CN107782784A - Ultrasonic flaw detecting device - Google Patents
Ultrasonic flaw detecting device Download PDFInfo
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- CN107782784A CN107782784A CN201710780657.8A CN201710780657A CN107782784A CN 107782784 A CN107782784 A CN 107782784A CN 201710780657 A CN201710780657 A CN 201710780657A CN 107782784 A CN107782784 A CN 107782784A
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- Prior art keywords
- signal
- switch
- ultrasonic
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- bottom electrode
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
Abstract
The present invention provides a kind of ultrasonic flaw detecting device, for being detected to examined object by ultrasonic signal, the ultrasonic flaw detecting device includes lower electrode layer and piezoelectric layer, the lower electrode layer is arranged on the first surface of piezoelectric layer, the lower electrode layer includes the bottom electrode block of multiple array arrangements, the bottom electrode block is connected to signal acquisition module by first switch module, when piezoelectric layer receives ultrasonic reflections signal, ultrasonic reflections signal is converted into electric signal transmission to after bottom electrode block and then the signal acquisition module that is connected with bottom electrode block gathers by piezoelectric layer.Ultrasonic flaw detecting device provided by the present invention has low cost and other advantages simple in construction.
Description
【Technical field】
The present invention relates to detection field, and in particular to a kind of ultrasonic flaw detecting device, it is used to detect rail and tunnel etc.
With the presence or absence of defect.
【Background technology】
The vehicles of train or high ferro as current land bearing capacity maximum, the security that it runs are particularly important.
Rail as train or the basic guarantee of high ferro safe operation, rail it is up-to-standard with it is otherwise most important.Past is generally logical
The mode for crossing artificial detection carries out quality testing to the rail of laying, and detecting rail is with the presence or absence of slight crack etc..However, artificial detection
Efficiency is low, takes time and effort.And then the detection of existing rail employs machinery equipment to replace artificial detection, but existing detection
The machinery equipment of rail belongs to precision instrument, and its is complicated, and cost is also of a relatively high.
【The content of the invention】
For overcome existing failure detector it is complicated the problem of, the present invention provide ultrasonic flaw detecting device.
The present invention is to provide a kind of ultrasonic flaw detecting device to solve a technical scheme of above-mentioned technical problem, for treating
Detection object is detected by ultrasonic signal, and the ultrasonic flaw detecting device includes lower electrode layer and piezoelectric layer, under described
Electrode layer is arranged on the first surface of piezoelectric layer, and the lower electrode layer includes the bottom electrode block of multiple array arrangements, under described
Electrode block is connected to signal acquisition module by first switch module, when piezoelectric layer receives ultrasonic reflections signal, ultrasound
Wave reflection signal is converted into electric signal transmission to after bottom electrode block and then the signal acquisition that is connected with bottom electrode block by piezoelectric layer
Module gathers.
Preferably, the ultrasonic flaw detecting device further comprises upper electrode layer, and the upper electrode layer is arranged on piezoelectric layer
Second surface on, the first surface and second surface are relative two surfaces of piezoelectric layer, the upper electrode layer be used for plus
Voltage is carried so that piezoelectric layer produces ultrasonic wave transmission signal.
Preferably, the ultrasonic flaw detecting device further comprises second switch module, described in the upper electrode layer connection
Second switch module, the second switch module control upper electrode layer connect different voltage.
Preferably, the second switch module includes an at least second switch, and the upper electrode layer passes through described at least one
The switching of second switch may be connected to GND or VDD.
Preferably, the first die sinking block includes the quantity first switch equal with bottom electrode block, and the bottom electrode block leads to
The switching for crossing the first switch may be connected to GND or described signal acquisition modules.
Preferably, the first switch module includes an at least sub switch and quantity is equal with bottom electrode block first opens
Close, one end of the multiple first switch connects one to one with the bottom electrode block, the other end of the multiple first switch
An electric connection point is connected to altogether, and described at least sub switch one end is connected to the electric connection point, and the other end may be connected to GND
Or the signal acquisition module.
Preferably, ultrasonic flaw detecting device includes initial shift：Upper electrode layer and bottom electrode block meet GND to realize electricity
Lotus resets, the second working stage：Bottom electrode block meets GND, and alternately meet VDD and GND excites pressure to upper electrode layer to produce square-wave signal
Electric layer produces ultrasonic wave transmission signal；3rd working stage：Upper electrode layer meets GND or VDD, and bottom electrode block connects signal acquisition list
Member, ultrasonic reflections signal, which is encountered examined object and reflected, produces the ultrasonic reflections signal, and piezoelectric layer is by ultrasonic wave
Reflected signal is transferred to the signal gathering unit being connected with bottom electrode block after being converted into electric signal.
Preferably, the ultrasonic flaw detecting device further comprises ultrasonic transmitter, and the ultrasonic transmitter is set
In the side of examined object, the lower electrode layer and piezoelectric layer are arranged on the relative opposite side of examined object.
Preferably, the first die sinking block includes the quantity first switch equal with bottom electrode block, and the multiple first opens
One end of pass connects one to one with the bottom electrode block, and the other end of the multiple first switch is connected to signal acquisition mould altogether
Block.
Preferably, ultrasonic flaw detecting device further comprises the signal processing module being connected with signal acquisition module, described
Signal processing module is according to the ultrasonic reflections signal analysis examined object that signal acquisition module is collected with the presence or absence of scarce
Fall into.
Compared with prior art, ultrasonic flaw detecting device provided by the present invention is simple in construction, and it is by piezoelectric layer with
Electrode layer coordinates first switch module and signal acquisition module to receive ultrasonic reflections signal, and signal reception is simple in construction, into
This is low, is readily produced manufacture.
Over the piezoelectric layer set upper electrode layer be used for on-load voltage so that piezoelectric layer produce ultrasonic wave transmission signal, in this way,
Together with ultrasonic wave transmission signal and the structure assembly of ultrasonic wave reception signal, dexterously realized by the break-make of controlling switch
Detection to examined object.Ultrasonic flaw detecting device integrated level is high, and structure is simplified.
【Brief description of the drawings】
Fig. 1 is the layer structure schematic diagram of first embodiment of the invention ultrasonic flaw detecting device.
Fig. 2 is the circuit modular structure schematic diagram of first embodiment of the invention ultrasonic flaw detecting device.
Fig. 3 is the concrete structure schematic diagram of first embodiment of the invention ultrasonic flaw detecting device.
Fig. 4 is the concrete structure schematic diagram of second embodiment of the invention ultrasonic flaw detecting device.
Fig. 5 is the concrete structure schematic diagram of third embodiment of the invention ultrasonic flaw detecting device.
【Embodiment】
In order that the purpose of the present invention, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and embodiment,
The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention,
It is not intended to limit the present invention.
Referring to Fig. 1, first embodiment of the invention ultrasonic flaw detecting device 10, for by ultrasonic signal to be detected
Object carries out defects detection, and during detection, ultrasonic flaw detecting device 10 is placed on the surface of examined object, and the examined object can
To be rail and tunnel etc..Ultrasonic flaw detecting device 10 includes flaw detection module 10a and control circuitry layer 17, control circuitry layer 17 are set
Put below flaw detection module 10a and (wait the noun of locality to be only limitted to the relative position in given view up and down mentioned in the present invention
Put, rather than absolute position, it will be understood that after given view planar carries out 180 ° of rotations, position word " under " can replace
For position word " on ").It is appreciated that the position of control circuitry layer 17 can need to be adjusted according to the practical layout of product,
It can be arranged on flaw detection module 10a left side, right side or lower right etc..
Flaw detection module 10a includes upper electrode layer 11, piezoelectric layer 13 and lower electrode layer 15, upper electrode layer 11 and lower electrode layer
15 are separately positioned on the first surface and second surface of piezoelectric layer 13, and first surface and second surface are relative two of piezoelectric layer 15
Individual surface, control circuitry layer 17 are arranged on side of the lower electrode layer 15 away from piezoelectric layer 13.Preferably, upper electrode layer 11 is one whole
Layer conductive material is made, and it is used for on-load voltage so that piezoelectric layer 13 produces ultrasonic wave transmission signal.Lower electrode layer 15 includes battle array
The bottom electrode block 151 (label is shown in Fig. 3) of arrangement is arranged, bottom electrode block 151 is made of conductive material, and it, which is used to receive, comes from piezoelectricity
The ultrasonic reflections signal of layer 13.
Piezoelectric layer 13 is piezoelectric film, it is preferable that piezoelectric layer 13 is the piezoelectric film of polarization in situ, i.e., described piezoelectric layer 13 is to adopt
Polarized to be formed with the mode of original position polarization.Specially described piezoelectric layer 13 is to be formed in situ piezoelectric film in matrix one side, described
Piezoelectric film includes relative first surface and second surface, and the first surface potential for making the piezoelectric film is zero；In the piezoelectric film
Second surface where side the first electric field and the second electric field are provided, the potential of the first electric field is higher than the potential of the second electric field；
Ionize the environmental gas of the side where the piezoelectric film second surface in the presence of one electric field, the environmental gas is through the second electricity
And be gathered in the second surface of piezoelectric film, make to form the film internal electric field along film thickness direction in the piezoelectric film, to described
Piezoelectric film carries out polarization and forms the piezoelectric layer 13.
In actual production, can be will using modes such as chemical vapor deposition, physical vapour deposition (PVD), plasma sputterings
Piezoelectric film is formed on matrix.In the prior art, piezoelectric film is glued typically by existing finished product is purchased by one layer of tack coat
It is attached on matrix to be polarized, generally, the thickness of piezoelectric layer 13 that such a method is formed is not suitable with existing electricity more than 30 μm
The frivolous development trend of sub- device, and the ultrasonic flaw detecting device of this piezoelectric layer 13 is used, because piezoelectric layer 13 is too thick, because
This resolution ratio is relatively low.And the piezoelectric layer 13 of the offer of the present invention is formed in situ on matrix, therefore very thin thickness, and form work
Skill is simple, so as to reduce the transmission loss of signal, is advantageous to improve the resolution ratio of the fingerprint recognition of ultrasonic flaw detecting device 10.Again
Person, the present invention set electrode compared to the upper and lower surface directly in piezoelectric layer 13, piezoelectric layer 13 will not be made directly to bear to be applied
High voltage electric field, be avoided that piezoelectric layer 13 is breakdown.The present invention (can for details, reference can be made to Application No. using ion body polarization
201710108374.9 Chinese patent application) or X ray polarization (for details, reference can be made in Application No. 201611222575.3
State's patent application) mode form the piezoelectric layer 13, the piezoelectric layer 13 formed can accomplish it is very thin, moreover, the present invention
The piezo-electric effect of piezoelectric layer 13 is preferable and service life is grown, and can be good at being useful in ultrasonic flaw detecting device 10, is beneficial to
Realize 10 preferable recognition effect of ultrasonic flaw detecting device.In the present invention, the pressure of the piezoelectric layer 13 of polarization in situ has been carried out
Electrical effect D33 scope is 20-35pC/N.
The material of the piezoelectric layer 13 is piezoelectric, specific to can be selected but be not limited to：Kynoar, polyvinyl chloride,
Poly-γ-methyl-L-glutamate, one or several kinds of combinations in makrolon, polyvinylidene fluoride copolymer.
In some embodiments of the invention, the copolymer of the material selection Kynoar of the piezoelectric layer 13 is poly- inclined
PVF-trifluoro-ethylene copolymer, in order to obtain the preferable piezoelectric layer 13 of piezo-electric effect, the Kynoar and trifluoro-ethylene
The scope of mass ratio be (60-95)：(5-30), it is preferable that the scope of its mass ratio is (75-86)：(15-25), further
Preferably, its mass ratio is 80：20, the Kynoar and trifluoro-ethylene copolymer can more individually be dropped from Kynoar
Low cost, and it also has preferable piezo-electric effect.
The thickness of the piezoelectric layer 13 is less than 30 μm, and its thickness may further be less than 9 μm, yet further, its thickness
Can be 1.5-7.4 μm, 1.9-7.2 μm, 2.2-8.6 μm, 2.8-8.4 μm or 3.6-6.6 μm, further, can be specific
It is 1.8 μm, 2.4 μm, 2.6 μm, 3.7 μm, 3.9 μm, 4.2 μm, 4.6 μm, 5.6 μm, 5.8 μm, 6.7 μm, 8.6 μm, 8.7 μm.
Referring to Fig. 2, control circuitry layer 17 is electrically connected with flaw detection module 10a, specifically, control circuitry layer 17 includes the
One switch module 171, second switch module 173, signal acquisition module 175 and signal processing module 177, signal processing module
177 are electrically connected with successively with signal acquisition module 175, first switch module 171 and flaw detection module 10a, second switch module
173 are also connected to flaw detection module 10a.
Referring to Fig. 3, upper electrode layer 11 is connected to second switch module 173, it can be connect by second switch module 173
VDD or GND.Specifically, the second switch module 173 includes switch S1 and switch S2, wherein switch S1 and switch S2 one end
It is connected with upper electrode layer 11, the other end connects VDD and GND respectively.Bottom electrode block 151 in lower electrode layer 15 passes through first switch
Module 171 is connected to signal acquisition module 175.First switch module 171 includes sub switch 1713 and quantity and bottom electrode block
151 equal first switches 1711, first switch 1711 are K1 as illustrated in the drawing, K2Kn, sub switch
1713 are S3 and S4, one end of the multiple first switch 1711 correspond with the bottom electrode block 151 as illustrated in the drawing
Connection, the other end of the multiple first switch 1711 are connected to an electric connection point A altogether, and the multiple one end of sub switch 1713 connects
The electric connection point A is connected to, the other end may be connected to GND or described signal acquisition modules 175.Signal acquisition module 175 with
Signal processing module 177 is electrically connected with.
Deformed as one kind, the first switch in the first switch module 171 can also be single, preferred single-pole double throw
Switch.
Deformed as one kind, the multiple sub switch 1713 can be omitted, and bottom electrode block 151 directly passes through first switch 1711
It is connected to GND or described signal acquisition modules 175.
Deformed as one kind, the quantity of sub switch 1713 can also be single, preferred single pole multiple throw.
When ultrasonic flaw detecting device 10 is operated, including initial shift：Upper electrode layer 11 and bottom electrode block 151 connect
GND is to realize that electric charge is reset, the second working stage：Bottom electrode block 151 meets GND, and upper electrode layer 11 alternately meets VDD and GND to produce
Raw square-wave signal excites piezoelectric layer 13 to produce ultrasonic wave transmission signal；3rd working stage：Upper electrode layer 11 meets GND or VDD, under
Electrode block 151 connects signal gathering unit, and ultrasonic reflections signal encounters examined object and reflects generation ultrasonic reflections letter
Number, ultrasonic reflections signal is converted into being transferred to the signal acquisition list being connected with bottom electrode block 151 after electric signal by piezoelectric layer 13
Member 175, ultrasonic reflections signal and then is gathered by the signal acquisition module 175 being connected with bottom electrode block 151.The signal transacting
The ultrasonic reflections signal analysis examined object that module gathers according to signal acquisition module 175 whether there is defect, such as detect
Rail whether there is crack, surface defect etc., and such as tunnel whether there is crack.
The signal processing mode of signal acquisition module 175 including but not limited to first establishes a standard database, the standard
Ultrasonic wave transmission signal is stored in database in the ultrasound for running into examined object back reflection existing for zero defect problem and returning
Wave reflection signal, signal acquisition module 175 is by the ultrasonic wave in the ultrasonic reflections signal currently collected and standard database
Reflected signal is compared, and larger difference such as occurs, then it is assumed that examined object is defective.It is on the contrary, then it is assumed that examined object
Zero defect.
Preferably, first stage, second stage and phase III are carried out successively.
It is appreciated that in the first phase, switch S1 and S2 and alternately close the voltage for being to provide for an alternating change
Signal is to piezoelectric layer 13 to produce ultrasonic wave transmission signal.It is appreciated that VD and GND is two voltage signals with pressure difference.
It is appreciated that first switch 1711 sequentially turns on and examined object is detected.It is appreciated that it is described successively
Turn on and turned on for a certain moment, one and only one first switch 1711.All first switches 1711 are completed after once turning on
Complete the detection to a cycle of examined object.
It is appreciated that first switch module 171 and second switch module 173 pass through the control that connects together in the present invention
Device control first switch 1711, sub switch 1713 and switch S1 and switch S2 break-make processed.Deformed as one kind, first switch mould
Block 171 connects a controller, and second switch module 173 connects another controller.
Referring to Fig. 4, second embodiment of the invention ultrasonic flaw detecting device 20, is filled with ultrasonic examination in first embodiment
20 are put to the difference is that only：The emitting structural of the ultrasonic signal of ultrasonic flaw detecting device 20 is different.Specifically, it is ultrasonic
Wave inspection device 20 includes ultrasonic transmitter 21, piezoelectric layer 23 and lower electrode layer 25, and lower electrode layer 25 is arranged on piezoelectric layer 23
A surface, lower electrode layer 25 includes the bottom electrode block 251 of multiple array arrangements.Bottom electrode block 251 passes through quantity and lower electricity
The equal first switch 2711 of pole block 251 is connected to signal acquisition module 275, one end of the multiple first switch 2711 and institute
Bottom electrode block 251 to be stated to connect one to one, the other end of the multiple first switch 2711 is connected to signal acquisition module 275 altogether,
Signal acquisition module 275 is electrically connected with signal processing module 277.
When ultrasonic flaw detecting device 20 is operated, including initial shift：Bottom electrode block 251 meets GND to realize electricity
Lotus resets, the second working stage：The work of ultrasonic transmitter 21 produces ultrasonic wave transmission signal；3rd working stage：Bottom electrode
Block 251 connects signal gathering unit, and ultrasonic reflections signal encounters examined object and reflects generation ultrasonic reflections signal, pressure
Ultrasonic reflections signal is converted into being transferred to the signal gathering unit 275 being connected with bottom electrode block 251 after electric signal by electric layer 23,
Ultrasonic reflections signal and then gathered by the signal acquisition module 275 being connected with bottom electrode block 251.The signal processing module root
The ultrasonic reflections signal analysis examined object gathered according to signal acquisition module 275 whether there is defect.
Preferably, initial shift, the second working stage and the 3rd working stage are sequentially carried out.
It is appreciated that first switch 2711 connects controller, controller controls the first switch 2711 to sequentially turn on.
Ultrasonic transmitter 21 in ultrasonic flaw detecting device 20 is arranged on the side of examined object, the lower electrode layer
15 with the opposite side that to be arranged on examined object relative of piezoelectric layer 13.Specifically, if examined object is the iron in dispensing use
During rail, rail bottom surface contacts with ground, and top surface is the contact surface with train or high ferro, and the ultrasonic transmitter 21 is arranged on it
Left surface, lower electrode layer 15 and piezoelectric layer 13 are arranged on its right flank, it is possible to understand that both positions can also exchange.Can
With understand, in the workshop of rail, ultrasonic transmitter 21 can be arranged on arbitrarily with lower electrode layer 15 and piezoelectric layer 13
The opposite side of place side.
Referring to Fig. 5, third embodiment of the invention ultrasonic flaw detecting device 30, ultrasonic flaw detecting device 30 includes piezoelectric layer
33 and lower electrode layer 35, lower electrode layer 35 be arranged on the surface of piezoelectric layer 33, lower electrode layer 35 is connected by first switch module 371
Signal acquisition module 375 is connected to, signal acquisition module 375 is electrically connected with signal processing module 377 again.Lower electrode layer 35 includes
The bottom electrode block 351 of multiple array arrangements.First switch module 371 includes an at least sub switch 3713 and quantity and bottom electrode block
351 equal first switches 3711, one end of the multiple first switch 3711 corresponds with the bottom electrode block 351 to be connected
Connect, the other end of the multiple first switch 3711 is connected to an electric connection point B altogether, and a described at least sub switch 3713 one end connects
The electric connection point B is connected to, the other end may be connected to GND or VDD or described signal acquisition modules 375.The present embodiment neutron
The quantity of switch 3713 is 3, specially S3, S4 and S5, and lower electricity is controlled by controlling the break-make of 3 sub switchs 3713
Pole block 351 is connected to GND or VDD or described signal acquisition module 375.
Deformed as one kind, the quantity of sub switch 3713 can also be single, preferred single pole multiple throw.
When ultrasonic flaw detecting device 30 is operated, including initial shift：First switch 3711 all turns on, control
Switch S5 to disconnect, S3 and S4 alternate conductions excite piezoelectric layer 33 to produce ultrasonic wave transmission signal to produce square-wave signal；Second work
Make the stage：The first switch 3711 is sequentially turned on, and controlling switch S3 and S4 disconnect, and S5 conductings, ultrasonic wave transmission signal is encountered
Examined object, which reflects, produces ultrasonic reflections signal, and piezoelectric layer 33 passes after ultrasonic reflections signal is converted into electric signal
It is defeated by the signal gathering unit 375 being connected with bottom electrode block 351, ultrasonic reflections signal and then is connected with bottom electrode block 351
Signal acquisition module 375 gather.The ultrasonic reflections that the signal processing module 377 gathers according to signal acquisition module 375
Signal analysis examined object whether there is defect.
Preferably, initial shift and the second working stage be alternately sequentially.
Lower electrode layer 35 is both as the electrode for exciting piezoelectric layer 33 to produce ultrasonic wave transmission signal, and conduct in the present embodiment
The electrode of ultrasonic wave reception signal is received, its is simple in construction, and integrated level is high.
Compared with prior art, ultrasonic flaw detecting device provided by the present invention is simple in construction, and it is by piezoelectric layer with
Electrode layer coordinates first switch module and signal acquisition module to receive ultrasonic reflections signal, and signal reception is simple in construction, into
This is low, is readily produced manufacture.
Over the piezoelectric layer set upper electrode layer be used for on-load voltage so that piezoelectric layer produce ultrasonic wave transmission signal, in this way,
Together with ultrasonic wave transmission signal and the structure assembly of ultrasonic wave reception signal, dexterously realized by the break-make of controlling switch
Detection to examined object.Ultrasonic flaw detecting device integrated level is high, and structure is simplified.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all originals in the present invention
Any modification made within then, equivalent substitution and improvement etc. all should be included within protection scope of the present invention.
Claims (10)
- A kind of 1. ultrasonic flaw detecting device, for being detected to examined object by ultrasonic signal, it is characterised in that：Institute Stating ultrasonic flaw detecting device includes lower electrode layer and piezoelectric layer, and the lower electrode layer is arranged on the first surface of piezoelectric layer, institute Stating lower electrode layer includes the bottom electrode block of multiple array arrangements, and the bottom electrode block is connected to signal by first switch module and adopted Collect module, when piezoelectric layer receives ultrasonic reflections signal, ultrasonic reflections signal is converted into electric signal transmission by piezoelectric layer To after bottom electrode block so that be connected with bottom electrode block signal acquisition module collection.
- 2. ultrasonic flaw detecting device as claimed in claim 1, it is characterised in that：The ultrasonic flaw detecting device further comprises Upper electrode layer, the upper electrode layer are arranged on the second surface of piezoelectric layer, and the first surface and second surface are piezoelectric layer Two relative surfaces, the upper electrode layer is used for on-load voltage so that piezoelectric layer produces ultrasonic wave transmission signal.
- 3. ultrasonic flaw detecting device as claimed in claim 2, it is characterised in that：The ultrasonic flaw detecting device further comprises Second switch module, the second switch module include an at least second switch, and the upper electrode layer passes through described at least 1 The switching of two switches can connect different voltage.
- 4. ultrasonic flaw detecting device as claimed in claim 1, it is characterised in that：The first switch module includes at least one son A pair of switch and the quantity first switch equal with bottom electrode block, one end of the multiple first switch and the bottom electrode block 1 It should connect, the other end of the multiple first switch is connected to an electric connection point altogether, and described at least sub switch one end is connected to The electric connection point, the other end may be connected to GND or VD D or described signal acquisition modules, and ultrasonic flaw detecting device carries out work When making, including initial shift：First switch Close All, bottom electrode block alternately meet VD D and GND to produce square-wave signal Piezoelectric layer is excited to produce ultrasonic wave transmission signal；Second working stage：The first switch sequentially turns on, bottom electrode block connection letter Number acquisition module, ultrasonic wave transmission signal, which is encountered examined object and reflected, produces ultrasonic reflections signal, and piezoelectric layer will be super Sound wave reflected signal is transferred to the signal gathering unit being connected with bottom electrode block after being converted into electric signal.
- 5. ultrasonic flaw detecting device as claimed in claim 1, it is characterised in that：The first die sinking block includes quantity and lower electricity The equal first switch of pole block, the bottom electrode block are adopted by the switching of the first switch connectable to GND or described signals Collect module.
- 6. ultrasonic flaw detecting device as claimed in claim 1, it is characterised in that：The first switch module includes at least one son Switch and the quantity first switch equal with bottom electrode block, one end of the multiple first switch and the bottom electrode block are one by one Corresponding connection, the other end of the multiple first switch are connected to an electric connection point, at least sub switch one end connection altogether In the electric connection point, the other end may be connected to GND or described signal acquisition modules.
- 7. ultrasonic flaw detecting device as claimed in claim 1, it is characterised in that：Ultrasonic flaw detecting device includes the first work rank Section：Upper electrode layer and bottom electrode block meet GND to realize that electric charge is reset, the second working stage：Bottom electrode block connects GND, upper electrode layer Alternating meets VD D and GND and excites piezoelectric layer to produce ultrasonic wave transmission signal to produce square-wave signal；3rd working stage：Top electrode Layer meets GND or VD D, and bottom electrode block connects signal gathering unit, and ultrasonic reflections signal encounters examined object and reflects generation Ultrasonic reflections signal is converted into being transferred to what is be connected with bottom electrode block after electric signal by the ultrasonic reflections signal, piezoelectric layer Signal gathering unit.
- 8. ultrasonic flaw detecting device as claimed in claim 1, it is characterised in that：The ultrasonic flaw detecting device further comprises Ultrasonic transmitter, the ultrasonic transmitter are arranged on the side of examined object, and the lower electrode layer and piezoelectric layer are set In the relative opposite side of examined object.
- 9. ultrasonic flaw detecting device as claimed in claim 8, it is characterised in that：The first die sinking block includes quantity and lower electricity The equal first switch of pole block, one end of the multiple first switch connects one to one with the bottom electrode block, the multiple The other end of first switch is connected to signal acquisition module altogether.
- 10. ultrasonic flaw detecting device as claimed in claim 1, it is characterised in that：Ultrasonic flaw detecting device further comprise with The signal processing module of signal acquisition module connection, the ultrasound that the signal processing module is collected according to signal acquisition module Wave reflection signal analysis examined object whether there is defect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710780657.8A CN107782784A (en) | 2017-09-01 | 2017-09-01 | Ultrasonic flaw detecting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710780657.8A CN107782784A (en) | 2017-09-01 | 2017-09-01 | Ultrasonic flaw detecting device |
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| Publication Number | Publication Date |
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| CN107782784A true CN107782784A (en) | 2018-03-09 |
Family
ID=61437812
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710780657.8A Pending CN107782784A (en) | 2017-09-01 | 2017-09-01 | Ultrasonic flaw detecting device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3410643A (en) * | 1961-04-14 | 1968-11-12 | Saint Gobain | Apparatus for detecting and recording the locations of defects in sheet material in two dimensions |
| CN1492999A (en) * | 2001-11-14 | 2004-04-28 | ��ʽ���綫֥ | Ultrasonic detector ultrasonic transducer, examining instrument and ultrosonograhping device |
| WO2010061912A1 (en) * | 2008-11-28 | 2010-06-03 | オリンパスメディカルシステムズ株式会社 | Ultrasonic transducer, electronic device, and ultrasonic endoscope |
| CN202404068U (en) * | 2011-12-27 | 2012-08-29 | 华南理工大学 | Crawler type wireless ultrasonic probe assembly for detecting flaws of steel rail |
| CN106166078A (en) * | 2016-06-27 | 2016-11-30 | 麦克思商务咨询(深圳)有限公司 | Ultrasonic sensing device and method for sensing thereof |
-
2017
- 2017-09-01 CN CN201710780657.8A patent/CN107782784A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3410643A (en) * | 1961-04-14 | 1968-11-12 | Saint Gobain | Apparatus for detecting and recording the locations of defects in sheet material in two dimensions |
| CN1492999A (en) * | 2001-11-14 | 2004-04-28 | ��ʽ���綫֥ | Ultrasonic detector ultrasonic transducer, examining instrument and ultrosonograhping device |
| WO2010061912A1 (en) * | 2008-11-28 | 2010-06-03 | オリンパスメディカルシステムズ株式会社 | Ultrasonic transducer, electronic device, and ultrasonic endoscope |
| CN202404068U (en) * | 2011-12-27 | 2012-08-29 | 华南理工大学 | Crawler type wireless ultrasonic probe assembly for detecting flaws of steel rail |
| CN106166078A (en) * | 2016-06-27 | 2016-11-30 | 麦克思商务咨询(深圳)有限公司 | Ultrasonic sensing device and method for sensing thereof |
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