CN107770971B - Paster conductive gasket, circuit board and mobile terminal - Google Patents
Paster conductive gasket, circuit board and mobile terminal Download PDFInfo
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- CN107770971B CN107770971B CN201710772335.9A CN201710772335A CN107770971B CN 107770971 B CN107770971 B CN 107770971B CN 201710772335 A CN201710772335 A CN 201710772335A CN 107770971 B CN107770971 B CN 107770971B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
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- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses a patch conductive gasket, a circuit mainboard and a mobile terminal, which optimizes the conductive performance of a conductive area of the circuit mainboard of the mobile terminal by providing the patch conductive gasket suitable for being installed in a narrow space, the patch conductive gasket comprises a gasket body and at least two point connecting units, a matching connecting part matched with the point connecting units is also arranged on the gasket body, the electric connecting units are fixed on the matching connecting part to be integrally formed, the electric connecting units are outwards protruded along the surface of the gasket body during assembly, the contact performance of the patch conductive gasket and other parts can be realized through the outwards protruded design, the patch conductive gasket can completely solve the problem that the patch conductive gasket is easy to fall off when the elasticity is insufficient, the damage of the patch conductive gasket to a gold foil layer on the conductive area is reduced, and the stability of bolt tightening torque during repeated disassembly and maintenance is improved, thereby improving the contact performance and the conductivity of the circuit main board.
Description
Technical Field
The invention relates to the field of mobile terminals, in particular to a patch conductive gasket, a circuit board and a mobile terminal.
Background
With the rapid development of mobile phone terminals, appearance setting and function high quality are more and more intense, and the introduction of front and back double cameras and the like in this year becomes necessary hardware configuration and functions of various manufacturers, the ultra-thin body cleaning design, the output of large volume, the use of double cameras and the use of high-capacity batteries, which leads to the more and more difficult layout space of the PCB single board, and under the premise of compact layout, the existing solutions mostly adopt the following two modes: one is to process a small elastic sheet and weld the elastic sheet on a corresponding conductive bonding pad, but the required elastic sheet structure of the method is complex, the requirement on the elastic structure of the elastic sheet is very high, the elastic sheet with low elasticity can cause poor contact, thus influencing the conduction, and the elastic sheet structure is very difficult to process; the other method is that a through hole is drilled on a PCB single plate, a gold foil layer is coated on the through hole, and then the PCB single plate is screwed on a conductive boss of the mobile phone shell through a screw, but the method can not be used repeatedly, and the gold foil layer on the through hole is abraded by the screw in the process of repeated screwing to cause poor contact, so that the conductive performance is further influenced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the conductive gasket structure is complicated on current circuit mainboard, and the processing difficulty to and contact elastic property is relatively poor, lead to contact failure, influence circuit mainboard electrical conductivity's problem, to this technical problem, provide a paster conductive gasket, circuit mainboard and mobile terminal.
In order to solve the above technical problem, the present invention provides a patch conductive pad applied to a conductive area on a circuit of a mobile terminal, the patch conductive pad comprising: the gasket comprises a gasket body and at least two electric connection units;
at least two matching connecting parts which are matched with the electric connecting unit are arranged on two side edges of the gasket body, one end of the electric connecting unit is fixed and integrally formed on the matching connecting parts, and the other end of the electric connecting unit protrudes outwards along the surface of the gasket body.
Optionally, the gasket body is of a circular ring structure, two matching connection portions are arranged on the edge of the circular ring structure, and the two matching connection portions are arranged along the radial direction of the gasket body in a symmetrical mode.
Optionally, the matching connection portion is a fan-shaped groove, and the fan-shaped groove is formed by inwards recessing along the edge of the circular ring-shaped structure towards the direction of the circle center.
Optionally, the gasket body is of a semi-annular structure, the opening end edge of the semi-annular structure is provided with the electric connection unit, and the electric connection unit and the gasket body form an included angle smaller than 180 degrees when connected.
Optionally, the electrical connection unit is a lug, and a folded edge is further disposed on an edge of the lug.
Optionally, the number of the lugs is two, and the lugs are symmetrically arranged on the matching connection part along the radial direction of the gasket body.
Optionally, the pad body is further provided with at least one soldering through hole for soldering the patch conductive pad to the conductive area of the circuit board.
Further, the present invention also provides a circuit board, including: the patch conductive gasket is welded on the conductive area on the PCB single board in a welding mode.
Optionally, the conductive area is a threaded hole coated with a gold foil conductive layer.
Further, the present invention also provides a mobile terminal, including: a housing and a circuit board as claimed in any preceding claim;
the shell is provided with at least one metal boss with an internal thread mounting hole, a patch conductive gasket on the circuit main board is electrically contacted with the metal boss, the circuit main board is fixed with the metal boss through a screw, and the electric connection unit on the patch conductive gasket is deformed under the force of the screw, so that the circuit main board is tightly contacted with the metal boss.
The invention has the beneficial effects that:
the invention provides a patch conductive gasket, a circuit main board and a mobile terminal, aiming at the defects that the conductive gasket on the existing circuit main board has complex structure, difficult processing and poor contact elastic performance, resulting in poor contact and influencing the conductive performance of the circuit main board, the invention optimizes the conductive performance of the conductive area of the circuit main board of the mobile terminal by providing the patch conductive gasket which is suitable for being installed in a narrow space, the patch conductive gasket comprises a gasket body and at least two point connecting units, the gasket body is also provided with a matching connecting part matched with the point connecting units, the electric connecting units are fixed on the matching connecting part to be integrally formed, the electric connecting units are outwards protruded along the surface of the gasket body during assembly, and the contact performance of the patch conductive gasket and other parts can be realized by the design of the outwards protruded parts, and also can prevent loosening. Therefore, the paster conductive gasket provided by the embodiment of the invention can completely solve the problem that the paster conductive gasket is easy to fall off when the elasticity is insufficient, can reduce the damage of the paster conductive gasket to the gold foil layer on the conductive area, and improves the stability of bolt tightening torque when the paster conductive gasket is repeatedly disassembled and maintained, thereby improving the contact performance and the conductive performance of the circuit mainboard.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic diagram of a hardware structure of an alternative mobile terminal for implementing various embodiments of the present invention;
fig. 2 is a schematic view of a first structure of a patch conductive pad according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second structure of a patch conductive pad according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a third structure of a patch conductive pad according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a fourth structure of a patch conductive pad according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a fifth structure of a patch conductive pad according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a sixth structure of a patch conductive pad according to an embodiment of the present invention;
fig. 8 is a schematic diagram illustrating a seventh structure of a patch conductive pad according to an embodiment of the present invention;
fig. 9 is an eighth structural diagram of a patch conductive pad according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the following description, suffixes such as "module", "component", or "unit" used to denote elements are used only for facilitating the explanation of the present invention, and have no specific meaning in itself. Thus, "module", "component" or "unit" may be used mixedly.
The terminal may be implemented in various forms. For example, the terminal described in the present invention may include a mobile terminal such as a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and the like, and a fixed terminal such as a Digital TV, a desktop computer, and the like.
The following description will be given by way of example of a mobile terminal, and it will be understood by those skilled in the art that the construction according to the embodiment of the present invention can be applied to a fixed type terminal, in addition to elements particularly used for mobile purposes.
Referring to fig. 1, which is a schematic diagram of a hardware structure of a mobile terminal for implementing various embodiments of the present invention, the mobile terminal 100 may include: RF (Radio Frequency) unit 101, WiFi module 102, audio output unit 103, a/V (audio/video) input unit 104, sensor 105, display unit 106, user input unit 107, interface unit 108, memory 109, processor 110, and power supply 111. Those skilled in the art will appreciate that the mobile terminal architecture shown in fig. 1 is not intended to be limiting of mobile terminals, which may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
The following describes each component of the mobile terminal in detail with reference to fig. 1:
the radio frequency unit 101 may be configured to receive and transmit signals during information transmission and reception or during a call, and specifically, receive downlink information of a base station and then process the downlink information to the processor 110; in addition, the uplink data is transmitted to the base station. Typically, radio frequency unit 101 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency unit 101 can also communicate with a network and other devices through wireless communication. The wireless communication may use any communication standard or protocol, including but not limited to GSM (Global System for Mobile communications), GPRS (General Packet Radio Service), CDMA2000 (Code Division Multiple Access 2000), WCDMA (Wideband Code Division Multiple Access), TD-SCDMA (Time Division-Synchronous Code Division Multiple Access), FDD-LTE (Frequency Division duplex-Long Term Evolution), and TDD-LTE (Time Division duplex-Long Term Evolution).
WiFi belongs to short-distance wireless transmission technology, and the mobile terminal can help a user to receive and send e-mails, browse webpages, access streaming media and the like through the WiFi module 102, and provides wireless broadband internet access for the user. Although fig. 1 shows the WiFi module 102, it is understood that it does not belong to the essential constitution of the mobile terminal, and may be omitted entirely as needed within the scope not changing the essence of the invention.
The audio output unit 103 may convert audio data received by the radio frequency unit 101 or the WiFi module 102 or stored in the memory 109 into an audio signal and output as sound when the mobile terminal 100 is in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, a broadcast reception mode, or the like. Also, the audio output unit 103 may also provide audio output related to a specific function performed by the mobile terminal 100 (e.g., a call signal reception sound, a message reception sound, etc.). The audio output unit 103 may include a speaker, a buzzer, and the like.
The a/V input unit 104 is used to receive audio or video signals. The a/V input Unit 104 may include a Graphics Processing Unit (GPU) 1041 and a microphone 1042, the Graphics processor 1041 Processing image data of still pictures or video obtained by an image capturing device (e.g., a camera) in a video capturing mode or an image capturing mode. The processed image frames may be displayed on the display unit 106. The image frames processed by the graphic processor 1041 may be stored in the memory 109 (or other storage medium) or transmitted via the radio frequency unit 101 or the WiFi module 102. The microphone 1042 may receive sounds (audio data) via the microphone 1042 in a phone call mode, a recording mode, a voice recognition mode, or the like, and may be capable of processing such sounds into audio data. The processed audio (voice) data may be converted into a format output transmittable to a mobile communication base station via the radio frequency unit 101 in case of a phone call mode. The microphone 1042 may implement various types of noise cancellation (or suppression) algorithms to cancel (or suppress) noise or interference generated in the course of receiving and transmitting audio signals.
The mobile terminal 100 also includes at least one sensor 105, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor that can adjust the brightness of the display panel 1061 according to the brightness of ambient light, and a proximity sensor that can turn off the display panel 1061 and/or a backlight when the mobile terminal 100 is moved to the ear. As one of the motion sensors, the accelerometer sensor can detect the magnitude of acceleration in each direction (generally three axes), can detect the magnitude and direction of gravity when stationary, and can be used for applications of recognizing the gesture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer gesture calibration), vibration recognition related functions (such as pedometer and tapping), and other sensors such as a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which are also configurable to the mobile phone, and are not described herein again.
The display unit 106 is used to display information input by a user or information provided to the user. The Display unit 106 may include a Display panel 1061, and the Display panel 1061 may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like.
The user input unit 107 may be used to receive input numeric or character information and generate key signal inputs related to user settings and function control of the mobile terminal. Specifically, the user input unit 107 may include a touch panel 1071 and other input devices 1072. The touch panel 1071, also referred to as a touch screen, may collect a touch operation performed by a user on or near the touch panel 1071 (e.g., an operation performed by the user on or near the touch panel 1071 using a finger, a stylus, or any other suitable object or accessory), and drive a corresponding connection device according to a predetermined program. The touch panel 1071 may include two parts of a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 110, and can receive and execute commands sent by the processor 110. In addition, the touch panel 1071 may be implemented in various types, such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. In addition to the touch panel 1071, the user input unit 107 may include other input devices 1072. In particular, other input devices 1072 may include, but are not limited to, one or more of a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like, and are not limited to these specific examples.
Further, the touch panel 1071 may cover the display panel 1061, and when the touch panel 1071 detects a touch operation thereon or nearby, the touch panel 1071 transmits the touch operation to the processor 110 to determine the type of the touch event, and then the processor 110 provides a corresponding visual output on the display panel 1061 according to the type of the touch event. Although the touch panel 1071 and the display panel 1061 are shown in fig. 1 as two separate components to implement the input and output functions of the mobile terminal, in some embodiments, the touch panel 1071 and the display panel 1061 may be integrated to implement the input and output functions of the mobile terminal, and is not limited herein.
The interface unit 108 serves as an interface through which at least one external device is connected to the mobile terminal 100. For example, the external device may include a wired or wireless headset port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input/output (I/O) port, a video I/O port, an earphone port, and the like. The interface unit 108 may be used to receive input (e.g., data information, power, etc.) from external devices and transmit the received input to one or more elements within the mobile terminal 100 or may be used to transmit data between the mobile terminal 100 and external devices.
The memory 109 may be used to store software programs as well as various data. The memory 109 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the cellular phone, and the like. Further, the memory 109 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The processor 110 is a control center of the mobile terminal, connects various parts of the entire mobile terminal using various interfaces and lines, and performs various functions of the mobile terminal and processes data by operating or executing software programs and/or modules stored in the memory 109 and calling data stored in the memory 109, thereby performing overall monitoring of the mobile terminal. Processor 110 may include one or more processing units; preferably, the processor 110 may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 110.
The mobile terminal 100 may further include a power supply 111 (e.g., a battery) for supplying power to various components, and preferably, the power supply 111 may be logically connected to the processor 110 via a power management system, so as to manage charging, discharging, and power consumption management functions via the power management system.
Although not shown in fig. 1, the mobile terminal 100 may further include a bluetooth module or the like, which is not described in detail herein.
Based on the hardware structure of the mobile terminal, the invention provides a conductive gasket structure which can solve the problem that a circuit mainboard on the mobile terminal is difficult to design due to the limitation of a forbidden area and space and has good contact performance and smaller temporary space.
The patch conductive gasket provided in the embodiment of the present invention is suitable for various mobile terminals, including terminals such as a PC, a mobile phone, a tablet, a notebook, and the like, and specifically, referring to fig. 2, fig. 2 is a schematic structural diagram of the patch conductive gasket provided in this embodiment, the patch conductive gasket is mainly applied to a conductive area of a circuit board on the mobile terminal, such as a ground terminal and a power terminal, and may even be a conductive through hole on the circuit board, and the patch conductive gasket includes: the gasket comprises a gasket body 11 and at least two electric connection units 12, wherein the at least two electric connection units 12 are mounted on the gasket body 11, but only part of the electric connection units 12 are connected with the gasket body 11, and other structures of the electric connection units 12 are protruded outwards along the surface of the gasket body, that is, the electric connection units 12 and the gasket body are not in the same plane after the installation is completed, and optionally, a certain angle can be formed when the electric connection units 12 and the gasket body are crossed.
In this embodiment, at least two mating connection portions 111 are further disposed on both sides of the gasket body 11, and the shape of the mating connection portions 111 matches with the shape of the electrical connection unit 12. Assuming that the electrical connection unit 12 is a strip-shaped high-density elastic sheet, the matching connection portion 111 is a strip-shaped groove matched with the strip-shaped direction, one end of the electrical connection unit 12 is fixed on the matching connection portion 111, and the other end protrudes outwards along the surface of the gasket body 11.
In practical application, the gasket body 11 and the electrical connection unit 12 may also be processed by an integral forming manner, specifically, a gasket body 11 is first processed, then the gasket body is obtained by stamping and cutting on a lathe through stamping and cutting technologies, a cutting machine is used to respectively cut a plurality of cutting marks at positions symmetrical to the edge of the gasket body 11, then the positions of the cutting marks are stamped through a stamping machine to obtain the electrical connection unit 12, and an included angle is formed between the electrical connection unit 12 and the gasket body 11 in the stamping process.
In this embodiment, the gasket body may be configured as a circular ring structure, where the circular ring structure refers to that a through hole is provided in the middle of the gasket body 11, and the through hole may be identical to or slightly smaller than a conductive through hole on the circuit board, and further, two matching connection portions 111 are provided on the edge of the circular ring structure, and the two matching connection portions 111 are specifically symmetrically provided along the radial direction of the gasket body 11.
In practical applications, the number of the mating connecting portions 111 may be four, six … … N, where N is a multiple of 2, but no matter how many mating connecting portions 111 are provided, they should be uniformly distributed on the edge of the gasket body 11.
In this embodiment, the mating connection portion 111 may be configured to operate in a fan shape, the fan-shaped groove is formed along the edge of the circular ring structure and is recessed toward the center of the circle, and the corresponding electrical connection unit 12 is configured as a fan-shaped strip matching with the fan-shaped groove.
As shown in fig. 2, the electrical connection unit 12 is disposed at the outer edge of the pad body 11; in practical applications, the electrical connection unit 12 may also be disposed on the inner edge of the gasket body 11, as shown in fig. 3, and in this case, the fan-shaped groove should be formed by recessing a position of the inner edge of the gasket body 11 along the radially outward edge of the gasket body 11.
As shown in fig. 4, when the patch conductive pad is obtained by integrally forming the pad body 11 and the electrical connection unit 12, the process of the patch conductive pad is as follows:
firstly, selecting a high-density elastic metal material;
then, cutting a gasket with a circular structure from the metal material;
further, at least two cuts are cut on the outer edge of the gasket of the circular ring structure, and the cuts are cut in a mode shown in fig. 4;
finally, the cut mark is punched by a punch press, so that the patch conductive gasket structure shown in fig. 4 is obtained.
In practical application, when the cut mark is punched, the punch press can keep the gasket body 11 unchanged, and the place of the cut mark is punched and bent downwards, so that the obtained electrical connection unit 12 and the gasket body 11 form an included angle, which can be an angle smaller than 180 degrees.
In this embodiment, the cut may also be disposed at an inner edge of the gasket body 11, and when the cut is disposed at the inner edge, the processing manner is consistent with the processing manner set at the outer edge, which is not described herein again, and the structure is as shown in fig. 5.
In this embodiment, the number of the electrical connection units 12 may also be more than three, and the following description is provided with three as an example, as shown in fig. 6, the pad body 11 is provided with three raised elastic pieces, and the elastic pieces and the pad body 11 are integrally formed, where the elastic pieces are the electrical connection units 12 in the patch conductive pad provided in this embodiment. Further, the elastic sheet can be arranged in an inner ring of the gasket body, as shown in fig. 7.
In this embodiment, the gasket body 11 may be configured as a semi-ring structure in addition to a circular ring structure, as shown in fig. 8, the edge of the opening end of the semi-ring structure is provided with the electrical connection unit 12, and when the electrical connection unit 12 is connected with the gasket body 11, an included angle smaller than 180 degrees should be formed between each other.
When the patch conductive pad is assembled on a circuit main board, specifically, the pad body 11 in the patch conductive pad is in contact with a gold foil layer on the circuit main board, and the protruding direction of the electrical connection unit 12 faces away from the circuit main board, and the pad body 11 is welded on the gold foil layer in a welding manner.
In the embodiment, in order to further improve the contact performance between the mounted patch conductive gasket and the metal boss on the mobile phone shell, the electrical connection unit 11 is provided as a lug, and a folded edge is further arranged on the edge of the lug, so that the height difference between the electrical connection unit 12 and the gasket body 11 is improved through the lug, the elastic contact of the electrical connection unit 12 is also improved, especially, the folded edge is further arranged, the height difference is further improved on the premise of not influencing the elasticity, and the contact force between the electrical connection unit 12 and the metal boss is also increased.
In practical application, the number of the lugs is two, and the lugs are symmetrically arranged on the matching connection portion 111 along the radial direction of the gasket body 11, and certainly, more than two lugs can be arranged, and the lugs can be specifically arranged according to actual needs, so that the contact area of the patch conductive gasket is increased, and the contact performance is further improved.
In practical applications, as shown in fig. 9, the gasket body 11 may also be configured as a U-shaped structure, the electrical connection units 12 are disposed on two end portions of the port of the U-shaped structure, and the electrical connection units 12 may be disposed in a transverse direction or may be disposed to extend along two side edges of the U-shaped structure, but the disposed electrical connection units 12 and the two side edges of the U-shaped structure should form an included angle smaller than 180 degrees.
In this embodiment, in order to subsequently solder the patch conductive pad to the conductive area of the circuit board, at least one soldering through hole is further disposed on the pad body 11, and the soldering through hole is disposed on the other area except the mating connection portion 111, so as to solder the patch conductive pad to the conductive area of the circuit board.
The patch conductive gasket provided by the embodiment of the invention comprises a gasket body and at least two point connecting units, wherein the gasket body is also provided with a matching connecting part matched with the point connecting units, the electric connecting units are fixed on the matching connecting part and integrally formed, and the electric connecting units are outwards protruded along the surface of the gasket body during assembly, so that the problem of poor contact caused by insufficient elasticity of the conventional conductive sheet is solved, the damage of the patch conductive gasket to a gold foil layer on a conductive area can be reduced, the stability of bolt tightening torque during repeated disassembly and maintenance is improved, the contact performance is improved, and the conductive performance of a circuit mainboard is improved.
Second embodiment:
referring to fig. 10, fig. 10 is a schematic structural diagram of a circuit board according to an embodiment of the present invention, where the circuit board includes: the mobile terminal comprises a PCB single board 20 and at least one patch conductive gasket, wherein the PCB single board 20 comprises various functional module circuits of the mobile terminal and at least one conductive area 21, and the patch conductive gasket is arranged on the conductive area 21 and is welded on the conductive area 21 in a welding mode.
In practical application, the patch conductive pad includes a pad body 11 and an electrical connection unit 12, optionally, the electrical connection unit 12 is an elastic contact piece, the elastic connection piece is disposed on the pad body 11 and is tilted outward, and the elastic connection piece may be welded or formed by stamping on the basis of the pad body 11; when the patch conductive pad is to be mounted on the conductive area 21, the surface of the pad body 11, on which the elastic contact piece is mounted, opposite to the elastic contact piece is electrically contacted with the conductive area 21, and the tilting surface of the elastic contact piece is outward, and the elastic contact piece is also tilted outward.
In this embodiment, the conductive area 21 is a threaded hole coated with a gold foil conductive layer, the threaded hole may be a through hole penetrating from one surface of the PCB single board 20 to the other surface, the inner wall and the edge of the through hole are coated with the gold foil conductive layer, and when the patch conductive pad is welded on the through hole, specifically, the pad body 11 on the patch conductive pad is welded on the gold foil conductive layer on the edge of the through hole.
If the gasket body 11 is a circular ring-shaped structure, the center circle of the circular ring-shaped structure is folded in half at the position of the through hole, and the edge area of the circular ring-shaped structure is electrically connected with the gold foil conducting layer.
In this embodiment, the gasket body 11 may be configured as a semi-ring structure in addition to a circular ring structure, as shown in fig. 8, the edge of the opening end of the semi-ring structure is provided with the electrical connection unit 12, and when the electrical connection unit 12 is connected with the gasket body 11, an included angle smaller than 180 degrees should be formed between each other.
When the patch conductive pad is assembled on a circuit main board, specifically, the pad body 11 in the patch conductive pad is in contact with a gold foil layer on the circuit main board, and the protruding direction of the electrical connection unit 12 faces away from the circuit main board, and the pad body 11 is welded on the gold foil layer in a welding manner.
In the embodiment, in order to further improve the contact performance between the mounted patch conductive gasket and the metal boss on the mobile phone shell, the electrical connection unit 11 is provided as a lug, and a folded edge is further arranged on the edge of the lug, so that the height difference between the electrical connection unit 12 and the gasket body 11 is improved through the lug, the elastic contact of the electrical connection unit 12 is also improved, especially, the folded edge is further arranged, the height difference is further improved on the premise of not influencing the elasticity, and the contact force between the electrical connection unit 12 and the metal boss is also increased.
In practical application, the number of the lugs is two, and the lugs are symmetrically arranged on the matching connection portion 111 along the radial direction of the gasket body 11, and certainly, more than two lugs can be arranged, and the lugs can be specifically arranged according to actual needs, so that the contact area of the patch conductive gasket is increased, and the contact performance is further improved.
In practical applications, as shown in fig. 9, the gasket body 11 may also be configured as a U-shaped structure, the electrical connection units 12 are disposed on two end portions of the port of the U-shaped structure, and the electrical connection units 12 may be disposed in a transverse direction or may be disposed to extend along two side edges of the U-shaped structure, but the disposed electrical connection units 12 and the two side edges of the U-shaped structure should form an included angle smaller than 180 degrees.
In this embodiment, in order to subsequently solder the patch conductive pad to the conductive area of the circuit board, at least one soldering through hole is further disposed on the pad body 11, and the soldering through hole is disposed on the other area except the mating connection portion 111, so as to solder the patch conductive pad to the conductive area of the circuit board.
The circuit main board that this embodiment provided, through the welding on the gold foil conducting layer at electrically conductive region (being the screw thread conducting hole) edge has the paster conducting pad, through the design of this paster conducting pad, not only solved present no frame, all metal class terminal equipment, under the restricted scene of veneer overall arrangement, antenna or ground connection function contact reliability unstable problem, still further promote the stability of product, can promote on all veneer designs and replace devices such as shell fragment, practice thrift more space and cost.
The third embodiment:
the present invention further provides a mobile terminal, please refer to fig. 11, which includes a housing 30 and the circuit main board 20 as described above; the housing 30 is provided with at least one metal boss 31 having a mounting hole with an internal thread, the patch conductive gasket on the circuit board 20 and the metal boss 31 are electrically contacted with each other, the circuit board 20 and the metal boss 31 are fixed by screws, and the electrical connection unit 12 on the patch conductive gasket is deformed under the force of the screws, so that the circuit board 20 and the metal boss 31 are in close contact.
In practical applications, the circuit board 20 is provided with circuits of modules such as a processor and a radio frequency module, and these circuit structures all need to have a power end and a ground end, and whether the contact performance between the ground end and the power end is good or not determines the communication quality of the whole mobile terminal.
Especially, the existing mobile terminal is developed to be large-screen, the design of a circuit board of the mobile terminal is generally limited by a forbidden area and space, more grounding functions and tuning circuits realize a conduction function by locking a PCB screw hole and a metal boss of a shell through a screw, and on a large-size product of a large-screen product, because the size of a metal middle frame is larger, the deformation of the middle frame and the deformation of the PCB often cause unstable contact between the metal boss and a PCB plane, and functional abnormality is easy to occur. Particularly, in the case of the frameless large-screen-size all-metal middle frame, the contact mode of locking the PCB by the screws is adopted for conducting and locking due to space limitation, and the contact between the PCB and the middle frame is poor after the screws are locked due to the small area of the gold foil conducting layer and the normal deformation tolerance of the middle frame and the PCB, so that a tuning circuit cannot form a loop, and the G800G 900 frequency band fails.
The patch conductive pad provided by the embodiment of the present invention comprises a pad body 11 and at least two electrical connection units 12, wherein the at least two electrical connection units 12 are mounted on the pad body 11, but only a part of the electrical connection units 12 is connected to the pad body 11, and other structures of the electrical connection units 12 protrude outward along the surface of the pad body, that is, after the mounting is completed, the electrical connection units 12 and the pad body are not in the same plane, and optionally, a certain angle may be formed when the two are crossed.
In practical application, gasket body 11 is provided with the shell fragment of three perk, the shell fragment with when gasket body 11 is integrated into one piece, this kind of structure is optimized circuit board's contact performance more, because when through the screw installation, its elasticity of the in-process of its perk shell fragment and metal boss contact can increase along with the deformation degree of compression to make paster conductive gasket and the inseparable contact of metal boss, the circuit board who improves greatly and the direct conduction degree of shell.
Furthermore, the patch conductive gasket provided by the embodiment of the invention solves the problem that the contact reliability of an antenna or a grounding function is unstable under the current situations of no frame, all-metal terminal equipment and limited single-board layout, simplifies the design structure of a conductive area, improves the stability of a product, can be popularized and used for replacing devices such as a spring plate and the like on all single-board designs, and saves more space and cost.
In summary, the invention provides a conductive gasket for a chip, a circuit board and a mobile terminal, aiming at the defects that the conductive gasket on the existing circuit board has complex structure, difficult processing and poor contact elasticity, which causes poor contact and affects the conductive performance of the circuit board, the invention optimizes the conductive performance of the conductive area of the circuit board of the mobile terminal by providing the conductive gasket for a chip which is suitable for being installed in a narrow space, the conductive gasket for a chip comprises a gasket body and at least two point connecting units, the gasket body is also provided with a matching connecting part matched with the point connecting units, the electric connecting units are fixed on the matching connecting part to be integrally formed, the electric connecting units are outwards protruded along the surface of the gasket body during assembly, and the contact performance of the conductive gasket for a chip and other parts can be realized by the design of the outwards protruded parts, and also can prevent loosening. Therefore, the paster conductive gasket provided by the embodiment of the invention can completely solve the problem that the paster conductive gasket is easy to fall off when the elasticity is insufficient, can reduce the damage of the paster conductive gasket to the gold foil layer on the conductive area, and improves the stability of bolt tightening torque when the paster conductive gasket is repeatedly disassembled and maintained, thereby improving the contact performance and the conductive performance of the circuit mainboard.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A mobile terminal, comprising: a housing and a circuit board;
the circuit main board includes: the PCB single board comprises a PCB single board and at least one patch conductive gasket, wherein the patch conductive gasket is welded on a conductive area on the PCB single board in a welding mode;
the patch conductive pad includes: the gasket comprises a gasket body and at least two electric connection units; at least two matching connecting parts which are matched with the electric connecting units are arranged on two side edges of the gasket body, one end of each electric connecting unit is fixed on the corresponding matching connecting part and is integrally formed, and the other end of each electric connecting unit protrudes outwards along the surface of the gasket body;
the shell is provided with at least one metal boss with an internal thread mounting hole, a patch conductive gasket on the circuit main board is electrically contacted with the metal boss, the circuit main board is fixed with the metal boss through a screw, and the electric connection unit on the patch conductive gasket is deformed under the force of the screw, so that the circuit main board is tightly contacted with the metal boss.
2. The mobile terminal according to claim 1, wherein the gasket body is a circular ring structure, and two mating connecting portions are disposed on an edge of the circular ring structure, and are symmetrically disposed along a radial direction of the gasket body.
3. The mobile terminal of claim 2, wherein the mating connection portion is a sector-shaped groove formed along an edge of the circular ring structure and recessed toward a center of the circular ring structure.
4. The mobile terminal according to claim 1, wherein the gasket body is a semi-ring structure, the edge of an opening end of the semi-ring structure is provided with the electrical connection unit, and an included angle formed between the electrical connection unit and the gasket body is smaller than 180 degrees when the electrical connection unit is connected with the gasket body.
5. Mobile terminal according to any of claims 1 to 4, characterized in that the electrical connection unit is a lug, on the edge of which a fold is also provided.
6. The mobile terminal of claim 5, wherein the lugs are two in number and are symmetrically disposed on the mating connection portion along a radial direction of the gasket body.
7. The mobile terminal of claim 5, wherein at least one soldering through hole is further formed in the pad body for soldering the patch conductive pad to the conductive area of the circuit main board.
8. A mobile terminal according to claim 1, characterized in that the conductive area is a threaded hole coated with a gold foil conductive layer.
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CN110968151B (en) * | 2018-09-29 | 2021-03-05 | Oppo(重庆)智能科技有限公司 | Electronic device |
CN109871306A (en) * | 2019-03-19 | 2019-06-11 | 浪潮商用机器有限公司 | A kind of mechanical stress monitoring method, device, equipment and the medium of server master board |
CN110855814B (en) * | 2019-11-05 | 2022-03-15 | 维沃移动通信有限公司 | Electronic device |
CN111343798B (en) * | 2020-03-25 | 2021-02-26 | 西安伟京电子制造有限公司 | Manual chip mounter auxiliary system and method based on machine vision recognition |
CN112930070B (en) * | 2021-01-21 | 2022-08-23 | 北京字节跳动网络技术有限公司 | Electronic device |
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