurance, matched coefficients of thermal expansion and good chemistry
The advantages that qualitative, but its manufacturing process is complicated, cost is high, is adapted to Aero-Space and military field.Plastics base encapsulating material by
Widely use in its packaging technology is simple, cost is low.Plastics base encapsulating material mainly has：It is epoxy resin encapsulating material, organic
Silicium encapsulating material, polyimides encapsulating material and polyurethane sealing package material etc., the ratio shared by its epoxy resin is maximum, epoxy
Resin-encapsulated material has the advantages that excellent electrical insulating property, water absorption rate are low, shaping is simple, heat-resisting, but its thermal conductivity is not high,
And in high temperature environments, steam can influence the glass transition temperature, modulus of elasticity and intensity of material, and then influence material
The reliability of encapsulation.Therefore, we provide a kind of composite electron packaging insulating material, with make up homogenous material in processing and fabricating and
Deficiency in performance.
The content of the invention
It is an object of the invention to provide Electronic Packaging insulating materials and preparation method thereof, to solve above-mentioned at least one technology
Problem.
Technical scheme is come as follows：
Electronic Packaging insulating materials, it is prepared by the component of following parts by weight：
Furfural acetone formaldehyde resin 36-55 parts, epoxyoleic acid butyl ester 12-28 parts, XNBR 4-13 parts, ceramic powder 2-7 parts, neighbour
Chlorine para-aminophenol 2-5 parts, ceteth 2-7 parts, silicone oil 3-8 parts, piperazine-2-carboxylic acid salt 1-5 parts, silicate cement
Mud 0.3-1.8 parts, PE wax 0.2-1.5 parts, 3- methyl tetrahydrochysene phthalate anhydride 0.8-2.4 parts.
In above-mentioned technical proposal, the ceramic powder is prepared by the component of following parts by weight：Lanthanum nitrate 4-7.6 parts, chlorine
Change magnesium 1-3.8 parts, potassium titanate 0.9-2.5 parts, carbonic acid molybdenum 3.2-6 parts, lysine 2.2-5 parts, urea 1.8-4.3 parts and deionization
Water 50-75 parts.
In above-mentioned technical proposal, the preparation process of the ceramic powder is：
1）Lanthanum nitrate, magnesium chloride are added in 1/3 deionized water, stirring and dissolving, then add half lysine, continues to stir molten
Solution；
2）Urea is added into stirring and dissolving in 1/3 deionized water, obtains urea liquid A；
3）Take half urea liquid A that step 1 is slowly added dropwise）In, time for adding 30min, stir, obtain after being added dropwise
Mixed liquor M；
4）By step 3）Obtained mixed liquor M is transferred in microwave reaction kettle, and then microwave hydrothermal reacts at 130-180 DEG C
10-60min, taken out after cooling, filter, obtain product I；
5）Potassium titanate, carbonic acid molybdenum are added in remaining 1/3 deionized water, stirring and dissolving, then add remaining half lysine and
Product I, continues to be uniformly mixed, and half urea liquid A is then slowly added dropwise, time for adding 30min, is stirred after being added dropwise
Mix uniformly, obtain mixed liquor N；
6）Mixed liquor N is transferred in microwave reaction kettle, then microwave hydrothermal reacts 10-60min, cooling at 150-180 DEG C
After take out, filtration washing is simultaneously dried in vacuo, and is produced.
In above-mentioned technical proposal, the silicone oil is vinyl-terminated silicone fluid, alkyl modified silicon oil, tetraethoxy silicone oil or hydrogen envelope
Hold phenyl silicone oil.
In above-mentioned technical proposal, it is prepared by the component of following parts by weight：
Furfural acetone formaldehyde resin 38-52 parts, epoxyoleic acid butyl ester 14-27 parts, XNBR 4.5-11.3 parts, ceramic powder 2.8-
6.5 parts, adjacent chlorine para-aminophenol 2.2-4.7 parts, ceteth 2.6-5.8 parts, silicone oil 3.2-7 parts, piperazine -2- carboxylics
Hydrochlorate 1.3-4.5 parts, portland cement 0.4-1.4 parts, PE wax 0.3-1.2 parts, 3- methyl tetrahydrochysene phthalate anhydrides 0.9-2.1
Part.
Another technical scheme of the present invention is come as follows：
The preparation method of Electronic Packaging insulating materials, comprises the following steps：
（1）By above-mentioned parts by weight dispensing；
（2）XNBR and epoxyoleic acid butyl ester are placed in the acetone of 10-20 times of total weight parts to being completely dissolved, obtained molten
Liquid A, it is standby；
（3）Furfural acetone formaldehyde resin is well mixed with ceramic powder, then adds step（2）In solution A, ultrasonic disperse is uniform,
Obtain solution B；
（4）Solution B is well mixed with adjacent chlorine para-aminophenol, 2-8h is stirred at 60-100 DEG C, obtains solution C；
（5）By ceteth, portland cement, piperazine-2-carboxylic acid's salt, silicone oil, PE waxes and 3- methyl tetrahydrochysenes benzene two
Formic anhydride is well mixed, and is then added in solution C, is uniformly mixed, obtains solution D；
（6）Solution D is poured into bubble removing in mould, 1-5h is incubated at 70-90 DEG C, is cooled to room temperature, it is exhausted to produce Electronic Packaging
Edge material.
In above-mentioned technical proposal, the step（4）In, stir 3-6h at 70-85 DEG C.
In above-mentioned technical proposal, the step（6）In, it is incubated 1-3h at 75-85 DEG C.
As a result of above technical scheme, beneficial effects of the present invention are：
The thermal conductivity of packaging insulating material provided by the invention reaches 154-167 W/（m•K）, thermal coefficient of expansion is up to 5.9 × 10-6-7.2×10-6K, high heat conductance and thermal coefficient of expansion are shown, meets very much requirement of the electronic applications to encapsulating material；Simultaneously
The preparation technology of the packaging insulating material is simple and preparation temperature is relatively low, and integral manufacturing cost is low, can be widely popularized use.
Embodiment
With reference to specific embodiment, the present invention is described in further detail.Following examples are used to illustrate the present invention,
But it is not limited to the scope of the present invention.
Embodiment 1
Electronic Packaging insulating materials, it is prepared by the component of following parts by weight：
36 parts of furfural acetone formaldehyde resin, 12 parts of epoxyoleic acid butyl ester, 4 parts of XNBR, 2 parts of ceramic powder, adjacent chlorine p-aminophenyl
2 parts of phenol, 2 parts of ceteth, 3 parts of silicone oil, 1 part of piperazine-2-carboxylic acid's salt, 0.3 part of portland cement, 0.2 part of PE waxes,
0.8 part of 3- methyl tetrahydrochysenes phthalate anhydride.
The silicone oil is vinyl-terminated silicone fluid.
The ceramic powder is prepared by the component of following parts by weight：4 parts of lanthanum nitrate, 1 part of magnesium chloride, 0.9 part of potassium titanate,
50 parts of 3.2 parts of carbonic acid molybdenum, 2.2 parts of lysine, 1.8 parts of urea and deionized water.
The preparation process of the ceramic powder is：
1）Lanthanum nitrate, magnesium chloride are added in 1/3 deionized water, stirring and dissolving, then add half lysine, continues to stir molten
Solution；
2）Urea is added into stirring and dissolving in 1/3 deionized water, obtains urea liquid A；
3）Take half urea liquid A that step 1 is slowly added dropwise）In, time for adding 30min, stir, obtain after being added dropwise
Mixed liquor M；
4）By step 3）Obtained mixed liquor M is transferred in microwave reaction kettle, and then microwave hydrothermal reacts 60min at 130 DEG C,
Taken out after cooling, filter, obtain product I；
5）Potassium titanate, carbonic acid molybdenum are added in remaining 1/3 deionized water, stirring and dissolving, then add remaining half lysine and
Product I, continues to be uniformly mixed, and half urea liquid A is then slowly added dropwise, time for adding 30min, is stirred after being added dropwise
Mix uniformly, obtain mixed liquor N；
6）Mixed liquor N is transferred in microwave reaction kettle, then microwave hydrothermal reacts 10min at 150 DEG C, is taken out after cooling,
Filtration washing is simultaneously dried in vacuo, and is produced.
The preparation method of above-mentioned Electronic Packaging insulating materials, comprises the following steps：
（1）By above-mentioned parts by weight dispensing；
（2）XNBR and epoxyoleic acid butyl ester are placed in the acetone of 10 times of total weight parts to being completely dissolved, obtain solution
A, it is standby；
（3）Furfural acetone formaldehyde resin is well mixed with ceramic powder, then adds step（2）In solution A, ultrasonic disperse is uniform,
Obtain solution B；
（4）Solution B is well mixed with adjacent chlorine para-aminophenol, 2h is stirred at 60 DEG C, obtains solution C；
（5）By ceteth, portland cement, piperazine-2-carboxylic acid's salt, silicone oil, PE waxes and 3- methyl tetrahydrochysenes benzene two
Formic anhydride is well mixed, and is then added in solution C, is uniformly mixed, obtains solution D；
（6）Solution D is poured into bubble removing in mould, 1h is incubated at 70 DEG C, is cooled to room temperature, produces Electronic Packaging insulation material
Material.
Embodiment 2
Electronic Packaging insulating materials, it is prepared by the component of following parts by weight：
55 parts of furfural acetone formaldehyde resin, 28 parts of epoxyoleic acid butyl ester, 13 parts of XNBR, 7 parts of ceramic powder, adjacent chlorine p-aminophenyl
5 parts of phenol, 7 parts of ceteth, 8 parts of silicone oil, 5 parts of piperazine-2-carboxylic acid's salt, 1.8 parts of portland cement, 1.5 parts of PE waxes,
2.4 parts of 3- methyl tetrahydrochysenes phthalate anhydride.
The silicone oil is alkyl modified silicon oil.
The ceramic powder is prepared by the component of following parts by weight：7.6 parts of lanthanum nitrate, 3.8 parts of magnesium chloride, potassium titanate
75 parts of 2.5 parts, 6 parts of carbonic acid molybdenum, 5 parts of lysine, 4.3 parts of urea and deionized water.
The preparation process of the ceramic powder is：
1）Lanthanum nitrate, magnesium chloride are added in 1/3 deionized water, stirring and dissolving, then add half lysine, continues to stir molten
Solution；
2）Urea is added into stirring and dissolving in 1/3 deionized water, obtains urea liquid A；
3）Take half urea liquid A that step 1 is slowly added dropwise）In, time for adding 30min, stir, obtain after being added dropwise
Mixed liquor M；
4）By step 3）Obtained mixed liquor M is transferred in microwave reaction kettle, and then microwave hydrothermal reacts 10min at 180 DEG C,
Taken out after cooling, filter, obtain product I；
5）Potassium titanate, carbonic acid molybdenum are added in remaining 1/3 deionized water, stirring and dissolving, then add remaining half lysine and
Product I, continues to be uniformly mixed, and half urea liquid A is then slowly added dropwise, time for adding 30min, is stirred after being added dropwise
Mix uniformly, obtain mixed liquor N；
6）Mixed liquor N is transferred in microwave reaction kettle, then microwave hydrothermal reacts 60min at 180 DEG C, is taken out after cooling,
Filtration washing is simultaneously dried in vacuo, and is produced.
The preparation method of above-mentioned Electronic Packaging insulating materials, comprises the following steps：
（1）By above-mentioned parts by weight dispensing；
（2）XNBR and epoxyoleic acid butyl ester are placed in the acetone of 20 times of total weight parts to being completely dissolved, obtain solution
A, it is standby；
（3）Furfural acetone formaldehyde resin is well mixed with ceramic powder, then adds step（2）In solution A, ultrasonic disperse is uniform,
Obtain solution B；
（4）Solution B is well mixed with adjacent chlorine para-aminophenol, 8h is stirred at 100 DEG C, obtains solution C；
（5）By ceteth, portland cement, piperazine-2-carboxylic acid's salt, silicone oil, PE waxes and 3- methyl tetrahydrochysenes benzene two
Formic anhydride is well mixed, and is then added in solution C, is uniformly mixed, obtains solution D；
（6）Solution D is poured into bubble removing in mould, 5h is incubated at 90 DEG C, is cooled to room temperature, produces Electronic Packaging insulation material
Material.
Embodiment 3
Electronic Packaging insulating materials, it is prepared by the component of following parts by weight：
38 parts of furfural acetone formaldehyde resin, 14 parts of epoxyoleic acid butyl ester, 4.5 parts of XNBR, 2.8 parts of ceramic powder, adjacent chlorine are to ammonia
2.2 parts of base phenol, 2.6 parts of ceteth, 3.2 parts of silicone oil, 1.3 parts of piperazine-2-carboxylic acid's salt, portland cement 0.4
Part, 0.3 part of PE waxes, 0.9 part of 3- methyl tetrahydrochysenes phthalate anhydride.
The silicone oil is tetraethoxy silicone oil.
The ceramic powder is prepared by the component of following parts by weight：4.6 parts of lanthanum nitrate, 1.9 parts of magnesium chloride, potassium titanate
62 parts of 1.4 parts, 4.6 parts of carbonic acid molybdenum, 2.5 parts of lysine, 2.7 parts of urea and deionized water.
The preparation process of the ceramic powder is：
1）Lanthanum nitrate, magnesium chloride are added in 1/3 deionized water, stirring and dissolving, then add half lysine, continues to stir molten
Solution；
2）Urea is added into stirring and dissolving in 1/3 deionized water, obtains urea liquid A；
3）Take half urea liquid A that step 1 is slowly added dropwise）In, time for adding 30min, stir, obtain after being added dropwise
Mixed liquor M；
4）By step 3）Obtained mixed liquor M is transferred in microwave reaction kettle, and then microwave hydrothermal reacts 30min at 15 DEG C,
Taken out after cooling, filter, obtain product I；
5）Potassium titanate, carbonic acid molybdenum are added in remaining 1/3 deionized water, stirring and dissolving, then add remaining half lysine and
Product I, continues to be uniformly mixed, and half urea liquid A is then slowly added dropwise, time for adding 30min, is stirred after being added dropwise
Mix uniformly, obtain mixed liquor N；
6）Mixed liquor N is transferred in microwave reaction kettle, then microwave hydrothermal reacts 40min at 170 DEG C, is taken out after cooling,
Filtration washing is simultaneously dried in vacuo, and is produced.
The preparation method of above-mentioned Electronic Packaging insulating materials, comprises the following steps：
（1）By above-mentioned parts by weight dispensing；
（2）XNBR and epoxyoleic acid butyl ester are placed in the acetone of 15 times of total weight parts to being completely dissolved, obtain solution
A, it is standby；
（3）Furfural acetone formaldehyde resin is well mixed with ceramic powder, then adds step（2）In solution A, ultrasonic disperse is uniform,
Obtain solution B；
（4）Solution B is well mixed with adjacent chlorine para-aminophenol, 3h is stirred at 70 DEG C, obtains solution C；
（5）By ceteth, portland cement, piperazine-2-carboxylic acid's salt, silicone oil, PE waxes and 3- methyl tetrahydrochysenes benzene two
Formic anhydride is well mixed, and is then added in solution C, is uniformly mixed, obtains solution D；
（6）Solution D is poured into bubble removing in mould, 1h is incubated at 75 DEG C, is cooled to room temperature, produces Electronic Packaging insulation material
Material.
Embodiment 4
Electronic Packaging insulating materials, it is prepared by the component of following parts by weight：
52 parts of furfural acetone formaldehyde resin, 27 parts of epoxyoleic acid butyl ester, 11.3 parts of XNBR, 6.5 parts of ceramic powder, adjacent chlorine are to ammonia
4.7 parts of base phenol, 5.8 parts of ceteth, 7 parts of silicone oil, 4.5 parts of piperazine-2-carboxylic acid's salt, 1.4 parts of portland cement,
1.2 parts of PE waxes, 2.1 parts of 3- methyl tetrahydrochysenes phthalate anhydride.
The silicone oil is that hydrogen blocks phenyl silicone oil.
The ceramic powder is prepared by the component of following parts by weight：5.5 parts of lanthanum nitrate, 1.8 parts of magnesium chloride, potassium titanate
65 parts of 2.1 parts, 4.5 parts of carbonic acid molybdenum, 3.6 parts of lysine, 2.8 parts of urea and deionized water.
The preparation process of the ceramic powder is：
1）Lanthanum nitrate, magnesium chloride are added in 1/3 deionized water, stirring and dissolving, then add half lysine, continues to stir molten
Solution；
2）Urea is added into stirring and dissolving in 1/3 deionized water, obtains urea liquid A；
3）Take half urea liquid A that step 1 is slowly added dropwise）In, time for adding 30min, stir, obtain after being added dropwise
Mixed liquor M；
4）By step 3）Obtained mixed liquor M is transferred in microwave reaction kettle, and then microwave hydrothermal reacts 40min at 160 DEG C,
Taken out after cooling, filter, obtain product I；
5）Potassium titanate, carbonic acid molybdenum are added in remaining 1/3 deionized water, stirring and dissolving, then add remaining half lysine and
Product I, continues to be uniformly mixed, and half urea liquid A is then slowly added dropwise, time for adding 30min, is stirred after being added dropwise
Mix uniformly, obtain mixed liquor N；
6）Mixed liquor N is transferred in microwave reaction kettle, then microwave hydrothermal reacts 40min at 158 DEG C, is taken out after cooling,
Filtration washing is simultaneously dried in vacuo, and is produced.
The preparation method of above-mentioned Electronic Packaging insulating materials, comprises the following steps：
（1）By above-mentioned parts by weight dispensing；
（2）XNBR and epoxyoleic acid butyl ester are placed in the acetone of 18 times of total weight parts to being completely dissolved, obtain solution
A, it is standby；
（3）Furfural acetone formaldehyde resin is well mixed with ceramic powder, then adds step（2）In solution A, ultrasonic disperse is uniform,
Obtain solution B；
（4）Solution B is well mixed with adjacent chlorine para-aminophenol, 6h is stirred at 85 DEG C, obtains solution C；
（5）By ceteth, portland cement, piperazine-2-carboxylic acid's salt, silicone oil, PE waxes and 3- methyl tetrahydrochysenes benzene two
Formic anhydride is well mixed, and is then added in solution C, is uniformly mixed, obtains solution D；
（6）Solution D is poured into bubble removing in mould, 3h is incubated at 85 DEG C, is cooled to room temperature, produces Electronic Packaging insulation material
Material.
Embodiment 5
Electronic Packaging insulating materials, it is prepared by the component of following parts by weight：
44 parts of furfural acetone formaldehyde resin, 17 parts of epoxyoleic acid butyl ester, 6.8 parts of XNBR, 5.4 parts of ceramic powder, adjacent chlorine are to ammonia
3.6 parts of base phenol, 4.2 parts of ceteth, 5.3 parts of silicone oil, 2.6 parts of piperazine-2-carboxylic acid's salt, portland cement 0.8
Part, 0.7 part of PE waxes, 1.5 parts of 3- methyl tetrahydrochysenes phthalate anhydride.
The silicone oil is alkyl modified silicon oil.
The ceramic powder is prepared by the component of following parts by weight：6.2 parts of lanthanum nitrate, 2.4 parts of magnesium chloride, potassium titanate
60 parts of 1.6 parts, 5.3 parts of carbonic acid molybdenum, 3.8 parts of lysine, 2.5 parts of urea and deionized water.
The preparation process of the ceramic powder is：
1）Lanthanum nitrate, magnesium chloride are added in 1/3 deionized water, stirring and dissolving, then add half lysine, continues to stir molten
Solution；
2）Urea is added into stirring and dissolving in 1/3 deionized water, obtains urea liquid A；
3）Take half urea liquid A that step 1 is slowly added dropwise）In, time for adding 30min, stir, obtain after being added dropwise
Mixed liquor M；
4）By step 3）Obtained mixed liquor M is transferred in microwave reaction kettle, and then microwave hydrothermal reacts 20min at 150 DEG C,
Taken out after cooling, filter, obtain product I；
5）Potassium titanate, carbonic acid molybdenum are added in remaining 1/3 deionized water, stirring and dissolving, then add remaining half lysine and
Product I, continues to be uniformly mixed, and half urea liquid A is then slowly added dropwise, time for adding 30min, is stirred after being added dropwise
Mix uniformly, obtain mixed liquor N；
6）Mixed liquor N is transferred in microwave reaction kettle, then microwave hydrothermal reacts 30min at 160 DEG C, is taken out after cooling,
Filtration washing is simultaneously dried in vacuo, and is produced.
The preparation method of above-mentioned Electronic Packaging insulating materials, comprises the following steps：
（1）By above-mentioned parts by weight dispensing；
（2）XNBR and epoxyoleic acid butyl ester are placed in the acetone of 18 times of total weight parts to being completely dissolved, obtain solution
A, it is standby；
（3）Furfural acetone formaldehyde resin is well mixed with ceramic powder, then adds step（2）In solution A, ultrasonic disperse is uniform,
Obtain solution B；
（4）Solution B is well mixed with adjacent chlorine para-aminophenol, 5h is stirred at 78 DEG C, obtains solution C；
（5）By ceteth, portland cement, piperazine-2-carboxylic acid's salt, silicone oil, PE waxes and 3- methyl tetrahydrochysenes benzene two
Formic anhydride is well mixed, and is then added in solution C, is uniformly mixed, obtains solution D；
（6）Solution D is poured into bubble removing in mould, 2h is incubated at 80 DEG C, is cooled to room temperature, produces Electronic Packaging insulation material
Material.
Comparative example 1
This comparative example is substantially the same manner as Example 1, and difference is：Not comprising ceramic powder and its correlation step.
Comparative example 2
This comparative example is substantially the same manner as Example 1, and difference is：Epoxyoleic acid butyl ester by etc. parts by weight chaff ketone formaldehyde tree
Fat substitutes, while does not include piperazine-2-carboxylic acid's salt and portland cement and its correlation step.
Performance test
Correlated performance test, its test result are carried out to the packaging insulating material prepared by above example 1-5 and comparative example 1,2
It is as shown in the table：
By upper table as can be seen that the thermal conductivity of packaging insulating material provided by the invention reaches 154-167 W/（m•K）, thermal expansion
Coefficient is up to 5.9 × 10-6-7.2×10-6K, high heat conductance and thermal coefficient of expansion are shown, meet very much electronic applications to encapsulation
The requirement of material；The preparation technology of the packaging insulating material is simple simultaneously and preparation temperature is relatively low, and integral manufacturing cost is low, can be wide
It is general to promote the use of.
Claims (8)
1. Electronic Packaging insulating materials, it is characterised in that be prepared by the component of following parts by weight：
Furfural acetone formaldehyde resin 36-55 parts, epoxyoleic acid butyl ester 12-28 parts, XNBR 4-13 parts, ceramic powder 2-7 parts, neighbour
Chlorine para-aminophenol 2-5 parts, ceteth 2-7 parts, silicone oil 3-8 parts, piperazine-2-carboxylic acid salt 1-5 parts, silicate cement
Mud 0.3-1.8 parts, PE wax 0.2-1.5 parts, 3- methyl tetrahydrochysene phthalate anhydride 0.8-2.4 parts.
2. Electronic Packaging insulating materials according to claim 1, it is characterised in that the ceramic powder is by following parts by weight
Component is prepared：Lanthanum nitrate 4-7.6 parts, magnesium chloride 1-3.8 parts, potassium titanate 0.9-2.5 parts, carbonic acid molybdenum 3.2-6 parts, lysine
2.2-5 parts, urea 1.8-4.3 parts and deionized water 50-75 parts.
3. Electronic Packaging insulating materials according to claim 1, it is characterised in that the preparation process of the ceramic powder is：
1）Lanthanum nitrate, magnesium chloride are added in 1/3 deionized water, stirring and dissolving, then add half lysine, continues stirring and dissolving；
2）Urea is added into stirring and dissolving in 1/3 deionized water, obtains urea liquid A；
3）Take half urea liquid A that step 1 is slowly added dropwise）In, time for adding 30min, stir, obtain after being added dropwise
Mixed liquor M；
4）By step 3）Obtained mixed liquor M is transferred in microwave reaction kettle, and then microwave hydrothermal reacts at 130-180 DEG C
10-60min, taken out after cooling, filter, obtain product I；
5）Potassium titanate, carbonic acid molybdenum are added in remaining 1/3 deionized water, stirring and dissolving, then add remaining half lysine and
Product I, continues to be uniformly mixed, and half urea liquid A is then slowly added dropwise, time for adding 30min, is stirred after being added dropwise
Mix uniformly, obtain mixed liquor N；
6）Mixed liquor N is transferred in microwave reaction kettle, then microwave hydrothermal reacts 10-60min, cooling at 150-180 DEG C
After take out, filtration washing is simultaneously dried in vacuo, and is produced.
4. Electronic Packaging insulating materials according to claim 1, it is characterised in that the silicone oil be vinyl-terminated silicone fluid,
Alkyl modified silicon oil, tetraethoxy silicone oil or hydrogen end-blocking phenyl silicone oil.
5. Electronic Packaging insulating materials according to claim 1, it is characterised in that by the component preparation of following parts by weight
：
Furfural acetone formaldehyde resin 38-52 parts, epoxyoleic acid butyl ester 14-27 parts, XNBR 4.5-11.3 parts, ceramic powder 2.8-
6.5 parts, adjacent chlorine para-aminophenol 2.2-4.7 parts, ceteth 2.6-5.8 parts, silicone oil 3.2-7 parts, piperazine -2- carboxylics
Hydrochlorate 1.3-4.5 parts, portland cement 0.4-1.4 parts, PE wax 0.3-1.2 parts, 3- methyl tetrahydrochysene phthalate anhydrides 0.9-2.1
Part.
6. the preparation method of the Electronic Packaging insulating materials according to claim 1-5 any one, it is characterised in that including
Following steps：
（1）By above-mentioned parts by weight dispensing；
（2）XNBR and epoxyoleic acid butyl ester are placed in the acetone of 10-20 times of total weight parts to being completely dissolved, obtained molten
Liquid A, it is standby；
（3）Furfural acetone formaldehyde resin is well mixed with ceramic powder, then adds step（2）In solution A, ultrasonic disperse is uniform,
Obtain solution B；
（4）Solution B is well mixed with adjacent chlorine para-aminophenol, 2-8h is stirred at 60-100 DEG C, obtains solution C；
（5）By ceteth, portland cement, piperazine-2-carboxylic acid's salt, silicone oil, PE waxes and 3- methyl tetrahydrochysenes benzene two
Formic anhydride is well mixed, and is then added in solution C, is uniformly mixed, obtains solution D；
（6）Solution D is poured into bubble removing in mould, 1-5h is incubated at 70-90 DEG C, is cooled to room temperature, it is exhausted to produce Electronic Packaging
Edge material.
7. the preparation method of Electronic Packaging insulating materials according to claim 6, it is characterised in that the step（4）In,
3-6h is stirred at 70-85 DEG C.
8. the preparation method of Electronic Packaging insulating materials according to claim 6, it is characterised in that the step（6）In,
1-3h is incubated at 75-85 DEG C.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105482224A (en) * | 2015-12-30 | 2016-04-13 | 太仓卡斯特姆新材料有限公司 | Color-changing polyethylene insulating release film |
| CN106800406A (en) * | 2016-12-19 | 2017-06-06 | 中国矿业大学 | A kind of microwave radiation technology collosol and gel burning synthesis method of titanium porcelain Special body porcelain powder |
| CN105602485B (en) * | 2016-01-26 | 2017-06-23 | 河北工业大学 | A kind of insulating heat-conductive adhesive of high infrared radiance and preparation method thereof |
-
2017
- 2017-11-13 CN CN201711112868.0A patent/CN107880479A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105482224A (en) * | 2015-12-30 | 2016-04-13 | 太仓卡斯特姆新材料有限公司 | Color-changing polyethylene insulating release film |
| CN105602485B (en) * | 2016-01-26 | 2017-06-23 | 河北工业大学 | A kind of insulating heat-conductive adhesive of high infrared radiance and preparation method thereof |
| CN106800406A (en) * | 2016-12-19 | 2017-06-06 | 中国矿业大学 | A kind of microwave radiation technology collosol and gel burning synthesis method of titanium porcelain Special body porcelain powder |
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