CN107815245B - Application of dodecyl triethoxy silane, tin surface protective agent for PCB manufacturing and tin surface protection method - Google Patents
Application of dodecyl triethoxy silane, tin surface protective agent for PCB manufacturing and tin surface protection method Download PDFInfo
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- CN107815245B CN107815245B CN201711061413.0A CN201711061413A CN107815245B CN 107815245 B CN107815245 B CN 107815245B CN 201711061413 A CN201711061413 A CN 201711061413A CN 107815245 B CN107815245 B CN 107815245B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- Electroplating Methods And Accessories (AREA)
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- Other Surface Treatments For Metallic Materials (AREA)
Abstract
In the prior art, a thicker tin layer needs to be electroplated on a PCB to resist etching, aiming at higher cost of electroplating the thicker tin layer, the invention discloses the application of dodecyl triethoxy silane and a tin surface protective agent and a tin surface protection method for PCB manufacture, the film forming component of the tin surface protective agent is dodecyl triethoxy silane, and in the PCB manufacturing process, the dodecyl triethoxy silane in the tin surface protective agent can generate a complex reaction with metallic tin to generate a compact, stable and transparent polymer nano organic complex film which is attached to the tin surface, passivates the surface activity of tin, isolates the contact of tin and air or other chemical components to play roles of preventing tin dissolution and etching, therefore, the PCB can achieve the same etching resistance effect only by electroplating a thinner tin layer and combining the tin surface protective agent, thereby reducing the consumption of metal tin and reducing the production cost.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to application of dodecyl triethoxy silane, a tin surface protective agent for PCB manufacturing and a tin surface protection method.
Background
The tin surface protective agent can be used for protecting the tin surface from being corroded and damaged by other chemical components in the environment, and is widely applied to the protection of metal parts. In addition, in the prior art, when a circuit board is manufactured, the electroplating thickness of tin of 5-8um is usually adopted to achieve the etching resistance effect, and if the electroplating thickness is too thin, the etching resistance effect may not be achieved, and because the cost of metal tin is high, great cost pressure is caused to enterprises.
Disclosure of Invention
in order to solve the technical problem, the invention discloses application of dodecyl triethoxy silane, namely the application of the dodecyl triethoxy silane to tin surface protection after a tin plating process in the manufacturing process of a PCB (printed circuit board).
In combination with the application of the dodecyl triethoxy silane in tin surface protection, the scheme also discloses a tin surface protective agent for PCB manufacturing, the tin surface protective agent comprises a film forming agent capable of generating a protective film on a tin surface, and the film forming agent is dodecyl triethoxy silane.
The emulsion is composed of dimethyl silicone oil and polyoxyethylene ether, the stabilizer is ethanol, and the solvent is water.
Further, according to the weight ratio, the content of the dodecyl triethoxy silane is 1% -2%, the content of the dimethyl silicon oil is 0.1% -0.2%, the content of the polyoxyethylene ether is 3% -8%, the content of the ethanol is 0.5% -2%, and the balance is water.
Further, according to the weight ratio, the content of the dodecyl triethoxy silane is 1.5%, the content of the dimethyl silicone oil is 0.15%, the content of the polyoxyethylene ether is 4%, the content of the ethanol is 1.2%, and the balance is water.
Further, the detergent also comprises a detergent which is phosphate.
further, the content of the phosphate is 2% -4%.
Further, the phosphate content is 3%.
Finally, also discloses a tin surface protection method used in PCB manufacture, namely after tin plating, under strong alkaline environment, adding the tin surface protective agent to generate a layer of protective film on the tin surface.
The invention discloses an application of dodecyl triethoxy silane, a tin surface protective agent for PCB manufacture and a tin surface protection method, wherein the main film forming component of the tin surface protective agent is dodecyl triethoxy silane, during the PCB manufacture process, the dodecyl triethoxy silane can generate a complex reaction with metallic tin to generate a compact, stable and transparent high molecular nano organic complex film which is attached on the tin surface, passivates the surface activity of tin, isolates the contact of tin with air and other chemical components, and plays roles of tin dissolution prevention and etching resistance.
Drawings
The invention will be described in detail with reference to the accompanying drawings
FIG. 1 is a flow chart of the application of the tin surface protective agent of the present invention in PCB manufacture.
Detailed Description
In order to explain technical contents, objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
In one embodiment, the invention discloses an application of dodecyl triethoxy silane, and particularly relates to the tin surface protection after a tin plating process in a PCB manufacturing process. In combination with the application, the invention particularly discloses a tin surface protective agent for PCB manufacturing, which comprises a film forming agent capable of generating a protective film on a tin surface, wherein the film forming agent is dodecyl triethoxy silane. In use, under a strong alkaline environment, the film-forming agent dodecyl triethoxy silane can perform a complex reaction with metallic tin to generate a compact, stable and transparent high-molecular nano organic complex film which is attached to a tin surface, passivates the surface activity of tin, and isolates the contact of tin with air and other chemical components to play roles of preventing tin dissolution and resisting etching. So that the thickness of the conventional tin coating of 5-8um can be reduced to 2-4um, and the same anti-etching effect can be achieved.
When the tin surface protective agent is prepared, a film-forming agent, namely dodecyl triethoxysilane, for a main reaction is needed to be matched with a corresponding solvent, an emulsifier and a stabilizer, so that the film-forming agent and the three-agent oxysilane can be well dispersed in the solvent and can be kept in a stable state. The solvent is preferably water, the emulsifier is preferably a mixture of dimethyl silicone oil and polyoxyethylene ether, the emulsifying effect is better, and the dispersion state of the film forming agent dodecyl triethoxy silane is stabilized by using ethanol as a stabilizing agent. Calculated by weight ratio, the content of the dodecyl triethoxy silane is 1-2%, the content of the dimethyl silicone oil is 0.1-0.2%, the content of the polyoxyethylene ether is 3-8%, the content of the ethanol is 0.5-2%, and the balance is water. More preferably, the content of the dodecyl triethoxysilane is 1.5%, the content of the dimethyl silicone oil is 0.15%, the content of the polyoxyethylene ether is 4%, the content of the ethanol is 1.2%, and the balance is water.
In addition, in one embodiment, the tin surface protective agent also comprises a scale remover, so that the tin surface protection can be achieved, and meanwhile, some attached precipitates, such as some calcium and magnesium salt substances, can be removed. The detergent may preferably be a phosphate. The content of the phosphate is 2% -4%. The phosphate content may also preferably be 3%.
In addition, the invention relates to a tin surface protection method used in PCB manufacture, namely after tin plating, the tin surface protective agent is added under strong alkaline environment to generate a protective film on the tin surface. Thereby achieving the purpose of protecting the tin surface.
For example, firstly, the tin surface protective agent is prepared according to the proportion of 1.5 percent of dodecyl triethoxysilane, 0.15 percent of dimethyl silicone oil, 4 percent of polyoxyethylene ether, 1.2 percent of ethanol, 3 percent of phosphate and the balance of water, and all the components are added into water, so that the dodecyl triethoxysilane is well dispersed and stably exists. Some details of the formulation method may be directed to other types of tin surface protectors formulated in the prior art.
Referring to fig. 1, in the manufacturing process of the PCB, when the PCB is subjected to the tin plating process, the conventional process employs 11ASF current density electroplating for 10 minutes, and the tin layer can substantially reach a thickness of 5.2um, and the tin plating layer can substantially achieve the subsequent etching resistance effect at the thickness. The tin surface protective agent is used in the scheme, the tin coating thickness is 2.6um only by adopting the 11ASF current density for electroplating for 5 minutes, and the subsequent complexing protective film is formed by combining the tin surface protective agent, so that the similar etching resistant effect can be achieved, as shown in the table I. Therefore, on one hand, half of the tinning time can be saved, on the other hand, half of the metal tin can be saved, and the actual cost of tinning protection can be greatly reduced.
Watch 1
In this embodiment, after the tin plating process of forming a thin tin layer, the processes of film removal → water washing → etching → tin removal → drying, etc. may be further performed. The key point of the application of the tin surface protective agent or tin surface protection is in the film stripping process. And adding 5% NaOH and 4% tin surface protective agent into the film removing component in the film removing groove, and removing the film of the tinned PCB for 24 hours at the temperature of 45-56 ℃. The addition of NaOH can provide a strong alkaline environment for the complex reaction of film forming agent dodecyl triethoxy silane in the tin surface protective agent and metallic tin.
In order to compare the effect of the tin surface protective agent, 5% NaOH or conventional organic film removing liquid can be respectively added into the film removing groove of the film removing process, and the film removing treatment is carried out on the tin-plated PCB for 24 hours at the temperature of 45-56 ℃. The treatment effect of the three schemes is shown in table two.
Watch two
From the second table, it can be seen that when only a thin tin layer is electroplated, if only 5% NaOH or other conventional organic stripping liquid is added to the stripping component in the stripping step, the tin dissolution phenomenon occurs in the subsequent process, and the tin surface is blackened. If the tin surface protective agent in the scheme is added into the film removing component and a strong alkaline environment is given, the tin dissolving phenomenon basically cannot occur in the subsequent treatment, and the appearance of the tin surface is relatively normal.
In summary, the tin surface protective agent and the tin surface protection method for PCB manufacture have the main film forming component of dodecyl triethoxy silane, water is used as a solvent, and an emulsifier of dimethyl silicon oil, polyoxyethylene ether and stabilizer of ethanol are matched, so that the dodecyl triethoxy silane can be well dispersed in the water solvent and stably exist, the tin surface protective agent is convenient to use in a film stripping process, and meanwhile, a scale remover phosphate can be further included. In the film stripping process after tin plating in the PCB manufacturing process, the tin surface protective agent is added, wherein dodecyl triethoxy silane can generate a complex reaction with metallic tin to generate a compact, stable and transparent polymer nano organic complex film which is attached to the tin surface, the surface activity of tin is passivated, and the tin is isolated from the contact of air and other chemical components to play the roles of tin dissolution prevention and etching resistance.
Compared with the prior art, if the tin surface protective agent and the tin surface protection method in the scheme are adopted in PCB manufacturing, the method has a plurality of advantages:
(1) Saving the procurement cost of metallic tin
The tin plating layer is combined with the tin surface protective agent, the thickness of the tin plating layer in the prior art can be reduced to half basically, so that a large amount of metal tin can be saved when the circuit board with the same amount is manufactured, and the purchase cost of the metal tin is saved
(2) Saving the cost of tin-containing polishing agent
The reduction of the thickness of the metallic tin layer naturally saves the cost of the tin-soldering agent
(3) Save the electroplating time and improve the productivity
Generally, the thickness of the tin plating layer is in positive correlation or direct proportion with the tin plating time, and the plating time is synchronous and less under the condition that the required thickness of the tin layer is reduced, so that more PCBs can be plated within the same time, and the productivity is improved
(4) Saving electroplating water and electricity
(5) The effect of film-removing is more rational
The thickness of the tin plating layer is reduced, and the poor film clamping can be reduced. In addition, the tin surface protective agent is basically not required to be defoamed, so that the cost of the defoaming agent is saved. Finally, the tin surface protective agent also has a scale inhibition function, so that a pipeline cannot be scaled and blocked, and a tank is easier to clean.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent flow transformations made by using the contents of the specification and drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. The application of dodecyl triethoxy silane is characterized in that: the dodecyl triethoxy silane is applied to tin surface protection after a tin plating process in a PCB manufacturing process.
2. A tin surface protective agent for PCB manufacture is characterized in that: comprises a film forming agent which can generate a protective film on a tin surface, and an emulsifier, a stabilizer and a solvent which are matched with the film forming agent; the film forming agent is dodecyl triethoxy silane, the emulsifier is dimethyl silicone oil and polyoxyethylene ether, the stabilizer is ethanol, and the solvent is water;
According to the weight ratio, the content of the dodecyl triethoxy silane is 1-2%, the content of the dimethyl silicone oil is 0.1-0.2%, the content of the polyoxyethylene ether is 3-8%, the content of the ethanol is 0.5-2%, and the balance is water.
3. The tin surface protectant for PCB manufacture of claim 2, wherein: according to the weight ratio, the content of the dodecyl triethoxysilane is 1.5%, the content of the dimethyl silicone oil is 0.15%, the content of the polyoxyethylene ether is 4%, the content of the ethanol is 1.2%, and the balance is water.
4. The tin surface protectant for PCB manufacture of claim 2 or 3, wherein: the descaling agent is phosphate, and the content of the phosphate is 2% -4%.
5. The tin surface protectant for PCB manufacture of claim 4, wherein: the phosphate content was 3%.
6. A tin surface protection method used in PCB manufacture is characterized in that: after tin plating, a protective film is formed on the tin surface by adding the tin surface protective agent according to any one of claims 2 to 5 in a strongly alkaline environment.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711061413.0A CN107815245B (en) | 2017-11-02 | 2017-11-02 | Application of dodecyl triethoxy silane, tin surface protective agent for PCB manufacturing and tin surface protection method |
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| CN201711061413.0A CN107815245B (en) | 2017-11-02 | 2017-11-02 | Application of dodecyl triethoxy silane, tin surface protective agent for PCB manufacturing and tin surface protection method |
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| CN107815245B true CN107815245B (en) | 2019-12-10 |
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| CN109831879A (en) * | 2019-02-23 | 2019-05-31 | 上海富柏化工有限公司 | A kind of shield tin type PCB goes film liquid |
| CN111118501A (en) * | 2020-01-07 | 2020-05-08 | 深圳市星扬高新科技有限公司 | Tin surface protective agent and preparation method thereof |
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| US8071160B2 (en) * | 2007-10-29 | 2011-12-06 | Integrated Surface Technologies | Surface coating process |
| TWI491601B (en) * | 2008-09-25 | 2015-07-11 | Sekisui Chemical Co Ltd | A sulfide compound, a mixture containing a cyclic sulfide, a process for producing a mixture containing a cyclic sulfide, a hardened composition and a connecting structure |
| CN102731558A (en) * | 2012-06-08 | 2012-10-17 | 湖北德邦化工新材料有限公司 | Organosilicone oligomer and preparation method thereof, and bi-component system and application thereof |
| US8587945B1 (en) * | 2012-07-27 | 2013-11-19 | Outlast Technologies Llc | Systems structures and materials for electronic device cooling |
| CN103088325B (en) * | 2012-12-18 | 2016-06-08 | 芜湖恒坤汽车部件有限公司 | A kind of metal material surface silane finish and preparation method thereof |
| CN103589266B (en) * | 2013-11-15 | 2015-11-18 | 桂林理工大学 | A kind of preparation method of oiliness stain control agent and application thereof |
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