CN204946873U - Chip mounter heat block primary and secondary module - Google Patents
Chip mounter heat block primary and secondary module Download PDFInfo
- Publication number
- CN204946873U CN204946873U CN201520770449.6U CN201520770449U CN204946873U CN 204946873 U CN204946873 U CN 204946873U CN 201520770449 U CN201520770449 U CN 201520770449U CN 204946873 U CN204946873 U CN 204946873U
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- CN
- China
- Prior art keywords
- heat block
- submodule
- chip mounter
- module
- secondary module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of chip mounter heat block primary and secondary module, comprise heat block, described heat block is integrally formed by female module and submodule, removably connects between described female module and submodule.The utility model adopts primary and secondary module, only need change submodule after wearing and tearing, convenient and simple for operation, increases work efficiency, and also can reduce spare parts cost simultaneously.
Description
Technical field
The utility model relates to field of semiconductor package, is specifically related to a kind of chip mounter heat block primary and secondary module.
Background technology
In semiconductor packages, during paster, the production temperature of eutectic product needs to control between 420 to 450 degree.Its operation principle is exactly by head swing arm, wafer is drawn to the longitudinal back and forth movement process of support from WAFERTABLE.
Therefore, on chip mounter heating track, heat block is very high to the requirement of material.First, require this material have high temperature resistant, hardness is high, the characteristic such as shock-resistant; Secondly, in processing type selecting, often select wolfram steel as rapidoprint according to this characteristic.But due to features such as wolfram steel material hardness are high, difficulty of processing is large, price is high, so heat block area is larger, processing cost is higher.
Utility model content
For the deficiency that prior art exists, the utility model provides a kind of enhances productivity, the chip mounter heat block primary and secondary module that cuts down finished cost.
In order to achieve the above object, the technical scheme taked of the utility model:
Chip mounter heat block primary and secondary module, comprise heat block, described heat block is integrally formed by female module and submodule, removably connects between described female module and submodule.
In such scheme, further, described female module with between submodule for trench structure is connected, this female module is offered the draw-in groove matched with submodule edge.
In such scheme, preferably, described submodule is made up of Wear-resistant, high-temperature resistant wolfram steel material, make submodule possess better high temperature resistant, hardness is high, shock-resistant characteristic.
Compared with prior art, the beneficial effect that has of the utility model:
In actual production, heat block is consumable accessory, need often change, and adopts primary and secondary module, only need change submodule after wearing and tearing, convenient and simple for operation, increases work efficiency, and also can reduce spare parts cost simultaneously.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is structural representation of the present utility model.
Wherein, figure knows label: 1, heating is fast; 2, female module; 3, submodule; 4, cell body.
Embodiment
Propose a kind of specific embodiment of the utility model as shown in Figure 1, chip mounter heat block primary and secondary module, comprises heat block 1, and described heat block 1 is integrally formed by female module 2 and submodule 3.In order to have high temperature resistant, hardness is high, shock-resistant characteristic, described submodule 3 is made up of Wear-resistant, high-temperature resistant wolfram steel material; In order to reduce production cost, removably connecting between described female module 2 and submodule 3, when heating fast 1 and being damaged, dismantling and changing submodule 3, greatly enhancing production efficiency.
In such scheme, further, described female module 2 with between submodule 3 for trench structure is connected, this female module 2 is offered the draw-in groove 4 matched with submodule 3 edge, after submodule 3 weares and teares, the submodule 3 of new replacing inserts clamping in female module 2, simple to operate, quick, determines very greatly degree cuts down finished cost.
Certainly; just by reference to the accompanying drawings the preferred embodiment of the utility model is described in detail above; not limit practical range of the present utility model with this; all equivalence changes done according to principle of the present utility model, structure and structure, all should be covered by protection range of the present utility model.
Claims (3)
1. chip mounter heat block primary and secondary module, comprise heat block (1), it is characterized in that: described heat block (1) is integrally formed by female module (2) and submodule (3), removably connects between described female module (2) and submodule (3).
2. chip mounter heat block primary and secondary module according to claim 1, it is characterized in that: for trench structure is connected between described female module (2) with submodule (3), this female module (2) is offered the draw-in groove (4) matched with submodule (3) edge.
3. chip mounter heat block primary and secondary module according to claim 1 and 2, is characterized in that: described submodule (3) is made up of Wear-resistant, high-temperature resistant wolfram steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520770449.6U CN204946873U (en) | 2015-09-30 | 2015-09-30 | Chip mounter heat block primary and secondary module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520770449.6U CN204946873U (en) | 2015-09-30 | 2015-09-30 | Chip mounter heat block primary and secondary module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204946873U true CN204946873U (en) | 2016-01-06 |
Family
ID=55014275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520770449.6U Expired - Fee Related CN204946873U (en) | 2015-09-30 | 2015-09-30 | Chip mounter heat block primary and secondary module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204946873U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140159A (en) * | 2015-09-30 | 2015-12-09 | 桂林斯壮微电子有限责任公司 | Heating block mother-son module unit of chip mounter |
-
2015
- 2015-09-30 CN CN201520770449.6U patent/CN204946873U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140159A (en) * | 2015-09-30 | 2015-12-09 | 桂林斯壮微电子有限责任公司 | Heating block mother-son module unit of chip mounter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160106 Termination date: 20200930 |