CN107834169B - 一种高电导率多层石墨烯厚膜及阻抗加载形射频识别电子标签 - Google Patents

一种高电导率多层石墨烯厚膜及阻抗加载形射频识别电子标签 Download PDF

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CN107834169B
CN107834169B CN201710964188.5A CN201710964188A CN107834169B CN 107834169 B CN107834169 B CN 107834169B CN 201710964188 A CN201710964188 A CN 201710964188A CN 107834169 B CN107834169 B CN 107834169B
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吴志鹏
何大平
张博涵
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Wuhan University of Technology WUT
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    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
    • H01Q1/368—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor using carbon or carbon composite
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    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
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    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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    • H01—ELECTRIC ELEMENTS
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    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
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    • H01Q9/20—Two collinear substantially straight active elements; Substantially straight single active elements
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    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
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Abstract

本发明公开了一种高电导率多层石墨烯厚膜及阻抗加载形射频识别电子标签。先将聚酰亚胺、聚酰胺、氧化石墨烯等石墨膜前驱体通过刮刀法或丝网印刷法成膜，在50～180℃温度下热压成型，制得石墨烯膜前驱体；将石墨烯膜前驱体置于高温炉中，先在200～500℃低温热处理1～2小时，再分别经1000～1500℃热处理2～5小时，2000～2800℃热处理2～5小时，多次循环热处理后再经12小时缓慢冷却；最后滚压成型。与传统的金属材料相比，所制成的射频识别电子标签具有类似的性能，在保证信号传输性能的同时，便于大规模生产使用来降低成本，还具有石墨烯材料独特的耐高温、抗腐蚀、柔性、环保等性质。

Description

一种高电导率多层石墨烯厚膜及阻抗加载形射频识别电子 标签
技术领域
本发明属于天线技术和无线射频识别领域，特别是一种高电导率多层石墨烯厚膜及阻抗加载形射频识别电子标签。
背景技术
射频识别RFID，是一种通过无线射频方式进行非接触的双向数据通信，对目标加以识别并获取相关数据的自动识别技术。随着物联网的普及，射频识别广泛用于物流、食品溯源、医药管理、门禁等日常生活领域。大量的文章专利专注于天线的设计，以期使标签可以传输更远的距离，应对更复杂的环境。目前，大多数的射频识别电子标签的天线材质是铜、铝、银浆或导电油墨，形状为宽度一致的线形，材料本身价格昂贵，天线较大用料较多且制作过程复杂，金属天线在机械柔韧性和耐腐蚀性方面有一定的不足。
发明内容
本发明主要目的在于针对传统材料的不足，提出一种高电导率多层石墨烯厚膜及阻抗加载形射频识别电子标签，替代传统金属制成的射频识别电子标签，以降低制作成本，满足高频、超高频和微波频段的工作要求。
为达到上述目的，采用技术方案如下：
一种高电导率多层石墨烯厚膜，采用以下步骤制备而来：
先将聚酰亚胺、聚酰胺、氧化石墨烯等石墨膜前驱体通过刮刀法或丝网印刷法成膜，在50～180℃温度下热压成型，制得石墨烯膜前驱体；将石墨烯膜前驱体置于高温炉中，先在200～500℃低温热处理1～2小时，再分别经1000～1500℃热处理2～5小时，2000～2800℃热处理2～5小时，多次循环热处理后再经12小时缓慢冷却；最后进一步滚压成型，制得高电导率多层石墨烯厚膜。
其中一种优化后的高电导率多层石墨烯厚膜，具体采用以下步骤制备而来：
1)将聚酰亚胺、聚酰胺、氧化石墨烯通过刮刀法或丝网印刷法成膜，在180℃温度下热压成型，制得石墨烯膜前驱体；
2)将所得石墨烯膜前驱体置于惰性气体或真空环境的高温炉中，先在500℃低温热处理2小时，再分别经1500℃热处理3小时和2800℃热处理3小时；
3)按步骤2所述热处理循环3次以上；再以每分钟4℃的降温速度匀速下降至室温；在室温下进一步滚压成型，制得高电导率多层石墨烯厚膜。
一种阻抗加载形射频识别电子标签，包含天线贴片、电子芯片和基板；
所述天线贴片采用上述高电导率多层石墨烯厚膜。
按上述方案，所述高电导率多层石墨烯厚膜电导率高于106S/m，层数在1千层至1兆层石墨烯之间，形状为阻抗加载形。
按上述方案，所述芯片为主流高频、超高频或微波频段中的一种。
按上述方案，所述基板材质为纸片、PVC、ABS、PET或PI中的一种。
本发明的技术效果如下：
高电导率多层石墨烯厚膜与传统的碳基材料如石墨烯墨水相比，具有高面内取向结构，从而具有优良的导电性，其电导率可以达到107S/m，为制作高性能射频识别电子标签提供了必要的电导率。
高电导率多层石墨烯厚膜与传统的金属材料相比，所制成的射频识别电子标签具有类似的性能，在保证信号传输性能的同时，高电导率多层石墨烯厚膜便于大规模生产使用来降低成本，还具有石墨烯材料独特的耐高温、抗腐蚀、柔性、环保等性质。
高电导率多层石墨烯厚膜制作的阻抗加载形天线，与传统的宽度一致的线形天线相比，既能有效缩短天线长度，满足小型化应用要求，减少材料用量，进一步降低成本；还能增加天线带宽，减少工艺制作误差，提高成品率。
附图说明
图1：石墨烯厚膜横截面及放大后的扫描电镜图；
图2：石墨烯基本组成单元的透射电镜图；
图3：实施例1超高频射频识别电子标签示意图；
图4：实施例2高频射频识别电子标签示意图；
图5：实施例3微波频段射频识别电子标签示意图。
其中，10-天线；20-芯片；30-基板；111-短路环；112-阻抗加载形方波段；113末端加载；121-阻抗加载形线圈；122-过桥；123-过孔；131-阻抗加载形直线偶极子。
具体实施方式
运用电磁仿真软件设计天线使其与电子芯片阻抗共轭匹配，按照仿真结果将高电导率多层石墨烯厚膜加工成型，将天线贴片与电子芯片用导电银胶粘合，制得不同频段的射频识别电子标签。
以下给出本发明的不同参数的实施例，进一步阐明本发明的技术方案，但不作为对本发明保护范围的限制。
实施例1
1)将聚酰亚胺、聚酰胺、氧化石墨烯通过刮刀法或丝网印刷法成膜，在180℃温度下热压成型，制得石墨烯膜前驱体；
2)将所得石墨烯膜前驱体置于惰性气体或真空环境的高温炉中，先在500℃低温热处理2小时，再分别经1500℃热处理3小时和2800℃热处理3小时；
3)按步骤2所述热处理循环3次以上；再以每分钟4℃的降温速度匀速下降至室温；在室温下进一步滚压成型，制得高电导率多层石墨烯厚膜。
采用扫描电镜与透射电镜对石墨烯厚膜的微观结构形貌进行表征：图1为石墨烯厚膜横截面及放大后的扫描电镜图，可见其是由石墨烯层有序堆积而成；图2为透射电镜观察到的石墨烯基本组成单元：碳原子六元环结构。
参照图3所示，本实施例中高电导率多层石墨烯厚膜及阻抗加载形的超高频射频电子识别电子标签包括天线10、芯片20和基板30，覆盖869MHz和915MHz频段。所述天线10包含短路环111及偶极子，采用上述步骤制备的高电导率多层石墨烯厚膜激光雕刻而成，其厚膜电导率为5x 106S/m，层数约为9万层。所述短路环111位于基板的中部，为矩形。所述偶极子设有左臂和右臂，所述左臂设有幅度相等的阻抗加载形方波段112和末端加载113，阻抗加载形方波段的数量为3个，高度为6mm，末端加载的形状为菱形，镂空的形状为椭圆形，所述右臂和左臂镜像对称。所述芯片20型号为Impinj Monza4。所述基板30呈矩形设置，材质为纸片，其尺寸为长80mm，宽10mm，厚度0.2mm。
实施例2
参照图4，本实施例中高电导率多层石墨烯厚膜及阻抗加载形的高频射频电子识别电子标签包括天线10、芯片20、基板30，覆盖13.56MHz频段。所述天线10包含阻抗加载形线圈121、过桥122和过孔123，其材质为高电导率多层石墨烯厚膜，厚膜电导率为1x 106S/m，层数约为7.5万层，由实施例1中成膜步骤制备一大片厚膜再用机械压膜而成。所述阻抗加载形线圈是方形，线圈宽度为0.5mm，线圈数为8圈。所述芯片型号为NXPMFRC522。所述基板30呈矩形设置，材质为PVC，其尺寸范围为长100mm，宽90mm，厚度0.2mm。
实施例3
参照图5，本实施例中高电导率多层石墨烯厚膜及阻抗加载形的微波频段射频电子识别电子标签包括天线10、芯片20、基板30，覆盖2.45GHz频段。所述天线10材质为高电导率多层石墨烯厚膜，厚膜电导率为8x 105S/m，层数约为6万层，由实施例1中成膜步骤直接制备而成。所述偶极子左臂为阻抗加载形直线偶极子131，臂长为50mm，所述右臂和左臂镜像对称。所述芯片型号为nRF2401。所述基板30呈矩形设置，材质为PET，其尺寸范围为长120mm，宽20mm，厚度0.3mm。

Claims (4)

1.一种阻抗加载形射频识别电子标签，其特征在于包含天线贴片、电子芯片和基板；
所述天线贴片采用高电导率多层石墨烯厚膜，所述石墨烯厚膜按以下方式制备而来：
先将聚酰亚胺、聚酰胺、氧化石墨烯通过刮刀法或丝网印刷法成膜，在50 ~ 180℃温度下热压成型，制得石墨烯膜前驱体；将石墨烯膜前驱体置于高温炉中，先在200 ~ 500℃低温热处理1 ~ 2小时，再分别经1000 ~ 1500℃热处理2 ~ 5小时，2000 ~ 2800℃热处理2 ~5小时，多次循环热处理后再经12小时缓慢冷却；最后进一步滚压成型，制得高电导率多层石墨烯厚膜。
2.如权利要求1所述阻抗加载形射频识别电子标签，其特征在于所述高电导率多层石墨烯厚膜电导率高于106 S/m，层数在1千层至1兆层石墨烯之间，形状为阻抗加载形。
3.如权利要求1所述阻抗加载形射频识别电子标签，其特征在于所述芯片为主流高频、超高频或微波频段中的一种。
4.如权利要求1所述阻抗加载形射频识别电子标签，其特征在于所述基板材质为纸片、PVC、 ABS、 PET或PI中的一种。
CN201710964188.5A 2017-10-17 2017-10-17 一种高电导率多层石墨烯厚膜及阻抗加载形射频识别电子标签 Expired - Fee Related CN107834169B (zh)

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