CN107778973B - Electrically heating expansion high-energy adhesive and preparation method thereof - Google Patents
Electrically heating expansion high-energy adhesive and preparation method thereof Download PDFInfo
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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Abstract
The invention discloses an electric heating expansion high-energy adhesive and a preparation method thereof. The temperature control device comprises a multilayer composite structure formed by a conductive heating layer and a heated expansion layer and a temperature control device, wherein the conductive heating layer contains a conductive wire, and the heated expansion layer is coated outside the conductive heating layer; wherein the temperature control device is positioned inside or outside the multilayer composite structure. The multilayer composite structure can also be selectively wrapped with a layer of insulating film and a layer of release layer. The electric heating expansion high-energy adhesive is convenient to use: the temperature control device is set to be at a set temperature, then 220v alternating current is connected, when the temperature of a system rises to be higher than the starting expansion temperature of the heated expansion layer, volume expansion is generated, and the used space is filled according to actual conditions. The heating rate is fast, and the temperature can be heated to 100-200 ℃ within 3-5 seconds.
Description
Technical Field
The invention belongs to the field of composite materials, and particularly relates to an electric heating expansion high-energy adhesive and a preparation method thereof.
Background
The high-energy glue is a thermoplastic expansion composite sheet material which can start to expand in a certain temperature range, and the effect of filling gaps is achieved after expansion. Can be applied to sport equipment grab handle and goods integrated into one piece and replace the PU foaming, save the filling equipment and drop into, damage is hindered in the bruise of product appearance when avoiding back process operation, or be applied to unmanned aerial vehicle, medical instrument etc. but it just can use under the external hot environment that needs, generally adopts oven etc. to carry out external heating, and the use is troublesome, and the use place needs there be external heating equipment.
Chinese patent application 201310098800.7 relates to a high-energy adhesive product, a preparation method and its use. The high-energy adhesive product comprises the following components in kilogram weight: 15-25 parts of thermoplastic rubber; 10-25 parts of ethyl acetate; 6-20 parts of foaming agent; 30-60 parts of butanone; 0.5-3 parts of plasticizer; 0.5-2.5 parts of anti-aging agent; 0.5-2 parts of stearic acid; 2-3.5 of a cross-linking agent; 3-10 parts of polyester fiber. The high-energy adhesive product can be used as an internal filling foaming agent in the production of various composite material products, can replace a nylon air pipe mode in the production of carbon fiber and glass fiber composite material products, is coated on cotton cloth, is directly wrapped by carbon cloth after being dried, and is placed in a mold for heating and forming. The method is characterized in that the mold is heated, heat is conducted to the high-energy adhesive, and then the high-energy adhesive is heated and expanded.
The invention aims to provide a high-energy adhesive which is heated by electrifying, and heat is transferred to the high-energy adhesive from inside to outside to cause the high-energy adhesive to expand.
Disclosure of Invention
The invention aims to provide the electrically-heated expandable high-energy adhesive which is simple to operate and convenient to use and can transfer heat to the high-energy adhesive from inside to outside.
In order to achieve the purpose of the invention, the invention provides an electric heating expansion high-energy adhesive which is characterized by comprising a multilayer composite structure formed by a conductive heating layer and a thermal expansion layer and a temperature control device, wherein the conductive heating layer contains a conductive wire, and the thermal expansion layer is coated outside the conductive heating layer; wherein the temperature control device is positioned inside or outside the multilayer composite structure.
Further, an outer layer of the thermally expansive layer is coated with an insulating film; preferably, the insulating film is one or more of polyimide, polyethylene, polyvinylidene fluoride and polytetrafluoroethylene.
Further, a release layer is attached to the outer layer of the heated expansion layer; preferably, the release layer is release paper or a PET release film.
Further, a release layer is attached to the outer layer of the insulating film; preferably, the release layer is release paper or a PET release film.
Further, the conductive heating layer is composed of 30-50% of carbon microcrystal particles; 20-40% of conductive metal filler; 1-30% of epoxy resin; 1-15% of latent epoxy resin curing agent; 1-10% of epoxy toughening agent; 1-5% of silicon dioxide; 0.1 to 1 percent of adhesion promoter; preferably, the carbon microcrystal particles are graphite powder with the particle size of 1-10 mu m.
Further, the carbon microcrystal particles are graphite powder.
Further, the heated expansion layer is an epoxy resin system which can be formed by thermosetting.
Further, the expansion temperature range of the heated expansion layer is 100-200 ℃; the expansion pressure is 0.1-20 MPa;
optionally, the volume magnification before and after expansion is 1-200 times.
Further, the temperature control device is implanted into the conductive heating layer or the thermal expansion layer or the insulating film.
Further, the conductive wire is made of conductive metal; preferably, the conductive wire is made of copper;
optionally, the conducting wire can be connected with a 220V alternating current power supply;
optionally, the conductive wire may be externally connected to the temperature control device.
The expansion temperature range of the heated expansion layer is 100-200 ℃, the volume multiplying power before and after expansion is 1-200 times, the temperature of the conductive heating layer can be controlled by adjusting an external temperature controller, so that the expansion multiplying power of the heated expansion layer is adjusted, and when the temperature is lower than 100 ℃, the heated expansion layer cannot achieve the effect of expansion repair; when the temperature is higher than 200 ℃, the expansion rate of the thermal expansion layer is too large, and the thermal expansion layer is easily decomposed.
The release layer has an isolation protection effect on internal materials, and can be conveniently peeled off when in use.
The invention has the beneficial effects that:
1. the conductive heating layer is prepared by mixing carbon microcrystal particles and a high polymer resin material, under the action of alternating current, carbon atoms in the conductive heating layer generate and violently collide and rub to generate a large amount of heat energy and transfer the heat energy to the outside, the heating rate is high, and the conductive heating layer can be heated to 100-5 seconds and 200 ℃;
2. the electrically heated and expanded high-energy adhesive is convenient to use, and can be directly externally connected with a power supply when in use, the conductive heating layer is electrified to generate heat, the heated volume of the heated and expanded layer expands greatly, other external heating equipment (such as a hot press) is not needed, and the electrically heated and expanded high-energy adhesive can be used under the condition of the power supply.
3. The electric heating expansion high-energy adhesive is suitable for generating outward expansion extrusion force in local or narrow environment.
Description of the drawings:
FIG. 1 is a schematic view of an internal structure of a portion of the electrically expandable high-energy adhesive according to the present invention;
FIG. 2 is a schematic view of an internal structure of a portion of the electrically expandable high-energy adhesive according to the present invention;
FIG. 3 is a schematic view of an internal structure of a portion of the electrically expandable high energy adhesive of the present invention;
fig. 4 is a schematic diagram of an internal structure of a portion of the electrically-heated expandable high-energy adhesive according to the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention. The examples do not specify particular techniques or conditions, and are performed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
The following examples are illustrated in conjunction with FIGS. 1-4. Fig. 1-4 are schematic diagrams of one internal structure of the part of the electrically heating expandable high-energy adhesive respectively. Wherein 1 is a conductive wire, 2 is a conductive heater, 3 is a thermal expander, 4 is an insulating film, and 5 is a release layer.
The preparation method of the electrically heating expanded high-energy adhesive comprises the following steps,
firstly, preparing a conductive heating layer: the conductive ink comprises the following components in percentage by mass: 30-50% of carbon microcrystal particles; 20-40% of conductive metal filler; 1-30% of epoxy resin; 1-15% of latent epoxy resin curing agent; 1-10% of epoxy toughening agent; 1-5% of silicon dioxide; 0.1 to 1 percent of adhesion promoter. The carbon crystallite particles are preferably graphite powder of 1-10 μm. The conductive ink resin is printed on a base material (such as release paper) by screen printing, the thickness range is 0.1-1mm, and then baking and drying are carried out to enable the conductive heating layer to be cured and molded, the baking temperature is 100-; two conductive wires (the number is not limited, for example, two) are erected at the same time and are used for connecting the conductive heating layer and the temperature control device;
and secondly, coating a heated expansion layer on the cured conductive heating layer, wherein the layer is formed by mixing 50-60 parts of epoxy resin, 10-20 parts of curing agent, 5-10 parts of foaming agent, 20-30 parts of heat conduction additive and 0.1-1 part of flatting agent, and the epoxy resin system is composed of heat-fusible epoxy resin, curing agent, foaming agent, heat conduction additive and leveling agent and can be formed by thermosetting. The hot melting coating temperature is 50-70 ℃, the coating is coated on the conductive heating layer, and when the conductive heating layer is cooled to room temperature, the heated expansion layer is in a semi-solid state; in order to obtain a symmetrical coating structure, the release layer in the first step needs to be peeled off, and then the conductive heating layer is coated with the thermal expansion layer in the same way, so as to obtain a structure of the thermal expansion layer/the conductive heating layer/the thermal expansion layer. The thickness of the coated thermal expansion layer is 50-400 μm, and less than 50 μm makes it difficult to realize stable mass production, and more than 400 μm makes the fluidity of the resin cause the edge thickness after coating to be lower and the quality to be inconsistent.
The heated expansion layer is a thermosetting composite material, and the expansion starting temperature range is 100-200 ℃; the generated expansion pressure is 0.1-20 MPa; the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
And thirdly, selectively including an insulating layer according to needs, wherein the preparation method comprises the following steps: the insulating layer material is coated or attached to the outer part of the heated expansion layer, and the thickness of the insulating layer material is selected to be 100-500 mu m in consideration of the convenience of operation and the bending deformation degree of the final integral high-energy adhesive product.
The fourth step, selectively attaching a release layer to the outermost layer, wherein in one case, if the insulating layer exists, the release layer is attached to the outer surface of the insulating layer; and if the second layer is not provided with the insulating layer, the release layer is attached to the outer surface of the thermal expansion layer.
And fifthly, connecting the electric lead in the first step with the conductive heating layer and the temperature control device, and finally reserving a connector for connecting alternating current 220 v. Thus obtaining the high-energy glue expanded by electric heating.
The using process is as follows:
and (3) peeling off the release layer, paving the high-energy adhesive at a use position, setting the temperature of the temperature control device to be 150 ℃, connecting 220v alternating current, controlling input power by the temperature control device, converting electric energy into heat energy, and when the temperature of the system rises to be higher than the starting expansion temperature of the heated expansion layer, enabling the heated expansion layer to expand in volume, so as to fill the use space according to actual conditions.
The carbon crystallite particles in the following examples may be graphite powder of 1 to 10 μm.
EXAMPLE 1 preparation of electrically expandable high-energy adhesive
Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The invention will now be further described with reference to the accompanying drawings and detailed description.
Firstly, preparing a conductive heating layer: the conductive ink comprises the following components in percentage by mass: 30% of carbon microcrystal particles; 40% of conductive metal filler; 1% of epoxy resin; 15% of latent epoxy resin curing agent; 8% of an epoxy toughening agent; 5% of silicon dioxide; 1 percent of adhesion promoter. According to a set circuit pattern such as a parallel circuit pattern, the prepared conductive ink resin is printed on the surface of release paper by silk screen printing, and the thickness range is 0.1 mm; two electric leads are erected at the same time and used for connecting the electric heating layer and the temperature control device;
then baking and drying to enable the conductive heating layer to be solidified and formed, wherein the baking temperature is 100-;
and secondly, coating a heated expansion layer on the cured conductive heating layer, wherein the material of the layer is an epoxy resin system which is formed by 50 parts of epoxy resin, 10 parts of curing agent, 5 parts of foaming agent, 20 parts of heat-conducting additive and 0.1 part of leveling auxiliary agent and can be subjected to thermosetting molding. The hot melting coating temperature is 50-70 ℃, the coating is coated on the conductive heating layer, and when the conductive heating layer is cooled to room temperature, the heated expansion layer is in a semi-solid state; in order to obtain a symmetrical coating structure, the release layer in the first step needs to be peeled off, and then the conductive heating layer is coated with the thermal expansion layer in the same way, so as to obtain a structure of the thermal expansion layer/the conductive heating layer/the thermal expansion layer. The thickness of the applied thermally expanded layer ranged from 400 μm.
The heated expansion layer is a thermosetting composite material, and the expansion starting temperature range is 100-200 ℃; the generated expansion pressure is 0.1-20 MPa; the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
And thirdly, selectively including an insulating layer according to needs, wherein the preparation method comprises the following steps: and coating or attaching an insulating layer material to the outside of the heated expansion layer, and selecting the thickness of the insulating layer material to be 100 mu m in consideration of the convenience of operation and the bending deformation degree of the overall final high-energy adhesive product.
The fourth step, selectively attaching a release layer to the outermost layer, wherein in one case, if the insulating layer exists, the release layer is attached to the outer surface of the insulating layer; and if the second layer is not provided with the insulating layer, the release layer is attached to the outer surface of the thermal expansion layer.
And fifthly, connecting the two conducting wires in the first step with a temperature control device, and finally reserving a connector for connecting alternating current 220 v. Thus obtaining the high-energy glue expanded by electric heating.
The using process is as follows:
and (3) peeling off the release layer, paving the high-energy adhesive at a use position, setting the temperature of the temperature control device to be 150 ℃, connecting 220v alternating current, controlling input power by the temperature control device, converting electric energy into heat energy, and generating volume expansion when the temperature of the system rises to be higher than the starting expansion temperature of the heated expansion layer, so that the space to be used is filled according to actual conditions.
Under the action of alternating current, the conductive heating layer generates a large amount of heat energy and transfers the heat to the outside, the heating speed is high, and the temperature can be heated to 100-200 ℃ within 3-5 seconds. Under the condition of no external space limitation at normal pressure, the expansion layer expands freely, and the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
EXAMPLE 2 preparation of electrically expandable high-energy adhesive
Firstly, preparing a conductive heating layer: the conductive ink comprises the following components in percentage by mass: 50% of carbon microcrystal particles; 20% of conductive metal filler; 10% of epoxy resin; 8.5 percent of latent epoxy resin curing agent; 10% of an epoxy toughening agent; 1% of silicon dioxide; 0.5 percent of adhesion promoter. According to a set circuit pattern, the prepared conductive ink resin is printed on the surface of release paper through screen printing, and the thickness range is 0.1 mm; meanwhile, erecting a conductive wire for standby;
then baking and drying to enable the conductive heating layer to be solidified and formed, wherein the baking temperature is 100-;
and secondly, coating a heated expansion layer on the cured conductive heating layer, wherein the material of the layer is a thermosetting epoxy resin system consisting of 60 parts of epoxy resin, 20 parts of curing agent, 10 parts of foaming agent, 30 parts of heat-conducting additive and 1 part of leveling auxiliary agent. The hot melting coating temperature is 50-70 ℃, the coating is coated on the conductive heating layer, and when the conductive heating layer is cooled to room temperature, the heated expansion layer is in a semi-solid state; in order to obtain a symmetrical coating structure, the release layer in the first step needs to be peeled off, and then the conductive heating layer is coated with the thermal expansion layer in the same way, so as to obtain a structure of the thermal expansion layer/the conductive heating layer/the thermal expansion layer. The thickness of the applied thermally expanded layer ranged from 50 μm.
The heated expansion layer is a thermosetting composite material, and the expansion starting temperature range is 100-200 ℃; the generated expansion pressure is 0.1-20 MPa; the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
And thirdly, selectively including an insulating layer according to needs, wherein the preparation method comprises the following steps: and coating or attaching an insulating layer material to the outside of the heated expansion layer, and selecting the thickness of the insulating layer material to be 200 mu m in consideration of the convenience of operation and the bending deformation degree of the overall final high-energy adhesive product.
The fourth step, selectively attaching a release layer to the outermost layer, wherein in one case, if the insulating layer exists, the release layer is attached to the outer surface of the insulating layer; and if the second layer is not provided with the insulating layer, the release layer is attached to the outer surface of the thermal expansion layer.
And fifthly, connecting the electric lead in the first step with a temperature control device, and finally reserving a connector for connecting alternating current 220 v. Thus obtaining the high-energy glue expanded by electric heating.
The using process is as follows:
and (3) peeling off the release layer, paving the high-energy adhesive at a use position, setting the temperature of the temperature control device to be 150 ℃, connecting 220v alternating current, controlling input power by the temperature control device, converting electric energy into heat energy, and generating volume expansion when the temperature of the system rises to be higher than the starting expansion temperature of the heated expansion layer, so that the space to be used is filled according to actual conditions.
Under the action of alternating current, the conductive heating layer generates a large amount of heat energy and transfers the heat to the outside, the heating speed is high, and the temperature can be heated to 100-200 ℃ within 3-5 seconds. Under the condition of no external space limitation at normal pressure, the expansion layer expands freely, and the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
EXAMPLE 3 preparation of electrically expanded high-energy adhesive
Firstly, preparing a conductive heating layer: the conductive ink comprises the following components in percentage by mass: 40% of carbon microcrystal particles; 26% of conductive metal filler; 30% of epoxy resin; 1% of latent epoxy resin curing agent; 1% of epoxy toughening agent; 1.9 percent of silicon dioxide; 0.1 percent of adhesion promoter. According to a set circuit pattern, the prepared conductive ink resin is printed on the surface of release paper through screen printing, and the thickness range is 0.1 mm; meanwhile, erecting a conductive wire for standby;
then baking and drying to enable the conductive heating layer to be solidified and formed, wherein the baking temperature is 100-;
and secondly, coating a heated expansion layer on the cured conductive heating layer, wherein the material of the layer is an epoxy resin system which is formed by 55 parts of epoxy resin, 15 parts of curing agent, 8 parts of foaming agent, 25 parts of heat conduction additive and 0.5 part of leveling auxiliary agent and can be subjected to thermosetting molding. The hot melting coating temperature is 50-70 ℃, the coating is coated on the conductive heating layer, and when the conductive heating layer is cooled to room temperature, the heated expansion layer is in a semi-solid state; in order to obtain a symmetrical coating structure, the release layer in the first step needs to be peeled off, and then the conductive heating layer is coated with the thermal expansion layer in the same way, so as to obtain a structure of the thermal expansion layer/the conductive heating layer/the thermal expansion layer. The thickness of the coated thermally expanded layer ranged from 200 μm.
The heated expansion layer is a thermosetting composite material, and the expansion starting temperature range is 100-200 ℃; the generated expansion pressure is 0.1-20 MPa; the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
And thirdly, selectively including an insulating layer according to needs, wherein the preparation method comprises the following steps: and coating or attaching an insulating layer material to the outside of the heated expansion layer, and selecting the insulating layer material with the thickness of 500 mu m in consideration of the convenience of operation and the bending deformation degree of the overall final high-energy adhesive product.
The fourth step, selectively attaching a release layer to the outermost layer, wherein in one case, if the insulating layer exists, the release layer is attached to the outer surface of the insulating layer; and if the second layer is not provided with the insulating layer, the release layer is attached to the outer surface of the thermal expansion layer.
And fifthly, connecting the electric lead in the first step with a temperature control device, and finally reserving a connector for connecting alternating current 220 v. Thus obtaining the high-energy glue expanded by electric heating.
The using process is as follows:
and (3) peeling off the release layer, paving the high-energy adhesive at a use position, setting the temperature of the temperature control device to be 150 ℃, connecting 220v alternating current, controlling input power by the temperature control device, converting electric energy into heat energy, and generating volume expansion when the temperature of the system rises to be higher than the starting expansion temperature of the heated expansion layer, so that the space to be used is filled according to actual conditions.
Under the action of alternating current, the conductive heating layer generates a large amount of heat energy and transfers the heat to the outside, the heating speed is high, and the temperature can be heated to 100-200 ℃ within 3-5 seconds. Under the condition of no external space limitation at normal pressure, the expansion layer expands freely, and the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
EXAMPLE 4 preparation of electrically expanded high-energy adhesive
Firstly, preparing a conductive heating layer: the conductive ink comprises the following components in percentage by mass: 38% of carbon microcrystal particles; 22% of conductive metal filler; 20% of epoxy resin; 11% of latent epoxy resin curing agent; 5% of an epoxy toughening agent; 3.3 percent of silicon dioxide; 0.7 percent of adhesion promoter. According to a set circuit pattern, the prepared conductive ink resin is printed on the surface of release paper through screen printing, and the thickness range is 0.1 mm; meanwhile, erecting a conductive wire for standby;
then baking and drying to enable the conductive heating layer to be solidified and formed, wherein the baking temperature is 100-;
and secondly, coating a heated expansion layer on the cured conductive heating layer, wherein the material of the layer is a thermosetting epoxy resin system consisting of 57 parts of epoxy resin, 18 parts of curing agent, 5 parts of foaming agent, 22 parts of heat-conducting additive and 0.8 part of leveling auxiliary agent. The hot melting coating temperature is 50-70 ℃, the coating is coated on the conductive heating layer, and when the conductive heating layer is cooled to room temperature, the heated expansion layer is in a semi-solid state; in order to obtain a symmetrical coating structure, the release layer in the first step needs to be peeled off, and then the conductive heating layer is coated with the thermal expansion layer in the same way, so as to obtain a structure of the thermal expansion layer/the conductive heating layer/the thermal expansion layer. The thickness of the coated thermally expanded layer ranged from 200 μm.
The heated expansion layer is a thermosetting composite material, and the expansion starting temperature range is 100-200 ℃; the generated expansion pressure is 0.1-20 MPa; the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
And thirdly, selectively including an insulating layer according to needs, wherein the preparation method comprises the following steps: and coating or attaching an insulating layer material to the outside of the heated expansion layer, and selecting the insulating layer material with the thickness of 500 mu m in consideration of the convenience of operation and the bending deformation degree of the overall final high-energy adhesive product.
The fourth step, selectively attaching a release layer to the outermost layer, wherein in one case, if the insulating layer exists, the release layer is attached to the outer surface of the insulating layer; and if the second layer is not provided with the insulating layer, the release layer is attached to the outer surface of the thermal expansion layer.
And fifthly, connecting the electric lead in the first step with a temperature control device, and finally reserving a connector for connecting alternating current 220 v. Thus obtaining the high-energy glue expanded by electric heating.
The using process is as follows:
and (3) peeling off the release layer, paving the high-energy adhesive at a use position, setting the temperature of the temperature control device to be 150 ℃, connecting 220v alternating current, controlling input power by the temperature control device, converting electric energy into heat energy, and generating volume expansion when the temperature of the system rises to be higher than the starting expansion temperature of the heated expansion layer, so that the space to be used is filled according to actual conditions.
Under the action of alternating current, the conductive heating layer generates a large amount of heat energy and transfers the heat to the outside, the heating speed is high, and the temperature can be heated to 100-200 ℃ within 3-5 seconds. Under the condition of no external space limitation at normal pressure, the expansion layer expands freely, and the volume ratio of the heated expansion layer before and after expansion is 1-200 times.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (16)
1. The electrically-heated and expanded high-energy adhesive is characterized by comprising a multilayer composite structure formed by a conductive heating layer and a heated expansion layer and a temperature control device, wherein the conductive heating layer contains a conductive wire, and the heated expansion layer is coated outside the conductive heating layer; wherein the temperature control device is positioned inside or outside the multilayer composite structure; the conductive heating layer is prepared by mixing 30-50% of carbon microcrystal particles, 20-40% of conductive metal filler, 1-30% of epoxy resin, 1-15% of latent epoxy resin curing agent, 1-10% of epoxy toughening agent, 1-5% of silicon dioxide and 0.1-1% of adhesion promoter; the conducting wire is connected with an alternating current power supply; the conductive heating layer can be heated to 100-200 ℃ within 3-5 seconds; the outer layer of the thermal expansion layer is coated with an insulating film.
2. The electrically heated expandable high-energy adhesive according to claim 1, wherein the insulating film is one or more of polyimide, polyethylene, polyvinylidene fluoride and polytetrafluoroethylene.
3. The electrically-heated expandable high-energy adhesive as claimed in claim 1, wherein a release layer is attached to the outer layer of the thermally-expanded layer.
4. The electrically heated expandable high-energy adhesive as claimed in claim 3, wherein the release layer is release paper or PET release film.
5. The electrically heated expandable high-energy adhesive as claimed in claim 1, wherein a release layer is attached to the outer layer of the insulating film.
6. The electrically heated expandable high-energy adhesive as claimed in claim 5, wherein the release layer is release paper or PET release film.
7. The electrically heated expandable high-energy adhesive as claimed in any one of claims 1 to 6, wherein the carbon microcrystal particles are graphite powder.
8. The electrically heated expandable high-energy adhesive as claimed in claim 7, wherein the carbon microcrystal particles are graphite powder with the particle size of 1-10 μm.
9. The electrically heated expandable high-energy adhesive as claimed in claim 1, wherein the thermally expandable layer is a thermosetting epoxy resin system.
10. The electrically-heated expandable high-energy adhesive as claimed in claim 1, wherein the expansion temperature of the heated expandable layer is in the range of 100-200 ℃; the expansion pressure is 0.1-20 MPa.
11. The electrically-heated expandable high-energy adhesive as claimed in claim 1, wherein the volume ratio of the thermally-expanded layer before and after expansion is 1-200 times.
12. The electrically heated expandable high-energy adhesive according to claim 1, wherein the temperature control device is embedded in the conductive heating layer or the heated expandable layer or the insulating film.
13. The electrically-heated expandable high-energy adhesive as claimed in claim 1, wherein the conductive wire is made of conductive metal.
14. The electrically expandable high-energy adhesive according to claim 13, wherein the conductive wire is made of copper.
15. The electrically heated expandable high-energy adhesive of claim 1, wherein the conductive wire is connected to a 220V ac power supply.
16. The electrically-heated expandable high-energy adhesive as claimed in claim 1, wherein the conductive wire is externally connected to the temperature control device.
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