CN107785276A - A kind of manufacture method for improving two-piece type framework encapsulation positioning precision - Google Patents
A kind of manufacture method for improving two-piece type framework encapsulation positioning precision Download PDFInfo
- Publication number
- CN107785276A CN107785276A CN201710965025.9A CN201710965025A CN107785276A CN 107785276 A CN107785276 A CN 107785276A CN 201710965025 A CN201710965025 A CN 201710965025A CN 107785276 A CN107785276 A CN 107785276A
- Authority
- CN
- China
- Prior art keywords
- framework
- positioning
- underframe
- encapsulation
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000005476 soldering Methods 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000006071 cream Substances 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A kind of manufacture method for improving two-piece type framework encapsulation positioning precision, comprises the following steps：A, by underframe（15）Positioning；B, in underframe（15）Slide holder on coat appropriate solder(ing) paste；C, by chip attachment in underframe（15）；D, in upper framework（14）Slide holder on coat appropriate tin cream；E, by upper framework（14）It is covered in underframe（15）On；F, high-temperature soldering is carried out to upper and lower frames；G, resin-encapsulate；H, Trim Molding.In resin-encapsulate step, upper lower Positioning holes are not isometrical, avoid the further expansion to be misplaced between framework and encapsulating mold, effectively improve the positioning precision between the framework in resin-encapsulate stage and encapsulating mold, damaged so as to effectively prevent in encapsulation phase mould to caused by framework, and the control of high-precision product design is realized, avoid Trim Molding step causes greatly pins of products or so cause different in size due to deviations the problem of.
Description
Technical field
The present invention relates to a kind of manufacture method for improving two-piece type framework encapsulation positioning precision.
Background technology
With continuous expansion of all trades and professions to the application demand of electronic component, and purchase cost constantly reduce will
Ask, the electronic component of some small-sized SMD profiles develops to high efficiency, low cost.Wherein using high density, square
Configuration framework turns into a kind of industrial trend, and the performance with upper and lower two-piece type combining form on cost-effective especially is more prominent
Go out, accepted extensively by industry.
But in traditional two-piece type Frame Design, the positioning hole of upper and lower two panels framework is isometrical, and this there is fixed
The problem of position precision and position error are accumulated：In the welding process of first step, due to the making control accuracy in hole and fixed
Reason of both the gap surplus of position pin, misplacing after upper and lower two panels frame welding can only control in≤0.04mm.Afterwards
Resin-encapsulate step, because the problem of misalignment of upper and lower framework caused by previous step has been present, so must further contract
The diameter of small pilot pin.More than 360 DEG C of high temperature is have passed through in the welding stage in view of framework, due to expanding with heat and contract with cold,
The dislocation of upper and lower two panels framework necessarily further increases, so pilot pin will typically reserve the even more big surpluses of 0.06mm,
So result in being merely able to satisfaction≤0.06mm even more in resin-encapsulate step, the positioning precision between framework and encapsulating mold
Greatly.And mold design trueness error is≤0.04mm, it mould is weighed framework wounded, have a strong impact on the longevity of encapsulating mold
Life and product appearance, and the controllability of product design size can be substantially reduced.
Trim Molding step behind resin-encapsulate step, still to use positioning hole positioning.The reason for same, due to
The dislocation of two panels framework up and down caused by chip welding step, and two panels framework can not up and down after high-temperature soldering
Relatively move, if still using upper and lower isometrical circular hole（Upper and lower circular hole has occurred and that dislocation）It is inevitable to position
There is the phenomenon that further expands of deviations, cause the pin of product after Trim Molding different in size, i.e., so-called " length
Pin ".
The content of the invention
In order to solve the above technical problems, the present invention provides a kind of manufacturer for improving two-piece type framework encapsulation positioning precision
Method, comprise the following steps：
A, underframe is positioned on graphite tool；
B, appropriate solder(ing) paste is coated on the slide holder of underframe；
C, by chip attachment on the slide holder of underframe；
D, appropriate tin cream is coated on the slide holder of upper framework；
E, upper framework is covered on underframe, elongated hole is positioned through welding step positioning round orifice group and welding step with pilot pin
Group alignment positioning；
F, high-temperature soldering is carried out to the upper and lower frames being combined；
G, resin-encapsulate positioning is carried out through encapsulation step positioning round orifice group, encapsulation step positioning elongated hole group with pilot pin；
H, resin-encapsulate is carried out to the framework after high-temperature soldering and reposition well；
I, Trim Molding is carried out to the framework after resin-encapsulate.
As a modification of the present invention, the positioning up and down of welding step positioning round orifice group and welding step positioning elongated hole group
Hole is isometrical.
As a further improvement on the present invention, encapsulation step positioning round orifice group and encapsulation step position the fixed up and down of elongated hole group
Position hole is not isometrical.
The beneficial effects of the invention are as follows in high-temperature soldering step, utilize welding step positioning round orifice group, welding step positioning
Elongated hole group positions to framework, then carries out high-temperature soldering.Because this two groups of positioning holes are isometrical, the upper and lower two panels after welding
The dislocation of framework can be controlled in≤0.04mm.It is fixed using encapsulation step positioning round orifice group, encapsulation step in resin-encapsulate step
The group positioning of bit length hole, upper lower Positioning holes are not isometrical, upper framework positioning hole diameter 1.5mm, underframe positioning bore dia 1.8mm, than
The big 0.3mm in aperture of upper framework, avoids the further expansion to be misplaced between framework and encapsulating mold, so as to effectively increase tree
Positioning precision between the framework and encapsulating mold of fat encapsulation phase, control is remained able in≤0.04mm, so as to effectively avoid
Damaged to caused by framework in encapsulation phase mould, and high-precision product design control can be realized, avoided in rib cutting
Forming step is due to the problem of deviations cause greatly pins of products or so cause different in size.
Brief description of the drawings
Fig. 1 is the schematic diagram after upper and lower frames alignment positioning.
Fig. 2 is the schematic diagram of upper framework positioning hole group.
Fig. 3 is the schematic diagram of underframe positioning hole group.
Fig. 4 is the schematic diagram of the Position Design used in high-temperature soldering step.
Fig. 5 is the schematic diagram of the Position Design used in resin-encapsulate step and Trim Molding step.
In figure, 1, upper framework positioning elongated hole, 2, upper framework positioning round orifice, 3, upper framework positioning round orifice, 4, the positioning of upper framework
Elongated hole, 5, underframe positioning round orifice, 6, underframe positioning elongated hole, 7, underframe positioning round orifice, 8, underframe positioning elongated hole, 9, bag
Seal step positioning round orifice group, 10, encapsulation step positioning elongated hole group, 11, welding step positioning round orifice group, 12, welding step positioning
Elongated hole group, 13, pilot pin, 14, upper framework, 15, underframe.
Embodiment
As Figure 1-5, a kind of manufacture method for improving two-piece type framework encapsulation positioning precision, comprises the following steps：
A, underframe 15 is positioned on graphite tool；
B, appropriate solder(ing) paste is coated on the slide holder of underframe 15；
C, by chip attachment on the slide holder of underframe 15；
D, appropriate tin cream is coated on the slide holder of upper framework 14；
E, upper framework 14 is covered on underframe 15, welding step positioning round orifice group 11 and welding step is passed through with pilot pin 13
Position elongated hole group 12 and be directed at positioning；
F, high-temperature soldering is carried out to the upper and lower frames being combined；
G, position elongated hole group 10 through encapsulation step positioning round orifice group 9, encapsulation step with pilot pin 13 and carry out resin-encapsulate positioning；
H, the framework to high-temperature soldering and after having good positioning carries out resin-encapsulate；
I, Trim Molding is carried out to the framework after resin-encapsulate.
The diameter of upper framework positioning round orifice 2 and 3 in upper framework 14 is 1.5mm, the semicircle of upper framework positioning elongated hole 1 and 4
Diameter is also 1.5mm.The diameter of underframe positioning round orifice 5 in underframe 15 and underframe positioning elongated hole 6 is 1.8mm, lower frame
The diameter of frame positioning round orifice 7 and underframe positioning elongated hole 8 is 1.5mm.As shown in figure 3, after upper and lower frames is combined, using straight
The pilot pin 13 that footpath is 1.48mm positions elongated hole group 12 through welding step positioning round orifice group 11 and welding step and framework is carried out
Positioning, then carries out high-temperature soldering.Because this two groups of positioning holes are isometrical, the dislocation energy of the upper and lower two panels framework after welding
Enough control in≤0.04mm.
Resin-encapsulate step after high-temperature soldering, elongated hole group is positioned using encapsulation step positioning round orifice group 9, encapsulation step
10 position.Still a diameter of 1.48mm pilot pin 13 is used, that is, only utilizing upper framework positioning length in upper framework 14
Hole 1 and upper 2 two diameter 1.5mm of framework positioning round orifice hole position, because the underframe of correspondence position in underframe 15 is determined
Bit length hole 6 and the aperture of underframe positioning round orifice 5 are 1.8mm, and the aperture than the upper correspondence position of framework 14 is big 0.3mm, more than institute,
Be not in block after the center superposition in two groups of holes of underframe, it is not necessary to consider the problem of misalignment of upper and lower two panels framework.So
Avoid the further expansion to be misplaced between framework and encapsulating mold, so as to effectively increase the framework in resin-encapsulate stage with
Positioning precision between encapsulating mold, control is remained able in≤0.04mm, so as to effectively prevent in encapsulation phase mould pair
Damage caused by framework, and high-precision product design control can be realized, avoid inclined due to positioning in Trim Molding step
Poor big the problem of causing pins of products or so cause different in size.
Claims (3)
1. a kind of manufacture method for improving two-piece type framework encapsulation positioning precision, comprises the following steps：
A, by underframe（15）It is positioned on graphite tool；
B, in underframe（15）Slide holder on coat appropriate solder(ing) paste；
C, by chip attachment in underframe（15）Slide holder on；
D, in upper framework（14）Slide holder on coat appropriate tin cream；
E, by upper framework（14）It is covered in underframe（15）On, use pilot pin（13）Through welding step positioning round orifice group（11）With
Welding step positions elongated hole group（12）Alignment positioning；
F, high-temperature soldering is carried out to the upper and lower frames being combined；
G, pilot pin is used（13）Through encapsulation step positioning round orifice group（9）, encapsulation step positioning elongated hole group（10）Carry out resin bag
Envelope positioning；
H, resin-encapsulate is carried out to the framework after high-temperature soldering and reposition well；
I, Trim Molding is carried out to the framework after resin-encapsulate.
2. according to a kind of manufacture method of raising two-piece type framework encapsulation positioning precision described in claim 1, it is characterised in that：
The welding step positioning round orifice group（11）Elongated hole group is positioned with welding step（12）Upper lower Positioning holes it is isometrical.
3. according to a kind of manufacture method of raising two-piece type framework encapsulation positioning precision described in claim 1, it is characterised in that：
The encapsulation step positioning round orifice group（9）Elongated hole group is positioned with encapsulation step（10）Upper lower Positioning holes it is not isometrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710965025.9A CN107785276A (en) | 2017-10-17 | 2017-10-17 | A kind of manufacture method for improving two-piece type framework encapsulation positioning precision |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710965025.9A CN107785276A (en) | 2017-10-17 | 2017-10-17 | A kind of manufacture method for improving two-piece type framework encapsulation positioning precision |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107785276A true CN107785276A (en) | 2018-03-09 |
Family
ID=61434479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710965025.9A Pending CN107785276A (en) | 2017-10-17 | 2017-10-17 | A kind of manufacture method for improving two-piece type framework encapsulation positioning precision |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107785276A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112530796A (en) * | 2020-11-02 | 2021-03-19 | 山东隽宇电子科技有限公司 | Automatic bar cutting machine with body positioning |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH091583A (en) * | 1995-06-26 | 1997-01-07 | Rohm Co Ltd | Apparatus for manufacture of electronic parts using hoop like frame and positioning method for hoop like frame in resin molding process |
| US20030020148A1 (en) * | 2001-07-30 | 2003-01-30 | Nec Corporation | Lead frame and semiconductor device having the same as well as method of resin-molding the same |
| CN200970672Y (en) * | 2006-08-01 | 2007-11-07 | 上海凯虹科技电子有限公司 | Frame type integrated frame-bridge welder |
| CN102630339A (en) * | 2009-11-25 | 2012-08-08 | 意法半导体(图尔)公司 | Mounting electronic components assembled by means of a clip in a package |
| CN103579162A (en) * | 2012-07-20 | 2014-02-12 | 台湾道康宁股份有限公司 | Lead frame assembly, lead frame thereof and cutting method |
| CN204067344U (en) * | 2014-07-26 | 2014-12-31 | 阳信金鑫电子有限公司 | High-power high-current diode package framework |
| CN204088300U (en) * | 2014-08-08 | 2015-01-07 | 上海隽壅精密工业设备有限公司 | The direct insertion framework of two-piece type matrix type MD |
| CN104617074A (en) * | 2013-11-01 | 2015-05-13 | 无锡华润安盛科技有限公司 | Frame packaging structure and application method thereof |
| CN105336721A (en) * | 2015-10-26 | 2016-02-17 | 杨海林 | Material sheet for ultrathin SOD123FL encapsulation diode |
| CN107123624A (en) * | 2016-02-25 | 2017-09-01 | 德州仪器公司 | Power module package with double-sided cooled |
-
2017
- 2017-10-17 CN CN201710965025.9A patent/CN107785276A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH091583A (en) * | 1995-06-26 | 1997-01-07 | Rohm Co Ltd | Apparatus for manufacture of electronic parts using hoop like frame and positioning method for hoop like frame in resin molding process |
| US20030020148A1 (en) * | 2001-07-30 | 2003-01-30 | Nec Corporation | Lead frame and semiconductor device having the same as well as method of resin-molding the same |
| CN200970672Y (en) * | 2006-08-01 | 2007-11-07 | 上海凯虹科技电子有限公司 | Frame type integrated frame-bridge welder |
| CN102630339A (en) * | 2009-11-25 | 2012-08-08 | 意法半导体(图尔)公司 | Mounting electronic components assembled by means of a clip in a package |
| CN103579162A (en) * | 2012-07-20 | 2014-02-12 | 台湾道康宁股份有限公司 | Lead frame assembly, lead frame thereof and cutting method |
| CN104617074A (en) * | 2013-11-01 | 2015-05-13 | 无锡华润安盛科技有限公司 | Frame packaging structure and application method thereof |
| CN204067344U (en) * | 2014-07-26 | 2014-12-31 | 阳信金鑫电子有限公司 | High-power high-current diode package framework |
| CN204088300U (en) * | 2014-08-08 | 2015-01-07 | 上海隽壅精密工业设备有限公司 | The direct insertion framework of two-piece type matrix type MD |
| CN105336721A (en) * | 2015-10-26 | 2016-02-17 | 杨海林 | Material sheet for ultrathin SOD123FL encapsulation diode |
| CN107123624A (en) * | 2016-02-25 | 2017-09-01 | 德州仪器公司 | Power module package with double-sided cooled |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112530796A (en) * | 2020-11-02 | 2021-03-19 | 山东隽宇电子科技有限公司 | Automatic bar cutting machine with body positioning |
| CN112530796B (en) * | 2020-11-02 | 2023-03-31 | 山东隽宇电子科技有限公司 | Automatic bar cutting machine with body positioning |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Li Chengjun Inventor after: Xue Zhixiang Inventor after: Yao Shuangshuang Inventor before: Li Chengjun Inventor before: Xue Zhixiang Inventor before: Yao Shuangshuang |