CN107778861A - A kind of Embedding Material for improving thin film capacitor moisture resistance and preparation method thereof - Google Patents
A kind of Embedding Material for improving thin film capacitor moisture resistance and preparation method thereof Download PDFInfo
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- CN107778861A CN107778861A CN201711150803.5A CN201711150803A CN107778861A CN 107778861 A CN107778861 A CN 107778861A CN 201711150803 A CN201711150803 A CN 201711150803A CN 107778861 A CN107778861 A CN 107778861A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention belongs to thin film capacitor encapsulating material technical field, and in particular to a kind of Embedding Material for improving thin film capacitor moisture resistance and preparation method thereof, be made up of following raw material：Bimaleimide resin, castor oil EU elastomer, polypropylene random copolymer, potassium titanate crystal whisker, ground slag, Chinese catalpa oil, fumaric acid, assorted fibre, barium stearate, cationic starch, diatomite.By adding assorted fibre in the present invention, and increase freezing step in preparation process, coordinate other raw materials and step, make resulting product mechanical stability stronger, with preferable moisture resistance, make product that there is preferable stability after being used for case potting of film capacitors, metal pole will not be caused to aoxidize under the conditions of hot and humid, so as to ensure the safe handling of circuit, the flexible and preferable restoration of the potting compound, can effectively improve the insulation of thin film capacitor inner member, improve its service life, excellent heat conductivity, fire resistance are preferable.
Description
Technical field
The invention belongs to thin film capacitor encapsulating material technical field, and in particular to one kind improves thin film capacitor moisture resistance
Embedding Material and preparation method thereof.
Background technology
Current thin film capacitor uses epoxy resin more, but the working environment of part thin film capacitor is moister,
The phenomenon of the metal pole oxidation of galvanized sheet often occurs, is likely to result in the improper decay of capacitor or even occurs what is opened a way
Situation, cause capacitor can not normal work, in order to overcome such case, it is necessary to further be studied for Embedding Material.
The content of the invention
The purpose of the present invention is to be directed to the problem of existing, there is provided a kind of Embedding Material for improving thin film capacitor moisture resistance
And preparation method thereof.
The present invention is achieved by the following technical solutions：A kind of Embedding Material for improving thin film capacitor moisture resistance, by
The raw material of following parts by weight is made：Bimaleimide resin 22-26 parts, castor oil EU elastomer 16-20 parts,
Polypropylene random copolymer 8-14 parts, potassium titanate crystal whisker 3-7 parts, ground slag 2-4 parts, Chinese catalpa oil 0.4-0.8 parts, fumaric acid 0.1-
0.2 part, assorted fibre 6-10 parts, barium stearate 0.3-0.5 parts, cationic starch 1-2 parts, diatomite 2-4 parts；
Wherein, the preparation method of the assorted fibre comprises the following steps：
（1）Raw material prepares：By weight, 4 parts of POLYPROPYLENE GLYCOL fiber, a diameter of 6-8 μm, length is 600-800 μm；Polypropylene
6 parts of nitrile fiber, a diameter of 10-12 μm, length is 400-600 μm；10 parts of ceramic fibre, a diameter of 2-4 μm, length 1-2mm；
6 parts, a diameter of 60-80nm of ferrite nano fiber, length are 200-300 μm；35 parts of sulfuric acid aluminum fiber, a diameter of 8-10 μm,
Length is 700-800 μm；
（2）Mixing：Above-mentioned raw materials are blended in water of 2 times equivalent to its gross weight, 55-60 DEG C are heated to, in 25-28MHz
Pressure under stir 18-24 minutes, filtering, under conditions of 400 DEG C heat 8-12 minutes, it is standby to obtain compound；
（3）Prepare：By compound and the Hydroxylated acrylic resin melting mixing equivalent to its weight half, it is put into after cooling and shaping
It is calcined, produces in 950 DEG C of reductant.
As further improvement of these options, the phenol content in the Chinese catalpa oil is 38-46%.
A kind of preparation method for the Embedding Material for improving thin film capacitor moisture resistance, comprises the following steps：
（1）Bimaleimide resin, castor oil EU elastomer, polypropylene random copolymer heating are melted,
75-80 DEG C is maintained the temperature at, adds potassium titanate crystal whisker and assorted fibre, low whipping speed is 200-240 revs/min of condition
Under, stir 15-20 minutes；
（2）Keeping temperature is 45-50 DEG C, in step（1）Ground slag, barium stearate, cation is added in gained compound to form sediment
Powder and diatomite, under conditions of low whipping speed is 1800-2000 revs/min, stir 4-6 minutes；
（3）By step（2）Middle gained compound is put into freezing equipment after being cooled to room temperature, and it is small that 8 are placed at a temperature of -3 DEG C
When；
（4）Surplus stock is added after compound after above-mentioned freezing is put to normal temperature, when being gradually heated to 220-240 DEG C, is kept
20 minutes；
（5）By above-mentioned slurry under 25MPa pressure effect, it is put into hot melt extruded in hot flow path co-extruding mould and is molded.
The present invention has advantages below compared with prior art：By adding assorted fibre in the present invention, and in preparation process
Middle increase freezing step, coordinates other raw materials and step, makes resulting product mechanical stability stronger, has preferable moisture resistance,
Make product that there is preferable stability after being used for case potting of film capacitors, metal pole oxygen will not be caused under the conditions of hot and humid
Change, so as to ensure the safe handling of circuit, the flexible and preferable restoration of the potting compound, thin film capacitor can be effectively improved
The insulation of inner member, improves its service life, excellent heat conductivity, and fire resistance can reach UL-94, V-0 levels.
Embodiment
Embodiment 1
A kind of Embedding Material for improving thin film capacitor moisture resistance, is made up of the raw material of following parts by weight：BMI tree
22 parts of fat, 20 parts of castor oil EU elastomer, 8 parts of polypropylene random copolymer, 7 parts of potassium titanate crystal whisker, levigate ore deposit
2 parts of slag, 0.8 part of Chinese catalpa oil, 0.1 part of fumaric acid, 10 parts of assorted fibre, 0.5 part of barium stearate, 2 parts of cationic starch, diatomite 3
Part；
Wherein, the preparation method of the assorted fibre comprises the following steps：
（1）Raw material prepares：By weight, 4 parts of POLYPROPYLENE GLYCOL fiber, a diameter of 6-8 μm, length is 600-800 μm；Polypropylene
6 parts of nitrile fiber, a diameter of 10-12 μm, length is 400-600 μm；10 parts of ceramic fibre, a diameter of 2-4 μm, length 1-2mm；
6 parts, a diameter of 60-80nm of ferrite nano fiber, length are 200-300 μm；35 parts of sulfuric acid aluminum fiber, a diameter of 8-10 μm,
Length is 700-800 μm；
（2）Mixing：Above-mentioned raw materials are blended in water of 2 times equivalent to its gross weight, 55-60 DEG C are heated to, in 25-28MHz
Pressure under stir 18-24 minutes, filtering, under conditions of 400 DEG C heat 8-12 minutes, it is standby to obtain compound；
（3）Prepare：By compound and the Hydroxylated acrylic resin melting mixing equivalent to its weight half, it is put into after cooling and shaping
It is calcined, produces in 950 DEG C of reductant.
As further improvement of these options, the phenol content in the Chinese catalpa oil is 38-46%.
A kind of preparation method for the Embedding Material for improving thin film capacitor moisture resistance, comprises the following steps：
（1）Bimaleimide resin, castor oil EU elastomer, polypropylene random copolymer heating are melted,
75-80 DEG C is maintained the temperature at, adds potassium titanate crystal whisker and assorted fibre, low whipping speed is 200-240 revs/min of condition
Under, stir 15-20 minutes；
（2）Keeping temperature is 45-50 DEG C, in step（1）Ground slag, barium stearate, cation is added in gained compound to form sediment
Powder and diatomite, under conditions of low whipping speed is 1800-2000 revs/min, stir 4-6 minutes；
（3）By step（2）Middle gained compound is put into freezing equipment after being cooled to room temperature, and it is small that 8 are placed at a temperature of -3 DEG C
When；
（4）Surplus stock is added after compound after above-mentioned freezing is put to normal temperature, when being gradually heated to 220-240 DEG C, is kept
20 minutes；
（5）By above-mentioned slurry under 25MPa pressure effect, it is put into hot melt extruded in hot flow path co-extruding mould and is molded.
Embodiment 2
A kind of Embedding Material for improving thin film capacitor moisture resistance, is made up of the raw material of following parts by weight：BMI tree
26 parts of fat, 16 parts of castor oil EU elastomer, 14 parts of polypropylene random copolymer, 3 parts of potassium titanate crystal whisker, levigate ore deposit
3 parts of slag, 0.8 part of Chinese catalpa oil, 0.1 part of fumaric acid, 6 parts of assorted fibre, 0.5 part of barium stearate, 1 part of cationic starch, diatomite 4
Part；
Remaining step is in the same manner as in Example 1.
Embodiment 3
A kind of Embedding Material for improving thin film capacitor moisture resistance, is made up of the raw material of following parts by weight：BMI tree
24 parts of fat, 18 parts of castor oil EU elastomer, 12 parts of polypropylene random copolymer, 5 parts of potassium titanate crystal whisker, levigate ore deposit
3 parts of slag, 0.6 part of Chinese catalpa oil, 0.2 part of fumaric acid, 8 parts of assorted fibre, 0.4 part of barium stearate, 2 parts of cationic starch, diatomite 3
Part；
Remaining step is in the same manner as in Example 1.
To Embedding Material in the present invention and the common potting compound conduct pair made of polyethers inserts and modified isocyanate
Performance comparision is carried out according to group, draws following result：
Table 1
| Project | Embodiment 1 | Embodiment 2 | Embodiment 3 | Control group |
| Tensile strength（MPa） | 74 | 78 | 75 | 62 |
| Bending strength（MPa） | 116 | 118 | 110 | 75 |
| Notch impact toughness（KJ/㎡） | 84 | 83 | 86 | 37 |
| Water absorption rate（%） | 0.17 | 0.09 | 0.19 | 0.94 |
| Heat distortion temperature（℃） | 156 | 154 | 155 | 97 |
| Glass transition temperature（℃） | 153 | 153 | 153 | 120 |
| Brittle temperature（℃） | -118 | -125 | -122 | -47 |
The Embedding Material by being prepared in the present invention is can be seen that by data in table 1, there is stronger water-resistance, so as in tide
In use, it is possible to prevente effectively from the oxidation of metal pole, makes the property retention of capacitor stable in the rugged environments such as wet, high temperature.
Claims (3)
1. a kind of Embedding Material for improving thin film capacitor moisture resistance, it is characterised in that be made up of the raw material of following parts by weight：It is double
Maleimide resin 22-26 parts, castor oil EU elastomer 16-20 parts, polypropylene random copolymer 8-14 parts,
It is potassium titanate crystal whisker 3-7 parts, ground slag 2-4 parts, Chinese catalpa oil 0.4-0.8 parts, fumaric acid 0.1-0.2 parts, assorted fibre 6-10 parts, hard
Resin acid barium 0.3-0.5 parts, cationic starch 1-2 parts, diatomite 2-4 parts；
Wherein, the preparation method of the assorted fibre comprises the following steps：
（1）Raw material prepares：By weight, 4 parts of POLYPROPYLENE GLYCOL fiber, a diameter of 6-8 μm, length is 600-800 μm；Polypropylene
6 parts of nitrile fiber, a diameter of 10-12 μm, length is 400-600 μm；10 parts of ceramic fibre, a diameter of 2-4 μm, length 1-2mm；
6 parts, a diameter of 60-80nm of ferrite nano fiber, length are 200-300 μm；35 parts of sulfuric acid aluminum fiber, a diameter of 8-10 μm,
Length is 700-800 μm；
（2）Mixing：Above-mentioned raw materials are blended in water of 2 times equivalent to its gross weight, 55-60 DEG C are heated to, in 25-28MHz
Pressure under stir 18-24 minutes, filtering, under conditions of 400 DEG C heat 8-12 minutes, it is standby to obtain compound；
（3）Prepare：By compound and the Hydroxylated acrylic resin melting mixing equivalent to its weight half, it is put into after cooling and shaping
It is calcined, produces in 950 DEG C of reductant.
2. a kind of Embedding Material for improving thin film capacitor moisture resistance as claimed in claim 1, it is characterised in that in the Chinese catalpa oil
Phenol content be 38-46%.
A kind of 3. preparation method for the Embedding Material for improving thin film capacitor moisture resistance as claimed in claim 1, it is characterised in that
Comprise the following steps：
（1）Bimaleimide resin, castor oil EU elastomer, polypropylene random copolymer heating are melted,
75-80 DEG C is maintained the temperature at, adds potassium titanate crystal whisker and assorted fibre, low whipping speed is 200-240 revs/min of condition
Under, stir 15-20 minutes；
（2）Keeping temperature is 45-50 DEG C, in step（1）Ground slag, barium stearate, cation is added in gained compound to form sediment
Powder and diatomite, under conditions of low whipping speed is 1800-2000 revs/min, stir 4-6 minutes；
（3）By step（2）Middle gained compound is put into freezing equipment after being cooled to room temperature, and it is small that 8 are placed at a temperature of -3 DEG C
When；
（4）Surplus stock is added after compound after above-mentioned freezing is put to normal temperature, when being gradually heated to 220-240 DEG C, is kept
20 minutes；
（5）By above-mentioned slurry under 25MPa pressure effect, it is put into hot melt extruded in hot flow path co-extruding mould and is molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711150803.5A CN107778861A (en) | 2017-11-18 | 2017-11-18 | A kind of Embedding Material for improving thin film capacitor moisture resistance and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711150803.5A CN107778861A (en) | 2017-11-18 | 2017-11-18 | A kind of Embedding Material for improving thin film capacitor moisture resistance and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN107778861A true CN107778861A (en) | 2018-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711150803.5A Pending CN107778861A (en) | 2017-11-18 | 2017-11-18 | A kind of Embedding Material for improving thin film capacitor moisture resistance and preparation method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104292750A (en) * | 2014-09-24 | 2015-01-21 | 铜陵市新泰电容电器有限责任公司 | IGBT absorption protection capacitor epoxy resin potting agent |
| CN106543746A (en) * | 2016-10-26 | 2017-03-29 | 安徽飞达电气科技有限公司 | A kind of high-performance metal membrane capacitance Embedding Material |
-
2017
- 2017-11-18 CN CN201711150803.5A patent/CN107778861A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104292750A (en) * | 2014-09-24 | 2015-01-21 | 铜陵市新泰电容电器有限责任公司 | IGBT absorption protection capacitor epoxy resin potting agent |
| CN106543746A (en) * | 2016-10-26 | 2017-03-29 | 安徽飞达电气科技有限公司 | A kind of high-performance metal membrane capacitance Embedding Material |
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Application publication date: 20180309 |
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