CN107775960A - A kind of micro-fluidic chip bonding method and micro-fluidic chip - Google Patents
A kind of micro-fluidic chip bonding method and micro-fluidic chip Download PDFInfo
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- CN107775960A CN107775960A CN201710888052.0A CN201710888052A CN107775960A CN 107775960 A CN107775960 A CN 107775960A CN 201710888052 A CN201710888052 A CN 201710888052A CN 107775960 A CN107775960 A CN 107775960A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000002390 adhesive tape Substances 0.000 claims abstract description 49
- 238000007731 hot pressing Methods 0.000 claims abstract description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 238000012360 testing method Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 9
- 238000004026 adhesive bonding Methods 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920005479 Lucite® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0887—Laminated structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/12—Specific details about materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
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Abstract
The present invention relates to bioscience micro-total analysis system technical field, specifically a kind of micro-fluidic chip bonding method and micro-fluidic chip.Method includes：A kind of micro-fluidic chip substrate is provided, the substrate upper surface is provided with MCA；Ultrasonic bond energy-oriented-ridge is set at surface MCA surrounding edge on the substrate or setting ultrasonic bond energy-oriented-ridge around the substrate surface MCA position is corresponded on cover plate；The adhesion surface sticking two-faced adhesive tape on the substrate or cover plate, the cover plate and the substrate are bonded；Ultrasonic bond is carried out to the substrate and the cover plate, is allowed to that first step bonding occurs；Pressure fixing or hot pressing are implemented to the chip, make the substrate of sticking double faced adhesive tape and the cover plate secure bond.The present invention can both ensure the stability of micro-fluidic chip bonding, can avoid influenceing the physicochemical properties of micro-fluidic chip in itself again, thus without interference with testing result.
Description
Technical field
The present invention relates to bioscience micro-total analysis system technical field, specifically a kind of micro-fluidic chip bonding side
Method and micro-fluidic chip.
Background technology
The bonding link of micro-fluidic chip is one of key link prepared by micro-fluidic chip, and the quality of bonding quality is directly
Influence the practical application of micro-fluidic chip.The subject matter that micro-fluidic chip bonding link should be noted at present includes：
1. require that chip can realize connection, and microchannel has sealing, has enough mechanical strengths after bonding, keeps away
Exempt from cracking and leakage.
2. microchannel is avoided to deform, block in bonding process or otherwise affected.
3. when being bonded using organic matter, it is necessary to avoid Surface Physical Chemistry performance from changing.
At present it is known that polymeric micro-fluidic chip bonding techniques include thermocompression bonding, solvent bonding, glue bonding, laser
Or ultrasonic bond.Wherein thermocompression bonding is less efficient, less use in business.Solvent bonding easily causes physical surface physics and chemistry
Matter changes, to being not appropriate for applied to biomedicine field.Glue, which is bonded between substrate and cover plate, introduces bonding agent or double faced adhesive tape
Realize the connection of device up and down.Although this method has that simple to operate, cost is low, bond strength is high etc. a little, simultaneously there is also
Easily causing glue to penetrate into passage causes the distinct disadvantage such as channel blockage or double faced adhesive tape non-specific adsorption sample or label.
Ultrasonic bonding techniques are the heat energy for supersonic frequency being converted into more than 20KHz mechanical vibrational energy device to be welded, make device
The link of weldment is realized after contact melt surface.Ultrasonic bonding techniques are simple to operate, and stability is stronger, but will to bonding wire
Ask higher, bonding wire, which is uneven, may result in the point of rosin joint and easily occur leakage, and the point of rosin joint can not be checked and.Swash
Light bonding is required using the material for absorbing laser, is produced heat in bonded interface by laser, is made under the melted by heating state of interface
Reach connection purpose, this method environmental protection, bonding precision are high, but implementation process is more complicated, it is necessary to special material or special
Preparation method, cost are of a relatively high.
China Patent No. 1480724 is by the use of infrared laser as thermal source thermal bonding plastic microfluidic chip, in irradiation process
In by warming interface produce partial melting reach bonding；China Patent No. 1588669, which describes, utilizes semiconductor thermoelectric refrigeration
The method of heater heat bonding polymeric micro-fluidic chip；China Patent No. 1740788 proposes to be modified by the surface of plastics,
In the specific chemical functional group of substrate surface chemical graft, and then pass through the bonding method of functional group reactionses formation chemical bond；In
State's patent No. 101088912 passes through polymer micro-structural and the sophisticated design of energy-oriented-ridge so that ultrasonic bonding plastic micro-fluidic
Chip is possibly realized.
However, most of the above bonding or method for packing may cause chip micro-structural to produce certain deformation, or residual
There is a certain amount of unreacted chemical reagent, bond strength is relatively low.In other words, at present still without a kind of micro-fluidic chip bonding side
Method bonding method not only can accurate carrying out firm packaging plastic microfluidic chip micro-structural, and the final micro-structural of chip is not produced
Raw influence physically or chemically.
The content of the invention
The technical problem to be solved in the present invention is, can not be both firm for the bonding method of micro-fluidic chip in the prior art
The defects of sealing fills micro-fluidic chip, and micro-structural not final to plastic microfluidic chip produces influence physically or chemically,
A kind of bonding method and micro-fluidic chip of new micro-fluidic chip are provided, the bonding method is by being used in combination supersonic bonding
The method being bonded with adhesive tape, the substrate of micro-fluidic chip and cover plate are combined to form to the MCA of firm closure, key
Close intensity height and micro-structural deformation extent is low.
To achieve the above object, the present invention uses following technical scheme：
A kind of micro-fluidic chip bonding method, for substrate of the surface with MCA and cover plate to be bonded in into one
Rise, form the micro-fluidic chip with default cavity structure, including：
Step 1, there is provided a kind of micro-fluidic chip substrate, the substrate upper surface are provided with MCA；
Step 2, ultrasonic bond energy-oriented-ridge is set at the MCA surrounding edge or on cover plate described in correspondence
Ultrasonic bond energy-oriented-ridge is set around substrate surface MCA position；
Step 3, the adhesion surface sticking two-faced adhesive tape on the substrate or cover plate, the cover plate and the substrate are bonded；
Step 4, ultrasonic bond is carried out to the substrate and the cover plate, is allowed to that first step bonding occurs；
Step 5, pressure fixing or hot pressing are implemented to the chip, makes the substrate and the cover plate jail of sticking double faced adhesive tape
Gu bonding.
Preferably, the ultrasonic bond energy-oriented-ridge width and thickness are 100 μm of -2mm.
Preferably, the energy-oriented-ridge can not be tied directly with the MCA EDGE CONTACT apart from the microchannel
100 μm of structure edge -2mm.
Preferably, the double faced adhesive tape can not be tied directly with the MCA EDGE CONTACT apart from the microchannel
10 μm -500 μm of structure edge.
Preferably, also include step before step 3：1 is picked with cloth：1 ethanol and the mixed liquor of water carry out surface and wiped
Cleaning, after being completely dried after surface, by the double faced adhesive tape adhesive tape gluing in the substrate or the adhesion surface of the cover plate.
Preferably, the double faced adhesive tape uses high-performance double faced adhesive tape, its thickness is 100 μm of -2mm.
A kind of micro-fluidic chip, including substrate and cover plate, MCA is previously provided with the substrate, and in substrate institute
State on MCA surrounding edge or cover plate corresponds to and ultrasonic bond energy-oriented-ridge is provided with around MCA, by substrate and cover plate
It is bonded using above-mentioned bonding method.
Preferably, the material selection PMMA of the substrate and the cover plate COC PC the material such as PS.
Preferably, the MCA comprises at least microchannel, the height and width of the microchannel are respectively in 5 μ
m-5mm。
Beneficial effect is：It is rational in infrastructure the invention provides a kind of micro-fluidic chip bonding method and micro-fluidic chip,
Bonding effect is obvious, and the phenomenon of leakage will not also be caused by rosin joint occur even if indivedual micro-fluidic chip ultrasonic bonding, and double faced adhesive tape is not
Directly and in passage liquid contacts, and will not form nonspecific adhesion in channel edge, this method can both ensure micro-fluidic
The stability of chip bonding, it can avoid influenceing the physicochemical properties of micro-fluidic chip in itself again, thus without interference with detection
As a result.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The required accompanying drawing used is briefly described in embodiment or description of the prior art.In all of the figs, similar element
Or part is typically identified by similar reference.In accompanying drawing, each element or part might not be drawn according to the ratio of reality.
Fig. 1 is a kind of microfluidic chip structure schematic diagram of the present invention.
Reference
Wherein 1 is MCA, and 2 be supersonic bonding energy-oriented-ridge, and 3 be double faced adhesive tape, and 4 be substrate.
Embodiment
Below by drawings and examples, the present invention is further detailed, it should be appreciated that these embodiments
It is only used for being described in more detail and is used, and should not be construed as limiting the present invention to any form, that is, is not intended to limitation originally
The protection domain of invention.
Embodiment
A kind of micro-fluidic chip bonding method, for substrate 4 of the surface with MCA 1 and cover plate to be bonded in into one
Rise, form the micro-fluidic chip with default cavity structure, including：
Step 1, there is provided a kind of micro-fluidic chip substrate 4, the upper surface of substrate 4 are provided with MCA 1；
Step 2, supersonic bonding energy-oriented-ridge 2, institute are set at the surrounding edge of 4 upper surface MCA of substrate 1
It is 100-500 μm to state the width of supersonic bonding energy-oriented-ridge 2 and thickness, more optimally, from 200 μm；The ultrasonic wave key
Close energy-oriented-ridge 2 can not directly with the EDGE CONTACT of MCA 1, apart from 100 μm of 1 edge of the MCA -2mm,
More optimally, from 200 μm；
Step 3, in the upper surface sticking two-faced adhesive tape 3 of substrate 4, the cover plate and the substrate 4 are bonded, the substrate
4 or the adhesion surface of the cover plate must be cleaned and dried, general recommendations picks 1 with cloth：1 ethanol and the mixed liquor of water
Carry out surface and wipe cleaning, after being completely dried after surface, by the two-sided 3 glue adhesive tape gluing in the substrate 4 or the lid
The adhesion surface of piece, the double faced adhesive tape 3 can not directly with the EDGE CONTACT of MCA 1, apart from the substrate passageway knot
10 μm -500 μm of 1 edge of structure, more optimally, from 100 μm, the double faced adhesive tape 3 is excellent using high-performance double faced adhesive tape, the present embodiment
3M double faced adhesive tapes are selected, its thickness is 100-200 μm, more optimally, from 100 μm；
Step 4, ultrasonic bond is carried out to the substrate 4 and the cover plate, is allowed to that first step bonding occurs, ultrasonic bond is adopted
Control mode is temporal mode, time precision 0.01s, and retention time 100-2000ms, more optimally, is selected
1000ms, ultrasonic wave range typically use 20-40kHz working frequency, more optimally, from 20kHz, what ultrasonic wave occurred
Power is between 0.1-4kW, more optimally, from 1kW；
Step 5, pressure fixing or hot pressing are implemented to the chip, makes the substrate 4 and the cover plate that double faced adhesive tape 3 is pasted
Secure bond, implement pressure fixing or hot pressing, application pressure limit is 0-100kgf, more optimally, from 100kgf, hot pressing
During the maximum temperature scope of instantaneous (being no more than 3 seconds) be 95-200 DEG C, more optimally, from 150 DEG C.
200 micro-fluidic chips being bonded with the bonding method are taken to be detected, from leakage rate, sample detection accuracy rate etc.
Aspect is detected, and measures result：Leakage rate<5%, sample sticks rate<5%, Detection accuracy>95%, substrate table is not influenceed
Surface properties, bond strength 5.9-8.2Mpa.
As shown in figure 1, a kind of micro-fluidic chip, including substrate 4 and cover plate, the material choosing of the substrate 4 and the cover plate
With PMMA COC PC the material such as PS, more optimally, from PMMA materials, i.e. lucite, be previously provided with the substrate 4
MCA 1, the MCA 1 comprise at least microchannel, micro-valve, micro- fluid reservoir, the height and width of the microchannel
Degree is provided with ultrasonic bond energy-oriented-ridge 2 respectively at 200 μm on the surrounding edge of MCA 1, and the ultrasonic bond is led
The energy width of muscle 2 and thickness are 200 μm, right in the upper surface of substrate 4 or the lower surface sticking two-faced adhesive tape 3 of the cover plate
The adhesion surface of the substrate 4 or the cover plate is cleaned and dried, and 1 is picked with cloth：1 ethanol and the mixed liquor of water are carried out
Surface wipes cleaning, after being completely dried after surface, by the double faced adhesive tape adhesive tape gluing in the viscous of the substrate or the cover plate
Surface, the double faced adhesive tape 3 can not directly with the EDGE CONTACT of MCA 1, apart from the edge of MCA 1
100 μm, the double faced adhesive tape 3 using 3M double faced adhesive tape, select 100 μm, the cover plate and the substrate 4 bonded, right by its thickness
The substrate 4 and the cover plate carry out ultrasonic bond, are allowed to occur first step bonding, the control mode that ultrasonic bond uses for when
Between pattern, time precision 0.01s, ultrasonic wave uses 20kHz working frequency, and the power that ultrasonic wave occurs is 1kW, and is kept
Time 1000ms, pressure fixing then is implemented to the chip again, make the substrate 4 and cover plate jail that double faced adhesive tape 3 is pasted
Gu bonding, the pressure of application is 100kgf, and the micro-fluidic chip is obtained after standing a period of time.
Comparative example 1
A kind of micro-fluidic chip of structure identical as described in above-mentioned embodiment and material, including substrate 4 and cover plate, institute are provided
State the upper surface of substrate 4 and be provided with MCA 1, ultrasonic bond energy-oriented-ridge 2, institute are set in the surrounding edge of MCA 1
It is 200 μm to state the width of ultrasonic bond energy-oriented-ridge 2 and thickness, and distance of the energy-oriented-ridge apart from microchannel is 200 μm, by the substrate
4 carry out ultrasonic bond with the cover plate, and ultrasonic wave uses 20kHz working frequency, and the power that ultrasonic wave occurs is 1kW, and is protected
Time 1000ms is held, bonding terminates static cooling and obtains bonding completion micro-fluidic chip.
200 micro-fluidic chips being bonded with the bonding method are taken to be detected, from leakage rate, sample detection accuracy rate etc.
Aspect is detected, and measures result：Leakage rate ≈ 20%~37%, sample sticks rate<5%, Detection accuracy>95%, not shadow
Substrate surface property is rung, bond strength 2.5-4.8Mpa, has small part because ultrasonic bonding rosin joint occurs and causes leakage feelings
Condition.
Comparative example 2
A kind of micro-fluidic chip of structure identical as described in above-mentioned embodiment and material, including substrate 4 and cover plate, institute are provided
State the upper surface of substrate 4 and be provided with MCA 1, to described before the upper surface sticking two-faced adhesive tape 3 of substrate 4, sticking two-faced adhesive tape 3
The adhesion surface of substrate 4 is cleaned and dried, and 1 is picked with cloth：1 ethanol and the mixed liquor of water carry out surface and wipe cleaning, treat table
After face is completely dried, the double faced adhesive tape adhesive tape gluing is used into 3M double faced adhesive tape in the substrate adhesion surface, the double faced adhesive tape,
Its thickness selects 100 μm, is bonded with the cover plate and the substrate 4, implements pressure fixing to the chip, makes double faced adhesive tape 3 viscous
The substrate 4 and the cover plate secure bond of patch, the pressure of application is 100kgf, and the miniflow is obtained after standing one end time
Control chip.
200 micro-fluidic chips being bonded with the bonding method are taken to be detected, from leakage rate, sample detection accuracy rate etc.
Aspect is detected, and measures result：Leakage rate<10%, sample sticks rate ≈ 27%, Detection accuracy ≈ 78%, does not influence base
Piece surface nature, bond strength 1.5-2.7Mpa, there is small part to appear in channel edge and form nonspecific adhesion.
Comparative example 3
A kind of micro-fluidic chip of structure identical as described in above-mentioned embodiment and material, including substrate 4 and cover plate, institute are provided
State the upper surface of substrate 4 and be provided with MCA 1, ultrasonic bond energy-oriented-ridge 2, institute are set in the surrounding edge of MCA 1
It is 200 μm to state the width of ultrasonic bond energy-oriented-ridge 2 and thickness, and distance of the energy-oriented-ridge apart from microchannel is 200 μm.In the substrate
4 upper surface sticking two-faced adhesive tapes 3, the adhesion surface of substrate 4 is cleaned and dried before sticking two-faced adhesive tape 3,1 is picked with cloth：1
The mixed liquor of ethanol and water carries out surface and wipes cleaning, after being completely dried after surface, by the double faced adhesive tape adhesive tape gluing in described
Substrate adhesion surface, the double faced adhesive tape use 3M double faced adhesive tape, and its thickness selects 100 μm, the cover plate and the substrate 4 are glued
Close.
The substrate 4 and the cover plate are subjected to ultrasonic bond, ultrasonic wave uses 20kHz working frequency, ultrasonic wave hair
Raw power is 1kW, and retention time 1000ms, ultrasonic bond implement pressure fixing to the chip after terminating, make double faced adhesive tape 3
The substrate 4 and the cover plate secure bond pasted, the pressure of application is 100kgf, and bonding terminates static cooling and is bonded
Complete micro-fluidic chip.
200 micro-fluidic chips being bonded with the bonding method are taken to be detected, from leakage rate, sample detection accuracy rate etc.
Aspect is detected, and measures result：Leakage rate<5%, sample sticks rate<5%, Detection accuracy>95%, substrate table is not influenceed
Surface properties, bond strength 5.9-8.2Mpa, chipless leakage, channel edge, which is also not observed, what nonspecific signals adsorbed
Situation.
Pass through above-described embodiment and comparative example, it can be deduced that：A kind of micro-fluidic chip bonding method of the present invention and micro-fluidic
Chip, rational in infrastructure, bonding effect is obvious, and leakage will not also be caused by rosin joint occur even if indivedual micro-fluidic chip ultrasonic bonding
Phenomenon, double faced adhesive tape is not direct to be contacted with liquid in passage, will not form nonspecific adhesion in channel edge, this method both may be used
To ensure the stability of micro-fluidic chip bonding, can avoid influenceing the physicochemical properties of micro-fluidic chip in itself again, thus
Without interference with testing result, and advantage is more obvious.
Although the foregoing describing the embodiment of the present invention, it will be appreciated by those of skill in the art that these
It is merely illustrative of, protection scope of the present invention is defined by the appended claims.Those skilled in the art is not carrying on the back
On the premise of principle and essence from the present invention, various changes or modifications can be made to these embodiments, but these are changed
Protection scope of the present invention is each fallen within modification.
Claims (9)
- A kind of 1. micro-fluidic chip bonding method, it is characterised in that including：Step 1, there is provided a kind of micro-fluidic chip substrate, the substrate upper surface are provided with MCA；Step 2, ultrasonic bond energy-oriented-ridge is set at the MCA surrounding edge or the substrate is corresponded on cover plate Ultrasonic bond energy-oriented-ridge is set around the MCA position of surface；Step 3, the adhesion surface sticking two-faced adhesive tape on the substrate or cover plate, the cover plate and the substrate are bonded；Step 4, ultrasonic bond is carried out to the substrate and the cover plate, is allowed to that first step bonding occurs；Step 5, pressure fixing or hot pressing are implemented to the chip, makes the substrate and the firm key of the cover plate of sticking double faced adhesive tape Close.
- A kind of 2. micro-fluidic chip bonding method according to claim 1, it is characterised in that：The ultrasonic bond energy-oriented-ridge Width and thickness are 100 μm of -2mm.
- A kind of 3. micro-fluidic chip bonding method according to claim 1, it is characterised in that：The energy-oriented-ridge can not be direct With the MCA EDGE CONTACT, apart from described 100 μm of -2mm in MCA edge.
- A kind of 4. micro-fluidic chip bonding method according to claim 1, it is characterised in that：The double faced adhesive tape can not be direct With the MCA EDGE CONTACT, 10 μm -500 μm of the energy-oriented-ridge apart from the MCA edge.
- A kind of 5. micro-fluidic chip bonding method according to claim 1, it is characterised in that：Also include step before step 3： 1 is picked with cloth：1 ethanol and the mixed liquor of water carry out surface and wipe cleaning, after being completely dried after surface, by the double faced adhesive tape glue Band fits in the substrate adhesion surface.
- A kind of 6. micro-fluidic chip bonding method according to claim 1, it is characterised in that：The double faced adhesive tape uses high property Energy double faced adhesive tape, its thickness is 100 μm of -1mm.
- 7. a kind of micro-fluidic chip, including substrate and cover plate, it is characterised in that：MCA is previously provided with the substrate, And it is passage knot that ultrasonic bond energy-oriented-ridge is provided with the MCA surrounding edge or substrate surface is corresponded on cover plate Ultrasonic bond energy-oriented-ridge is set around structure position, and the substrate is with cover plate using the method key described in claim any one of 1-6 Close.
- A kind of 8. micro-fluidic chip according to claim 7, it is characterised in that：The material of the substrate and the cover plate selects With PMMA COC PC the material such as PS.
- A kind of 9. micro-fluidic chip according to claim 7, it is characterised in that：The MCA comprises at least micro- logical Road, the height and width of the microchannel are respectively in 5 μm of -5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710888052.0A CN107775960B (en) | 2017-09-27 | 2017-09-27 | Microfluidic chip bonding method and microfluidic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710888052.0A CN107775960B (en) | 2017-09-27 | 2017-09-27 | Microfluidic chip bonding method and microfluidic chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107775960A true CN107775960A (en) | 2018-03-09 |
| CN107775960B CN107775960B (en) | 2020-08-11 |
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| CN118059974A (en) * | 2024-04-22 | 2024-05-24 | 中南大学 | Microfluidic chip collaborative thermocompression bonding regulation and control method |
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Denomination of invention: A bonding method for microfluidic chips and microfluidic chips Granted publication date: 20200811 Pledgee: Chengdu Bank Co.,Ltd. Shawan Branch Pledgor: CHENGDU WEIKANG BIOTECHNOLOGY CO.,LTD. Registration number: Y2024980013523 |
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