CN107808835B - Magnetic conduction plate and device transfer device - Google Patents
Magnetic conduction plate and device transfer device Download PDFInfo
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- CN107808835B CN107808835B CN201710984900.8A CN201710984900A CN107808835B CN 107808835 B CN107808835 B CN 107808835B CN 201710984900 A CN201710984900 A CN 201710984900A CN 107808835 B CN107808835 B CN 107808835B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Abstract
The invention discloses a magnetic conduction plate and a device transfer device. The magnetic conductive plate comprises a first preset region and a second preset region; the magnetic conducting plate is used for enabling a magnetic field generated by a magnetic member in the corresponding device transferring device to be concentrated on the first preset area, and shielding the magnetic field at the second preset area adjacent to the first preset area, so that the acting force of the magnetic field corresponding to the magnetic field is concentrated on the first preset area, and the device to be transferred by the device transferring device is transferred to the preset position of the array substrate arranged on the bearing table of the device transferring device within the range of the preset path corresponding to the first preset area. The invention can rapidly arrange a large number of devices on the array substrate, and improves the manufacturing efficiency of the device array substrate comprising the devices and the array substrate.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display panel manufacturing, in particular to a magnetic conduction plate and a device transfer device.
[ background of the invention ]
As technology has evolved, portions of the display panel require multiple devices (e.g., Micro L ED) to be implanted (placed) during the manufacturing process.
In order to arrange a plurality of devices on a display panel in a process of manufacturing the display panel, a conventional technical solution is: the implant device is used to align the devices to be set one by one with predetermined positions in the display panel and then set (fix) the devices one by one in the display panel.
The technical scheme has low efficiency. Since the number of devices to be disposed in the display panel is often large, it takes a lot of time to dispose the devices in the display panel by using the above technical solution.
Therefore, a new technical solution is needed to solve the above technical problems.
[ summary of the invention ]
The invention aims to provide a magnetic conduction plate and a device transfer device, which can quickly arrange a large number of devices on an array substrate and improve the manufacturing efficiency of a device array substrate comprising the devices and the array substrate.
In order to solve the problems, the technical scheme of the invention is as follows:
a device transfer apparatus includes a stage, a device transfer plate, a magnetic member, and a magnetic conductive plate; the magnetic conduction plate is arranged above the bearing surface of the bearing platform or in the bearing platform and comprises a first preset area and a second preset area; the magnetic conducting plate is used for enabling the magnetic field generated by the magnetic component to be concentrated at the first preset area and shielding the magnetic field at the second preset area adjacent to the first preset area so as to enable the magnetic field acting force corresponding to the magnetic field to be concentrated at the first preset area, and therefore the device to be transferred by the device transferring plate is transferred to a preset position of the array substrate arranged on the bearing table within a preset path range corresponding to the first preset area; the magnetic member comprises an electromagnetic generator, a switch control line, a switch and a power supply line, wherein the switch is connected with the switch control line, the power supply line and the electromagnetic generator, and the switch is used for opening or closing a current channel between the power supply line and the electromagnetic generator under the control of a switch control signal provided by the switch control line; the magnetic member is used for firstly increasing the intensity of the magnetic field acting force acting on the device when the device to be transferred is positioned above the array substrate so as to separate the device from the device transfer plate, and then reducing the intensity of the magnetic field acting force in the process of falling the device.
In the above device transfer apparatus, the first predetermined region corresponds to a region of the array substrate where the device is to be disposed.
In the above device transferring apparatus, the magnetic conductive plate is further configured to form a magnetic induction line at the first predetermined region to increase the strength of the magnetic field acting force acting on the device.
In the above device transfer apparatus, at least two of the first predetermined regions may be arranged in a one-dimensional array or a two-dimensional array.
In the above device transfer apparatus, the magnetic conductive plate is made of iron.
A magnetically conductive plate suitable for use in the device transfer apparatus described above, the magnetically conductive plate comprising a first predetermined region and a second predetermined region; the magnetic conducting plate is used for enabling a magnetic field generated by a magnetic member in the corresponding device transferring device to be concentrated on the first preset area, and shielding the magnetic field at the second preset area adjacent to the first preset area, so that the acting force of the magnetic field corresponding to the magnetic field is concentrated on the first preset area, and the device to be transferred by the device transferring device is transferred to the preset position of the array substrate arranged on the bearing table of the device transferring device within the range of the preset path corresponding to the first preset area.
In the above magnetic conductive plate, the first predetermined region corresponds to a region of the array substrate where the device is to be disposed.
In the above magnetic conductive plate, the magnetic conductive plate is further configured to form a magnetic induction line at the first predetermined region to increase the strength of the magnetic field acting force acting on the device.
In the above magnetic conductive plate, at least two of the first predetermined regions are arranged in a one-dimensional array or a two-dimensional array.
In the above magnetic conductive plate, the material of the magnetic conductive plate is iron.
Compared with the prior art, the invention applies magnetic field acting force to a large number of devices arranged on the device transfer plate through the magnetic component, so that the large number of devices can be transferred (arranged) to the array substrate at one time, namely, the invention can rapidly arrange the large number of devices on the array substrate, and improves the manufacturing efficiency of the device array substrate comprising the devices and the array substrate.
In order to make the aforementioned and other objects of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
Fig. 1 is a schematic view of a positional relationship between a device transfer apparatus provided with a magnetic conductive plate of the present invention and an array substrate on which devices are to be disposed;
fig. 2 is a schematic view of a first embodiment of a magnetic conductive plate of the present invention;
fig. 3 is a schematic view of a second embodiment of the magnetic conductive plate of the present invention.
[ detailed description ] embodiments
The word "embodiment" as used herein means an example, instance, or illustration. In addition, the articles "a" and "an" as used in this specification and the appended claims may generally be construed to mean "one or more" unless specified otherwise or clear from context to be directed to a singular form.
Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic diagram of a position relationship between a device transfer apparatus provided with a magnetic conductive plate 106 and an array substrate 102 on which a device 104 is to be disposed according to the present invention, fig. 2 is a schematic diagram of a first embodiment of the magnetic conductive plate 106 according to the present invention, and fig. 3 is a schematic diagram of a second embodiment of the magnetic conductive plate 106 according to the present invention.
The magnetically permeable plate 106 of the present invention may be disposed in a device transfer apparatus.
The device transfer apparatus includes a stage 101, a device transfer plate 103, and a magnetic member 105.
The carrier 101 has a carrying surface for carrying the array substrate 102 of the device 104 to be received.
The magnetic conductive plate 106 is disposed above the carrying surface of the carrier 101 or in the carrier 101, and the magnetic conductive plate 106 is configured to concentrate the magnetic field generated by the magnetic member 105 in a first predetermined region 1061 and shield the magnetic field at a second predetermined region 1062 adjacent to the first predetermined region 1061, so that the magnetic force corresponding to the magnetic field is concentrated in the first predetermined region 1061, and the device 104 is moved to the predetermined position on the array substrate 102 within a predetermined path range corresponding to the first predetermined region 1061.
The magnetic conductive plate 106 is used for transmitting the magnetic field in the first predetermined region 1061 and shielding the magnetic field in the second predetermined region 1062.
The first predetermined area 1061 corresponds to an area of the array substrate 102 where the device 104 is to be disposed. At least two of the first predetermined areas 1061 are arranged in a one-dimensional array or a two-dimensional array.
The magnetic conductive plate 106 is also used to form magnetic induction lines at the first predetermined region 1061 to increase the strength of the magnetic force applied to the device 104.
The magnetic conductive plate 106 is made of a material having a magnetic conductivity greater than a predetermined value.
The magnetic conductive plate 106 is made of iron.
Under the condition that the magnetic conductive plate 106 is disposed above the carrying surface, the magnetic conductive plate 106 has a predetermined distance from the carrying surface.
At least two of the magnetic members 105 form an array of magnetic field sources, the magnetic members 105 act as magnetic field sources, and the at least two magnetic field sources are arranged in a one-dimensional array or a two-dimensional array. The magnetic field source is a permanent magnet or an electromagnetic generator.
In the case where the magnetic field source is the electromagnetic generator, the magnetic member 105 further includes a switch control line, a switch, and a power supply line. The switch is a triode switch.
The switch is connected with the switch control line, the power supply line and the electromagnetic generator. The switch is used for opening or closing a current channel between the power supply line and the electromagnetic generator under the control of a switch control signal provided by the switch control line.
The device transfer plate 103 has an attachment surface for attaching the device 104 to be transferred, and the device transfer plate 103 moves the device 104 to be transferred above the stage 101 and causes the device 104 to be transferred to face the array substrate 102.
The magnetic member 105 is disposed in the carrier stage 101 or at a surface of the carrier stage 101 facing away from the carrying surface, and the magnetic member 105 is used for generating a magnetic field and applying a magnetic field force to the device 104 to be transferred when the device 104 to be transferred is located above the array substrate 102.
Wherein the device transfer plate 103 is further used for releasing the device 104 to be transferred when the device 104 is located above the array substrate 102, so that the device 104 is transferred to a predetermined position on the array substrate 102 under the combined action of gravity and the magnetic field.
The device transfer plate 103 is further configured to reduce a suction force for sucking the device 104 when the device 104 to be transferred is located above the array substrate 102, so as to release the device 104, thereby allowing the device 104 to be transferred to the predetermined position on the array substrate 102 under the combined action of the gravity and the magnetic field.
Wherein the adsorption force is at least one of intermolecular acting force, electrostatic force and magnetic force.
The magnetic member 105 is configured to increase the strength of the magnetic force acting on the device 104 when the device 104 to be transferred is located above the array substrate 102, so as to separate the device 104 from the device transfer plate 103, and then decrease the strength of the magnetic force during the dropping of the device 104.
The apparatus further includes a connector for heating a solder material disposed between the array substrate 102 and the device 104 transferred onto the array substrate 102 to melt the solder material and connect the device 104 and the array substrate 102.
The predetermined position corresponds to a pixel region in the array substrate 102.
In the case where the attracting force is an electrostatic force, the device transfer plate 103 serves to reduce the amount of electric charge that applies the electrostatic force to the device 104.
The size of the device 104 is less than a predetermined value. The device 104 is a light emitting diode lamp.
The device 104 has magnetic poles. The device 104 has an electrode terminal.
The device array substrate comprises an array substrate 102, a device array and a fixing component.
The array substrate 102 is provided with a first lead array, a second lead array, a control switch array and a contact electrode array, wherein the first lead array comprises at least two first leads, the at least two first leads are arranged in a one-dimensional array along a first direction, the second lead array comprises at least two second leads, the at least two second leads are arranged in a one-dimensional array along a second direction perpendicular to the first direction, the control switch array comprises at least four control switches, the at least four control switches are arranged in a two-dimensional array along the first direction and the second direction, the contact electrode array comprises at least four contact electrodes, and the control switches are connected with the first leads, the second leads and the contact electrodes.
The device array comprises at least two devices 104, the at least two devices 104 are arranged in a one-dimensional array or a two-dimensional array, the devices 104 are arranged on the array substrate 102, and the devices 104 are arranged on the array substrate 102 through a device transfer device.
The fixing member is made by applying a photoresist to the array substrate 102 provided with the device 104 such that the photoresist is in contact with both the device 104 and the array substrate 102, and curing the photoresist, and is used to fix the device 104 to the array substrate 102.
The array substrate 102 is used to connect to and form the device array substrate including at least two of the devices 104.
The contact electrode is configured to receive the device 104 and is coupled to the device 104, the contact electrode has a first area, the device 104 has a second area, the second area is an area where the device 104 is in contact with the contact electrode, and the first area is greater than twice the second area.
The magnetic conductive plate 106 may also be disposed in the array substrate 102.
A gap is formed between two adjacent devices 104 disposed on the array substrate 102, and the fixing member fills the gap.
The securing member is in contact with at least a portion of the sidewall of the device 104.
The fixing member covers the device 104, and is further used for encapsulating the whole body formed by the device 104 and the array substrate 102.
The fixing member is cured by heating the photoresist material with a heat source, and/or the fixing member is cured by irradiating the photoresist material with an ultraviolet light source.
The method of transferring the device 104 of the device transferring apparatus of the present invention comprises the steps of:
A. the device transfer plate 103 moves the device 104 to be transferred above the carrier stage 101 such that the device 104 to be transferred faces the array substrate 102.
B. The magnetic member 105 applies a magnetic field force to the device 104 to be transferred when the device 104 to be transferred is positioned over the array substrate 102.
C. The device transfer plate 103 releases the device 104 to be transferred when the device 104 is positioned above the array substrate 102, so that the device 104 is transferred to a predetermined position on the array substrate 102 under the combined action of gravity and the magnetic field.
The step C is as follows:
the device transfer plate 103 reduces the suction force that sucks the device 104 when the device 104 to be transferred is positioned above the array substrate 102 to release the device 104, so that the device 104 is transferred to the predetermined position on the array substrate 102 under the combined action of the gravity and the magnetic field.
Wherein the adsorption force is at least one of intermolecular acting force, electrostatic force and magnetic force.
The step B comprises the following steps:
b1, the magnetic member 105 increases the intensity of the magnetic force acting on the device 104 when the device 104 to be transferred is located above the array substrate 102, so as to detach the device 104 from the device transfer plate 103.
b2, the magnetic member 105 reduces the strength of the magnetic force during the fall of the device 104.
The method further comprises the steps of:
D. the connector heats a solder material disposed between the array substrate 102 and the device 104 transferred to the array substrate 102 to melt the solder material and join the device 104 and the array substrate 102.
The predetermined position corresponds to a pixel region in the array substrate 102.
The manufacturing method of the device array substrate comprises the following steps:
E. an array of devices is disposed on the array substrate 102, wherein the array of devices includes at least two devices 104, and the at least two devices 104 are arranged in a one-dimensional array or a two-dimensional array.
F. A photoresist is applied to the array substrate 102 provided with the device 104 such that the photoresist is in contact with both the device 104 and the array substrate 102.
G. The photoresist material is cured to form the securing means for securing the device 104 to the array substrate 102.
A gap is formed between two adjacent devices 104 disposed on the array substrate 102.
The step F comprises the following steps:
f1, coating the photoresist material at the gap.
The securing member is in contact with at least a portion of the sidewall of the device 104.
The step F further comprises the following steps:
b2, coating the photoresist material on the device 104 to package the whole composed of the device 104 and the array substrate 102.
The step G comprises the following steps:
c1, heating the photoresist material by a heat source to cure so as to form the fixing component; and/or
c2, irradiating the photoresist material by using an ultraviolet light source to cure so as to form the fixing component.
The core of the Device 104(Micro Device) transfer apparatus and method of the present invention is to "throw" or "jet print" the Device 104 from the Device transfer plate 103(Donor substrate) to the array substrate 102(Receiver substrate) by magnetic interaction, thereby eliminating the complicated and lengthy precise alignment process.
In the carrier stage 101 or below the array substrate 102, there is a magnetic field formed by a permanent magnet or an electromagnetic generator. The magnetic field acting force corresponding to the magnetic field is used to make the device 104 with magnetism be attracted by the array substrate 102.
The device transfer apparatus and method of the present invention can be applied to any one or a combination of more than one of the following three cases:
(1) the device 104 having a vertical electrode structure;
(2) there is only one electrode contact on the array substrate 102;
(3) a specific location of the device 104 is required to contact the array substrate 102.
At this time, the device 104 is separated from the device transfer plate 103 and moves towards the array substrate 102 under the combined action of gravity and magnetic field force by only reducing the attraction of the device transfer plate 103 to the device 104 without requiring precise alignment and complicated force interaction processes of the device transfer plate 103 and the array substrate 102. The device transfer plate 103 attracts the device 104 by intermolecular forces, hydrogen bonds, electrostatic forces or magnetic forces or other chemical physical means, and during the transfer of the device 104, the attraction of the device transfer plate 103 is weakened, for example by reducing the electrostatic force, for example by reducing the current at the head (head) of the array substrate 102; on the other hand, the attractive force of the array substrate 102 may be increased, for example, during the advance of the device transfer plate 103, the magnetic field strength is increased and then decreased, so that the device 104 is forced to be separated from the device transfer plate 103.
In the case where the device 104 is a Micro L ED, a Micro L ED needs to be in contact with and bonded (Bonding) to a single side of the array substrate 102, the device transfer plate 103 is located above the array substrate 102, the two move towards each other, when the device transfer plate 103 is located above a pixel region in the array substrate 102, the Micro L ED is separated from the device transfer plate 103 and falls on the array substrate 102 by the decrease of the suction force of the device transfer plate 103 or the increase of the suction force of the array substrate 102 or the combined action of the two, and then the Bonding is achieved by heating of solder or the like at the connection.
The above process does not use an operation of precise alignment, and there is no connection of the device transfer plate 103 and the array substrate 102 through the device 104, and the device transfer plate 103 and the array substrate 102 are not in contact. A large number of the devices 104 can be easily dropped on the array substrate 102 during the facing motion. It is important that the position where the electrodes of the device 104 fall is the pixel area of the array substrate 102 in order to ensure that the position of the fall is correct.
To ensure that the device 104 is "thrown" or "jet printed" in the correct position, the present invention employs a patterned plate (magnetic conductive plate 106) that shields the magnetic field between the magnetic field and the array substrate 102. The magnetic conducting plate 106 is made of a high-permeability material and is arranged between the bearing platform 101(Stage) and the magnetic member 105, so that magnetic lines of force in the preset position pass through, and the magnetic lines of force in positions other than the preset position are closed between the plates as much as possible, and the magnetic field acting force in an invalid position (positions other than the preset position) is greatly reduced.
The magnetic field sources are patterned in one-to-one correspondence with the location of the pixels or the devices 104.
Further, for example, when the Micro L ED or other Micro devices are in contact with the array substrate 102, the contact area may be designed to be larger to meet the above requirements.
The magnetic field passes through the circular hole hollow area (the first predetermined area 1061) of the magnetic conduction plate 106 at least partially, and the other areas of the magnetic conduction plate 106 are mainly shielded by the material with higher magnetic permeability.
The hollow area of the circular hole of the magnetic conducting plate 106 is penetrated by a small amount of magnetic induction lines, so that the magnetic force action on the corresponding position is greatly enhanced, and the material with high magnetic conductivity, such as iron, can be manufactured into a structure which corresponds to the open hole of the pixel area and is shielded by the non-pixel area through a photoetching process and the like.
The size of the electrode on the array substrate 102, which is in contact with the device 104 to be transferred, is two or more times the size of the device 104, so that the device 104 can still work effectively when it is located at the predetermined position.
After the device 104 is "printed," the magnetic pole side of the device 104 is pressed against the array substrate 102 under the action of the magnetic field. The magnetic poles may or may not be electrically connected to electrodes on the array substrate 102.
In order to fix the device 104 disposed on the array substrate 102, the array substrate 102 disposed with the device 104 is coated with a photoresist (Photo Resist) according to the present invention, and the coating thickness may or may not completely cover the device 104. When fully covered, it can serve both to secure the device 104 and to isolate the package. If the Slit Coating method is adopted, the method of thermal curing or UV light irradiation or the combined action of the thermal curing and the UV light irradiation is adopted after the wet film Coating is finished, so that the photoresist is cured, and the cured photoresist packaging layer is used
The device 104 is fixed on the array substrate 102 by the interaction of the cured photoresist (the fixing member) with the array substrate 102 and the interaction with the sidewalls of the device 104.
The present embodiment is different from the connection method in which solder is disposed at the contact portion between the device 104 and the array substrate 102, and is melted by heating and re-solidified by bottom contact.
When the device 104 is attracted by the magnetic member 105, a layer of encapsulating material (photoresist) is applied by Slit Coating or spin down, so as to encapsulate the device 104 directly on the array substrate 102.
According to the invention, because the magnetic field acting force is applied to a large number of devices arranged on the device transfer plate through the magnetic member, the large number of devices can be transferred (arranged) to the array substrate at one time, namely, the large number of devices can be rapidly arranged on the array substrate, and the manufacturing efficiency of the device array substrate comprising the devices and the array substrate is improved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. The device transfer device is characterized by comprising a bearing table, a device transfer plate, a magnetic member and a magnetic conduction plate;
the magnetic conduction plate is arranged above the bearing surface of the bearing platform or in the bearing platform and comprises a first preset area and a second preset area;
the magnetic conducting plate is used for enabling the magnetic field generated by the magnetic component to be concentrated at the first preset area and shielding the magnetic field at the second preset area adjacent to the first preset area so as to enable the magnetic field acting force corresponding to the magnetic field to be concentrated at the first preset area, and therefore the device to be transferred by the device transferring plate is transferred to a preset position of the array substrate arranged on the bearing table within a preset path range corresponding to the first preset area;
the magnetic member comprises an electromagnetic generator, a switch control line, a switch and a power supply line, wherein the switch is connected with the switch control line, the power supply line and the electromagnetic generator, and the switch is used for opening or closing a current channel between the power supply line and the electromagnetic generator under the control of a switch control signal provided by the switch control line;
the magnetic member is used for firstly increasing the intensity of the magnetic field acting force acting on the device when the device to be transferred is positioned above the array substrate so as to separate the device from the device transfer plate, and then reducing the intensity of the magnetic field acting force in the process of falling the device.
2. The device transfer apparatus according to claim 1, wherein the first predetermined region corresponds to a region of the array substrate where the device is to be disposed.
3. The device transfer apparatus according to claim 1 wherein said magnetically permeable plate is further configured to form lines of magnetic induction at said first predetermined regions to increase the strength of said magnetic field force applied to said device.
4. The device transfer apparatus according to claim 1, wherein at least two of said first predetermined regions are arranged in a one-dimensional array or a two-dimensional array.
5. The device transfer apparatus of claim 1, wherein the material of the magnetically permeable plate is iron.
6. A magnetically conductive plate suitable for use in the device transfer apparatus of claim 1, wherein said magnetically conductive plate comprises a first predetermined region and a second predetermined region;
the magnetic conducting plate is used for enabling a magnetic field generated by a magnetic member in the corresponding device transferring device to be concentrated on the first preset area, and shielding the magnetic field at the second preset area adjacent to the first preset area, so that the acting force of the magnetic field corresponding to the magnetic field is concentrated on the first preset area, and the device to be transferred by the device transferring device is transferred to the preset position of the array substrate arranged on the bearing table of the device transferring device within the range of the preset path corresponding to the first preset area.
7. A magnetic conductive plate according to claim 6, wherein the first predetermined region corresponds to a region of the array substrate where the device is to be disposed.
8. A magnetically conductive plate according to claim 6, further being adapted to form lines of magnetic induction at said first predetermined regions to increase the strength of the magnetic field force applied to the device.
9. A magnetic conductive plate according to claim 6, wherein at least two of the first predetermined regions are arranged in a one-dimensional array or a two-dimensional array.
10. A magnetic conduction plate according to claim 6, wherein the material of the magnetic conduction plate is iron.
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| CN201710984900.8A CN107808835B (en) | 2017-10-20 | 2017-10-20 | Magnetic conduction plate and device transfer device |
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| CN201710984900.8A CN107808835B (en) | 2017-10-20 | 2017-10-20 | Magnetic conduction plate and device transfer device |
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| CN111128790B (en) * | 2018-10-31 | 2022-08-30 | 成都辰显光电有限公司 | Micro-element processing device, welding method and display panel |
| CN110379760B (en) | 2019-07-05 | 2021-04-02 | 深超光电（深圳）有限公司 | Light emitting element transfer method, display panel, preparation method of display panel and substrate |
| CN110265341B (en) * | 2019-07-05 | 2021-04-02 | 深超光电（深圳）有限公司 | Light emitting element transfer method, display panel, preparation method of display panel and substrate |
| CN110416124B (en) * | 2019-07-05 | 2020-10-13 | 深超光电（深圳）有限公司 | LED transfer method and LED display panel preparation method |
| CN110416122B (en) * | 2019-07-05 | 2021-06-29 | 深超光电（深圳）有限公司 | Light emitting element transfer method, display panel, preparation method of display panel and substrate |
| CN110518098B (en) * | 2019-09-26 | 2020-12-29 | 京东方科技集团股份有限公司 | Mass transfer method and system for micro light-emitting diode chip |
| CN111244016B (en) | 2020-03-10 | 2022-10-18 | 深超光电（深圳）有限公司 | Transfer device, manufacturing method of transfer device, and transfer method |
| CN111508888B (en) * | 2020-04-26 | 2024-04-05 | Tcl华星光电技术有限公司 | LED array transfer device and LED array transfer method |
| CN113053793B (en) * | 2021-03-19 | 2023-02-03 | 江西乾照光电有限公司 | Mass transfer device and method for Micro LED array device |
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