CN107843378A - Pressure of surging suspension polishing Fluid pressure wireless acquisition system - Google Patents
Pressure of surging suspension polishing Fluid pressure wireless acquisition system Download PDFInfo
- Publication number
- CN107843378A CN107843378A CN201711370151.6A CN201711370151A CN107843378A CN 107843378 A CN107843378 A CN 107843378A CN 201711370151 A CN201711370151 A CN 201711370151A CN 107843378 A CN107843378 A CN 107843378A
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- CN
- China
- Prior art keywords
- pressure
- wireless
- module
- pressure sensor
- acquisition system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005498 polishing Methods 0.000 title claims abstract description 58
- 239000012530 fluid Substances 0.000 title claims abstract description 24
- 239000000725 suspension Substances 0.000 title claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 2
- 230000006837 decompression Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
One kind, which is surged, presses suspension polishing Fluid pressure wireless acquisition system, including pressure sensor, balance adjustment stud, compartment, wireless transmitter module and wireless receiver；By one of location of workpiece together with polishing tool disk perforate, the pressure sensor measured for hydraulic pressure is fixed on the location of workpiece from top to bottom, on the position of the symmetrical side of the location of workpiece, using same way stable equilibrium regulation stud, the balance adjustment stud is equal with pressure sensor quality and rotary inertia；A compartment, the fixed wireless transmitter module in compartment are fixed above polishing tool disk, the pressure sensor is connected with wireless transmitter module, and the wireless transmitter module coordinates with the wireless receiver.Accuracy of the present invention is higher, and the pressure of target fixing point (location of workpiece) is gathered by wireless (bluetooth) method.
Description
Technical field
The present invention relates to non-contact polishing fluids pressure acquisition field, is surged in particular to one kind and presses suspension polishing
The acquisition system of Fluid pressure.
Background technology
Pressure of surging suspension polishing method is to be applied to a kind of polishing method of the low injured surface processing of atom level ultra-smooth.
During pressure of surging suspension polishing, polishing tool disk rotates under the driving of servomotor and drives liquid to flow, the liquid of flowing
Know from experience the sample generation fluid pressure effect to pasting face of being tried to get to the heart of a matter in polishing tool, the size of the fluid pressure and distribution are to sample
Surfacing clearance and surface uniformity important.Therefore, to the pressure of workpiece area in polishing processing
Measurement is one of research very effective means of its mechanism of action.
A kind of existing hydraulic pressure, buoyancy and floating distance detection method, pressure sensor are fixed on container bottom,
Same circumferential directions four, sensor radial position is corresponding with sample patch location.When biography is skimmed in polishing tool sweeping
Sensor position, sensor collect pressure signal with certain sample frequency.The pressure signal measured is defeated by data collecting card
It is sent in computer and saves.Due to the polishing tool in the patented method try to get to the heart of a matter face flow passage structure be it is periodic, therefore
It is also cyclically-varying to measure the pressure signal come.It is not mesh although pressure time change has some reference value
Mark the pressure of fixing point (location of workpiece).And sensor arrangement, in container bottom, what is measured is the liquid pressure of the nearly bottom of container
Power, due to the presence of polishing fluid thickness, and there is certain deviation in the pressure being actually needed at the workpiece paster of measurement.
The content of the invention
In order to overcome the shortcomings of that the accuracy of existing polishing fluids pressure detecting is relatively low, the invention provides a kind of accuracy
The higher pressure suspension polishing Fluid pressure wireless acquisition system that surges, target fixing point (work is gathered by wireless (bluetooth) method
Part position) pressure.
The technical solution adopted for the present invention to solve the technical problems is：
One kind, which is surged, presses suspension polishing Fluid pressure wireless acquisition system, in pressure of surging suspension polishing equipment, polishing tool
Parallel zone below disk is provided with groove, and workpiece is pasted with the groove, and the polishing tool disk is arranged on ball spline shaft
Lower end；The system includes pressure sensor, balance adjustment stud, compartment, wireless transmitter module and wireless receiver；Will
One of location of workpiece fixes the pressure sensor measured for hydraulic pressure together with polishing tool disk perforate from top to bottom
It is described flat using same way stable equilibrium regulation stud on the position of the symmetrical side of the location of workpiece in the location of workpiece
The regulation stud that weighs is equal with pressure sensor quality and rotary inertia；A compartment is fixed above polishing tool disk, it is described
The fixed wireless transmitter module in compartment, the pressure sensor are connected with wireless transmitter module, the wireless transmission mould
Block coordinates with the wireless receiver.
Further, the system also bag conducting slip ring, conducting slip ring is installed on ball spline shaft, the conducting slip ring
Inner ring coordinates with ball spline shaft, and the outer shroud of the conducting slip ring is fixed on intermediate support plate bottom；The conducting slip ring it is interior
The connecting line of ring is connected with wireless transmitter module, connecting line and 24V power lines and the ground wire of the outer shroud of the conducting slip ring
It is connected.This is the implementation that wireless transmitter module needs externally fed, can be with if wireless transmitter module is self-powered
Reduction procedure.
Further, the system also includes signal condition amplifier, and the pressure sensor is put with the signal condition
Big device connection, the signal condition amplifier are connected with the wireless transmitter module.
Preferably, the pressure sensor is silicon piezoresistance type pressure sensor.
The conducting slip ring is disc type via precise conductive slip ring.
Further, the wireless transmitter module includes power voltage step down module, signal acquisition module and low-power consumption bluetooth mould
Block, the output end of the pressure sensor are connected with the signal acquisition module, the signal acquisition module and the low-power consumption
Bluetooth module is connected, and the power voltage step down module is connected with the signal acquisition module.Bluetooth wireless mode is a kind of preferable
Scheme, it is of course also possible to select other wireless transmission methods.
The pressure sensor output is current signal, and a measurement resistance is accessed in sensor loop, is adopted with signal
Collect the voltage signal at module measurement resistance both ends, and voltage analog signal is converted into pressure on the number signal.Pressure signal is adopted
After collection module is transported to low-power consumption bluetooth, pressure signal is wirelessly sent to wireless receiver (bluetooth by bluetooth module
Receiving device).External 24V voltages are reduced to by 10V using power voltage step down module, powered to signal acquisition module.Adopted with signal
Collection module carries 5V voltages and powered to low-power consumption bluetooth.
Preferably, the single-chip microcomputer of the signal acquisition module is the ATMEGA328 of atmel corp.
The SoC System on Chip/SoCs of the low-power consumption bluetooth module are TI CC2541.
The power voltage step down chip is LM2596S.
Beneficial effects of the present invention are mainly manifested in：Realize and the Fluid pressure of polishing regional aim fixing point is entered
Measurement, the kinking problem of sensor conductor when not only solving polishing tool disc spins, and sensor are arranged on throwing to row in real time
Dynamic equilibrium problems caused by optical tool disk, accuracy are higher.
Brief description of the drawings
Fig. 1 is the structural representation for surging and pressing suspension polishing Fluid pressure wireless acquisition system.
Fig. 2 is the scheme of installation of pressure sensor of the present invention.
Fig. 3 is the scheme of installation of conducting slip ring of the present invention, compartment and wireless transmitter module.
Fig. 4 is the circuit theory diagrams of wireless transmitter module and pressure sensor of the present invention.
In figure, 1- intermediate support plates, 2- containers, 3- distance measuring sensors, 4- pressure sensors, 5- polishing tools disk, 6- are put down
Weighing apparatus regulation stud, 7- wireless transmissions element module, 8- compartments, 9- conducting slip rings, 10- ball spline shafts, 11- driving wheels, 12- are watched
Take motor, 13- vernier knobs, 14- piezoelectric types force cell, 15- axle sleeves, 16- driven pulleys, 17- and move plate, 18- wireless receivings
Device.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings.
1~Fig. 3 of reference picture, one kind, which is surged, presses suspension polishing Fluid pressure wireless acquisition system, including pressure sensor 4,
Balance adjustment stud 6, signal condition amplifier, compartment 8, conducting slip ring 9, wireless transmitter module 7, wireless receiver 18.Throw
The parallel zone of the lower section of optical tool disk 5 is provided with groove, and workpiece is pasted with groove.By one of location of workpiece together with buffer
Have the perforate of disk 5, the pressure sensor 4 measured for hydraulic pressure is fixed on the location of workpiece from top to bottom.In the workpiece position
On the position for putting symmetrical side, using same way stable equilibrium regulation stud 6.A waterproof is fixed above polishing tool disk
Box 8, the fixed wireless transmitter module 7 in compartment 8.Conducting slip ring is installed on ball spline shaft, the inner ring of conducting slip ring with
Ball spline shaft coordinates, and outer shroud is fixed on intermediate support plate bottom.The connecting line and wireless transmitter module of the inner ring of conducting slip ring
It is connected, the connecting line of the outer shroud of conducting slip ring is connected with 24V power lines and ground wire.Pressure sensor 4 and wireless transmission
Module 7 is connected.
The pressure sensor 4 is silicon piezoresistance type pressure sensor.
The conducting slip ring 7 is disc type via precise conductive slip ring.
The balance adjustment stud 6 is equal with the quality and rotary inertia of pressure sensor 4.
The center drilling of compartment 8, is fixed on polishing tool disk, and concentric with polishing tool disk 5, around compartment
There is high wall, liquid splash protects wireless transmitter module 7 not to be short-circuited in box when preventing processing.
As shown in figure 1, the present invention is realized in pressure suspension polishing equipment surging, so place of matchmakers first surges
Press suspension polishing equipment and operation principle.Device therefor includes servomotor 12, belt wheel 11 and 16, ball spline shaft 10, polishing
Tool shelf 5, container 2, dynamic plate 17, intermediate support plate 1 and guide rail.Polishing tool disk 5 connects ball spline shaft 10 by shaft coupling,
Ball spline shaft 10 is fixed on dynamic plate 17, and dynamic plate 17 can under the drive of line slideway, ball-screw and stepper motor
Vertically move up and down；The lower end of polishing tool disk 5 is provided with container 2.During polishing, servomotor 10 is by installed in band
Timing belt on wheel 9 and belt wheel 14 drives ball spline shaft 8 and the high-speed rotation of polishing tool disk 5.Offset in modules such as springs dynamic
After the gravity such as plate 15, ball spline shaft 8, polishing tool disk 5, when polishing tool disk 5 rotates, the bottom surface of polishing tool disk 5 can be by
To the effect of hydraulic pressure, adaptively it can float and sink.
As shown in figure 4, the wireless transmitter module 7 includes power voltage step down module 71, signal acquisition module 72 and low-power consumption
Bluetooth module 73.A measurement resistance R is accessed in pressure sensor loop, resistance both ends are measured with signal acquisition module 72
Voltage signal, and voltage signal is converted into pressure signal.Pressure signal is transported to low-power consumption bluetooth 73, wirelessly will
Pressure signal is sent to wireless receiver (Bluetooth recipient devices).External 24V voltages are reduced to using power voltage step down module 71
10V, powered to signal acquisition module 72.5V voltages are carried with signal acquisition module 72 to power to low-power consumption bluetooth module 73.
The single-chip microcomputer of the signal acquisition module is the ATMEGA328 of atmel corp.
The SoC (System on Chip/SoC) of the low-power consumption bluetooth module is the CC2541 of TI companies.
The power voltage step down chip is LM2596S.
During polishing, external power supply is powered by conducting slip ring 9 to pressure sensor 4, the sensing on pressure sensor 4
Element experiences the pressure change of the polishing fluid of workpiece area, and the voltage for being connected on resistance both ends in pressure acquisition circuit becomes
Change.Signal acquisition chip 72 in wireless transmitter module 7 will measure voltage signal and be converted into pressure on the number signal.Wireless transmission mould
Pressure signal is wirelessly transmitted to wireless receiver by the Bluetooth chip 73 in block.
Above-described embodiment is presently preferred embodiments of the present invention, is not the limitation to technical solution of the present invention, as long as
The technical scheme that can be realized on the basis of above-described embodiment without creative work, it is regarded as falling into patent of the present invention
Rights protection scope in.
Claims (9)
1. one kind is surged, pressure suspension polishing Fluid pressure wireless acquisition system, surges and presses in suspension polishing equipment, polishing tool disk
The parallel zone of lower section is provided with groove, and workpiece is pasted with the groove, and the polishing tool disk is arranged on ball spline shaft
Lower end；It is characterized in that：The system includes pressure sensor, balance adjustment stud, compartment, wireless transmitter module and wireless
Receiver；By one of location of workpiece together with polishing tool disk perforate, by the pressure sensor measured for hydraulic pressure from
The location of workpiece is fixed under above, on the position of the symmetrical side of the location of workpiece, is adjusted using same way stable equilibrium
Stud, the balance adjustment stud are equal with pressure sensor quality and rotary inertia；One is fixed above polishing tool disk
Compartment, the fixed wireless transmitter module in compartment, the pressure sensor is connected with wireless transmitter module, described
Wireless transmitter module coordinates with the wireless receiver.
2. the pressure suspension polishing Fluid pressure wireless acquisition system as claimed in claim 1 that surges, it is characterised in that：The system
Also bag conducting slip ring, conducting slip ring is installed on ball spline shaft, inner ring and the ball spline shaft of the conducting slip ring coordinate, institute
The outer shroud for stating conducting slip ring is fixed on intermediate support plate bottom；The connecting line and wireless transmitter module of the inner ring of the conducting slip ring
It is connected, the connecting line of the outer shroud of the conducting slip ring is connected with 24V power lines and ground wire.
3. the pressure suspension polishing Fluid pressure wireless acquisition system as claimed in claim 1 or 2 that surges, it is characterised in that：It is described
System also includes signal condition amplifier, and the pressure sensor is connected with the signal condition amplifier, the signal condition
Amplifier is connected with the wireless transmitter module.
4. the pressure suspension polishing Fluid pressure wireless acquisition system as claimed in claim 1 or 2 that surges, it is characterised in that：It is described
Pressure sensor is silicon piezoresistance type pressure sensor.
5. the pressure suspension polishing Fluid pressure wireless acquisition system as claimed in claim 1 or 2 that surges, it is characterised in that：It is described
Conducting slip ring is disc type via precise conductive slip ring.
6. the pressure suspension polishing Fluid pressure wireless acquisition system as claimed in claim 1 or 2 that surges, it is characterised in that：It is described
Wireless transmitter module includes power voltage step down module, signal acquisition module and low-power consumption bluetooth module, the pressure sensor it is defeated
Go out end to be connected with the signal acquisition module, the signal acquisition module is connected with the low-power consumption bluetooth module, the power supply
Voltage reduction module is connected with the signal acquisition module.
7. the pressure suspension polishing Fluid pressure wireless acquisition system as claimed in claim 6 that surges, it is characterised in that：The signal
The single-chip microcomputer of acquisition module is the ATMEGA328 of atmel corp.
8. the pressure suspension polishing Fluid pressure wireless acquisition system as claimed in claim 6 that surges, it is characterised in that：The low work(
The SoC System on Chip/SoCs for consuming bluetooth module are TI CC2541.
9. the pressure suspension polishing Fluid pressure wireless acquisition system as claimed in claim 6 that surges, it is characterised in that：The power supply
Decompression chip is LM2596S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711370151.6A CN107843378A (en) | 2017-12-19 | 2017-12-19 | Pressure of surging suspension polishing Fluid pressure wireless acquisition system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711370151.6A CN107843378A (en) | 2017-12-19 | 2017-12-19 | Pressure of surging suspension polishing Fluid pressure wireless acquisition system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107843378A true CN107843378A (en) | 2018-03-27 |
Family
ID=61663945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711370151.6A Pending CN107843378A (en) | 2017-12-19 | 2017-12-19 | Pressure of surging suspension polishing Fluid pressure wireless acquisition system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107843378A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030037618A1 (en) * | 2001-08-24 | 2003-02-27 | Surpass Industry Co., Ltd., A Japanese Corporation | Pressure sensor |
| CN101344468A (en) * | 2008-08-25 | 2009-01-14 | 浙江工业大学 | Sound suspending polissoir for nanometer mechanics characterization sample |
| CN101905438A (en) * | 2010-07-13 | 2010-12-08 | 厦门大学 | Polishing pressure detection device for heavy-calibre element |
| CN102221416A (en) * | 2011-03-10 | 2011-10-19 | 清华大学 | Polishing solution physical parameter measuring apparatus, measuring method and chemically mechanical polishing equipment |
| CN104316231A (en) * | 2014-10-28 | 2015-01-28 | 浙江工业大学 | Dynamic force chain observation device of flexible polishing wear particle group |
| CN104897296A (en) * | 2015-06-13 | 2015-09-09 | 广东工业大学 | Temperature detection device of polishing interface and utilization of temperature signals in chemically mechanical polishing process |
| CN105181187A (en) * | 2015-09-09 | 2015-12-23 | 沈阳仪表科学研究院有限公司 | Silicon-based pressure sensor and manufacturing method thereof |
-
2017
- 2017-12-19 CN CN201711370151.6A patent/CN107843378A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030037618A1 (en) * | 2001-08-24 | 2003-02-27 | Surpass Industry Co., Ltd., A Japanese Corporation | Pressure sensor |
| CN101344468A (en) * | 2008-08-25 | 2009-01-14 | 浙江工业大学 | Sound suspending polissoir for nanometer mechanics characterization sample |
| CN101905438A (en) * | 2010-07-13 | 2010-12-08 | 厦门大学 | Polishing pressure detection device for heavy-calibre element |
| CN102221416A (en) * | 2011-03-10 | 2011-10-19 | 清华大学 | Polishing solution physical parameter measuring apparatus, measuring method and chemically mechanical polishing equipment |
| CN104316231A (en) * | 2014-10-28 | 2015-01-28 | 浙江工业大学 | Dynamic force chain observation device of flexible polishing wear particle group |
| CN104897296A (en) * | 2015-06-13 | 2015-09-09 | 广东工业大学 | Temperature detection device of polishing interface and utilization of temperature signals in chemically mechanical polishing process |
| CN105181187A (en) * | 2015-09-09 | 2015-12-23 | 沈阳仪表科学研究院有限公司 | Silicon-based pressure sensor and manufacturing method thereof |
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