CN107808835A - Magnetic conductive board and device transfer device - Google Patents
Magnetic conductive board and device transfer device Download PDFInfo
- Publication number
- CN107808835A CN107808835A CN201710984900.8A CN201710984900A CN107808835A CN 107808835 A CN107808835 A CN 107808835A CN 201710984900 A CN201710984900 A CN 201710984900A CN 107808835 A CN107808835 A CN 107808835A
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- magnetic
- presumptive area
- conductive board
- magnetic conductive
- base palte
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- 239000000463 material Substances 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 230000001965 increasing effect Effects 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 230000003993 interaction Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a kind of magnetic conductive board and device transfer device.The magnetic conductive board includes the first presumptive area and the second presumptive area；The magnetic field that the magnetic conductive board is used to the magnetic component in corresponding device transfer device is generated is gathered in first presumptive area, and the magnetic field is shielded at second presumptive area adjacent with first presumptive area, so that the magnetic force corresponding to the magnetic field is gathered in first presumptive area, so that treating that the device of the device transfer device transfer is transferred to the pre-position for the array base palte being arranged on the plummer of the device transfer device in the range of predefined paths corresponding with first presumptive area.Substantial amounts of device rapidly can be arranged on array base palte by the present invention, improve the manufacture efficiency of the device array substrate including device and array base palte.
Description
【Technical field】
The present invention relates to display panel manufacturing technology field, more particularly to a kind of magnetic conductive board and device transfer device.
【Background technology】
With the development of technology, part display panel need to be implanted into the fabrication process (setting) multiple device (for example,
Micro LED)。
In order to which multiple devices are arranged on into display panel during display panel is manufactured, traditional technical scheme is：
Device to be placed is aligned with the precalculated position in display panel one by one using implanted device, then one by one set the device
(fixation) is put in the display panel.
Under above-mentioned technical proposal is less efficient.Because the quantity for the device for needing to set in display panel is often more, because
Device is arranged in display panel by this using above-mentioned technical proposal to be needed to take a substantial amount of time.
Therefore, it is necessary to a kind of new technical scheme is proposed, to solve above-mentioned technical problem.
【The content of the invention】
It is an object of the invention to provide a kind of magnetic conductive board and device transfer device, and it rapidly can set substantial amounts of device
It is placed on array base palte, improves the manufacture efficiency of the device array substrate including device and array base palte.
To solve the above problems, technical scheme is as follows：
A kind of magnetic conductive board, the magnetic conductive board include the first presumptive area and the second presumptive area；The magnetic conductive board is used to make
Corresponding to the magnetic field that is generated of magnetic component in device transfer device be gathered in first presumptive area, and with it is described
The magnetic field is shielded at adjacent second presumptive area of first presumptive area, so that the magnetic fields corresponding to the magnetic field
Power is gathered in first presumptive area, so that treating that the device of the device transfer device transfer makes a reservation for described first
The pre- of the array base palte that is arranged on the plummer of the device transfer device is transferred to corresponding to region in the range of predefined paths
Determine opening position.
In above-mentioned magnetic conductive board, first presumptive area and the region pair of the device to be placed in the array base palte
Should.
In above-mentioned magnetic conductive board, the magnetic conductive board is additionally operable to form magnetic induction line at first presumptive area, with increase
Act on the intensity of the magnetic force of the device.
In above-mentioned magnetic conductive board, at least two first presumptive areas are arranged in the form of one-dimensional array or two-dimensional array.
In above-mentioned magnetic conductive board, the material of the magnetic conductive board is iron.
A kind of device transfer device, the device transfer device include plummer, device transfer blade, magnetic component and magnetic conduction
Plate；The magnetic conductive board is arranged at the top of the loading end of the plummer or is arranged in the plummer, the magnetic conductive board bag
Include the first presumptive area and the second presumptive area；The magnetic field that the magnetic conductive board is used to the magnetic component is generated is gathered in
First presumptive area, and the magnetic field is shielded at second presumptive area adjacent with first presumptive area,
So that the magnetic force corresponding to the magnetic field is gathered in first presumptive area, so that treating the device transfer blade
The device of transfer is transferred in the range of predefined paths corresponding with first presumptive area and is arranged on the plummer
The pre-position of array base palte.
In above-mentioned device transfer device, first presumptive area and the device to be placed in the array base palte
Region is corresponding.
In above-mentioned device transfer device, the magnetic conductive board is additionally operable to form magnetic induction line at first presumptive area,
With increasing action in the intensity of the magnetic force of the device.
In above-mentioned device transfer device, at least two first presumptive areas are in the form of one-dimensional array or two-dimensional array
Arrangement.
In above-mentioned device transfer device, the material of the magnetic conductive board is iron.
Compared with the prior art, the present invention by magnetic component to the substantial amounts of device that device transfer blade is provided with due to being applied
Magnetic force, therefore the substantial amounts of device can be allowd disposably to shift (setting) to array base palte, also
It is to say, substantial amounts of device rapidly can be arranged on array base palte by the present invention, improve the device including device and array base palte
The manufacture efficiency of part array base palte.
For the above of the present invention can be become apparent, preferred embodiment cited below particularly, and coordinate institute's accompanying drawings, make
Describe in detail as follows.
【Brief description of the drawings】
Fig. 1 is that the device transfer device for being provided with magnetic conductive board of the present invention closes with the position of the array base palte of device to be placed
The schematic diagram of system；
Fig. 2 is the schematic diagram of the first embodiment of the magnetic conductive board of the present invention；
Fig. 3 is the schematic diagram of the second embodiment of the magnetic conductive board of the present invention.
【Embodiment】
Word used in this specification " embodiment " means example, example or illustration.In addition, this specification and appended power
Profit require used in article " one " can usually be interpreted " one or more ", unless otherwise or from context
It can understand and determine singulative.
With reference to the device transfer device for being provided with magnetic conductive board 106 and device to be placed that figure 1, Fig. 2 and Fig. 3, Fig. 1 are the present invention
The schematic diagram of the position relationship of the array base palte 102 of part 104, Fig. 2 are the signal of the first embodiment of the magnetic conductive board 106 of the present invention
Figure, Fig. 3 are the schematic diagram of the second embodiment of the magnetic conductive board 106 of the present invention.
The magnetic conductive board 106 of the present invention can be arranged in device transfer device.
The device transfer device includes plummer 101, device transfer blade 103, magnetic component 105.
The plummer 101 has loading end, and the loading end is used for the array base palte 102 for carrying device 104 to be received.
The magnetic conductive board 106 is arranged at the top of the loading end of plummer 101 or is arranged in the plummer 101, institute
Magnetic conductive board 106 is stated to be used for so that the magnetic field that the magnetic component 105 is generated is gathered in the first presumptive area 1061, and with institute
State and the magnetic field is shielded at the second adjacent presumptive area 1062 of the first presumptive area 1061, so that the institute corresponding to the magnetic field
State magnetic force and be gathered in first presumptive area 1061 so that the device 104 with first fate
The pre-position being transferred to corresponding to domain 1061 in the range of predefined paths on the array base palte 102.
The magnetic conductive board 106 is used to pass through the magnetic field in first presumptive area 1061, and for described the
Two presumptive areas 1062 shield the magnetic field.
First presumptive area 1061 is corresponding with the region of the device 104 to be placed in the array base palte 102.Extremely
Few two first presumptive areas 1061 are arranged in the form of one-dimensional array or two-dimensional array.
The magnetic conductive board 106 is additionally operable to form magnetic induction line at first presumptive area 1061, with increasing action in institute
State the intensity of the magnetic force of device 104.
The material of the magnetic conductive board 106 is the material that magnetic conductivity is more than predetermined value.
The material of the magnetic conductive board 106 is iron.
In the case where the magnetic conductive board 106 is arranged at the top of the loading end, the magnetic conductive board 106 and the carrying
Face has preset distance.
At least two magnetic components 105 form magnetic field sources array, and the magnetic component 105 is used as magnetic field sources, at least two
The magnetic field sources are arranged in the form of one-dimensional array or two-dimensional array.The magnetic field sources are permanent magnet or electromagnetism generator.
The magnetic field sources be the electromagnetism generator in the case of, the magnetic component 105 also include thread switching control,
Switch and power supplying line.The switch is triode switch.
The switch is connected with the thread switching control, power supplying line and the electromagnetism generator.Described switch is used for
The power supplying line and the electricity are turned on and off under the control for the switch controlling signal that the thread switching control is provided
Current channel between magnetic generator.
The device transfer blade 103 has attachment surface, and the attachment surface is used to adhere to the device 104 to be transferred, institute
The top that device transfer blade 103 is used to for the device 104 to be transferred to be moved to the plummer 101 is stated, and for causing
The device 104 to be transferred is towards the array base palte 102.
The magnetic component 105 is placed in the plummer 101 or is placed in the plummer 101 backwards to the loading end
Surface at, the magnetic component 105 is used to generate magnetic field, and for being located at the battle array in the device 104 to be transferred
Apply magnetic force to the device 104 to be transferred during the top of row substrate 102.
Wherein, the device transfer blade 103 is additionally operable to be located at the array base palte 102 in the device 104 to be transferred
Top when discharge the device 104 so that the device 104 shifts under the collective effect of gravity and the magnetic force
Pre-position on to the array base palte 102.
The device transfer blade 103 is additionally operable to the top for being located at the array base palte 102 in the device 104 to be transferred
When reduce the absorption affinity for adsorbing the device 104, to discharge the device 104, so that the device 104 is in the gravity
With the pre-position being transferred under the collective effect of the magnetic force on the array base palte 102.
Wherein, the absorption affinity is at least one of intermolecular force, electrostatic force, magnetic force.
The magnetic component 105 is used for first when the device 104 to be transferred is located at the top of the array base palte 102
Increasing action is in the intensity of the magnetic force of the device 104, so that the device 104 and the device transfer blade
103 are separated, then the intensity of the magnetic force is reduced during the device 104 falls.
Described device also includes connector, and the connector is used for being arranged at array base palte 102 and being transferred to the battle array
The welding material between the device 104 on row substrate 102 is heated, so that the welding material melts and linked described
Device 104 and the array base palte 102.
The precalculated position is corresponding with the pixel region in the array base palte 102.
In the case where the absorption affinity is electrostatic force, the device transfer blade 103 is used to reduce to be applied to the device 104
Add the quantity of the electric charge of the electrostatic force.
The size of the device 104 is less than predetermined value.The device 104 is LED light lamp.
The device 104 has magnetic pole.The device 104 has an electrode tip.
The device array substrate includes array base palte 102, device array, fixing component.
The first wire array, the second wire array, controlling switch array, contact electricity are provided with the array base palte 102
Pole array, wherein, first wire array includes at least two first wires, at least two first wires in the first direction with
The form arrangement of one-dimensional array, second wire array include at least two second wires, at least two second wires edges with
The vertical second direction of the first direction is arranged in the form of one-dimensional array, and the controlling switch array includes at least four controls
Switch, at least four controlling switches are arranged along the first direction and the second direction in the form of two-dimensional array, the contact
Electrod-array includes at least four contact electrodes, the controlling switch and first wire, second wire and described contacts
Electrode connects.
The device array includes at least two devices 104, and at least two devices 104 are with one-dimensional array or two-dimensional array
Form is arranged, and the device 104 is arranged on the array base palte 102, and the device 104 is set by device transfer device
On the array base palte 102.
The fixing component is by being coated with photoresist to the array base palte 102 for being provided with the device 104, making
Obtain the photoresist to contact with the device 104 and the array base palte 102, and the photoresist is solidified
Manufactured, the fixing component is used to the device 104 being fixed on the array base palte 102.
The array base palte 102 is used to the device array including at least two devices 104 link and form institute
State device array substrate.
The contact electrode is used to receive the device 104 and with the device 104 link, and the contact electrode has the
One area, the device 104 have second area, and the second area is the device 104 and the contact contact electrode
Area, first area is more than twice of the second area.
The magnetic conductive board 106 can also be arranged in the array base palte 102.
Being arranged between adjacent two device 104 on the array base palte 102 has gap, and the fixing component is filled out
Fill the gap.
The fixing component is in contact with least a portion of the side wall of the device 104.
The fixing component coats the device 104, and the fixing component is additionally operable to by the device 104 and the battle array
The entirety that row substrate 102 is formed is packaged.
The fixing component is heated to solidify by thermal source to the photoresist, and/or, the fixed structure
Part is irradiated to solidify by ultraviolet source to the photoresist.
The method of the device transfer device transferring device 104 of the present invention comprises the following steps：
A, the device 104 to be transferred is moved to the top of the plummer 101 by the device transfer blade 103, and
So that the device 104 to be transferred is towards the array base palte 102.
B, the magnetic component 105 when the device 104 to be transferred is located at the top of the array base palte 102 to treating
The device 104 of transfer applies magnetic force.
C, the device transfer blade 103 is released when the device 104 to be transferred is located at the top of the array base palte 102
The device 104 is put, so that the device 104 is transferred to the array under the collective effect of gravity and the magnetic force
Pre-position on substrate 102.
The step C is：
The device transfer blade 103 reduces when the device 104 to be transferred is located at the top of the array base palte 102
The absorption affinity of the device 104 is adsorbed, to discharge the device 104, so that the device 104 is in the gravity and described
The pre-position being transferred under the collective effect of magnetic force on the array base palte 102.
Wherein, the absorption affinity is at least one of intermolecular force, electrostatic force, magnetic force.
The step B includes：
B1, the magnetic component 105 are first when the device 104 to be transferred is located at the top of the array base palte 102
Increasing action is in the intensity of the magnetic force of the device 104, so that the device 104 and the device transfer blade
103 are separated.
B2, the magnetic component 105 reduce the intensity of the magnetic force during the device 104 falls.
Methods described is further comprising the steps of：
D, connector is to being arranged between array base palte 102 and the device 104 being transferred on the array base palte 102
Welding material heated so that the welding material melts and links the device 104 and the array base palte 102.
The precalculated position is corresponding with the pixel region in the array base palte 102.
The preparation method of the device array substrate of the present invention comprises the following steps：
E, device array is set on array base palte 102, wherein, the device array includes at least two devices 104, at least
Two devices 104 are arranged in the form of one-dimensional array or two-dimensional array.
F, to be provided with the device 104 the array base palte 102 be coated with photoresist so that the photoresist with
The device 104 and the array base palte 102 contact.
G, the photoresist is solidified, to form the fixing component, the fixing component is used for the device
Part 104 is fixed on the array base palte 102.
Being arranged between adjacent two device 104 on the array base palte 102 has gap.
The step F includes：
F1, the photoresist is coated on the gap location.
The fixing component is in contact with least a portion of the side wall of the device 104.
The step F also includes：
B2, the photoresist is coated at the device 104, with to by the device 104 and the array base palte
102 entirety formed are packaged.
The step G includes：
C1, the photoresist is heated to solidify using thermal source, to form the fixing component；And/or
C2, the photoresist is irradiated to solidify using ultraviolet source, to form the fixing component.
The present invention (Micro Device) transfer device of device 104 and method core be by magnetic interaction,
From the device transfer blade 103 (Donor substrates) to the array base palte 102 (Receiver substrates) " throwing " or " spray printing " institute
Device 104 is stated, eliminates complicated tediously long exactitude position process.
In the plummer 101 or array base palte 102 lower section, the magnetic that permanent magnet or electromagnetism generator are formed be present
.The magnetic force corresponding with the magnetic field is used to make it that the magnetic device 104 of tool can be by the array base palte
102 absorption.
Any one or more than one that the device transfer device and method of the present invention can be applied in following three situation
Combination：
(1) there is the device 104 of vertical electrode structure；
(2) an electrode contact is only existed on the array base palte 102；
(3) a certain ad-hoc location of the device 104 is needed to be in contact with the array base palte 102.
Now, not need accurate contraposition and the device transfer blade 103, the array base palte 102 it is complicated
The interaction process of power, the suction only by the reduction device transfer blade 103 to the device 104 so that the device
Part 104 departs from the device transfer blade 103 under the collective effect of gravity and magnetic force, is transported to the array base palte 102
It is dynamic.The device transfer blade 103 is adsorbed by intermolecular force, hydrogen bond, electrostatic force or magnetic force or other Chemical Physics modes
The device 104, during the device 104 shifts, the absorption affinity of the device transfer blade 103 weakens, such as can be with
Electric current for example, by reducing the head of array base palte 102 (head) place reduces electrostatic force to complete；On the other hand, the battle array
The attraction of row substrate 102 can strengthen therewith, for example, during the device transfer blade 103 advance, magnetic field intensity has one
Rise to the process declined again so that the stress of device 104 departs from the device transfer blade 103.
So that the device 104 is Micro LED as an example.Micro LED need the one-side contact with the array base palte 102
And linking (Bonding), the device transfer blade 103 is in the top of the array base palte 102, both move toward one anothers, in institute
When stating above the pixel region that device transfer blade 103 is located in the array base palte 102, inhaled by the device transfer blade 103
The collective effect of the decline of attached power or the increase of the attraction of the array base palte 102 or both so that described in Micro LED depart from
Device transfer blade 103, and fall within the array base palte 102, linked afterwards by heating such as the solders of junction to realize.
Said process does not use the operation of exactitude position, without the device transfer blade 103 and the array base palte yet
102 by the connection of the device 104, and the device transfer blade 103 is non-contacting with the array base palte 102.Opposite
The substantial amounts of device 104 can be easily caused to fall within array base palte 102 during motion.Importantly, in order to
Ensure the correct of the position of whereabouts, the position of the electrode whereabouts of the device 104 is the pixel region of the array base palte 102.
In order to ensure the device 104 by " throwing " or " spray printing " on correct position, present invention employs one kind to exist
The patterning plate (magnetic conductive board 106) of armoured magnetic field between magnetic field and array base palte 102.The magnetic conductive board 106 uses high magnetic permeability material
Material, is placed between plummer 101 (Stage) and magnetic component 105 so that the magnetic line of force in the precalculated position is by and making
The magnetic line of force for obtaining the position beyond the precalculated position closes between plate as far as possible, (described pre- so as to substantially reduce inoperative position
Positioning put beyond position) magnetic force.
Magnetic field sources are patternings, are corresponded with the position of pixel or the device 104.
Further, such as when Micro LED or other Micro Device contact with array base palte 102, in order to full
The above-mentioned requirement of foot, can design contact area larger.
Magnetic field at least partially through the magnetic conductive board 106 circular hole hollow area (first presumptive area 1061), it is described
Other regions of magnetic conductive board 106 are mainly by higher magnetic permcability material shields.
The circular hole hollow area of magnetic conductive board 106 has a small amount of magnetic induction line to pass through so that the magnetic force that its correspondence position is subject to
Effect greatly enhances, and the material such as iron of this high magnetic permeability, can be fabricated to the perforate of respective pixel area by photoetching process etc.,
The structure of non-pixel areas shielding.
The size for the electrode being in contact on the array base palte 102 with the device 104 to be transferred is the device 104
Twice or more than twice of size, so as to still can effectively be worked when the device 104 falls within the precalculated position.
After the completion of the device 104 is by " spray printing ", in the presence of the magnetic field, the magnetic pole side of the device 104 is tight
Paste the array base palte 102.The magnetic pole can mutually be conducted with the electrode on the array base palte 102, can not also produce
Electric action.
In order to which the device 104 being arranged on the array base palte 102 is fixed, the present invention uses photoresistance
(Photo Resist) is coated with the array base palte 102 for being provided with the device 104, and coating thickness can be completely covered described
Device 104, it can not also cover.When being completely covered, it can both play the fixed device 104, can play isolation again
The effect of encapsulation.If by the way of photoresist Slit Coating, heat cure or UV are used after the completion of wet film coating
The coefficient method of light irradiation or both so that photoresistance solidifies, so as to rent encapsulated layer by the light of solidification
By the photoresist (fixing component) after solidification and the interaction force of the array base palte 102, and
With the interaction force of the side wall of the device 104, the device 104 is fixed on the array base palte 102.
The technical program is arranged on the position that the device 104 contacts with the array base palte 102 with by solder, and passes through
The mode for the connection function that bottom contact heating and melting solidifies again is different.
When the device 104 is adsorbed by magnetic component 105, by way of Slit Coating or downward Sputter
One layer of encapsulating material (photoresist) is coated with, the device 104 is directly encapsulated on the array base palte 102.
The present invention because the substantial amounts of device being provided with by magnetic component to device transfer blade applies magnetic force, because
This can allow the substantial amounts of device disposably to shift (setting) to array base palte, that is to say, that energy of the present invention
Rapidly substantial amounts of device is arranged on array base palte, improves the system of the device array substrate including device and array base palte
Make efficiency.
In summary, although the present invention is disclosed above with preferred embodiment, above preferred embodiment simultaneously is not used to limit
The system present invention, one of ordinary skill in the art, without departing from the spirit and scope of the present invention, it can make various changes and profit
Decorations, therefore protection scope of the present invention is defined by the scope that claim defines.
Claims (10)
1. a kind of magnetic conductive board, it is characterised in that the magnetic conductive board includes the first presumptive area and the second presumptive area；
The magnetic conductive board be used to causing corresponding to the magnetic field that is generated of magnetic component in device transfer device be gathered in described the
One presumptive area, and the magnetic field is shielded at second presumptive area adjacent with first presumptive area, so that institute
State the magnetic force corresponding to magnetic field and be gathered in first presumptive area, so that treating the device transfer device transfer
Device be transferred in the range of predefined paths corresponding with first presumptive area and be arranged at the device transfer device
The pre-position of array base palte on plummer.
2. magnetic conductive board according to claim 1, it is characterised in that first presumptive area in the array base palte with treating
Set the region of the device corresponding.
3. magnetic conductive board according to claim 1, it is characterised in that the magnetic conductive board is additionally operable in first presumptive area
Place forms magnetic induction line, with increasing action in the intensity of the magnetic force of the device.
4. magnetic conductive board according to claim 1, it is characterised in that at least two first presumptive areas with one-dimensional array or
The form arrangement of two-dimensional array.
5. magnetic conductive board according to claim 1, it is characterised in that the material of the magnetic conductive board is iron.
6. a kind of device transfer device, it is characterised in that the device transfer device includes plummer, device transfer blade, magnetic
Component and magnetic conductive board；
The magnetic conductive board is arranged at the top of the loading end of the plummer or is arranged in the plummer, the magnetic conductive board bag
Include the first presumptive area and the second presumptive area；
The magnetic conductive board is used to causing that the magnetic field that is generated of the magnetic component to be gathered in first presumptive area, and with institute
State and the magnetic field is shielded at adjacent second presumptive area of the first presumptive area, so that the magnetic field corresponding to the magnetic field is made
First presumptive area is firmly gathered in, so that treating that the device of the device transfer blade transfer makes a reservation for described first
The pre-position for the array base palte being arranged on the plummer is transferred to corresponding to region in the range of predefined paths.
7. device transfer device according to claim 6, it is characterised in that first presumptive area and the array base
The region of the device to be placed is corresponding in plate.
8. device transfer device according to claim 6, it is characterised in that the magnetic conductive board is additionally operable to pre- described first
Determine to form magnetic induction line at region, with increasing action in the intensity of the magnetic force of the device.
9. device transfer device according to claim 6, it is characterised in that at least two first presumptive areas are with one-dimensional
The form of array or two-dimensional array arranges.
10. device transfer device according to claim 6, it is characterised in that the material of the magnetic conductive board is iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710984900.8A CN107808835B (en) | 2017-10-20 | 2017-10-20 | Magnetic conduction plate and device transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710984900.8A CN107808835B (en) | 2017-10-20 | 2017-10-20 | Magnetic conduction plate and device transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107808835A true CN107808835A (en) | 2018-03-16 |
| CN107808835B CN107808835B (en) | 2020-07-10 |
Family
ID=61592263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710984900.8A Active CN107808835B (en) | 2017-10-20 | 2017-10-20 | Magnetic conduction plate and device transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107808835B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| US11887997B2 (en) | 2019-07-05 | 2024-01-30 | Century Technology (Shenzhen) Corporation Limited | Method for transferring light emitting elements, display panel, method for making display panel, and substrate |
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| US11322644B2 (en) | 2019-07-05 | 2022-05-03 | Century Technology (Shenzhen) Corporation Limited | Method for transferring light emitting elements, and method for making display panel |
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| CN110265341A (en) * | 2019-07-05 | 2019-09-20 | 深超光电（深圳）有限公司 | The transfer method of light-emitting component, display panel and preparation method thereof, substrate |
| CN110416122B (en) * | 2019-07-05 | 2021-06-29 | 深超光电（深圳）有限公司 | Light emitting element transfer method, display panel, preparation method of display panel and substrate |
| US11114473B2 (en) | 2019-07-05 | 2021-09-07 | Century Technology (Shenzhen) Corporation Limited | Method for transferring light emitting elements, display panel, method for making display panel, and substrate |
| CN110416122A (en) * | 2019-07-05 | 2019-11-05 | 深超光电（深圳）有限公司 | The transfer method of light-emitting component, display panel and preparation method thereof, substrate |
| CN110518098B (en) * | 2019-09-26 | 2020-12-29 | 京东方科技集团股份有限公司 | Mass transfer method and system for micro light-emitting diode chip |
| US11335583B2 (en) | 2019-09-26 | 2022-05-17 | Boe Technology Group Co., Ltd. | Mass transfer method and device for micro light emitting diode chips |
| CN110518098A (en) * | 2019-09-26 | 2019-11-29 | 京东方科技集团股份有限公司 | A kind of the flood tide transfer method and system of micro-led chip |
| US11393799B2 (en) | 2020-03-10 | 2022-07-19 | Century Technology (Shenzhen) Corporation Limited | Device for transfer of light emitting elements, method for transferring light emitting elements, and method of manufacturing the transfer device |
| US11621251B2 (en) | 2020-03-10 | 2023-04-04 | Century Technology (Shenzhen) Corporation Limited | Device for transfer of light emitting elements, method for transferring light emitting elements, and method of manufacturing the transfer device |
| CN111508888A (en) * | 2020-04-26 | 2020-08-07 | Tcl华星光电技术有限公司 | L ED array transfer device and L ED array transfer method |
| CN111508888B (en) * | 2020-04-26 | 2024-04-05 | Tcl华星光电技术有限公司 | LED array transfer device and LED array transfer method |
| CN113053793A (en) * | 2021-03-19 | 2021-06-29 | 江西乾照光电有限公司 | Mass transfer device and method for Micro LED array device |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |